CN103801787A - Novel chip soldering machine device and chip soldering method thereof - Google Patents
Novel chip soldering machine device and chip soldering method thereof Download PDFInfo
- Publication number
- CN103801787A CN103801787A CN201410071076.3A CN201410071076A CN103801787A CN 103801787 A CN103801787 A CN 103801787A CN 201410071076 A CN201410071076 A CN 201410071076A CN 103801787 A CN103801787 A CN 103801787A
- Authority
- CN
- China
- Prior art keywords
- chip
- head
- ejection
- ejection cap
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 46
- 238000000926 separation method Methods 0.000 claims description 7
- 230000001737 promoting effect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Die Bonding (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Abstract
The invention discloses a novel chip soldering machine device and a chip soldering method of the novel chip soldering machine device. The device comprises a machine head (2), an ejection cap (4) and a track soldering table (1). An ejection pin (6) for pushing the ejection cap (4) to move is arranged below the ejection cap (4), an ejector (5) is arranged on the upper surface of the ejection cap (4), the track soldering table (1) is arranged on the upper right portion of the ejection cap (4), and the machine head (2) for picking up chips and soldering the chips is arranged above the ejection cap (4). The method includes the chip soldering step, the chip suction step, the chip detection step and the chip discharging step. The problems that traditional soldering efficiency is low, the machine head easily collides with the track soldering table, and the bottom face of a suction nozzle easily collides with the track soldering table are solved, operation is convenient to conduct, and cost is saved.
Description
Technical field
The present invention relates to a kind of Soldering lug machine device solder technology, particularly a kind of novel weld tabs machine and weld tabs method thereof.
Background technology
In the process of welding, easily there are a lot of problems in existing Soldering lug machine, owing to there is a distance between track welding platform and ejection cap, head need to be carried out welding operation to track welding platform by absorption chip from ejection cap.But head, in the time that absorption chip arrives track welding platform, usually easily collides track welding platform, and head or suction nozzle are caused to damage, and the serious direct machine that affects can not be carried out welding job, the maintenance of need to stopping.The production of product is brought to very large impact, also indirectly improved the production cost of product simultaneously, reduced the production efficiency of product.
Number of patent application: CN2013104110297.4 discloses a kind of microphone miaow head automatic welding device and method, this invention involving vibrations dish feeding module, image capture module, soldering operation module, lead-in wire feeding module and electrical control cabinet, microphone solder pad, lead-in wire automatic peeling and the function of cutting off, lower weldering, automatic sorting miaow head, automatic conveying go between are automatically adjusted in automatic identification that this contrive equipment is integrated, efficiently solve welding microphone efficiency not high, cannot realize the problem of automation material loading and blanking.But what this invention solved is the problem of material loading blanking, the easy collision orbit welding bench of head solving with the application, and the not high problem of welding efficiency is far from each other.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of novel weld tabs machine and weld tabs method thereof are provided, solve traditional welding inefficiency, the phenomenon of the easy collision orbit welding bench of head and the easy collision orbit welding bench in suction nozzle bottom surface, easy to operate, cost-saving.
The object of the invention is to be achieved through the following technical solutions: a kind of novel weld tabs machine, it comprises head, ejection cap and track welding platform, head moves back and forth between ejection cap and track welding platform, ejection cap below is provided with the ejection pin moving for promoting ejection cap, ejection cap upper surface is provided with ejector, and described head comprises for the plumb joint of welding chip and the suction nozzle of pick-up chip.
Lateral separation between described track welding platform and ejection cap is 26.5mm, and the fore-and-aft distance between the peak of head and ejection cap is 28.5mm.
One side of described ejection cap is also provided with detecting sensor.
S1: head moves to track welding platform top, and the chip on track welding bench is welded;
S2: head is drawn the chip having welded by suction nozzle, and carry and draw chip on head and move to together above ejection cap;
S3: the chip that the detecting sensor butt welding of ejection cap side connects detects;
S4: head is placed on the chip after detecting on ejection cap, ejection pin promotes on ejection cap position to move, ejector by the chip ejection after placing to discharging track;
S5: repeatedly carry out step S1 to step S4, until receive out-of-work signal.
The invention has the beneficial effects as follows: head is provided with suction nozzle and plumb joint simultaneously, can weld and absorption chip, performance is strong, easy to operate, reciprocal distance when head welding chip between track welding bench and ejection cap is short, efficiency is high, saves production cost, and can not cause the phenomenon of head collision orbit welding bench or head suction nozzle bottom surface collision orbit welding bench.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
In figure, 1-track welding platform, 2-head, 3-chip, 4-ejection cap, 5-ejector, 6-ejection pin.
