CN103852598B - 具有针对热力学应力低敏感度的微机电结构 - Google Patents
具有针对热力学应力低敏感度的微机电结构 Download PDFInfo
- Publication number
- CN103852598B CN103852598B CN201310651898.4A CN201310651898A CN103852598B CN 103852598 B CN103852598 B CN 103852598B CN 201310651898 A CN201310651898 A CN 201310651898A CN 103852598 B CN103852598 B CN 103852598B
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- China
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- inspection quality
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- elastic element
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/006—Details of instruments used for thermal compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/058—Rotation out of a plane parallel to the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/705,680 | 2012-12-05 | ||
US13/705,680 US9176157B2 (en) | 2012-12-05 | 2012-12-05 | Micro-electromechanical structure with low sensitivity to thermo-mechanical stress |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103852598A CN103852598A (zh) | 2014-06-11 |
CN103852598B true CN103852598B (zh) | 2018-11-20 |
Family
ID=50726142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310651898.4A Expired - Fee Related CN103852598B (zh) | 2012-12-05 | 2013-12-05 | 具有针对热力学应力低敏感度的微机电结构 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9176157B2 (zh) |
CN (1) | CN103852598B (zh) |
DE (1) | DE102013111787A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110308308A (zh) * | 2019-06-27 | 2019-10-08 | 深迪半导体(上海)有限公司 | 一种带补偿电极的面内平动式加速度计 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9927459B2 (en) | 2013-11-06 | 2018-03-27 | Analog Devices, Inc. | Accelerometer with offset compensation |
JP6655281B2 (ja) * | 2014-08-19 | 2020-02-26 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
US10203351B2 (en) * | 2014-10-03 | 2019-02-12 | Analog Devices, Inc. | MEMS accelerometer with Z axis anchor tracking |
CN105699693B (zh) * | 2014-12-11 | 2019-04-12 | 意法半导体股份有限公司 | 具有减少漂移功能的z轴微机电检测结构 |
US9840409B2 (en) * | 2015-01-28 | 2017-12-12 | Invensense, Inc. | Translating Z axis accelerometer |
US10203352B2 (en) | 2016-08-04 | 2019-02-12 | Analog Devices, Inc. | Anchor tracking apparatus for in-plane accelerometers and related methods |
US10261105B2 (en) | 2017-02-10 | 2019-04-16 | Analog Devices, Inc. | Anchor tracking for MEMS accelerometers |
JP2019045171A (ja) | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
JP2019045170A (ja) * | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
JP2019045172A (ja) * | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
US10571268B2 (en) | 2017-11-30 | 2020-02-25 | Invensense, Inc. | MEMS sensor with offset anchor load rejection |
US11415595B2 (en) | 2019-06-28 | 2022-08-16 | Analog Devices, Inc. | Multiple anchor high frequency accelerometer |
JP2021006794A (ja) * | 2019-06-28 | 2021-01-21 | セイコーエプソン株式会社 | 慣性センサー、電子機器および移動体 |
CN110501522B (zh) * | 2019-09-16 | 2022-10-11 | 上海矽睿科技股份有限公司 | 一种微机电系统的电容式加速度计 |
CN110824196B (zh) * | 2019-11-18 | 2023-10-03 | 中国兵器工业集团第二一四研究所苏州研发中心 | 对应力不敏感的mems电容式z轴加速度计 |
US20220050124A1 (en) * | 2020-08-17 | 2022-02-17 | Nxp Usa, Inc. | Inertial sensor with split anchors and flexure compliance between the anchors |
CN114264844B (zh) * | 2021-12-21 | 2024-07-09 | 苏州感测通信息科技有限公司 | 一种具有应力补偿功能的mems加速度计 |
CN114487480A (zh) * | 2022-01-14 | 2022-05-13 | 瑞声开泰科技(武汉)有限公司 | 微机电系统加速度计 |
CN117509529B (zh) * | 2023-12-28 | 2024-03-08 | 苏州敏芯微电子技术股份有限公司 | 惯性传感器结构与惯性传感器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6230567B1 (en) * | 1999-08-03 | 2001-05-15 | The Charles Stark Draper Laboratory, Inc. | Low thermal strain flexure support for a micromechanical device |
CN101987718A (zh) * | 2009-07-31 | 2011-03-23 | 意法半导体股份有限公司 | 具有低的热漂移的微机电z轴探测结构 |
CN102602875A (zh) * | 2011-01-24 | 2012-07-25 | 飞思卡尔半导体公司 | 具有折叠扭力弹簧的mems传感器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7140250B2 (en) * | 2005-02-18 | 2006-11-28 | Honeywell International Inc. | MEMS teeter-totter accelerometer having reduced non-linearty |
-
2012
- 2012-12-05 US US13/705,680 patent/US9176157B2/en active Active
-
2013
- 2013-10-25 DE DE201310111787 patent/DE102013111787A1/de not_active Withdrawn
- 2013-12-05 CN CN201310651898.4A patent/CN103852598B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6230567B1 (en) * | 1999-08-03 | 2001-05-15 | The Charles Stark Draper Laboratory, Inc. | Low thermal strain flexure support for a micromechanical device |
CN101987718A (zh) * | 2009-07-31 | 2011-03-23 | 意法半导体股份有限公司 | 具有低的热漂移的微机电z轴探测结构 |
CN102602875A (zh) * | 2011-01-24 | 2012-07-25 | 飞思卡尔半导体公司 | 具有折叠扭力弹簧的mems传感器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110308308A (zh) * | 2019-06-27 | 2019-10-08 | 深迪半导体(上海)有限公司 | 一种带补偿电极的面内平动式加速度计 |
CN110308308B (zh) * | 2019-06-27 | 2021-07-13 | 深迪半导体(绍兴)有限公司 | 一种带补偿电极的面内平动式加速度计 |
Also Published As
Publication number | Publication date |
---|---|
US9176157B2 (en) | 2015-11-03 |
DE102013111787A1 (de) | 2014-06-05 |
CN103852598A (zh) | 2014-06-11 |
US20140298909A1 (en) | 2014-10-09 |
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Effective date of registration: 20180806 Address after: Ohio, USA Applicant after: Hanking Microelectronics Co.,Ltd. Address before: California, USA Applicant before: Maxim Integrated Products, Inc. |
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Effective date of registration: 20231120 Address after: Room A, 12th Floor, 300 Lockhart Road, Wan Chai, Hong Kong, China Patentee after: Hanwang Microelectronics Hong Kong Ltd. Address before: Ohio, USA Patentee before: Hanking Microelectronics Co.,Ltd. |
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