CN103864311A - Method for forming glass substrate - Google Patents

Abstract

The invention provides a forming method of a glass substrate, which comprises the following steps: step (S10) of providing a tempered glass, wherein an upper surface and a lower surface of the tempered glass respectively include a reinforcing layer; a step (S50) of disposing two protection layers on the upper surface and the lower surface of the strengthening layer correspondingly; step (S100) of thinning the strengthening layer without the protection layer by the strengthening layer thinning device to make the thickness of the strengthening layer less than 30 μm; step (S150) of cutting the tempered glass from the thinner portion of the tempered layer by means of a cutting tool to form an edge; a step (S200) of strengthening the edge by means of an edge etching tool; and a step (S250) of removing the protective layer and cleaning the tempered glass to form the glass substrate. Through the design, the tempered glass with the thicker reinforced layer can be quickly molded into the glass substrate, and the breakage of the tempered glass can be effectively avoided.

Description

Forming method of glass substrate

technical field

The invention relates to a molding method of a glass substrate, in particular to a molding method capable of molding strengthened glass with a thick strengthening layer into a glass substrate.

Background technique

In today's society, the touch screens used in smart phones, tablet computers, thin computers and other devices are strengthened glass, and current manufacturers use knife wheel cutting tools or grinding wheel cutting tools to cut strengthened glass to make glass substrates; because The known strengthened glass has a strengthened layer with a thickness of 10 μm to 30 μm, so the manufacturer must cut through the strengthened layer before cutting the strengthened glass to form a glass substrate.

However, with the advancement of technology, manufacturers increase the thickness of the strengthening layer (such as 35 μm, 40 μm, etc.) to increase the strength of the strengthened glass, but at the same time make the process of making the glass substrate more difficult. Using the above-mentioned cutting tool to cut the strengthened glass takes more time to cut through the strengthening layer, and the strengthened glass is easily broken during the cutting process.

Therefore, how to invent a method for forming a glass substrate to quickly and easily form strengthened glass with a thicker strengthening layer into a glass substrate will be an active feature of the present invention.

Contents of the invention

An object of the present invention is to provide a method for forming a glass substrate, which can quickly form strengthened glass with a thicker strengthening layer into a glass substrate, and can effectively prevent the strengthened glass from cracking.

In order to achieve the above and other purposes, the present invention provides a method for forming a glass substrate, which includes: step S10 providing a strengthened glass, the upper surface and the lower surface of the strengthened glass respectively include strengthening layers; step S50 forming two protective layers Correspondingly arranged on the strengthening layer on the upper surface and the lower surface; step S100 thinning the strengthening layer without the protective layers by means of a strengthening layer thinning device, so that the thickness of the strengthening layer is less than 30 μm ; Step S150 cuts the strengthened glass from the thinner parts of the strengthened layers by means of a cutting tool to form an edge; Step S200 strengthens the edge by means of an edge etching tool; and Step S250 removes the protective layers, and The strengthened glass is cleaned to form a glass substrate.

In a specific embodiment of the present invention, the protective layers have at least one protective layer through hole, and after step S150, a step S160 is further included: using a drilling tool to drill the reinforced hole from the protective layer through hole. glass to form at least one glass through hole.

In a specific embodiment of the present invention, after the step S150 or S160, a step S170 is further included: performing edge grinding on the edge by means of an edge grinding tool.

In a specific embodiment of the present invention, step S100 uses a strengthening layer thinning device to thin the strengthening layer without the protective layers, so that the thickness of the strengthening layers is less than 20 μm. Wherein, preferably, the thickness of the strengthening layers is equal to 0 μm.

In a specific embodiment of the present invention, the protective layers are protective films, protective glue or protective plates.

To sum up, the method for forming a glass substrate of the present invention enables the strengthened glass with a thicker strengthened layer to be rapidly formed into a glass substrate by virtue of the design of thinning the strengthened layer, and can effectively prevent the strengthened glass from cracking.

Description of drawings

Fig. 1 is a flow chart of the forming method of the glass substrate of the present invention.

FIG. 2 is a schematic diagram of disposing a protective layer on strengthened glass.

FIG. 3 is a schematic diagram of a strengthening layer thinning device for thinning a strengthening layer.

FIG. 4 is a schematic diagram of a thinned strengthening layer.

FIG. 5 is a schematic diagram of a cutting tool cutting strengthened glass.

FIG. 6 is a schematic diagram showing the edge of strengthened glass being strengthened by means of an edge etching tool.

7 is a schematic diagram of a glass substrate.

FIG. 8 is a partial flowchart of another forming method of the glass substrate of the present invention.

FIG. 9 is a schematic diagram of disposing a protective layer with through holes on strengthened glass.

Fig. 10 is a schematic diagram of a drilling tool for drilling strengthened glass.

Fig. 11 is a partial flow chart of another forming method of the glass substrate of the present invention.

Fig. 12 is a schematic diagram of edges of strengthened glass after being edged.

[Description of main component symbols]

1 glass substrate

10 tempered glass

11 upper surface

12 lower surface

13 reinforced layers

14 edges

15 glass perforations

20 layers of protection

21 protective layer through hole

30 strengthening layer thinning device

40 cutting tools

50 Edge Etching Tool

60 drilling tool

A thickness

S10-S250 steps

Detailed ways

In order to fully understand the purpose, features and effects of the present invention, the present invention will be described in detail by means of the following specific embodiments and accompanying drawings, as follows:

Please refer to Figures 1 to 7 at the same time, which are the forming method of the glass substrate of the present invention. Figure 1 discloses the flow chart of the forming method of the glass substrate of the present invention. The forming method includes the following steps:

As shown in FIG. 2, first, in step S10, a strengthened glass 10 is provided, and the upper surface 11 and the lower surface 12 of the strengthened glass 10 respectively include a strengthening layer 13; then, in step S50, the two protective layers 20 The strengthening layer 13 is disposed on the upper surface 11 and the lower surface 12 corresponding to each other. Among them, the protective layers 20 are resistant to liquids such as hydrofluoric acid (HF), ammonium fluoride (NH ₄ F) or sulfuric acid (H ₂ SO ₄ ), so as to prevent the strengthened glass 10 from being etched by the above liquids, so the The material of the protective layers 20 can be PVC, PET, PP, Teflon, etc.; in addition, the protective layers 20 are protective films, protective glue or protective plates.

Next, as shown in Figures 3 and 4, in step S100, the user sprays hydrofluoric acid (HF), ammonium fluoride (NH ₄ F) or sulfuric acid (H ₂ SO ₄ ) through the strengthening layer thinning device 30 ... and other liquids to thin the reinforcement layer 13, the thickness A of the reinforcement layer 13 after thinning at the place where the protective layers 20 are not provided is less than 30 μm, preferably less than 20 μm, and even more 0 μm. With the above-mentioned design, the cutting tool used by the user can easily cut the strengthened glass 10 .

Furthermore, as shown in FIG. 5, in step S150, the user uses a cutting tool 40 (such as knife wheel cutting, grinding wheel cutting or laser cutting... etc.) from the thinner parts of the reinforcement layers 13 (ie the The strengthened glass 10 is cut at a thickness A) of the strengthened layer 13 to form edges 14 (as shown in FIG. 6 ). In addition, the user can use the cutting tool 40 to cut strengthened glass in different shapes according to the needs of customers, for example, it can perform linear cutting, chamfer cutting or round corner cutting, etc.

Next, as shown in FIG. 6, in step S200, the user strengthens the edge 14 by means of an edge etching tool 50, and the edge etching tool 50 sprays hydrofluoric acid (HF), ammonium fluoride (NH ₄ F) or sulfuric acid (H ₂ SO ₄ )... etc liquid to edge etch the edge 14 to restore the strength of the strengthened glass 10 .

