CN103794954A - Modular Connector - Google Patents

Abstract

A modular connector comprises a shell, a first circuit board, a first terminal group, a second terminal group and a second circuit board. The housing includes a first terminal hole and a second terminal hole. The first terminal set extends into the first terminal hole and is electrically connected with the first circuit board. The second terminal group extends into the second terminal hole and is electrically connected with the first circuit board. The second circuit board is vertically combined with the first circuit board.

Description

Modular Connector

technical field

The invention relates to a connector, in particular to a modular connector.

Background technique

With the development of science and technology, most of the electronic devices used in the electronic information industry tend to be micro-sized and multi-functional. In order to facilitate the transmission of data between different electronic devices, several communication protocols with different specifications have also been developed. At the same time, corresponding electrical connectors have also been developed for each communication protocol for electrical connection between different electronic devices for data transmission. . In recent years, the connectors widely used in network interfaces are twisted pair connectors, and subdivided twisted pair connectors can be roughly divided into two categories: RJ45 connectors and RJ11 connectors.

In recent years, electronic devices have gradually developed towards functional diversification and intelligence, which has greatly increased the amount of signals that need to be transmitted in the entire system; however, in this case, the appearance and parts of computers and related parts tend to be lightweight, direction of miniaturization. In order to meet the dual development needs of greatly increased signal transmission and volume miniaturization of electronic products at the same time, the RJ connector with a large number of terminals and a small volume used in high-frequency transmission came into being.

When the signal is transmitted to the circuit in the RJ connector, the signal delay (signal skew) has always been a problem that cannot be ignored. The occurrence of the signal delay is mainly due to the difference in the path length of the circuit passed between the signal pair, so that the signal arriving at the receiving end is different. The time is different, so in order to reduce the signal delay, in the circuit layout, generally strive to make the path length of the corresponding signal as close as possible. However, based on structural or manufacturing considerations, the existing RJ connectors (especially Two-layer stacked RJ connectors) are mostly difficult to achieve this effect.

Contents of the invention

In view of the above problems, the object of the present invention is to provide a modular connector, which can effectively reduce the signal delay between signal pairs.

To achieve the above purpose, a modular connector according to the present invention includes a housing, a first circuit board, a first terminal group, a second terminal group and a second circuit board. The casing includes a first terminal hole and a second terminal hole. The first terminal group is electrically connected to the first circuit board, and the first terminal group extends into the first terminal hole. The second terminal group is electrically connected to the first circuit board, and the second terminal group extends into the second terminal hole. The second circuit board is vertically combined with the first circuit board.

The first circuit board includes a first circuit layer, a second circuit layer and a first shielding layer, the first circuit layer is electrically connected to the first terminal group, the second circuit layer is electrically connected to the second terminal group, and the first circuit layer is electrically connected to the second terminal group. The shielding layer is disposed between the first circuit layer and the second circuit layer.

The second circuit board includes a third circuit layer, a fourth circuit layer and a second shielding layer, the third circuit layer is electrically connected to the first circuit layer and the second circuit layer, and the fourth circuit layer is electrically connected to the first The circuit layer and the second circuit layer, the second shielding layer is arranged between the third circuit layer and the fourth circuit layer.

The modularized connector of the present invention further includes a connecting piece electrically connected to the first shielding layer and the second shielding layer.

The modularized connector of the present invention also includes a base, which is parallel to the first circuit board and perpendicular to the second circuit board on one side of the second circuit board, and is electrically connected to the second circuit board. The base has multiple a plurality of first identification structures, and the housing further includes a plurality of second identification structures corresponding to the plurality of first identification structures. The plurality of first identification structures are arranged up and down and not aligned. Roots of the plurality of first identification structures respectively have grooves. The plurality of first identification structures are protruding rod-shaped structures, or have a shape of rectangle, triangle or circle. The plurality of second identification structures are blocked holes, or have rectangular, triangular or circular holes.

The modularized connector of the present invention further includes a shielding sheet disposed between the second circuit board and the base.

The modular connector of the present invention further includes a plurality of conductive elements electrically connected to the first circuit board and the second circuit board.