The specific embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 1, a kind of novel weld tabs machine, it comprises head 2, ejection cap 4 and track welding platform 1, head 2 moves back and forth between ejection cap 4 and track welding platform 1, ejection cap 4 belows are provided with the ejection pin 6 moving for promoting ejection cap 4, ejection cap 4 upper surfaces are provided with ejector 5, and described head 2 comprises for the plumb joint of welding chip and the suction nozzle of pick-up chip.
Lateral separation between described track welding platform 1 and ejection cap 4 is 26.5mm, and the fore-and-aft distance between the peak of head 2 and ejection cap 4 is 28.5mm.
One side of described ejection cap 4 is also provided with detecting sensor.
A weld tabs method for novel weld tabs machine, it includes following steps:
S1: head 2 moves to track welding platform 1 top, and the chip 3 on track welding bench 1 is welded;
S2: head 2 is drawn the chip 3 having welded by suction nozzle, and carry and draw chip 3 on head 2 and move to together above ejection cap 4;
S3: the chip 3 that the detecting sensor butt welding of ejection cap 4 sides connects detects;
S4: head 2 by detect after chip 3 be placed on ejection cap 4, ejection pin 6 promotes to move on ejection cap 4 positions, ejector 5 by place after chip 3 ejections to discharging track;
S5: repeatedly carry out step S1 to step S4, until receive out-of-work signal.
Concrete, head is carrying out in the process of welding chip, and traditional head welding 20 rows' displacements are: lateral separation=636mm+30mm*20=1236mm; Vertical range=30mm*20+5mm*20=700mm; Total distance=lateral separation+vertical range=1236mm+700mm=1936mm.
Apparatus of the present invention welding 20 rows' displacement is: lateral separation=636mm+26.5mm*20=1166mm; Vertical range=28.5mm*20+3.5*20=640mm; Total distance=lateral separation+vertical range=1166mm+640mm=1806mm; Therefore, apparatus of the present invention reduce 130mm than traditional welder head displacement.
Concrete, on average weld a chip, the distance that head moves is 1936mm/20=97mm.
Concrete, the speed of machine head is 686mm/ms, the head required time of chip of welding is 170ms, and the few mobile 130mm of head, machine is saved 185ms.Therefore, head welding 20 row's chips are than chip of the many welding of traditional Soldering lug machine, and its efficiency improves 5%.
Claims (4)
1. a novel weld tabs machine, it is characterized in that: it comprises head (2), ejection cap (4) and track welding platform (1), head (2) moves back and forth between ejection cap (4) and track welding platform (1), ejection cap (4) below is provided with for promoting the mobile ejection pin (6) of ejection cap (4), ejection cap (4) upper surface is provided with ejector (5), and described head (2) comprises for the plumb joint of welding chip and the suction nozzle of pick-up chip.
2. the novel weld tabs machine of one according to claim 1, it is characterized in that: the lateral separation between described track welding platform (1) and ejection cap (4) is 26.5mm, the fore-and-aft distance between the peak of head (2) and ejection cap (4) is 28.5mm.
3. the novel weld tabs machine of one according to claim 1, is characterized in that: a side of described ejection cap (4) is also provided with detecting sensor.