Please continue to refer to FIG. 7. In step S250, the user removes the protective layers 20 and cleans the strengthened glass 10 to form a glass substrate 1. The glass substrate 1 is a finished product required by customers, such as a smart phone. , tablet computers, thin computers... and other devices using touch screens.

To sum up, the method for forming a glass substrate of the present invention allows the cutting tool to easily cut strengthened glass with a thicker strengthened layer through the design of thinning the strengthened layer, so that the strengthened glass can be formed quickly It is a glass substrate, and can effectively prevent the strengthened glass from cracking.

Again, please refer to Fig. 8 to Fig. 10, it is another molding method of the glass substrate of the present invention, the process flow of this another molding method is substantially the same as that shown in Fig. 1, wherein the protective layer used in this molding method has at least A protective layer through hole 21, and after step S150, further includes step S160, the step S160 is to drill the strengthened glass 10 from the protective layer through hole 21 through a drilling tool 60, so as to form at least one glass through hole 15 . Although not shown in the figure, it can be understood that the glass through-hole 15 formed by the above-mentioned design on the glass substrate 1 can be a button hole, a mobile phone hole or an earphone hole...etc.

Finally, please refer to FIG. 11 and FIG. 12 , which are yet another molding method of the glass substrate of the present invention. The flow of this another molding method is substantially the same as that shown in FIG. 1 , wherein after step S150, step S170 is also included, In this step S170 , the edge 14 is edged by means of an edge grinding tool 70 , so that the edge 14 becomes smoother. In addition, although not shown in the figure, the step S170 may also be located after the step S160.

In summary, the method for forming a glass substrate of the present invention allows the cutting tool to easily cut strengthened glass with a thicker strengthened layer by virtue of the design of thinning the strengthened layer, so that the strengthened glass can be formed quickly It is a glass substrate, and can effectively prevent the strengthened glass from cracking.

The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be considered within the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the claims.

Claims (9)

1. a forming method for glass substrate, it includes:

Step (S10) a: chilled glass is provided, and the upper surface of described chilled glass and lower surface include respectively strengthening layer;

Step (S50): two protective layers are arranged on the strengthening layer of described upper surface and described lower surface mutually accordingly;

Step (S100): carry out thinning and be not provided with the strengthening layer of described protective layer by strengthening layer thinning apparatus, so that the thickness of described strengthening layer is less than 30 μ m;

Step (S150): cut described chilled glass by parting tool from the thinner thickness place of described strengthening layer, to form an edge;

Step (S200): strengthen this edge by edge etch tool; And

Step (S250): remove described protective layer, and clean described chilled glass, to form a glass substrate.

2. forming method as claimed in claim 1; wherein said protective layer has at least one protective layer through hole; and in step (S150) afterwards; also include step (S160): this chilled glass of holing from this protective layer through hole by boring bar tool, to form at least one glass perforation.

3. forming method as claimed in claim 1, wherein in step (S150) afterwards, also includes step (S170): by edging instrument, described edge is carried out to edging processing.

4. forming method as claimed in claim 2, wherein in step (S160) afterwards, also includes step (S170): by edging instrument, described edge is carried out to edging processing.

5. the forming method as described in any one in claim 1 to 4, wherein step (S100) is carried out thinning and is not provided with the strengthening layer of described protective layer by strengthening layer thinning apparatus, so that the thickness of described strengthening layer is less than 20 μ m.

6. forming method as claimed in claim 5, wherein step (S100) is carried out thinning and is not provided with the strengthening layer of described protective layer by strengthening layer thinning apparatus, so that the thickness of described strengthening layer equals 0 μ m.

7. the forming method as described in any one in claim 1 to 4, wherein said protective layer is protective membrane, protection glue or protecting sheet.

8. forming method as claimed in claim 5, wherein said protective layer is protective membrane, protection glue or protecting sheet.

9. forming method as claimed in claim 6, wherein said protective layer is protective membrane, protection glue or protecting sheet.

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