CN103805127A - High-temperature-resisting epoxy organic silicon pouring sealant and preparation method thereof - Google Patents
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Abstract
一种耐高温环氧有机硅灌封胶及其制备方法，它涉及一种灌封胶及其制备方法。本发明的目的是要解决现有灌封胶存在的不能同时兼具韧性好、耐热性高和粘接性好的问题。一种耐高温环氧有机硅灌封胶由环氧有机硅树脂、活性有机硅填料，固化剂、固化促进剂、稀释剂和消泡剂制备而成；制备方法：一、制备环氧有机硅树脂；二、制备活性有机硅填料；三、称取；四、混合。提供了环氧有机硅树脂和活性有机硅填料的制备方法，将制备的环氧有机硅树脂和活性有机硅填料作为本发明的原料，制备的环氧有机硅灌封胶粘度低，浸润性好，固化产物兼具韧性和耐热性，灌封件的质量稳定。本发明可获得一种耐高温环氧有机硅灌封胶。
A high-temperature-resistant epoxy silicone potting glue and a preparation method thereof, which relate to a potting glue and a preparation method thereof. The purpose of the present invention is to solve the problem that the existing potting compound cannot simultaneously have good toughness, high heat resistance and good adhesion. A high temperature resistant epoxy silicone potting adhesive is prepared from epoxy silicone resin, active silicone filler, curing agent, curing accelerator, diluent and defoamer; preparation method: 1. Preparation of epoxy silicone Resin; 2. Preparation of active silicone filler; 3. Weighing; 4. Mixing. The preparation method of epoxy silicone resin and active silicone filler is provided, and the prepared epoxy silicone resin and active silicone filler are used as raw materials of the present invention, and the prepared epoxy silicone potting adhesive has low viscosity and wettability Well, the cured product has both toughness and heat resistance, and the quality of the potting parts is stable. The invention can obtain a high temperature resistant epoxy silicone potting glue.
Description
Technical field
The present invention relates to a kind of joint sealant and preparation method thereof.
Background technology
Epoxy resin, organosilicon and urethane are most widely used three major types in joint sealant.Wherein the feature of epoxy resin encapsulated material be that shrinking percentage is little, no coupling product, good electrical insulation capability, but be subject to the restriction of molecular structure itself, toughness is poor and thermotolerance is not high.The features such as add-on type liquid silicon rubber has no coupling product when crosslinked and discharges, and shrinking percentage is little, and cross-linking density and vulcanization rate are easy to control are also the conventional body materials of joint sealant.But addition-type silicon rubber is because molecule itself is nonpolar, cementability is poor, and while use as Embedding Material, moisture can infiltrate device inside by the space between rubber and base material and cause corrosion and failure of insulation.
Along with the development of technology, the requirement of the performance of every profession and trade to joint sealant is more and more higher, and existing joint sealant exists and can not have good toughness, thermotolerance is high and cementability is good problem simultaneously concurrently.
Summary of the invention
The object of the invention is to solve that existing joint sealant exists can not have good toughness, thermotolerance is high and cementability is good problem concurrently simultaneously, and a kind of fire resistant epoxy organic silicon potting adhesive and preparation method thereof is provided.
A kind of fire resistant epoxy organic silicon potting adhesive is prepared from by 100 parts～150 parts epoxy silicone resins, 10 parts～55 parts active organosilicon fillers, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers by weight.
