CN103852710B - Opposite electronic component working equipment - Google Patents

Abstract

The present invention is an opposed electronic component operation equipment. The test and classification equipment is mainly configured with a feeding device, a receiving device, an operation device, a conveying device and a central control unit for controlling and integrating the actuation of each device to perform automated operations on a machine. The feeding device is used to accommodate at least one electronic component to be operated, the receiving device is used to accommodate at least one electronic component that has completed the operation, and the conveying device is provided with at least one transfer and placement device for carrying electronic components between the feeding and receiving devices and the operation device; wherein, the operation device is provided with a plurality of oppositely arranged operation areas on at least two sides of the machine, and at least one supporting seat is provided in each operation area for supporting the electronic component and performing the operation; in this way, by using the method of oppositely arranged operation areas, not only can the conveying device effectively shorten the transfer stroke, but also the machine can achieve the practical benefit of easy expansion of the operation area under the premise of effectively reducing the occupied machine table space.

Description

Opposite electronic component working equipment

technical field

The invention relates to a kind of opposed electronic component operation equipment which can effectively shorten the transfer stroke of the conveying device, and effectively reduce the occupation of the table space of the machine table, so as to easily expand the operation area.

Background technique

Please refer to Fig. 1, Fig. 2, it is China Taiwan Patent Application No. 91105851 IC test handler patent case, this test handler is equipped with feeding box/lifter 11, empty box/lifter respectively at the front end of machine table 10 12 and the output box 13, the supply box/elevator 11 is filled with the IC to be tested, and the empty box/elevator 12 receives the empty supply box used by the supply box/elevator 11, and can be taken out to The seat of the output box is used to place the tested IC. The output box can be subdivided into different levels of output boxes 13a, 13b, 13c to store different levels of tested ICs. Several test ports 14a, 14b, 14c, 14d is located at the rear end of machine platform 10, and the test boards 16a, 16b, 16c, 16d with test seats 15a, 15b, 15c, 15d are arranged in parallel in each test port 14a, 14b, 14c, 14d, and on the test board 16a , 16b, 16c, and 16d front ends are each provided with a pair of IC rotary buffer tables 17a, 17b, 17c, 17d to be tested and IC rotary buffer tables 18a, 18b, 18c, 18d for completed testing, and another IC conveying mechanism 19 revolves around the feeding box/ Between the lifter 11, each test port 14a, 14b, 14c, 14d and the output box 13a, 13b, 13c, to be responsible for the IC delivery work between the various institutions, and a preheat box 20 can be added to test the IC to be tested Preheating operation; when performing IC test operation, if the IC placement direction of the test sockets 15a, 15b, 15c, 15d of the test boards 16a, 16b, 16c, 16d is the same as the IC placement direction in the supply box/lifter 11 Simultaneously, the ICs to be tested on the supply box/lifter 11 are directly taken out by the IC conveying mechanism 19, and are respectively conveyed and placed in each test socket 15a, 15b, 15c, 15d. The transport mechanism 19 takes out the tested ICs in the test sockets 15a, 15b, 15c, and 15d respectively, and transports the tested ICs to the output boxes 13a, 13b, and 13c according to the test results; if the test boards 16a, 16b, and 16c , 16d, when the IC placement direction of the test sockets 15a, 15b, 15c, 15d is different from the placement direction of the IC in the supply box/lifter 11, the IC delivery mechanism 19 will be used to place the IC on the supply box/lifter 11 to be tested. The ICs are taken out, transported and placed on the rotating buffer tables 17a, 17b, 17c, and 17d for the ICs to be tested respectively, and rotate the directions of the rotating buffer tables 17a, 17b, 17c, and 17d for the ICs to be tested so that the angular positions of the ICs are the same as those of the test seats 15a , 15b, 15c, 15d, then use the IC delivery mechanism 19 to put the IC into the test sockets 15a, 15b, 15c, 15d, and after the test is completed, the IC delivery mechanism 19 will place the test sockets 15a, 15b, 15c respectively , The ICs that have been tested within 15d are taken out and placed on the rotary buffer tables 18a, 18b, 18c, and 18d of the ICs that have been tested, so that the IC angle phase Same as the output boxes 13a, 13b, 13c, and then the IC delivery mechanism 19 will deliver the tested ICs to the output boxes 13a, 13b, 13c according to the test results; the design framework of the test handler has the following disadvantages:

1. Each test port 14a, 14b, 14c, 14d of the test processor is arranged in parallel with test boards 16a, 16b, 16c, 16d at the rear end of the machine platform 10, so when the test port is added due to demand, the body must be constantly The ground extends to both sides, resulting in an oversized body, which is accompanied by the situation that the workshop space is not enough for use.

2. After the body of the test processor is continuously extended to both sides to expand and add test ports, the IC conveying mechanism 19 must make a farther movement stroke to circle each test seat 15a, 15b, 15c, 15d and the feeding box/lifter 11 and Between the output boxes 13a, 13b, and 13c, it will lead to excessive workload of the IC delivery mechanism 19, and the IC delivery operation cannot be carried out smoothly according to the timing arrangement, which may cause some test ports to stand by and reduce the test operation. production efficiency.

In view of this, the inventor has been engaged in research and development and production experience in related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term hard research and trial production, he has finally created a device that can effectively save space and improve The working equipment of operating speed, to effectively improve the shortcoming of habit formula, this is the design purpose of the present invention.

Contents of the invention

Aiming at the deficiencies of the prior art, the object of the present invention is to provide an opposed electronic component operation equipment to solve the above deficiencies in the prior art.

In order to achieve the above object, the technical scheme adopted in the present invention is:

An opposed electronic component operation equipment, characterized in that it includes:

Feeding device: for carrying at least one electronic component to be executed;

Receiving device: for carrying at least one completed electronic component;

Working device: at least on the first side and the second side of the machine platform, there are a plurality of opposite working areas, and each working area is respectively equipped with at least one bearing seat for holding electronic components and performing operations;

Conveying device: equipped with a first transfer pick-and-place device, a second transfer pick-and-place device, a third transfer pick-and-place device and at least one reloading platform, the first transfer pick-and-place device transfers the electronics of the feeding device to be executed. The components are transferred to the transfer table, and the electronic components that have completed the operation in the transfer table are transferred to the receiving device for classification and placement. The second transfer pick-and-place device transfers the electronic components to be executed from the transfer table to the first side for operation each bearing seat in the working area, and transfer the completed electronic components from each bearing seat in the first side operation area to the transfer platform, and the third transfer pick-and-place device transfers the electronic components to be executed from the transfer platform The electronic components are transferred to the bearing seats of the second side operation area, and the completed electronic components are transferred from each bearing seat of the second side operation area to the transfer platform;

Central control unit: used to control and integrate the actions of various devices to perform automated operations.

The above-mentioned opposed electronic assembly operation equipment, wherein: an empty tray device is also provided, and the empty tray device carries a plurality of empty trays, and a tray shifter is used to transfer the empty trays of the feeding device to the empty trays device, or transfer the empty tray on the empty tray device to the receiving device.

The opposed type electronic component operation equipment, wherein: the material receiving device is provided with a composite material receiving device, and the composite material receiving device includes a storage box which is an upright multi-layer box body, and the storage box is used to bear A plurality of receiving trays capable of holding electronic components of different grades to complete operations, a tray holder used to hold each receiving tray removed from the storage box, and a tray used to transfer each receiving tray in the storage box to Plate shifter on plate holder.

The opposed type electronic component operation equipment, wherein: the plate holder is driven up and down by the first power group, and a disk shifter is installed on the disk holder, and the disk shifter is driven by the second power group to move laterally, so as to Move the receiving trays of the storage box to the tray holder, and use the conveying device to classify and place the completed electronic components according to the operation results.

Said opposed electronic component working equipment, wherein: the supporting seats in the working areas on the first side and the second side of the working device are test seats for holding electronic components and performing testing operations.

The opposed electronic component operation equipment, wherein: the top of each test seat in the working area on the first side and the second side of the operation device is provided with a lower pressure head to press against the electronic component to be tested or to open it. test socket.

The opposed type electronic component operation equipment, wherein: the conveying device is provided with a first transfer platform and a second transfer platform, and the first transfer pick-and-place device transfers the electronic components to be executed in the feeding device to the second transfer platform. The first transfer table and the second transfer table, and the electronic components completed by the first transfer table and the second transfer table are transferred to the receiving device for classification and placement, and the second transfer pick-and-place device is transferred from the first transfer table to wait The electronic components that perform the operation are transferred to the bearing seats in the first side operation area, and the electronic components that have completed the operation are transferred from each bearing seat in the first side operation area to the first transfer platform, and the third transfer takes The placer then transfers the electronic components to be executed from the second transfer table to the bearing seats in the second-side operation area, and transfers the completed electronic components from the bearing seats in the second-side operation area to the second transfer station.