The first circuit layer, the second circuit layer, the third circuit layer and the fourth circuit layer respectively include a plurality of electronic components, and the plurality of electronic components are surface mount type.

The first terminal group and the second terminal group are arranged on the first circuit board by surface adhesive technology.

In one embodiment, the heights of the plurality of electronic components disposed on the third circuit layer and the fourth circuit layer are less than 6 microns.

The first circuit board has a first opening located at the center of one side of the first circuit board, and the first circuit board and the second circuit board are vertically combined through the first opening. The second circuit board includes a second opening, which is disposed in the center of one side of the second circuit board corresponding to the first opening.

Based on the above, a modular connector provided by the present invention is respectively arranged in the center of one side of the first circuit board and the second circuit board through the first opening and the second opening, and the circuit of the first circuit board The layout is symmetrical to each other based on the first opening, so as to reduce the signal delay between signal pairs. In manufacturing, the first circuit layer, the second circuit layer and the first shielding layer are integrated on the first circuit board, which not only reduces the cost, The degree of modularization can also be improved. In addition, by setting the first identification structure and the second identification structure on the base and the housing respectively, the cost of mold opening of the housing can be reduced, so that only one mold opening is required, and it can be widely used Multiple bases without being difficult to tell apart.

Description of drawings

FIG. 1A is a schematic diagram of a modular connector according to a preferred embodiment of the present invention;

FIG. 1B is an exploded schematic diagram of a modular connector according to a preferred embodiment of the present invention;

FIG. 2 is a partially exploded schematic diagram of a modular connector according to a preferred embodiment of the present invention;

Figure 3A is a partially enlarged schematic view of the base; and

FIG. 3B is a partially enlarged schematic view of the casing.

Wherein, the reference signs are explained as follows:

1: connector

11: shell

111: first terminal hole

112: Second terminal hole

12: First circuit board

121: First opening

122: First Surface

123: second surface

13: The first terminal group

14: Second terminal group

15: Second circuit board

151: Second opening

16: Conductive parts

17: Base

C1: the first circuit layer

C2: second circuit layer

C3: The third circuit layer

C4: fourth circuit layer

IDa, IDa1～IDa8: the first identification structure

IDb1～IDb8: the second identification structure

S1: first shielding layer

S2: Second shielding layer

Detailed ways

A connector according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols. It should be noted that the drawings are only for illustration and do not represent actual dimensions and proportions. In practice, the dimensions and proportions can be designed in different ways according to needs.

Please refer to Figure 1A and Figure 1B, wherein Figure 1A is a schematic diagram of a modular connector 1 in a preferred embodiment of the present invention, and Figure 1B is a modular connector 1 in a preferred embodiment of the present invention Explosion diagram. Please also refer to FIG. 2 , which is a partially exploded schematic diagram of the connector 1 shown in FIG. 1A . In practice, the connector 1 is, for example, used in network communication, and can be divided into different types such as RJ-45, RJ-11 and RJ-12 according to different transmission bandwidths. The connector 1 includes a housing 11 , a first circuit board 12 , a first terminal set 13 , a second terminal set 14 , a second circuit board 15 and a plurality of conductive elements 16 .

The casing 11 is used to protect the circuit inside it from being damaged, and to prevent users from touching the circuit inside it. Therefore, the material of the upper casing 11 is, for example, an insulating material such as plastic, and is injected Formed by way of production. The casing 11 has a first terminal hole 111 and a second terminal hole 112 for inserting a plug (not shown) of a connecting wire terminal. The first terminal hole 111 and a second terminal hole 112 are stacked up and down in the vertical direction. The number of terminal holes of the housing 11 can be increased or decreased according to actual needs.

The first circuit board 12 is for example a printed circuit board (Printed Circuit Board, PCB) in implementation, the first circuit board 12 has a first opening 121, a first surface 122 and a second surface 123, the first opening 121 It is disposed at the center of one side of the first circuit board 12 , and the second surface 123 is disposed on the other side opposite to the first surface 122 . It should be noted that in different embodiments, the first circuit board may not have the first opening, which does not affect its implementability, so the present invention is not limited thereto.

The first terminal group 13 is disposed on the first surface 122 of the first circuit board 12 and is electrically connected to the first circuit board 12 . The first terminal group 13 is, for example, disposed on the first surface 122 by surface mount technology (SMT), so as to reduce the required thickness during the disposition. The first terminal group 13 has a plurality of first terminals. For an RJ-45 type connector, the number of the first terminals is eight, and in different embodiments, the number of the first terminals can also be different. Inventions are not limited. The first terminal group 13 extends into the first terminal hole 111 to be electrically connected to the plug (not shown) of the connecting wire terminal.

The second terminal group 14 is disposed on the second surface 123 of the first circuit board 12 and is electrically connected to the first circuit board 12 . The second terminal group 14 is, for example, disposed on the second surface 123 by surface-mounting technology, so as to reduce the required thickness during the disposition. The second terminal group 14 has a plurality of second terminals. For the RJ-45 type connector, the number of the second terminals is eight, and in different embodiments, the number of the second terminals can also be different. Inventions are not limited. The second terminal set 14 extends into the second terminal hole 112 to be electrically connected to the plug (not shown) of the connecting wire terminal.

In practice, the second circuit board 15 is, for example, a printed circuit board (Printed Circuit Board, PCB). The second circuit board 15 is vertically combined with the first circuit board 12 through the first opening 121 .

In this embodiment, based on increasing the combination of the first circuit board 12 and the second circuit board 15 more firmly, the second circuit board 15 may have a second opening 151 corresponding to the first opening 121, and the second opening 151 is provided In the center of one side of the second circuit board 15, the first circuit board 12 and the second circuit board 15 can be fitted together to increase the structural strength. It should be noted that in different embodiments, the second circuit board may not have the second opening, and this does not affect its implementability, so the present invention is not limited thereto.

The conductive member 16 is electrically connected to the first circuit board 12 and the second circuit board 15 . The conductive element 16 is, for example, an L-shaped pin in practice.

Furthermore, the first circuit board 12 includes a first circuit layer C1 , a second circuit layer C2 and a first shielding layer S1 . The first circuit layer C1 is disposed on the first surface 122 , and the first circuit layer C1 is electrically connected to the first terminal group 13 so that signals can be transmitted between the first terminal group 13 and the first circuit layer C1 . The second circuit layer C2 is disposed on the second surface 123 , and the second circuit layer C2 is electrically connected to the second terminal group 14 so that signals can be transmitted between the second terminal group 14 and the second circuit layer C2 . In addition, the circuit layouts on both sides of the first circuit layer C1 in the horizontal direction based on the first opening 121 are substantially symmetrical, and the same is true for the second circuit layer C2.

The first shielding layer S1 is disposed between the first circuit layer C1 and the second circuit layer C2. The first shielding layer S1 is used to reduce mutual interference between the first circuit layer C1 and the second circuit layer C2 during operation. In practice, the first shielding layer S1 is generally made of metal, such as copper, to effectively shield electromagnetic waves generated during circuit operation.

The second circuit board 15 includes a third circuit layer C3, a fourth circuit layer C4 and a second shielding layer S2, the third circuit layer C3 is electrically connected to the first circuit layer C1 and the second circuit layer C2, the fourth circuit layer C4 The circuit layer C4 is electrically connected to the first circuit layer C1 and the second circuit layer C2.

The second shielding layer S2 is disposed between the third circuit layer C3 and the fourth circuit layer C4. The second shielding layer S2 is used to reduce the mutual interference between the third circuit layer C3 and the fourth circuit layer C4 during operation. In practice, the second shielding layer S2 is generally made of metal, such as copper, to effectively shield electromagnetic waves generated when the circuit is in operation.

It is worth mentioning that since the first opening 121 is disposed at the center of one side of the first circuit board 12, and the second opening 151 is disposed at the center of one side of the second circuit board 15, and the first circuit layer C1 is formed by the first circuit layer C1. The circuit layout on both sides of the horizontal direction with an opening 121 as the reference is substantially symmetrical, whereby when the first circuit board 12 and the second circuit board 15 are combined and electrically connected, the signals transmitted by the first circuit layer C1 The path lengths are approximately the same, so that the signal delays between the signal pairs are the same, and the same is true for the second circuit layer C2.

In addition, based on the purpose of electrically connecting the first shielding layer S1 and the second shielding layer S2, the connector 1 may further include a connecting piece (not shown in the figure) to electrically connect the first shielding layer S1 and the second shielding layer S1. Shielding layer S2. In practice, the material of the connecting piece can be the same as that of the first shielding layer S1 or the second shielding layer S2, such as copper, and of course it can also be different from the first shielding layer S1 and the second shielding layer S2, which is not limited in the present invention. .

Not only that, in this embodiment, the first circuit layer C1, the second circuit layer C2, the third circuit layer C3 and the fourth circuit layer C4 may also include a plurality of electronic components (not shown in the figure), and the plurality of The electronic components are surface mount technology type (SMT type), that is, the plurality of electronic components are arranged on each circuit layer by surface mount technology, so as to reduce the overall thickness of the first circuit board 12 and the second circuit board 15 . Preferably, the height of the plurality of electronic components is less than 6 microns, such as 5.5 microns or 5 microns, which is not limited in the present invention.

The connector 1 may also include a base 17, which is parallel to the first circuit board 12 and perpendicular to the second circuit board 15 on one side of the second circuit board 15, such as the second circuit board 15 in the vertical direction and adjacent to the side connected to the first circuit board 12 . The pins of the second circuit board 15 are electrically connected to the contacts of the base 17, and then electrically connected to a mother circuit board (not shown in the figure) through the pins of the base 17. For example, the mother circuit board can pass through The second circuit board 15, the conductive member 16, the first circuit layer C1 and the first terminal group 13 are then transmitted to an electronic device (not shown in the figure) through the connecting wire. On the contrary, when the signal passes through the connecting wire from the electronic device, the The input of the first terminal group 13 can be transmitted to the mother circuit board through the first circuit layer C1 , the conductive element 16 and the second circuit board 15 .

In this embodiment, in order to reduce the mutual interference between the first circuit board 12 or the second circuit board 15 and the mother circuit board during operation, the connector 1 may further include a shielding sheet (not shown) disposed on the second circuit board 15 and the base 17. In practice, the material of the shielding sheet can be copper or other metals, for example, to shield electromagnetic waves generated when the electronic components are in operation.

In this embodiment, in order to improve the convenience of identification when the base 17 is assembled with the housing, the base 17 can have a plurality of first identification structures IDa, and the housing 11 can also include A plurality of second recognition structures corresponding to IDa (not shown in the figure).

Please refer to FIG. 3A and FIG. 3B , wherein FIG. 3A is a partially enlarged schematic diagram of the base 17 , and FIG. 3B is a partially enlarged schematic diagram of the housing 11 . As shown in FIG. 3A , the base 17 includes a plurality of first identification structures IDa1-IDa8, which can be respectively a raised rod-shaped structure. Using tools such as scissors, cut off more than one first identification structure as required, and replace them with In other words, different first recognition structures can be cut out to form different combinations to achieve the function of recognition. In this embodiment, the first identification structures of the two rows are not aligned up and down, which will facilitate injection during fabrication. As shown in FIG. 3A , there is a groove at the root of all the first identification structures, which can be easily removed manually during production. The first identification structure can also be a geometric shape such as a rectangle, a triangle or a circle.

As shown in FIG. 3B , the housing 11 includes a plurality of second identification structures IDb1-IDb8, which can be a blocked hole respectively. Through a tool such as scissors, according to the combination of the first identification structures, the corresponding second identification structures Dig through to achieve the function of identification. The second identification structure can also be designed to have rectangular, triangular or circular holes.