A kind of preparation method of fire resistant epoxy organic silicon potting adhesive specifically completes according to the following steps:
One, prepare epoxy silicone resin: take by weight 30 parts～80 parts organosilicon sources, 10 parts～40 parts water, 20 parts～100 parts epoxy resin and 40 parts～80 parts solvents; First 30 parts～80 parts organosilicon sources and 10 parts～40 parts water are mixed, be to react 1h～5h at 50 ℃～100 ℃ in temperature, obtain mixed solution, then under being 70 ℃～100 ℃ and pressure 1kPa～10kPa, temperature removes water in mixed solution and the alcohols material of generation, add again 20 parts～100 parts epoxy resin and 40 parts～80 parts solvents, be to react 2h～4h at 60 ℃～100 ℃ in temperature, underpressure distillation desolvation, obtains epoxy silicone resin; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is one or more the mixture in dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, vinyltriethoxysilane, phenylbenzene diethoxy silane and methyl triacetoxysilane; Described solvent is one or more the mixed solution in toluene, methylethylketone, ethyl acetate, ethanol, acetone, tetrahydrofuran (THF) and dimethylbenzene; Described epoxy resin is one or more the mixture in bisphenol-A type epoxy resin E-44, E-51 and E-54;
Two, prepare active organosilicon filler: take by weight 30 parts～80 parts organosilicon sources, 10 parts～40 parts water and 5 parts～20 parts tetraethoxys; 30 parts～80 parts organosilicon sources and 10 parts～40 parts water that take are mixed, and are to react 1h～5h at 50 ℃～100 ℃ in temperature, naturally cool to 30 ℃～60 ℃, then drip 5 parts～20 parts tetraethoxys, obtain gel; By gel vacuum-drying 10h～20h at 20 ℃～30 ℃, obtain active organosilicon filler; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is one or more the mixture in dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, vinyltriethoxysilane, phenylbenzene diethoxy silane and methyl triacetoxysilane;
Three, take: the epoxy silicone resin being obtained by 100 parts～150 parts step 1 by weight, 10 parts～55 parts active organosilicon filler, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers that step 2 obtains;
Four, mix: the epoxy silicone resin that 100 parts～150 parts step 1 that step 1 is taken obtain, 10 parts～55 parts active organosilicon filler, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers mixing that step 2 obtains, obtain fire resistant epoxy organic silicon potting adhesive;
Thinner described in step 3 is 1,4-butanediol diglycidyl ether, ethylene glycol diglycidylether, resorcinol diglycidyl ether, 1, the mixture of one or more in 6-hexanediol diglycidyl ether, o-tolyl glycidyl ether and neopentylglycol diglycidyl ether;
Defoamer described in step 3 is the defoamer that model that German Di Gao company produces is airex940.
Advantage of the present invention: the preparation method who, the invention provides epoxy silicone resin and active organosilicon filler, using preparation epoxy silicone resin and active organosilicon filler as raw material of the present invention, epoxy organosilicon joint sealant viscosity prepared by the present invention is low, wetting property is good, cured product has toughness and thermotolerance concurrently, the steady quality of embedding part, initial decomposition temperature of the present invention is 393 ℃～410 ℃, in the time of 25 ℃, shearing resistance is 23MPa～26MPa; Two, the present invention combines the adhesiveproperties of organosilyl high heat resistance and epoxy resin excellence, increase the toughness in epoxy resin by flexible organosilicon segment, the good adhesiveproperties of retaining ring epoxy resins and base material simultaneously, add again active organosilicon filler, prepare and there is excellent toughness, simultaneously the fire resistant epoxy organic silicon potting adhesive of thermotolerance and adhesiveproperties excellence.
The present invention can obtain a kind of fire resistant epoxy organic silicon potting adhesive.
Accompanying drawing explanation
Fig. 1 is the infrared spectrum of the epoxy silicone resin that obtains of test one step 1.
Embodiment
Embodiment one: present embodiment is that a kind of fire resistant epoxy organic silicon potting adhesive is prepared from by 100 parts～150 parts epoxy silicone resins, 10 parts～55 parts active organosilicon fillers, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers by weight.
The advantage of present embodiment: one, present embodiment provides the preparation method of epoxy silicone resin and active organosilicon filler, using the epoxy silicone resin of preparation and active organosilicon filler as the raw material of present embodiment, epoxy organosilicon joint sealant viscosity prepared by present embodiment is low, wetting property is good, cured product has toughness and thermotolerance concurrently, the steady quality of embedding part, present embodiment initial decomposition temperature is 393 ℃～410 ℃, in the time of 25 ℃, shearing resistance is 23MPa～26MPa; Two, present embodiment combines the adhesiveproperties of organosilyl high heat resistance and epoxy resin excellence, increase the toughness in epoxy resin by flexible organosilicon segment, the good adhesiveproperties of retaining ring epoxy resins and base material simultaneously, add again active organosilicon filler, prepare and there is excellent toughness, simultaneously the fire resistant epoxy organic silicon potting adhesive of thermotolerance and adhesiveproperties excellence.
Present embodiment can obtain a kind of fire resistant epoxy organic silicon potting adhesive.
Embodiment two: present embodiment and embodiment one difference are: described epoxy silicone resin is prepared according to the following steps:
Take by weight 30 parts～80 parts organosilicon sources, 10 parts～40 parts water, 20 parts～100 parts epoxy resin and 40 parts～80 parts solvents; First 30 parts～80 parts organosilicon sources and 10 parts～40 parts water are mixed, be to react 1h～5h at 50 ℃～100 ℃ in temperature, obtain mixed solution, then under being 70 ℃～100 ℃ and pressure 1kPa～10kPa, temperature removes water in mixed solution and the alcohols material of generation, add again 20 parts～100 parts epoxy resin and 40 parts～80 parts solvents, be to react 2h～4h at 60 ℃～100 ℃ in temperature, underpressure distillation desolvation, obtains epoxy silicone resin; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is one or more the mixture in dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, vinyltriethoxysilane, phenylbenzene diethoxy silane and methyl triacetoxysilane; Described solvent is one or more the mixed solution in toluene, methylethylketone, ethyl acetate, ethanol, acetone, tetrahydrofuran (THF) and dimethylbenzene; Described epoxy resin is one or more the mixture in bisphenol-A type epoxy resin E-44, E-51 and E-54.Other steps are identical with embodiment one.
Embodiment three: one of present embodiment and embodiment one or two difference is: described active organosilicon filler is specifically prepared according to the following steps:
Take by weight 30 parts～80 parts organosilicon sources, 10 parts～40 parts water and 5 parts～20 parts tetraethoxys; 30 parts～80 parts organosilicon sources and 10 parts～40 parts water that take are mixed, and are to react 1h～5h at 50 ℃～100 ℃ in temperature, naturally cool to 30 ℃～60 ℃, then drip 5 parts～20 parts tetraethoxys, obtain gel; By gel vacuum-drying 10h～20h at 20 ℃～30 ℃, obtain active organosilicon filler; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is one or more the mixture in dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, vinyltriethoxysilane, phenylbenzene diethoxy silane and methyl triacetoxysilane.Other steps are identical with embodiment one or two.
Embodiment four: one of present embodiment and embodiment one to three difference is: described solidifying agent is 4,4-diaminodiphenyl oxide, 4,4-diaminodiphenylsulfone(DDS), methyl tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride or methyl carbic anhydride.Other steps are identical with embodiment one to three.
Embodiment five: one of present embodiment and embodiment one to four difference is: described curing catalyst is 2,4,6-tri-(dimethylamino methyl) phenol, Resorcinol, oxine, dimethyl benzylamine, 2-ethyl-4-methylimidazole or glyoxal ethyline.Other steps are identical with embodiment one to four.
Embodiment six: one of present embodiment and embodiment one to five difference is: described thinner is 1,4-butanediol diglycidyl ether, ethylene glycol diglycidylether, resorcinol diglycidyl ether, 1, the mixture of one or more in 6-hexanediol diglycidyl ether, o-tolyl glycidyl ether and neopentylglycol diglycidyl ether.Other steps are identical with embodiment one to five.
Embodiment seven: one of present embodiment and embodiment one to six difference is: described defoamer is the defoamer that model that German Di Gao company produces is airex940.Other steps are identical with embodiment one to six.
Embodiment eight: present embodiment is a kind of preparation method of fire resistant epoxy organic silicon potting adhesive, specifically completes according to the following steps:
One, prepare epoxy silicone resin: take by weight 30 parts～80 parts organosilicon sources, 10 parts～40 parts water, 20 parts～100 parts epoxy resin and 40 parts～80 parts solvents; First 30 parts～80 parts organosilicon sources and 10 parts～40 parts water are mixed, be to react 1h～5h at 50 ℃～100 ℃ in temperature, obtain mixed solution, then under being 70 ℃～100 ℃ and pressure 1kPa～10kPa, temperature removes water in mixed solution and the alcohols material of generation, add again 20 parts～100 parts epoxy resin and 40 parts～80 parts solvents, be to react 2h～4h at 60 ℃～100 ℃ in temperature, underpressure distillation desolvation, obtains epoxy silicone resin; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is one or more the mixture in dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, vinyltriethoxysilane, phenylbenzene diethoxy silane and methyl triacetoxysilane; Described solvent is one or more the mixed solution in toluene, methylethylketone, ethyl acetate, ethanol, acetone, tetrahydrofuran (THF) and dimethylbenzene; Described epoxy resin is one or more the mixture in bisphenol-A type epoxy resin E-44, E-51 and E-54;
Two, prepare active organosilicon filler: take by weight 30 parts～80 parts organosilicon sources, 10 parts～40 parts water and 5 parts～20 parts tetraethoxys; 30 parts～80 parts organosilicon sources and 10 parts～40 parts water that take are mixed, and are to react 1h～5h at 50 ℃～100 ℃ in temperature, naturally cool to 30 ℃～60 ℃, then drip 5 parts～20 parts tetraethoxys, obtain gel; By gel vacuum-drying 10h～20h at 20 ℃～30 ℃, obtain active organosilicon filler; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is one or more the mixture in dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, vinyltriethoxysilane, phenylbenzene diethoxy silane and methyl triacetoxysilane;
Three, take: the epoxy silicone resin being obtained by 100 parts～150 parts step 1 by weight, 10 parts～55 parts active organosilicon filler, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers that step 2 obtains;
Four, mix: the epoxy silicone resin that 100 parts～150 parts step 1 that step 1 is taken obtain, 10 parts～55 parts active organosilicon filler, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers mixing that step 2 obtains, obtain fire resistant epoxy organic silicon potting adhesive;
Thinner described in step 3 is 1,4-butanediol diglycidyl ether, ethylene glycol diglycidylether, resorcinol diglycidyl ether, 1, the mixture of one or more in 6-hexanediol diglycidyl ether, o-tolyl glycidyl ether and neopentylglycol diglycidyl ether;
Defoamer described in step 3 is the defoamer that model that German Di Gao company produces is airex940.
The advantage of present embodiment: one, present embodiment provides the preparation method of epoxy silicone resin and active organosilicon filler, using the epoxy silicone resin of preparation and active organosilicon filler as the raw material of present embodiment, epoxy organosilicon joint sealant viscosity prepared by present embodiment is low, wetting property is good, cured product has toughness and thermotolerance concurrently, the steady quality of embedding part, present embodiment initial decomposition temperature is 393 ℃～410 ℃, in the time of 25 ℃, shearing resistance is 23MPa～26MPa; Two, present embodiment combines the adhesiveproperties of organosilyl high heat resistance and epoxy resin excellence, increase the toughness in epoxy resin by flexible organosilicon segment, the good adhesiveproperties of retaining ring epoxy resins and base material simultaneously, add again active organosilicon filler, prepare and there is excellent toughness, simultaneously the fire resistant epoxy organic silicon potting adhesive of thermotolerance and adhesiveproperties excellence.
Present embodiment can obtain a kind of fire resistant epoxy organic silicon potting adhesive.
Embodiment nine: present embodiment and embodiment eight differences are: the curing catalyst described in step 3 is 2,4,6-tri-(dimethylamino methyl) phenol, Resorcinol, oxine, dimethyl benzylamine, 2-ethyl-4-methylimidazole or glyoxal ethyline.Other steps are identical with embodiment eight.
Embodiment ten: one of present embodiment and embodiment eight or nine difference is: the solidifying agent described in step 3 is 4,4-diaminodiphenyl oxide, 4,4-diaminodiphenylsulfone(DDS), methyl tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride or methyl carbic anhydride.Other steps are identical with embodiment eight or nine.
Adopt following verification experimental verification beneficial effect of the present invention:
Test one: a kind of preparation method of fire resistant epoxy organic silicon potting adhesive, specifically completes according to the following steps:
One, prepare epoxy silicone resin: take by weight 50 parts of organosilicon sources, 10 parts of water, 90 parts of epoxy resin and 50 parts of solvents; First 50 parts of organosilicon sources and 10 parts of water are mixed, be to react 5h at 80 ℃ in temperature, obtain mixed solution, then under being 100 ℃ and pressure 1kPa, temperature removes water in mixed solution and the alcohols material of generation, add again 90 parts of epoxy resin and 50 parts of solvents, be to react 2h at 90 ℃ in temperature, underpressure distillation desolvation, obtains epoxy silicone resin; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is the mixture of dimethyldiethoxysilane, Union carbide A-162, methyl triacetoxysilane; Described solvent is ethyl acetate; Described epoxy resin is the mixture of bisphenol-A type epoxy resin E-44 and E-51;
Two, prepare active organosilicon filler: take by weight 40 parts of organosilicon sources, 15 parts of water and 5 parts of tetraethoxys; The 40 parts of organosilicon sources and the 15 parts of water that take are mixed, and are to react 5h at 70 ℃ in temperature, naturally cool to 40 ℃, then drip 5 parts of tetraethoxys, obtain gel; By gel vacuum-drying 15h at 25 ℃, obtain active organosilicon filler; Wherein, described organosilicon source is γ-aminopropyl triethoxysilane and organosilane monomer compositions of mixtures; Described organosilane monomer mixture is the mixture of methyl triacetoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane and vinyltriethoxysilane;
Three, take: the epoxy silicone resin being obtained by 100 parts～150 parts step 1 by weight, 10 parts～55 parts active organosilicon filler, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers that step 2 obtains;
Four, mix: the epoxy silicone resin that 100 parts～150 parts step 1 that step 1 is taken obtain, 10 parts～55 parts active organosilicon filler, 25 parts～70 parts solidifying agent, 1 part～3 parts curing catalysts, 10 parts～50 parts thinners and 0.5 part～3 parts defoamers mixing that step 2 obtains, obtain fire resistant epoxy organic silicon potting adhesive;
Thinner described in step 3 is the mixture of BDDE and ethylene glycol diglycidylether;
Defoamer described in step 3 is the defoamer that model that German Di Gao company produces is airex940;
Curing catalyst described in step 3 is 2,4,6-tri-(dimethylamino methyl) phenol;
Solidifying agent described in step 3 is 4,4-diaminodiphenylsulfone(DDS).
Use infrared spectrometer to test the epoxy silicone resin of testing a step 1 and obtaining, as shown in Figure 1.Fig. 1 is the infrared spectrum of the epoxy silicone resin that obtains of test one step 1, from Fig. 1, at 3462cm
-1, 3052cm
-1, 1247cm
-1, 916cm
-1, 1130cm
-1and 1035cm
-1there is characteristic peak at place, at 3462cm
-1for hydroxyl characteristic peak, be 3052cm
-1, 1247cm
-1, 916cm
-1place is epoxide group characteristic peak, 1130cm
-1and 1035cm
-1place is siloxane bond characteristic peak.
The initial decomposition temperature of this test fire resistant epoxy organic silicon potting adhesive is 393.5 ℃, shearing resistance in the time of 25 ℃ is 24.3MPa, shearing resistance in the time of 250 ℃ is 4.5MPa, and the shearing resistance in the time of 300 ℃ is 2.3MPa, and the shearing resistance in the time of 350 ℃ is 1.1MPa.
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| CN104231945A (en) * | 2014-09-12 | 2014-12-24 | 东莞市新懿电子材料技术有限公司 | Liquid-state optical cement |
| CN105860081A (en) * | 2016-05-30 | 2016-08-17 | 哈尔滨工业大学 | Photo/thermal-curing organic silicone resin and preparation method thereof |
| CN106519189A (en) * | 2016-11-05 | 2017-03-22 | 福州大学 | Epoxy silicone oil modified phosphorus-containing flame-retardant epoxy resin and preparation method thereof |
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
| CN109880561A (en) * | 2017-12-06 | 2019-06-14 | 上海本诺电子材料有限公司 | A kind of epoxy resin embedding adhesive composition and preparation method thereof |
| CN110229585A (en) * | 2019-06-18 | 2019-09-13 | 刘涛 | A kind of heat treatment can quick selfreparing coating and preparation method thereof |
| CN116693810A (en) * | 2023-07-04 | 2023-09-05 | 嘉兴南洋万事兴化工有限公司 | High heat-resistant epoxy curing agent for LED packaging, preparation method and epoxy pouring sealant prepared by using high heat-resistant epoxy curing agent |
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| CN104231945A (en) * | 2014-09-12 | 2014-12-24 | 东莞市新懿电子材料技术有限公司 | Liquid-state optical cement |
| CN104231945B (en) * | 2014-09-12 | 2016-03-23 | 东莞市新懿电子材料技术有限公司 | A kind of liquid optical cement |
| CN105860081A (en) * | 2016-05-30 | 2016-08-17 | 哈尔滨工业大学 | Photo/thermal-curing organic silicone resin and preparation method thereof |
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| CN106519189A (en) * | 2016-11-05 | 2017-03-22 | 福州大学 | Epoxy silicone oil modified phosphorus-containing flame-retardant epoxy resin and preparation method thereof |
| CN106519189B (en) * | 2016-11-05 | 2018-08-17 | 福州大学 | A kind of phosphorus-containing flame-retardant epoxy resin and preparation method thereof that epoxy silicon oil is modified |
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
| CN106753205B (en) * | 2017-01-11 | 2020-05-22 | 湖南博翔新材料有限公司 | Epoxy modified organic silicon pouring sealant with low viscosity and high heat conductivity and application thereof |
| CN109880561A (en) * | 2017-12-06 | 2019-06-14 | 上海本诺电子材料有限公司 | A kind of epoxy resin embedding adhesive composition and preparation method thereof |
| CN110229585A (en) * | 2019-06-18 | 2019-09-13 | 刘涛 | A kind of heat treatment can quick selfreparing coating and preparation method thereof |
| CN116693810A (en) * | 2023-07-04 | 2023-09-05 | 嘉兴南洋万事兴化工有限公司 | High heat-resistant epoxy curing agent for LED packaging, preparation method and epoxy pouring sealant prepared by using high heat-resistant epoxy curing agent |
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