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CN103811290A - 一种液体喷洒回收装置 - Google Patents

一种液体喷洒回收装置 Download PDF

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CN103811290A
CN103811290A CN201210455236.5A CN201210455236A CN103811290A CN 103811290 A CN103811290 A CN 103811290A CN 201210455236 A CN201210455236 A CN 201210455236A CN 103811290 A CN103811290 A CN 103811290A
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卢继奎
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Shenyang Solidtool Co Ltd
Shenyang Xinyuan Microelectronics Equipment Co Ltd
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Priority to PCT/CN2013/084950 priority patent/WO2014075524A1/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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Abstract

本发明属于半导体行业晶片湿法处理领域,具体地说是一种回收从晶片上甩落液体的液体喷洒回收装置,本发明中有与升降气缸连接的内层防护罩,可以根据使用液体的不同选择上升或下降;另外外层防护罩上装有晶片位置检测器,可通过装有伸缩气缸的支撑台的升降来检测晶片的位置。当连接支撑台的伸缩气缸处于伸出状态时,支撑台处于上位,可通过外部机械手将晶片放在支撑台上,然后伸缩气缸收缩,支撑台下降,在下降过程中外层防护罩上装有晶片位置检测器检测晶片的位置是否正确,当晶片位置出现偏差时,晶片位置检测器发出信号。可以防止支撑台旋转时将晶片甩出。在支撑台下方有一排气环,可以向腔体内排除保护气体,防止连接支撑台的电机受腐蚀。

Description

一种液体喷洒回收装置
技术领域
本发明属于半导体行业晶片湿法处理领域,具体地说是一种回收从晶片上甩落液体的液体喷洒回收装置。
背景技术
目前,湿法处理晶片采用非真空的方式夹持,在晶片放置在支撑台的过程中可能会因为误差将晶片放偏,当支撑台旋转时晶片很容易被甩出,从而产生危险。另外,湿法处理晶片大多采用腐蚀性液体,会对设备安全产生影响。
发明内容
为了解决非真空方式夹持晶片存在因晶片放偏而被甩出的问题,本发明的目的在于提供一种液体喷洒回收装置。该体喷洒回收装置可以检测晶片在支撑台上的位置是否偏移,同时设置内外防护罩,通过改变内层防护罩的升降状态回收处理晶片的液体。
本发明的另一目的在于提供一种液体喷洒回收装置。该体喷洒回收装置可以向腔体内吹保护气体,防止连接支撑台的主轴电机受腐蚀。
本发明的目的是通过以下技术方案来实现的:
本发明包括内层防护罩、外层防护罩、晶片检测器、支撑台、支撑板、升降气缸、伸缩气缸、底板及主轴电机,其中支撑板及伸缩气缸分别位于底板的下方、并分别连接于底板上,所述主轴电机连接于伸缩气缸的输出端,主轴电机的输出端由所述底板穿过、连接有放置晶片的支撑台,该放置晶片的支撑台由主轴电机驱动旋转、并随主轴电机通过伸缩气缸驱动升降;所述内层防护罩及外层防护罩由内向外依次设在支撑台的外围,外层防护罩安装在所述底板上,内层防护罩与安装在支撑板上的升降气缸的输出端相连,通过升降气缸驱动升降;所述内层防护罩及外层防护罩的顶部均开有供支撑台升降的孔,在外层防护罩上孔的边缘设有检测晶片位置的晶片检测器。
其中:所述主轴电机的输出端上安装有排气环,该排气环上沿轴向设有向内层防护罩内部腔体吹出气体的气孔,所述气孔与气源相连通;所述气孔为至少两个,每个气孔均与气源相连通;由所述气孔吹出的清洁干燥气体通过主轴电机与底板之间的间隙进入内层防护罩内部腔体;所述晶片检测器上设有向晶片检测器顶部吹出气体的气管,该气管的一端与气源相连通,另一端向晶片检测器的顶部弯折;所述外层防护罩上孔的边缘设有一对对称设置的晶片检测器,两个晶片检测器之间的连接经过所述孔及晶片的圆心;所述内层防护罩及外层防护罩的顶部均为锥台形,内部中空,内层防护罩、外层防护罩、支撑台及主轴电机同心设置;所述支撑台的边缘沿周向均布有多个定位晶片的挡柱;所述内层防护罩通过导柱与升降气缸的输出端相连。
本发明的优点与积极效果为:
1.本发明在外层防护罩顶部有一对晶片检测器,晶片放在支撑台后,支撑台下降,晶片检测器发出的光线会被晶片阻挡,根据晶片阻挡的光线的强弱可以判定晶片是否放平,位置是否准确,防止碎片;内层防护罩通过导柱和支撑板与升降气缸相连,外层防护罩安置在内层防护罩外侧,通过改变内层防护罩的升降状态可以控制从晶片甩落液体的流向。
2.本发明中与支撑台连接的主轴电机外圈有一排气环,该排气环上有不少于两个的气孔,从气孔可以吹出清洁干燥的气体,这些气体可以对腔体的器件起到保护作用。
3.本发明在每个晶片检测器旁都有一个气管,该气管可以对准晶片检测器顶部吹出干燥清洁的气体,可以对晶片检测器起到保护的作用。
4.本发明的支撑台可以通过伸缩气缸进行升降,可以采用机械手将晶片传递到支撑台。
附图说明
图1为本发明的整体立体结构示意图;
图2为本发明在机械手送晶片时的结构剖视图;
图3为本发明支撑台处在工作位置的结构剖视图;
图4为本发明内层防护罩处在上升位置的结构剖视图;
其中:1A为内层防护罩,1B为外层防护罩,2为晶片,3为晶片位置检测器,4为支撑台,5为排气环,6为导柱,7为支撑板,8为升降气缸,9为伸缩气缸,10为气管,11为底板,12为主轴电机,13为连接件。
具体实施方式
下面结合附图对本发明作进一步详述。
如图1、图2所示,本发明包括包括内层防护罩1A、外层防护罩1B、晶片检测器3、支撑台4、排气环5、导柱6、支撑板7、升降气缸8、伸缩气缸9、气管10、底板11及主轴电机12,其中支撑板7及伸缩气缸9分别位于底板11的下方、并分别连接于底板11上;主轴电机12通过连接件13连接于伸缩气缸9的输出端,主轴电机12的输出端由所述底板11穿过、连接有放置晶片2的支撑台4,在支撑台4的边缘沿周向均布有多个定位晶片2的挡柱,放置晶片2的支撑台4由主轴电机12驱动旋转、并随主轴电机12通过伸缩气缸9驱动升降。
内层防护罩1A及外层防护罩1B由内向外依次设在支撑台4的外围,内层防护罩1A及外层防护罩1B的顶部均为锥台形,内部中空,内层防护罩1A、外层防护罩1B、支撑台4及主轴电机12同心设置。内层防护罩1A及外层防护罩1B的顶部均开有供支撑台4升降的孔,在外层防护罩1B上孔的边缘设有检测晶片2位置的晶片检测器3;本实施例是在外层防护罩1B上孔的边缘设有一对对称设置的晶片检测器3,两个晶片检测器3之间的连接经过所述孔及晶片2的圆心;每个晶片检测器3上均设有向晶片检测器3顶部吹出干燥清洁气体的气管10,该气管10的一端与气源相连通,另一端向晶片检测器3的顶部弯折,气管10吹出的气体可以对晶片检测器3起到保护的作用。
外层防护罩1B安装在底板11上,内层防护罩1A通过导柱6与安装在支撑板7上的升降气缸8的输出端相连,通过升降气缸8驱动升降。在主轴电机12的输出端上安装有排气环5,该排气环5上沿轴向设有向内层防护罩1A内部腔体吹出气体的气孔,所述气孔为至少两个,每个气孔均与气源相连通,由所述气孔吹出的清洁干燥气体通过主轴电机12与底板11之间的间隙进入内层防护罩1A内部腔体,这些气体可以对腔体的器件起到保护作用。
本发明的工作原理为:
如图1所示,当伸缩气缸9处于伸出状态时支撑台4处于最高位置,机械手将晶片放置在支撑台4上,伸缩气缸9收缩带动支撑台4下降;下降的同时一对晶片位置检测器3发出光线,其中一个位置检测器3发出光线,另一晶片位置检测器3接收光线,晶片2下降时会挡住一对位置检测器3中间的光线,晶片位置检测器3会将晶片2挡住的光线大小与晶片2正常放置时挡住的光线大小进行对比,如果有偏差则说明晶片2在支撑台4上的位置有偏差,会给控制系统(本发明的控制系统为现有技术)一个信号进行报警,如果两个光线对比无偏差则晶片2在支撑台4上的位置准确,则可以进行下一工艺步骤。
晶片2准确放置在支撑台4上后,伸缩气缸9收缩带动支撑台4下降到最低端,此时主轴电机12带动支撑台4和晶片2旋转,外部结构对晶片2表面喷洒液体;升降气缸8通过支撑板7与导柱6相连,导柱6的另一端与内层防护罩1a相连,升降气缸8可以平滑的来控制内层防护罩1a的上升下降状态。当内层防护罩1a处在下降状态时,如图3所示,喷洒的液体会从内层防护罩1a外侧流出,当内层防护罩1a处在上升状态时喷洒的液体会从内层防护罩1a内侧流出,如图4所示。
在外部结构对晶片2喷洒液体时,排气环5会给腔体内喷出洁净干燥的气体,防止喷洒的液体产生的雾靠近主轴电机12,从而对主轴电机12起到保护的作用。另外在晶片位置检测器3的旁边有一气管10,在给晶片2喷洒液体时,液体会溅落在晶片位置检测器3上,会影响晶片位置检测器3产生的光线的强度和发射方向,从而会引起晶片位置检测器3误报警。

Claims (8)

1.一种液体喷洒回收装置,其特征在于:包括内层防护罩(1A)、外层防护罩(1B)、晶片检测器(3)、支撑台(4)、支撑板(7)、升降气缸(8)、伸缩气缸(9)、底板(11)及主轴电机(12),其中支撑板(7)及伸缩气缸(9)分别位于底板(11)的下方、并分别连接于底板(11)上,所述主轴电机(12)连接于伸缩气缸(9)的输出端,主轴电机(12)的输出端由所述底板(11)穿过、连接有放置晶片(2)的支撑台(4),该放置晶片(2)的支撑台(4)由主轴电机(12)驱动旋转、并随主轴电机(12)通过伸缩气缸(9)驱动升降;所述内层防护罩(1A)及外层防护罩(1B)由内向外依次设在支撑台(4)的外围,外层防护罩(1B)安装在所述底板(11)上,内层防护罩(1A)与安装在支撑板(7)上的升降气缸(8)的输出端相连,通过升降气缸(8)驱动升降;所述内层防护罩(1A)及外层防护罩(1B)的顶部均开有供支撑台(4)升降的孔,在外层防护罩(1B)上孔的边缘设有检测晶片(2)位置的晶片检测器(3)。
2.按权利要求1所述液体喷洒回收装置,其特征在于:所述主轴电机(12)的输出端上安装有排气环(5),该排气环(5)上沿轴向设有向内层防护罩(1A)内部腔体吹出气体的气孔,所述气孔与气源相连通。
3.按权利要求2所述液体喷洒回收装置,其特征在于:所述气孔为至少两个,每个气孔均与气源相连通;由所述气孔吹出的清洁干燥气体通过主轴电机(12)与底板(11)之间的间隙进入内层防护罩(1A)内部腔体。
4.按权利要求1或2所述液体喷洒回收装置,其特征在于:所述晶片检测器(3)上设有向晶片检测器(3)顶部吹出气体的气管(10),该气管(10)的一端与气源相连通,另一端向晶片检测器(3)的顶部弯折。
5.按权利要求1或2所述液体喷洒回收装置,其特征在于:所述外层防护罩(1B)上孔的边缘设有一对对称设置的晶片检测器(3),两个晶片检测器(3)之间的连接经过所述孔及晶片(2)的圆心。
6.按权利要求1或2所述液体喷洒回收装置,其特征在于:所述内层防护罩(1A)及外层防护罩(1B)的顶部均为锥台形,内部中空,内层防护罩(1A)、外层防护罩(1B)、支撑台(4)及主轴电机(12)同心设置。
7.按权利要求1或2所述液体喷洒回收装置,其特征在于:所述支撑台(4)的边缘沿周向均布有多个定位晶片(2)的挡柱。
8.按权利要求1或2所述液体喷洒回收装置,其特征在于:所述内层防护罩(1A)通过导柱(6)与升降气缸(8)的输出端相连。
CN201210455236.5A 2012-11-13 2012-11-13 一种液体喷洒回收装置 Pending CN103811290A (zh)

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CN109701943A (zh) * 2019-01-22 2019-05-03 上海提牛机电设备有限公司 一种晶片清洗盆
CN110420803A (zh) * 2019-06-25 2019-11-08 泉州丰泽如通机械设计有限公司 一种活动式催干式传感器密封设备
CN110420803B (zh) * 2019-06-25 2020-12-11 德清县诚达金属材料有限公司 一种活动式催干式传感器密封设备

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