For example, when the first identification structures IDa1, IDa3 and IDa8 of the base 17 are cut out, in order to correspond to them, the second identification structures IDb2, IDb4-IDb7 of the housing 11 are dug through, whereby the base 17 and the housing 11 can be matched with each other when they are assembled without being confused with other models, so as to achieve the effect of identification.

To sum up, the modularized connector provided by the present invention is respectively arranged in the center of one side of the first circuit board and the second circuit board through the first opening and the second opening, and the circuit of the first circuit board The layout is symmetrical to each other based on the first opening to reduce the signal delay between signal pairs. In manufacturing, the first circuit layer, the second circuit layer and the first shielding layer are integrated on the first circuit board, which not only reduces costs, The degree of modularization can also be improved. In addition, by setting the first identification structure and the second identification structure on the base and the housing respectively, the cost of mold opening of the housing can be reduced, so that only one mold opening is required, and it can be widely used Multiple bases without being difficult to tell apart.

The above descriptions are illustrative only, not restrictive. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention shall be included in the scope of the appended claims.

Claims (17)

1. a modular connector, comprising:

One housing, this housing comprises a first terminal hole and one second terminal hole;

One first circuit board;

One first end subgroup, is electrically connected this first circuit board, and this first end subgroup extends into this first terminal hole;

One second terminal group, is electrically connected this first circuit board, and this second terminal group extends into this second terminal hole; And

One second circuit board, itself and this first circuit board vertical cartel.

2. connector according to claim 1, wherein this first circuit board comprises one first circuit layer, a second circuit layer and one first screen, this first circuit layer is electrically connected this first end subgroup, this second circuit layer is electrically connected this second terminal group, and this first screen is arranged between this first circuit layer and this second circuit layer.

3. connector according to claim 2, wherein this second circuit board comprises a tertiary circuit layer, one the 4th circuit layer and a secondary shielding layer, this tertiary circuit layer is electrically connected this first circuit layer and this second circuit layer, the 4th circuit layer is electrically connected this first circuit layer and this second circuit layer, and this secondary shielding layer is arranged between this tertiary circuit layer and the 4th circuit layer.

4. connector according to claim 3, it also comprises a connecting piece, is electrically connected this first screen and this secondary shielding layer.

5. according to the connector described in claim 3 or 4, wherein this first circuit layer, this second circuit layer, this tertiary circuit layer and the 4th circuit layer comprise respectively multiple electronic components, and the plurality of electronic component is SMD LED surface-mount device LED.

6. connector according to claim 1, it also comprises a pedestal, parallel with this first circuit board and be vertically installed in one side of this second circuit board with this second circuit board, and is electrically connected with this second circuit board.

7. connector according to claim 6, wherein this pedestal has multiple the first recognition structures, and this housing also comprises multiple second recognition structures corresponding with the plurality of the first recognition structure.

8. connector according to claim 7, wherein the plurality of the first recognition structure is and is arranged above and below and does not line up.

9. connector according to claim 7, wherein the root of the plurality of the first recognition structure has respectively a groove.

10. connector according to claim 7, wherein the plurality of the first recognition structure is protruding club shaped structure, or has rectangle, triangle or circular shape.

11. according to the connector described in any one in claim 7-10, and wherein the plurality of the second recognition structure is the hole being blocked, or has rectangle, triangle or circular hole.

12. connectors according to claim 7, it also comprises a shielding sheet, is arranged between this second circuit board and this pedestal.

13. according to the connector of claim 1, and it also comprises multiple electric-conductors, is electrically connected this first circuit board and this second circuit board.

14. connectors according to claim 1, wherein this first end subgroup and this second terminal group are arranged at this first circuit board by surface mount technology.

15. connectors according to claim 5, the height that is wherein arranged at the plurality of electronic component of this tertiary circuit layer and the 4th circuit layer is less than 6 microns.

16. connectors according to claim 1, wherein this first circuit board has one first opening, is positioned at the wherein central authorities on one side of this first circuit board, by this first opening by this first circuit board and second circuit board vertical cartel.

17. connectors according to claim 16, wherein this second circuit board comprises one second opening, to being arranged at the wherein central authorities on one side of this second circuit board by the first opening.

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