Said opposing electronic assembly operation equipment, wherein: the first transfer platform has a first material supply base and a first material receiving base, and the first material supply base is used for placing the to-be-executed materials transferred by the first pick-and-place device. For the electronic components of the operation, the first receiving platform is used to place the completed electronic components transferred by the second transfer pick-and-place device. The second transfer platform has a second feeding platform and a second receiving platform. The material pedestal is used for placing the electronic components to be carried out by the first transfer pick-and-place device, and the second material receiving pedestal is used for placing the test electronic components transferred by the third transfer pick-and-place device.

The opposed electronic assembly operation equipment, wherein: the first feeding platform, the first receiving platform of the first transfer platform, and the second feeding platform and the second receiving platform of the second transferring platform are respectively controlled by the first The driving source drives the motion to slide in a straight line and is driven by the second driving source to rotate, so as to switch the angular position when the placement direction of the electronic components on the bearing seat is different from the placement direction of the electronic components to be executed in the feeding device.

The above-mentioned opposed electronic component operation equipment, which also includes: inspectors are provided on the second pick-and-place device and the third transfer pick-and-place device of the conveying device, for inspecting the completed work in each bearing seat Whether the electronic components have been removed, or check whether the electronic components to be executed in each holder are placed correctly.

Compared with prior art, the beneficial effect that the present invention has is:

The invention provides a kind of opposed electronic component operation equipment, the operation equipment is mainly equipped with a feeding device, a material receiving device, an operation device and a conveying device on the machine platform; wherein, the operation device is installed on at least two sides of the machine platform A plurality of working areas are arranged facing each other, and at least one bearing seat is provided in each working area for holding electronic components and performing operations, and then the working areas on both sides of the machine can be set up opposite to each other to make the machine On the premise of effectively reducing the space occupied by the machine table, the platform achieves the practical benefit of easy expansion of the work area.

The invention provides a kind of opposed electronic component operation equipment, the operation equipment is mainly equipped with a feeding device, a material receiving device, an operation device and a conveying device on the machine platform; wherein, the operation device is installed on at least two sides of the machine platform A plurality of working areas are arranged in opposite directions, and at least one bearing seat is provided in each working area for holding electronic components and performing operations, and then the way of setting the working areas on the two sides of the machine is opposite, so that the conveying The device can effectively shorten the transfer stroke to effectively ensure the production efficiency of the operation.

Description of drawings

Fig. 1 is a configuration schematic diagram of the patent case of IC test handler patent application No. 91105851 in Taiwan, China;

Fig. 2 is a schematic diagram of part of the appearance of the IC test processor patent case of Taiwan Patent Application No. 91105851;

Fig. 3 is a schematic diagram of the structure of the opposed test area of the present invention;

Fig. 4 is the schematic diagram of the first and second transfer stations of the present invention;

Fig. 5 is the schematic diagram of the two-side test area and the transfer pick-and-place device of the present invention;

Figure 6 is a schematic diagram of the action of the present invention (1);

Fig. 7 is a schematic diagram of the action of the present invention (2);

Figure 8 is a schematic diagram of the action of the present invention (3);

Fig. 9 is a schematic diagram of the action of the present invention (4);

Figure 10 is a schematic diagram of the action of the present invention (five);

Figure 11 is a schematic diagram (1) of the compound receiving device of the present invention;

Fig. 12 is a schematic diagram (2) of the composite receiving device of the present invention.