4. a weld tabs method for Soldering lug machine device, is characterized in that: it includes following steps:
S1: head (2) moves to track welding platform (1) top, and the chip (3) on track welding bench (1) is welded;
S2: head (2) is drawn the chip (3) having welded by suction nozzle, and carry and draw chip (3) on head (2) and move to together ejection cap (4) top;
S3: the chip (3) that the detecting sensor butt welding of ejection cap (4) side connects detects;
S4: it is upper that the chip (3) after detecting is placed on ejection cap (4) by head (2), and ejection pin (6) promotes to move on ejection cap (4) position, ejector (5) by chip (3) ejection after placing to discharging track;
S5: repeatedly carry out step S1 to step S4, until receive out-of-work signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410071076.3A CN103801787B (en) | 2014-02-28 | 2014-02-28 | A kind of Soldering lug machine device and weld tabs method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410071076.3A CN103801787B (en) | 2014-02-28 | 2014-02-28 | A kind of Soldering lug machine device and weld tabs method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103801787A true CN103801787A (en) | 2014-05-21 |
| CN103801787B CN103801787B (en) | 2016-05-25 |
Family
ID=50699432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410071076.3A Expired - Fee Related CN103801787B (en) | 2014-02-28 | 2014-02-28 | A kind of Soldering lug machine device and weld tabs method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103801787B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174042A (en) * | 2001-12-04 | 2003-06-20 | Nec Machinery Corp | Die bonder |
| JP2004273805A (en) * | 2003-03-10 | 2004-09-30 | Hikari:Kk | Chip mounting apparatus, chip mounting method, ic module manufacturing method, and computer program for controlling chip mounting apparatus |
| CN1725461A (en) * | 2004-07-02 | 2006-01-25 | 优利讯国际贸易有限责任公司 | Method and apparatus for mounting semiconductor chips |
| CN201936864U (en) * | 2010-12-20 | 2011-08-17 | 乐山-菲尼克斯半导体有限公司 | Elastic thimble used in field of semi-conductor capsulation |
| CN102308377A (en) * | 2009-03-05 | 2012-01-04 | 株式会社新川 | Apparatus and method for picking up semiconductor die |
| CN102646572A (en) * | 2011-02-18 | 2012-08-22 | 株式会社日立高新技术仪器 | Die bonder and semiconductor manufacturing method |
| CN203725947U (en) * | 2014-02-28 | 2014-07-23 | 成都先进功率半导体股份有限公司 | Novel chip welding machine device |
-
2014
- 2014-02-28 CN CN201410071076.3A patent/CN103801787B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174042A (en) * | 2001-12-04 | 2003-06-20 | Nec Machinery Corp | Die bonder |
| JP2004273805A (en) * | 2003-03-10 | 2004-09-30 | Hikari:Kk | Chip mounting apparatus, chip mounting method, ic module manufacturing method, and computer program for controlling chip mounting apparatus |
| CN1725461A (en) * | 2004-07-02 | 2006-01-25 | 优利讯国际贸易有限责任公司 | Method and apparatus for mounting semiconductor chips |
| CN102308377A (en) * | 2009-03-05 | 2012-01-04 | 株式会社新川 | Apparatus and method for picking up semiconductor die |
| CN201936864U (en) * | 2010-12-20 | 2011-08-17 | 乐山-菲尼克斯半导体有限公司 | Elastic thimble used in field of semi-conductor capsulation |
| CN102646572A (en) * | 2011-02-18 | 2012-08-22 | 株式会社日立高新技术仪器 | Die bonder and semiconductor manufacturing method |
| CN203725947U (en) * | 2014-02-28 | 2014-07-23 | 成都先进功率半导体股份有限公司 | Novel chip welding machine device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103801787B (en) | 2016-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103921394A (en) | Automatic production and detection equipment of insert injection molding product | |
| CN104148920A (en) | Steering knuckle bearing material press-fitting production line | |
| CN103659802A (en) | Grabbing mechanism | |
| CN204817631U (en) | Chipware pre -compaction equipment in automobile | |
| CN102201357B (en) | Equipment for extracting, turning and setting wafer-level packaged microchip | |
| CN108493137B (en) | Chip taking machine | |
| CN203652764U (en) | Lifting-up type positioner | |
| CN102969643A (en) | Material band breaking device | |
| CN104692156A (en) | Board feeding machine and board feeding method | |
| CN203095251U (en) | Integrated chip lead frame counting stacking device | |
| CN203725947U (en) | Novel chip welding machine device | |
| CN112719900A (en) | Automatic riveting and pressing welding equipment for bus plates and operation method of automatic riveting and pressing welding equipment | |
| CN210854219U (en) | Automatic arrangement machine for wafer base | |
| CN103801787B (en) | A kind of Soldering lug machine device and weld tabs method thereof | |
| CN207806931U (en) | A kind of vehicle thermoregulator stern post automatic welding device | |
| CN203471167U (en) | Spot welding machine for batteries | |
| CN204639547U (en) | A kind of USB flash disk production equipment | |
| CN106881281B (en) | Automatic sorting device and system | |
| CN104400268A (en) | Casing feeding and discharging mechanism | |
| CN104723028A (en) | Dual-interface card production method and device | |
| CN206010126U (en) | Sheet metal component projection welding leak-proof device based on robot | |
| CN210235451U (en) | Stacker frame | |
| CN203197150U (en) | Automatic material taking device for punch | |
| CN202316553U (en) | Roller feeding device | |
| CN103925882A (en) | Visual detection device for inserts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 Termination date: 20170228 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |