CN103885578B - Contact panel and its manufacture method - Google Patents
Contact panel and its manufacture method Download PDFInfo
- Publication number
- CN103885578B CN103885578B CN201210595781.4A CN201210595781A CN103885578B CN 103885578 B CN103885578 B CN 103885578B CN 201210595781 A CN201210595781 A CN 201210595781A CN 103885578 B CN103885578 B CN 103885578B
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- Prior art keywords
- visible area
- sensing electrode
- layer
- electrode layer
- contact panel
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The present invention provides a kind of contact panel; the contact panel has been defined visible area and non-visible area; contact panel includes sensing electrode layer and protective layer; wherein sensing electrode layer correspondence is positioned at visible area and non-visible area; protective layer is open comprising first and is formed at the surface of sensing electrode layer comprehensively to cover the sensing electrode layer positioned at visible area, exposes a part for the sensing electrode layer positioned at non-visible area via the first opening correspondence of protective layer.In addition, the present invention also provides the manufacture method of above-mentioned contact panel.
Description
【Technical field】
The present invention is related to touch technology, particularly with regard to contact panel and its manufacture method.
【Background technology】
In recent years, contact panel is increasingly becoming topmost input interface, is widely used in various electronic products, example
Such as mobile phone, personal digital assistant (PDA) or hand held personal computer etc..Contact panel generally includes substrate with some internal groups
Part, such as sensing electrode, black photoresist layer and touching signals wire etc., traditional contact panel is generally initially formed sensing on substrate
Electrode, then re-forms the component such as black photoresist layer and touching signals wire.Afterwards, contact panel meeting and flexible printed wiring board
(flexible printed circuit；FPC) engaged and with display module (such as liquid crystal display device module (LCD
module：LCM)) carry out assembling laminating.
However, in traditional contact panel, printing and the cleaning processing procedure of black photoresist layer and touching signals wire hold
Easily sensing electrode is caused to damage, and the connection process of follow-up contact panel and flexible printed wiring board (FPC), and touch-control
Panel processing procedure of being fitted with the assembling of display module also can be damaged to sensing electrode, cause the touch-control sense of traditional contact panel
Brake is damaged.
【The content of the invention】
In view of the problems referred to above that known techniques are present, the present invention provides a kind of contact panel and its manufacture method, in sense
After survey electrode layer completes, protective layer is formed immediately to cover sensing electrode layer, contact panel its is then just carried out again
The processing procedure of his component, can so reduce or prevent sensing electrode layer to be damaged, and then overcome asking for above-mentioned conventional touch panel
Topic.
According to one embodiment of the invention, there is provided contact panel, contact panel have been defined visible area and non-visible area, this
Contact panel includes：Correspondence is positioned at visible area and the sensing electrode layer of non-visible area；And protective layer comprising first opening and
The surface of sensing electrode layer is formed at comprehensively to cover the sensing electrode layer positioned at visible area, it is sudden and violent via the first opening correspondence
Expose a part for the sensing electrode layer positioned at non-visible area.
In one embodiment, the contact panel also includes a protective substrate, and the sensing electrode layer is formed at the protection group
The surface of plate.
In one embodiment, the contact panel also includes：One protective substrate；And an optical match film, it is arranged at this
Between protective substrate and the sensing electrode layer.
In one embodiment, the contact panel also includes：One light shielding part, at least a portion of the light shielding part are formed at this
To define the non-visible area on protective layer, and the light shielding part is comprising one second opening, and second opening is to should protective layer
This first opening；One conducting resinl, is filled in first opening and second opening；And a conductor layer, it is formed at part
The light shielding part on and corresponding to this second opening, wherein the conductor layer is electrically connected with the sensing electrode by the conducting resinl
Layer.
In one embodiment, the light shielding part includes an at least decorative layer.
In one embodiment, the contact panel also includes：One insulating barrier, is formed on the conductor layer and the light shielding part simultaneously
Correspondence is positioned at the non-visible area.
In one embodiment, the contact panel also includes：One insulating barrier, is formed at the protective layer, the conductor layer and is somebody's turn to do
On light shielding part and correspondingly positioned at the visible area and the non-visible area.
In one embodiment, the contact panel also includes：One protective substrate；One light shielding part, is formed at the protective substrate
Surface to define the non-visible area, wherein the sensing electrode layer is formed on the light shielding part in the non-visible area, and
The visible area is formed on the protective substrate；One conducting resinl, is filled in first opening；And a conductor layer, it is formed at portion
On the protective layer for dividing and corresponding to first opening, wherein the conductor layer is electrically connected with the sensing electrode by the conducting resinl
Layer.
In one embodiment, the contact panel also includes：One insulating barrier, is formed on the conductor layer and the protective layer,
And correspondence is positioned at the non-visible area.
In one embodiment, the contact panel also includes：One insulating barrier, is formed on the conductor layer and the protective layer simultaneously
Correspondence is positioned at the visible area and the non-visible area.
According to one embodiment of the invention, there is provided the manufacture method of contact panel, contact panel be defined visible area and
Non-visible area, this manufacture method include：Sensing electrode layer is formed, wherein sensing electrode layer is corresponding positioned at visible area and non-visual
Area；And the protective layer comprising the first opening is formed in the surface of sensing electrode layer, wherein protective layer is comprehensively covered and is located at
The sensing electrode layer of visible area, and a part for the sensing electrode layer positioned at non-visible area is exposed via the first opening correspondence.
In one embodiment, the manufacture method of the contact panel also includes：Form a shading comprising one second opening
To define the non-visible area, at least a portion of the wherein light shielding part is formed on the protective layer in portion, and second opening
To should protective layer this first opening；Fill a conducting resinl interior in first opening and second opening；And formation one is led
On the light shielding part of part and corresponding to second opening, wherein the conductor layer is electrically connected with this by the conducting resinl to line layer
Sensing electrode layer.
In one embodiment, the manufacture method of the contact panel also includes：An insulating barrier is formed in the conductor layer and is somebody's turn to do
It is on light shielding part and corresponding positioned at the non-visible area.
In one embodiment, the manufacture method of the contact panel also includes：Formed an insulating barrier in the protective layer, this leads
On line layer and the light shielding part and correspondingly positioned at the visible area and the non-visible area.
In one embodiment, the manufacture method of the contact panel also includes：Before the sensing electrode layer is formed, formed
One light shielding part defines the non-visible area in the surface of a protective substrate, and wherein the sensing electrode layer is shape in the non-visible area
Into on the light shielding part, and it is formed on the protective substrate in the visible area；Fill a conducting resinl interior in first opening；With
And formed a conductor layer on the protective layer of part and corresponding to this first be open, wherein the conductor layer by the conducting resinl come
It is electrically connected with the sensing electrode layer.
In one embodiment, the manufacture method of the contact panel also includes：An insulating barrier is formed in the conductor layer and is somebody's turn to do
It is on protective layer and corresponding positioned at the non-visible area.
In one embodiment, the manufacture method of the contact panel also includes：An insulating barrier is formed in the conductor layer and is somebody's turn to do
On protective layer and correspondingly positioned at the visible area and the non-visible area.
In one embodiment, the manufacture method of the contact panel also includes：An optical match film is formed in a protection group
The surface of plate；And the sensing electrode layer is formed in the surface of the optical match film.
In one embodiment, the sensing electrode layer is formed at the surface of a protective substrate.
In order to above-mentioned purpose, feature and the advantage of the present invention can also be become apparent, below coordinate institute's accompanying drawings, make detailed
Carefully it is described as follows：
【Description of the drawings】
Fig. 1 is shown according to one embodiment of the invention, the generalized section of contact panel；
Fig. 2A to Fig. 2 F shows according to one embodiment of the invention, the section for manufacturing each interstage of the contact panel of Fig. 1
It is intended to；
Fig. 3 is shown according to one embodiment of the invention, the generalized section of contact panel；And
Fig. 4 is shown according to one embodiment of the invention, the generalized section of contact panel.
Wherein description of reference numerals is as follows：
100～protective substrate；
100A～inner surface；
100B～outer surface；
100P～non-visible area；
100V～visible area；
102～optical match film；
104～anti-functional coating；
106～sensing electrode layer；
110X, 110Y～conductive pattern；
112～insulation division；
114～jumper；
116～protective layer；
116a～opening；
118～light shielding part；
118a～opening；
120～conducting resinl；
124～conductor layer；
126～insulating barrier；
128～anisotropic conductive film；
130～flexible printed wiring board.
【Specific embodiment】
In each schema, in order to more clearly represent the feature of the embodiment of the present invention, each component of contact panel can not
It is drawn to scale.In addition, alleged in the following description orientation " on " and D score be to be existed with protective substrate (cover lens) 100
The direction of lower section represents that these orientation are intended merely to represent the position relationship that each component is relative, but in contact panel reality
Using upper, be with protective substrate 100 up in the form of use.
Fig. 1 shows the generalized section of the contact panel according to one embodiment of the invention.The touch-control of the embodiment of the present invention
Panel, for example, capacitance type touch-control panel, have been defined visible area 100V and non-visible area 100P, and usual non-visible area 100P is
An at least side of visible area 100V is located relatively at, contact panel includes a sensing electrode layer 106 and a protective layer 116, wherein
The correspondence of sensing electrode layer 106 is positioned at visible area 100V and non-visible area 100P, and protective layer 116 includes one first opening 116a,
And protective layer 116 is formed at the surface of sensing electrode layer 106 comprehensively to cover the sensing electrode positioned at visible area 100V
Layer 106, and a part for the sensing electrode layer 106 positioned at non-visible area 100P is exposed by the first opening 116a correspondences.
The contact panel of Fig. 1 also includes a protective substrate 100, and sensing electrode layer 106 can be formed at the interior of protective substrate 100
Side surface 100A.Further illustrate, whole touch control components of contact panel all may be formed at the inner surface of protective substrate 100
The side of 100A, the outer surface 100B of protective substrate 100 are the touch surface of contact panel.Additionally, the embodiment of the present invention is so-called
Protective substrate 100 refers to the substrate after Jing strengthens, for providing the function of carrying and protect touch control component, and protection group
The material of plate 100 is, for example, glass or other suitable materials.
The contact panel of Fig. 1 also includes a light shielding part 118, a conducting resinl 120 and a conductor layer 124, wherein light shielding part 118
At least a portion can be formed on protective layer 116 to define non-visible area 100P, and light shielding part 118 is opened comprising one second
Mouth 118a, the first opening 116a of this second opening 118a correspondence protective layers 116；Namely protective layer 116 is in non-visible area
Can be between sensing electrode layer 106 and light shielding part 118 in 100P.Conducting resinl 120 is to be filled in the first opening 106a and second
In opening 118a, and conductor layer 124 can be formed on the light shielding part 118 of part and corresponds to the second opening 118a, wherein wire
Layer 124 is electrically connected with sensing electrode layer 106 by conducting resinl 120.
Furthermore, light shielding part 118 can for example include an at least decorative layer in actual design, and the material of decorative layer can be black
Coloured light resistance, black ink or colored ink, and can make by technologies such as coating and photolithographic processes or printing process.
By the design of Multilayer decorative layer, more visual effects of the contact panel in non-visible area 100P can be increased.For example, if
Decorative layer of the light shielding part 118 comprising two-layer different colours, can be designed with pierced pattern in the decorative layer for being close to protective layer 116, enter
And allow the decorative layer away from protective layer 116 to be able to by pierced pattern to appear different colors.If it should be noted that shading
Portion 118 is made up of Multilayer decorative layer, have no on the laminated construction up and down of those decorative layers be any limitation as be directly stacking and
Into the structure of indirect stacking actually can be formed according to the architecture design demand of contact panel.
The contact panel of Fig. 1 is also located at the insulating barrier 126 of non-visible area 100P including a correspondence, due to conductor layer 124 such as
Can be formed on the light shielding part 118 of part described in front, therefore insulating barrier 126 is may partly form on conductor layer 124, part is formed
On light shielding part 118.In this embodiment, insulating barrier 126 is only partly corresponded to positioned at non-visible area 100P and is covered in wire
The surface of layer 124 and light shielding part 118, for further avoiding conductor layer 124 from being damaged by chemical or physical property.However,
If in order to more ensure that sensing electrode layer 106 is avoided damage to, in other embodiments, insulating barrier 126 further can also be formed
With correspondence positioned at visible area 100V and non-visible area 100P on protective layer 116, conductor layer 124 and light shielding part 118.
The present invention separately proposes a kind of manufacture method of contact panel, as it was previously stated, contact panel has been defined a visible area
And a non-visible area, include the step of this manufacture method：A sensing electrode layer is formed, wherein the sensing electrode layer correspondence is located at and is somebody's turn to do
Visible area and the non-visible area, re-form a protective layer comprising one first opening afterwards in the surface of the sensing electrode layer, its
In the protective layer comprehensively cover sensing electrode layer positioned at the visible area, and expose by the first opening correspondence that be located at should
A part for the sensing electrode layer of non-visible area.Detailed manufacture process, please join following explanation.
Fig. 2A -2F are referred to, is, according to one embodiment of the invention, to illustrate each intermediate manufacturing state of Fig. 1 contact panels
Generalized section.
Refering to Fig. 2A, sensing electrode layer 106 is formed above protective substrate 100 (i.e. on inner surface 100A), and is felt
The forming position for surveying electrode layer 106 is correspondence positioned at visible area 100V and non-visible area 100P.In one embodiment, sensing electrode
Layer 106 comprising plural bar along first axially (such as X-axis) conductive pattern 110X arranged in parallel, plural bar along second axially (such as Y
Axle) conductive pattern 110Y arranged in parallel and an insulation division 112, conductive pattern 110X and conductive pattern 110Y passes through insulation division
112 are electrically insulated from each other.The conductive pattern 110X and 110Y of sensing electrode layer 106 has no and is any limitation as its shape, structure or row
Row mode, the sensing electrode layer 106 of the present embodiment are the designs for example with single layer structure, and wherein insulation division 112 is provided in
Between the connecting line 113 of the jumper 114 and conductive pattern 110Y of conductive pattern 110X, the jumper of conductive pattern 110X is allowed
114 form bridging structure.
The material of above-mentioned conductive pattern 110X and 110Y is, for example, tin indium oxide (indium tin oxide, ITO), oxidation
Indium zinc (indium zinc oxide, IZO), aluminum zinc oxide (aluminum zinc oxide, AZO) or other are suitable transparent
Conductive material, forms these conductive patterns 110X and 110Y using depositing and photolithographic processes.The material of insulation division 112 can be with
It is the insulant of organic or inorganic, for example, pi (polyimide) can be by deposition and photolithographic processes or printing
This insulation artwork is formed insulation division 112 by processing procedure.
Refering to Fig. 2 B, after all components of sensing electrode layer 106 complete, the guarantor comprising opening 116a is formed immediately
Sheath 116 allows protective layer 116 comprehensively to cover the sensing electrode positioned at visible area 100V in the surface of sensing electrode layer 106
The all components of layer 106, comprising conductive pattern 110X and 110Y, insulation division 112 etc., and expose position by opening 116a correspondences
In a part for the sensing electrode layer 106 of non-visible area 100P.More specifically, the protective layer 116 of the present embodiment is with direct
Contact conductive pattern 110X and 110Y, the mode of insulation division 112 are being covered in the surface of sensing electrode layer 106.
The material of protective layer 116 can be the transparent insulation material of organic or inorganic, for example, pi
(polyimide), the material such as silicon dioxide (SiO2), transparent insulation glue, when the material of protective layer 116 is organic photoresist
When, the opening 116a of protective layer 116 and protective layer 116 can be formed by photolithographic processes.Additionally, when the material of protective layer 116
Expect for other transparent insulation materials when, such as silicon dioxide (SiO2) or during transparent insulation glue, it is possible to use printing process or its
His film-plating process forms the opening 116a of protective layer 116 and protective layer 116.
In this embodiment, the coverage of protective layer 116 is carrying out cloth according to the full wafer area of protective substrate 100
If however, in other embodiments, protective layer 116 can also be only according to the forming region of sensing electrode layer 106 carrying out cloth
If.As long as covering protection sensing electricity can be carried out by protective layer 116 immediately after sensing electrode layer 106 completely form
The various change of pole layer 106, comes under the scope that the present invention can cover.
Refering to Fig. 2 C, light shielding part 118 is formed on protective layer 116, light shielding part 118 is used for defining described non-visible area
100P.Supplementary notes, as the coverage of the protective layer 116 of the present embodiment is the full wafer face according to protective substrate 100
Accumulate to be laid, therefore the whole light shielding part 118 of the present embodiment is formed on protective layer 116, in another embodiment, if
The coverage of protective layer 116 is only if being laid, then only having part according to the forming region of sensing electrode layer 106
Light shielding part 118 be formed on protective layer 116.From the point of view of the framework of the present embodiment, protective layer 116 is in non-visible area 100P
It is between sensing electrode layer 106 and light shielding part 118.
The light shielding part 118 of the present embodiment is further comprising an opening 118a, the opening of this opening 118a correspondence protective layers 116
116a.In this embodiment, by reserved opening 118a and 116a, allow the conductor layer 124 and sensing electrode layer being subsequently formed
106 are able to be electrically connected with.
Refering to Fig. 2 D, fill out in the opening 118a of the opening 116a and light shield layer 118 of the protective layer 116 for corresponding to each other
Fill conducting resinl 120 so that 120 sensing electrode layer in electrical contact 106 of conducting resinl.The conducting resinl 120 of the present embodiment can be for example with
With the opaque conductive rubber of 118 same color of light shielding part, allow light shielding part 118 that the effect covered will not be reduced because of opening 118a
Really.Certainly, conducting resinl 120 can also adopt electrically conducting transparent colloid, and light shielding part 118 is then setting using aforesaid Multilayer decorative layer
Meter, allows the decorative layer further away from protective layer 116 to be able to provide the background color of electrically conducting transparent colloid, and reaches light shielding part 118
Screening effect.
Refering to Fig. 2 E, conductor layer 124 is formed on part light shielding part 118, and allows formed conductor layer 124 to correspond to and opened
Mouth 118a.The material of conductor layer 124 be, for example, metal, metal-oxide, can by depositing, exposure imaging and etch process, or
Person forms conductor layer 124 by printing process.Above-mentioned formed conductor layer 124 can be open in 116a and 118a with being filled in
Conducting resinl 120 is in electrical contact so that conductor layer 124 is electrically connected by being filled in the conducting resinl 120 being open in 116a and 118a
Connect sensing electrode layer 106.
Refering to Fig. 2 F, insulating barrier 126 is formed on conductor layer 124 and light shielding part 118, in the present embodiment, due to wire
Layer 124 is made only on part light shielding part 118, therefore insulating barrier 126 has the folded conductor layer 124, part of being located in part and folds and be located at
On light shielding part 118.As the sensing electrode layer 106 of embodiments of the invention has been protected the protection of layer 116 upon formation,
As it was earlier mentioned, insulating barrier 126 only partly can be corresponded to and being located at non-visible area 100P and being covered in conductor layer 124 and light shielding part
118 surface, or be further formed on protective layer 116, conductor layer 124 and light shielding part 118 with correspondence positioned at visible area 100V
And non-visible area 100P.
In one embodiment, the material of insulating barrier 126 can be identical with the material of protective layer 116, for example, organic or nothing
The transparent insulation material of machine, can form insulating barrier 126 with photolithographic processes, printing process or other film-plating process by coating.
Finally, after the processing procedure of above-mentioned Fig. 2 F, allow conductor layer 124 again via anisotropic conductive film (anisotropic
conductive film；ACF) 128 engage with flexible printed wiring board (FPC) 130, complete contact panel as shown in Figure 1.
Thereby, sensing electrode layer 106 can be by conducting resinl 120, conductor layer 124 and anisotropic conductive film (ACF) 128 and soft print
Printed circuit board (FPC) 130 is electrically connected with, and then the signal processor (not drawing) being electrically connected with flexible printed wiring board 130
It is able to the electrical change that sensed according to sensing electrode layer 106 to calculate actual touch points position.
According to embodiments of the invention, after all components of sensing electrode layer 106 complete, protection is formed immediately
Layer 116 is covering sensing electrode layer 106, therefore the conductive pattern 110X and 110Y and insulation division 112 of sensing electrode layer 106 exist
The protection of layer 116 can be protected during follow-up light shielding part 118, conducting resinl 120, the processing procedure of 124 insulating barrier 126 of conductor layer,
Will not be damaged by the action needed for the processing procedure of follow-up these components, the frictioning action of such as print steps, or cleaning
Wiping action scratch.Additionally, protective layer 116 may also help in opposing static discharge of sensing electrode layer 106 (ESD), therefore, according to
According to embodiments of the invention, the reliability of contact panel can be lifted.
In addition, according to embodiments of the invention, when contact panel carry out subsequently with flexible printed wiring board (FPC) 130
Connection process, and with display module (LCM) when fitting, assembling processing procedure, protective layer 116 can also persistently provide protection touch-control
The effect of the sensing electrode layer 106 of panel, further lifts the reliability of the sensing electrode layer 106 of contact panel.
Refering to Fig. 3, Fig. 3 shows the generalized section of the contact panel according to one embodiment of the invention.The present embodiment with
Touch panel structure provided roughly the same shown in the embodiment of Fig. 1, discrepancy is, in Fig. 3 embodiments, to be formed at protective substrate
100 surface 100A's is that an optical match film (index match film) 102, i.e. optical match film 102 may be disposed at guarantor
Between shield substrate 100 and sensing electrode layer 106.Difference in manufacture method is that, before Fig. 2A, the present embodiment is in protection
On the inner surface 100A of substrate 100 first make have optical match film 102, that is, allow optical match film 102 lower surface with protection
The inner surface 100A contacts of substrate 100, and cause to continue in posterior Fig. 2A stages, sensing electrode layer 106 is further shape
Into the upper surface in optical match film 102.The optical match film 102 of the present embodiment can be used to prevent sensing electrode layer 106
Etching line causes reflected light color distortion, reduces the visual effect of sensing electrode layer 106.
Additionally, the present embodiment is also provided with anti-functional coating 104 on the outer surface 100B of protective substrate 100, it is such as anti-
Finger mark (anti-finger；AF), anti-soil (anti-smudge；AS), resist dizzy (anti-glare；AG) etc..In manufacture method,
Anti- functional coating 104 can be more initially formed on the outer surface 100B of protective substrate 100, or in other assemblies compared with other assemblies
Re-form on the outer surface 100B of protective substrate 100 after all being formed.Certainly, optical match film 102 and anti-functional coating 104
Respective whether selection is that determining, here is not limited by the present invention according to the design requirement of actual contact panel.
Fig. 4 shows the generalized section of the contact panel according to one embodiment of the invention.The enforcement of the present embodiment and Fig. 1
The difference of example is that the light shielding part 118 in the present embodiment for defining non-visible area 100P is formed in protective substrate 100
On inner surface 100A so that sensing electrode layer 106 is still formed at the inner surface of protective substrate 100 in visible area 100A
On 100A, but it is formed on light shielding part 118 in non-visible area 100P.In other words, the light shielding part 118 of the present embodiment is to be formed
Below sensing electrode layer 106.Likewise, after all components of sensing electrode layer 106 complete, forming protection immediately
Layer 116 in the upper surface of sensing electrode layer 106, therefore, the conductive pattern 110X and 110Y of the sensing electrode layer 106 of this embodiment
And insulation division 112 can be protected layer during the processing procedure of conducting resinl 120, conductor layer 124 and insulating barrier 126 is subsequently formed
116 protection, will not be damaged by the action needed for the processing procedure of follow-up these components.
Additionally, the conducting resinl 120 that the difference of the embodiment of the present embodiment and Fig. 1 is the present embodiment is to be filled in protective layer
In 116 opening 116a, and conductor layer 124 is formed in partial protection layer 116 and corresponding to opening 116a so that wire
Layer 124 is electrically connected with sensing electrode layer 106 by being filled in the conducting resinl 120 being open in 116a.According to the framework of the present embodiment
From the point of view of, protective layer 116 is between sensing electrode layer 106 and conductor layer 124 in non-visible area 100P interior part.Furthermore, this
The insulating barrier 126 of embodiment be it is for example corresponding be formed on conductor layer 124 and protective layer 116 positioned at non-visible area 100P, root
According to another embodiment, insulating barrier 126 also can further be corresponded to and be formed in wire positioned at visible area 100V and non-visible area 100P
On layer 124 and protective layer 116.
Difference in manufacture method is that the present embodiment, before the sensing electrode layer 106 of Fig. 2A is formed, is to be initially formed
Light shielding part 118 in protective substrate 100 inner surface 100A defining non-visible area 100P, that is, allow the following table of light shielding part 118
Face is contacted with the inner surface 100A of protective substrate 100, and causes to continue in posterior Fig. 2A stages, and sensing electrode layer 106 exists
Non-visible area 100P is the upper surface for being further formed at light shielding part 118, and protective substrate is still formed in visible area 100V
100 inner surface 100A.For another example the protective layer 116 comprising the first opening 116a is formed afterwards as Fig. 2 B in sensing electrode layer
On 106, in the present embodiment, if in non-visible area 100P, sensing electrode layer 106 is only partially formed on light shielding part 118, then
Protective layer 116 in non-visible area 100P, in addition to part is formed on sensing electrode layer 106, also has part and is formed in shading
In portion 118.
As in the present embodiment, the position change of light shielding part 118 causes subsequent components also produce position change, such as
The conducting resinl 120 for being formed in figure 2d can be only filled in the first opening 116a of protective layer 116, and formed in Fig. 2 E
Conductor layer 124 can be formed on the protective layer 116 of part in non-visible area 100P and corresponding to the first opening 116a.In Fig. 2 F
The insulating barrier 126 for being formed can be formed on conductor layer 124 and protective layer 116, in another embodiment in non-visible area 100P,
The design of insulating barrier 126 can extend to visible area 100V and non-visible area 100P.
Supplementary notes, as the sensing electrode layer 106 of the present embodiment is just made after light shielding part 118 is formed
Make, therefore sensing electrode layer 106 can be because the presence of light shielding part 118 rather than shape between visible area 100V and non-visible area 100P
Into in same level.However, according to actual design demand, can further before making forms sensing electrode layer 106, can
A smooth layer (SmoothingLayer) (not shown) is initially formed in vision area 100V in the inner surface 100A of protective substrate 100,
Smooth layer and light shielding part 118 is allowed with height so that sensing electrode layer 106 is able to be formed in light shielding part 118 and is constituted with smooth layer
Same level surface, increase the reliability of sensing electrode layer 106.
In sum, according to embodiments of the invention, all components of the sensing electrode layer 106 of contact panel can be subject to
The complete preservation of protective layer 116, it is to avoid sensing electrode layer 106 sustains damage in the processing procedure of follow-up other assemblies, therefore can be with
Improve the reliability of contact panel.Additionally, by the setting of protective layer 116, the sensing electrode layer of contact panel can also be lifted
106 for the resistivity of static discharge (ESD).
Although the present invention has disclosed preferred embodiment as above, so which is not limited to the present invention, in this technical field
Tool usually intellectual when it can be appreciated that without departing from the spirit and scope of the present invention, when a little change and retouching can be done.Cause
This, protection scope of the present invention is when being defined depending on claim is defined.
Claims (11)
1. a kind of contact panel, has been defined a visible area and a non-visible area, it is characterised in that the contact panel includes：
One sensing electrode layer, correspondence is positioned at the visible area and the non-visible area；And
One protective layer, is formed on the sensing electrode layer comprehensively to cover position comprising one first opening, and the protective layer
In the sensing electrode layer of the visible area, and the sensing electrode layer positioned at the non-visible area is exposed by the first opening correspondence
A part；
One light shielding part, at least a portion of the light shielding part are formed on the protective layer to define the non-visible area, and the screening
Light portion include one second opening, this second opening to should protective layer this first opening；
One conducting resinl, is filled in first opening and second opening；And
One conductor layer, is formed on the light shielding part of part and corresponding to second opening, wherein the conductor layer is by the conduction
Glue is being electrically connected with the sensing electrode layer.
2. contact panel according to claim 1, it is characterised in that also including a protective substrate, the sensing electrode layer shape
Into in the surface of the protective substrate.
3. contact panel according to claim 1, it is characterised in that also include：
One protective substrate；And
One optical match film, is arranged between the protective substrate and the sensing electrode layer.
4. contact panel according to claim 1, it is characterised in that the light shielding part includes an at least decorative layer.
5. contact panel according to claim 1, it is characterised in that also include：
One insulating barrier, is formed on the conductor layer and the light shielding part and correspondence is positioned at the non-visible area.
6. contact panel according to claim 1, it is characterised in that also include：
One insulating barrier, is formed on the protective layer, the conductor layer and the light shielding part and correspondence is located at the visible area and this is non-visual
Area.
7. a kind of manufacture method of contact panel, the wherein contact panel have been defined a visible area and a non-visible area, and which is special
Levy and be, include the step of the manufacture method：
A sensing electrode layer is formed, wherein the sensing electrode layer correspondence is positioned at the visible area and the non-visible area；And
A protective layer comprising one first opening is formed on the sensing electrode layer, wherein the protective layer is comprehensively covered and is located at
The sensing electrode layer of the visible area, and the sensing electrode layer positioned at the non-visible area is exposed by the first opening correspondence
A part；
A light shielding part comprising one second opening is formed to define the non-visible area, wherein at least a portion shape of the light shielding part
Into on the protective layer, and second opening to should protective layer first opening；
Fill a conducting resinl interior in first opening and second opening；And
A conductor layer is formed on the light shielding part of part and corresponding to second opening, the wherein conductor layer passes through the conducting resinl
To be electrically connected with the sensing electrode layer.
8. the manufacture method of the contact panel according to claim 7, it is characterised in that also include：
An insulating barrier is formed on the conductor layer and the light shielding part and correspondence is positioned at the non-visible area.
9. the manufacture method of contact panel according to claim 7, it is characterised in that also include：
An insulating barrier is formed on the protective layer, the conductor layer and the light shielding part and correspondence is located at the visible area and this is non-visual
Area.
10. the manufacture method of contact panel according to claim 7, it is characterised in that also include：
An optical match film is formed in the surface of a protective substrate；And
The sensing electrode layer is formed in the surface of the optical match film.
The manufacture method of 11. contact panels according to claim 7, it is characterised in that the sensing electrode layer is formed at
The surface of one protective substrate.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595781.4A CN103885578B (en) | 2012-12-20 | 2012-12-20 | Contact panel and its manufacture method |
| TW102206361U TWM458612U (en) | 2012-12-20 | 2013-04-09 | Touch panels |
| TW102112457A TWI526890B (en) | 2012-12-20 | 2013-04-09 | Touch panels and fabrication methods thereof |
| PCT/CN2013/085746 WO2014094494A1 (en) | 2012-12-20 | 2013-10-23 | Touch panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595781.4A CN103885578B (en) | 2012-12-20 | 2012-12-20 | Contact panel and its manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103885578A CN103885578A (en) | 2014-06-25 |
| CN103885578B true CN103885578B (en) | 2017-04-05 |
Family
ID=49480218
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210595781.4A Active CN103885578B (en) | 2012-12-20 | 2012-12-20 | Contact panel and its manufacture method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103885578B (en) |
| TW (2) | TWI526890B (en) |
| WO (1) | WO2014094494A1 (en) |
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| TWI571782B (en) * | 2013-04-09 | 2017-02-21 | 宸正光電（廈門）有限公司 | Touch panels and fabrication methods thereof |
| TWI509483B (en) * | 2013-08-28 | 2015-11-21 | Rtr Tech Technology Co Ltd | Touch panel and manufacturing method |
| CN104516576B (en) * | 2013-09-29 | 2016-04-13 | 宸鸿科技(厦门)有限公司 | The method for making of contact panel |
| TWI494821B (en) * | 2013-10-31 | 2015-08-01 | Au Optronics Corp | Touch panel |
| TWI505156B (en) * | 2013-11-29 | 2015-10-21 | Innolux Corp | Touch display device |
| CN104731397A (en) * | 2013-12-19 | 2015-06-24 | 胜华科技股份有限公司 | Touch panel and touch display device |
| CN105334988B (en) * | 2014-07-01 | 2019-03-12 | 长鸿光电(厦门)有限公司 | Touch panel |
| CN105573539B (en) * | 2014-10-17 | 2019-05-03 | 宸鸿光电科技股份有限公司 | Touch panel and manufacturing method thereof |
| CN106155387B (en) * | 2015-04-10 | 2023-09-22 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| CN104750347A (en) * | 2015-04-17 | 2015-07-01 | 合肥京东方光电科技有限公司 | Capacitive touch screen, production technology for same and touch display panel |
| CN106990808B (en) * | 2016-01-20 | 2023-10-24 | 宸鸿科技(厦门)有限公司 | Protective cover plate and manufacturing method thereof |
| KR20180026348A (en) * | 2016-09-02 | 2018-03-12 | 스템코 주식회사 | A method of fabricating flexible printed circuit boards and the flexble printed circuit boards made by using the same |
| CN107256099B (en) * | 2017-05-11 | 2020-09-01 | 昆山龙腾光电股份有限公司 | Touch screen manufacturing method |
| CN110377179B (en) * | 2019-06-27 | 2023-07-14 | 云谷（固安）科技有限公司 | Touch panel, preparation method of touch panel and display device |
| CN110597418A (en) * | 2019-09-19 | 2019-12-20 | 京东方科技集团股份有限公司 | Touch module, preparation method thereof, touch display screen and touch display device |
| CN110825268B (en) * | 2019-11-12 | 2022-12-02 | 业成科技（成都）有限公司 | Touch module, touch display device and electronic equipment |
| CN112526780A (en) * | 2020-12-10 | 2021-03-19 | 业成科技（成都）有限公司 | Cover plate assembly and display device using same |
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- 2013-04-09 TW TW102112457A patent/TWI526890B/en active
- 2013-04-09 TW TW102206361U patent/TWM458612U/en unknown
- 2013-10-23 WO PCT/CN2013/085746 patent/WO2014094494A1/en active Application Filing
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| CN102298475A (en) * | 2011-08-16 | 2011-12-28 | 深圳市宝明科技股份有限公司 | Indium tin oxide (ITO) through hole integrated capacitive touch screen and production method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWM458612U (en) | 2013-08-01 |
| WO2014094494A1 (en) | 2014-06-26 |
| TW201426449A (en) | 2014-07-01 |
| TWI526890B (en) | 2016-03-21 |
| CN103885578A (en) | 2014-06-25 |
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Effective date of registration: 20170711 Address after: 361009 intellectual property department, No. 199, Shang Lu Road, information hi tech Zone, torch hi tech Zone, Fujian, Xiamen Patentee after: XIANGDA OPTICAL (XIAMEN) CO., LTD. Address before: 361009 Fujian Province, Xiamen torch hi tech Zone information photoelectric park is Sakamoto Road No. 199 Patentee before: Chenzheng Photoelectric (Xiamen) Co., Ltd. |