Explanation of reference numerals: 10-machine platform; 11-feed magazine/elevator; 12-empty magazine/elevator; 13, 13a, 13b, 13c-output magazine; 14a, 14b, 14c, 14d-test port; 15a , 15b, 15c, 15d-test seat; 16a, 16b, 16c, 16d-test board; 17a, 17b, 17c, 17d-rotating buffer table for IC to be tested; 18a, 18b, 18c, 18d-rotating buffer table for completed IC ;19-IC conveying mechanism; 20-preheating box; 30-machine; 31-feeding device; 311-feed tray; 32-empty tray device; 321-feed tray; Device; 331-First-level receiving device; 332-Second-level receiving device; 333-Compound receiving device; 3331-Storage box; ; 3335-the first power group; 3336-the second power group; 34-operation device; 34a, 34b, 34c, 34d, 34e, 34f-operation area; 34g, 34h, 34i, 34j, 34k, 34l-operation area; 341-test seat; 342-test circuit board; 343-down pressure head; 35-conveying device; 351-the first pick-and-place device; 3511-the first suction nozzle; 3521-the third suction nozzle; 3522-the fourth suction nozzle; 3523-the first viewer; 353-the third transfer pick-and-place device; 3531-the fifth suction nozzle; 3532-the sixth suction nozzle ; 3533-the second viewer; 354-the first transfer platform; 3541-the first feeding platform; 3542-the first receiving platform; 3543-the first driving source; 3544-the second driving source; 355-the second reprinting Taiwan; 3551-the second feeding pedestal; 3552-the second receiving pedestal; 3553-the first driving source; 3554-the second driving source; 36-the first heating plate; 37-the second heating plate.

detailed description

In order to make your examiner further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, as follows in detail:

Please refer to Fig. 3, the opposed type electronic assembly operation equipment of the present invention, it is equipped with feeding device 31, empty plate device 32, receiving device 33, operating device 34, conveying device 35 and is used for controlling and integrating each The central control unit (not shown in the figure) for the device to operate to perform automated operations; the feeding device 31 can lift and carry a plurality of trays 311, and each tray 311 can accommodate at least one electronic component to be executed. The empty tray device 32 can lift and carry a plurality of empty trays 321, and use a tray shifter 322 to transfer the empty trays of the feeding device 31 to the empty tray device 32, or transfer the empty trays on the empty tray device 32 Transfer to the material receiving device 33, the material receiving device 33 is used to accommodate at least one electronic component that has completed the operation. In this embodiment, the material receiving device 33 is respectively provided with a first-level material receiving device 331 and a second-level material receiving device 332 As well as the compound receiving device 333 of the third to sixteenth grades (described later), the operating device 34 is provided with a plurality of oppositely arranged operating areas on both sides of the machine platform 30. In this embodiment, the The first side and the second side of the machine table 30 are respectively provided with 6 operation areas 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, 34l, each operation area 34a, 34b, 34c . . A test circuit board 342 with at least one test seat 341 is provided for placing electronic components and performing test operations. The present invention can effectively reduce the occupation of the machine due to the fact that the first side and the second side of the machine are opposite to each other. table space, and easy to expand the work area to increase the test capacity; in addition, the test sockets 341 in the work areas 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, and 34l can be regular Open test sockets or normally closed test sockets, in this embodiment, each test socket 341 is a normally open test socket, in order to ensure that the electronic components to be tested maintain good electrical contact with each test socket 341, each test socket 341 The upper part is provided with a lower pressure head 343 that can be lifted and lowered to reach the electronic component to be tested; however, if each test seat 341 is a normally closed test seat, the lower pressure head 343 can be raised and lowered to open the normally closed test seat , to be placed into the electronic components to be tested; the delivery device 35 carries the electronic components to be tested or the electronic components that have completed the test between the feeding device 31, the receiving device 33 and the operating device 34, the present invention Since the working area is set opposite to the first side and the second side of the machine, the conveying device The device 35 can have a short transfer stroke to carry the electronic components to be tested or the electronic components that have completed the test between the feeding device 31, the receiving device 33 and the operating device 34; in this embodiment, the conveying device 35 is equipped with a first transfer pick-and-place device 351, a second transfer pick-and-place device 352, a third transfer pick-and-place device 353, a first transfer platform 354 and a second transfer platform 355, and the first transfer pick-and-place device 351 It is located at the front end of the machine table 30 and can move in three axes. It has first and second suction nozzles 3511 and 3512 to transfer the electronic components to be tested in the tray 311 of the feeding device 31 to the The first transfer station 354 or the second transfer station 355, and the electronic components that have completed the test operation in the first transfer station 354 or the second transfer station 355 are transferred to the receiving device 33 for classification and placement; please refer to Figures 3 and 4 , the first transfer table 354 and the second transfer table 355 of the present invention correspond to the work areas 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, 34l respectively arranged on the two sides of the machine platform 30 On the front side, the first reloading platform 354 has a first feeding platform 3541 and a first receiving platform 3542, and the first feeding platform 3541 is used for placing the electronics to be carried out by the first transfer pick-and-place device 351 for testing operations. Components, the first receiving platform 3542 is used to place the electronic components that have been transferred by the second transfer pick-and-place device 352 to complete the test operation; the second transfer platform 355 is the same as the first transfer platform 354, and has a second supply platform 3551 and the second receiving platform 3552, the second feeding platform 3551 is used to place the electronic components to be carried out by the first transfer pick-and-place device 351, and the second receiving platform 3552 is used to place the electronic components transferred by the third transfer device 351. The electronic components that have been transferred by the pick-and-place device 353 to complete the test operation; in this embodiment, the first transfer platform 354 or the second transfer platform 355 of the present invention, its first feeding platform 3541 and the first receiving platform 3542 (The second feeding pedestal 3551 and the second receiving pedestal 3552) can be driven by the first driving source 3543 (3553) to slide in a straight line, and can be driven by the second driving source 3544 (3554) to rotate at the same time, so as to test the seat 341 When the placement direction of the electronic components of the test socket 341 is different from the placement direction of the electronic components to be tested in the feeding device 31, it is used as a conversion of the corner position. When the electronic components are placed in the same direction, there is no need to rotate the first feeding pedestal 3541 and the first receiving pedestal 3542 (the second feeding pedestal 3551 and the second receiving pedestal 3552 ). Please refer to FIG. 3 and FIG. 5 , the second transfer pick-and-place device 352 and the third transfer pick-and-place device 353 correspond to the operation areas 34a, 34b, 34c, 34d, The sides of 34e, 34f, 34g, 34h, 34i, 34j, 34k, 34l, and can move in three axes; the second pick-and-place device 352 moves in the first side operation area 34a, 34b, 34c, 34d . Whether the electronic components of the operation have been removed, or check whether the electronic components to be tested in each test socket 341 are placed correctly, and the third and fourth suction nozzles 3521 and 3522 are respectively transferred from the first transfer platform 354 to be tested. electronic components into each test socket 341, and transfer the electronic components that have completed the test operation from each test socket 341 to the first transfer platform 354; the third transfer pick-and-place device 353 moves to the second side operation area 34g, Between 34h, 34i, 34j, 34k, 34l and the second transfer platform 355, it also has the fifth and sixth suction nozzles 3531, 3532 and a second viewer 3533 that can be a CCD, and the second viewer 3533 is for viewing each test Whether the electronic components that have completed the test operation in the seat 341 have been removed, or check whether the electronic components to be tested in each test seat 341 are placed correctly, the fifth and sixth suction nozzles 3531, 3532 are respectively moved from the second transfer platform 355 Carry the electronic components to be tested into each test seat 341, and transfer the electronic components that have completed the test operation from each test seat 341 to the second transfer platform 355; The first and second heating plates 36 and 37 are used for preheating the electronic components to be tested.

Please refer to FIG. 6 , the present invention uses the first pick-and-place device 351 to transfer the electronic components 40a to be tested in the tray 311 of the feeding device 31 to the first feeding platform 3541 of the first transfer platform 354 respectively. Or the second feeding platform 3551 of the second transfer platform 355 . Please refer to Fig. 7, then the first transfer table 354 and the second transfer table 355 will slide a small distance in a straight line (such as the placement direction of the electronic components of the test seat 341 and the placement direction of the electronic components to be tested in the feeding device 31 At the same time, there is no need to make the first feeding platform 3541 of the first transfer platform 354 and the first receiving platform 3542 and the second feeding platform 3551 and the second receiving platform 3552 of the second transferring platform 355 rotate), the second The transfer pick-and-place device 352 moves to the position of the first feeding platform 3541 of the first transfer table 354 to take out the electronic assembly 40a to be tested, and then moves to the operation area 34a on the first side; and the third transfer pick-and-place The device 353 then moves to the position of the second feeding platform 3551 of the second transfer platform 355 to take out another electronic component 40a to be tested, and then moves to the working area 34g on the second side. Please refer to Fig. 8, if there are electronic components that have completed the test operation in the operation area 34a on the first side, then the second transfer pick-and-place device 352 will first use the fourth suction nozzle 3522 to suck the electronic components that have completed the test operation in the test socket 341. Component 41a, and use the first viewer 3523 to check whether the electronic component that has completed the test operation in the test socket 341 has been removed, and then use the third suction nozzle 3521 to place the electronic component 40a to be tested into the test socket in the operation area 34a In 341, after the first inspector 3523 inspects whether the electronic component 40a to be tested in the test socket 341 is placed correctly, the lower pressing head 343 is pressed down to the electronic component 40a to be tested in the test socket 341, Keep it in good electrical contact with the test seat 341 to perform the test operation. As for the third pick-and-place device 353 , the same operation is performed in the operation area 34g on the second side. Please refer to Fig. 9, when the second transfer pick-and-place device 352 moves to the position of the first transfer platform 354, because the first transfer pick-and-place device 351 has transferred another electronic component 40a to be performed the test operation to the first transfer pick-and-place device 351. On the first feeding platform 3541 of the transfer platform 354, the fourth suction nozzle 3522 of the second transfer pick-and-place device 352 will place the electronic component 41a that has completed the test operation on the first material receiving platform of the first transfer platform 354 3542, at the same time take out another electronic component 40a to be tested on the first feeding platform 3541 with the third suction nozzle 3521, and then move to the working area 34b on the first side, as for the third transfer pick-and-place device 353 Then, the same operation is performed on the second transfer platform 355 . Please refer to Fig. 10, then, the first transfer pick-and-place device 351 again transfers another electronic component 40a to be tested to the first feeding platform 3541 of the first transfer platform 354, and simultaneously takes out the first transfer The electronic assembly 41a that has completed the test operation on the first receiving pedestal 3542 of the platform 354, and the electronic assembly 41a that has completed the test operation is placed in the first-level receiving device 331 or the second-level receiving device 332 according to the test results. The compound receiving device 333 of the third to sixteenth grades.

Please refer to Figure 11. Since the test grades of electronic components have been subdivided into more than ten grades, if you want to store the first to ten different grades of electronic components, you need to add more than ten receiving devices horizontally on the machine. , it is bound to make the machine body continue to expand to both sides, so that the machine body is quite large, resulting in space occupation and the lack of factory space configuration. However, if more than ten receiving devices are not added, it will not be able to cope with the increased test level, resulting in the test level. Therefore, the present invention assigns some rare test levels to the composite receiving device 333 for storage, and the composite receiving device 333 includes storage for vertical multi-layer boxes. The box 3331 is used to hold a plurality of receiving trays 3334 that can hold different grades of electronic components that complete the test operation, and a tray 3332 that is used to hold each receiving tray 3334 output by the receiving box 3331, and a tray that is used to place the Each receiving tray 3334 in the storage box 3331 is transferred to the tray shifter 3333 on the tray holder 3332. Since the storage box 3331 is an upright multi-layer box body, in order to remove each receiving tray 3334 of the storage box 3331, For sorting and placing the electronic components that have completed the test operation, the corresponding receiving tray 3334 can be moved out of the receiving tray 3331 by lifting the storage box 3331 or lifting the tray holder 3332. In this embodiment, it is a tray The lifting mode of the device 3332 is correspondingly moved out of the receiving tray 3334; the plate holder 3332 is driven up and down by the first power group 3335, and the disk transfer device 3333 is installed on the disk holder 3332, and the disk transfer device 3333 is driven by the second power group 3336 drives the lateral displacement, and the receiving trays 3334 of the storage box 3331 can be moved out to the tray holder 3332, and then driven by the tray holder 3332 to rise to an appropriate position for the first transfer pick-and-place device 351 to base on As a result of the test, the electronic components 41a that have completed the test operation are sorted and placed in the compound receiving device 333 .

The present invention utilizes the method of setting up the work area on the machine table with opposite sides, which not only can effectively shorten the transfer stroke of the conveying device, but also can achieve easy expansion of operations under the premise that the machine table can effectively reduce the space occupied by the machine table. area to increase test operation capacity.

The above description is only illustrative of the present invention, rather than restrictive. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined in the claims, but All will fall within the protection scope of the present invention.

Claims (7)

1. An opposed electronic component operation equipment, characterized in that it comprises: Feeding device: for carrying at least one electronic component to be executed; Receiving device: The receiving device is equipped with a composite receiving device, which includes a storage box that is an upright multi-layer box body, and the storage box is used to hold a plurality of boxes that can hold different levels to complete operations. A receiving tray for the electronic components of the storage box, a tray used to hold the trays removed from the storage box, and a tray transfer device used to transfer the trays in the storage box to the tray ; Working device: at least on the first side and the second side of the machine table, there are a plurality of working areas arranged in opposite directions, and each working area is respectively equipped with at least one test seat bearing seat for holding electronic components And to perform the test operation, the top of each test seat is provided with a lower pressure head to press against the electronic component to be tested or press to open the test seat; Conveying device: equipped with a first transfer pick-and-place device, a second transfer pick-and-place device, a third transfer pick-and-place device and at least one reloading platform, the first transfer pick-and-place device transfers the electronics of the feeding device to be executed. The components are transferred to the transfer table, and the electronic components that have completed the operation in the transfer table are transferred to the receiving device for classification and placement. The second transfer pick-and-place device transfers the electronic components to be executed from the transfer table to the first side for operation each bearing seat in the working area, and transfer the completed electronic components from each bearing seat in the first side operation area to the transfer platform, and the third transfer pick-and-place device transfers the electronic components to be executed from the transfer platform The electronic components are transferred to the bearing seats of the second side operation area, and the completed electronic components are transferred from each bearing seat of the second side operation area to the transfer platform; Central control unit: used to control and integrate the actions of various devices to perform automated operations. 2. The opposed type electronic assembly operation equipment according to claim 1, characterized in that: an empty tray device is also provided, the empty tray device carries a plurality of empty trays, and a tray shifter moves the trays of the feeding device The empty tray is transferred to the empty tray device, or the empty tray on the empty tray device is transferred to the receiving device. 3. The opposed type electronic component operation equipment according to claim 1, characterized in that: the plate holder is driven up and down by the first power group, and a disk shifter is installed on the disk holder, and the disk mover uses the second The two power groups drive the lateral displacement to move the receiving trays of the storage box to the tray holder, and the conveying device can sort and place the completed electronic components according to the operation results. 4. The opposed electronic component operation equipment according to claim 1, characterized in that: the conveying device is provided with a first reloading platform and a second reloading platform, and the first pick-and-place device transfers the materials to be executed in the feeding device The electronic components of the operation are transferred to the first transfer platform and the second transfer platform, and the electronic components completed by the first transfer platform and the second transfer platform are transferred to the receiving device for classification and placement, and the second transfer pick-and-place device The electronic components to be executed are transferred from the first transfer platform to each bearing seat in the first side operation area, and the electronic components that have completed the operation are transferred from each bearing seat in the first side operation area to the first side. The transfer platform, the third pick-and-place device transfers the electronic components to be executed from the second transfer platform to the bearing seats of the second side operation area, and transfers the completed electronic components from the second side operation area Transfer to the second transfer platform in each bearing seat. 5. The opposed electronic assembly operation equipment according to claim 4, characterized in that: the first reloading platform has a first feeding platform and a first receiving platform, the first feeding platform is used for placement by the first transferring platform The pick-and-place device transfers the electronic components to be executed, and the first receiving platform is used to place the completed electronic components transferred by the second transfer pick-and-place device. The second transfer platform has a second feeding platform and a second The second receiving platform, the second feeding platform is used to place the electronic components to be transferred by the first pick-and-place device, and the second receiving platform is used to place the operation completed by the third transfer pick-and-place device test electronic components. 6. The opposed electronic assembly operation equipment according to claim 5, characterized in that: the first feeding platform, the first receiving platform of the first transfer platform, the second feeding platform, the second receiving platform of the second transferring platform The two receiving pedestals are driven by the first driving source to slide in a straight line, and are driven to rotate by the second driving source, so that when the placement direction of the electronic components on the receiving seat is different from the placement direction of the electronic components to be executed in the feeding device , used as the transformation of the angle position. 7. The opposed type electronic component processing equipment according to claim 1, further comprising a viewer provided on the second pick-and-place device and the third pick-and-place device of the conveying device for viewing Whether the completed electronic components in each seat have been removed, or check whether the electronic components to be executed in each seat are placed correctly.