CN103781332A - Heat sink device - Google Patents

Abstract

The invention discloses a heat dissipation device which is applied to an electronic device with a first heat source and a second heat source. The heat dissipation device comprises a shell, an impeller, a first heat conduction assembly, a second heat conduction assembly and an opening and closing device. The shell is provided with an accommodating space, a first air outlet and a second air outlet. The first air outlet and the second air outlet are communicated with the accommodating space. The impeller is arranged in the accommodating space. The first heat conducting assembly is connected to the first air outlet and the first heat source. The second heat conducting assembly is connected to the second air outlet and the second heat source. The opening and closing device is arranged at the first air outlet and can open or close the first air outlet.

Description

heat sink

technical field

The invention relates to a heat dissipation device.

Background technique

Electronic devices usually generate heat during operation. If the heat is not efficiently discharged, it is easy to crash, and in severe cases, the electronic components in the electronic device may be burned, resulting in property damage or injury to users. .

Designers can set cooling components such as fans, heat sinks, and heat pipes in electronic devices to reduce the temperature of chips. For example, when a central processing unit (CPU) and a graphics processing unit (GPU) are installed in an electronic device, a set of fans, heat sinks and heat pipes can be used to dissipate heat from the CPU, and another set of fans, heat sinks and The heat pipe removes heat from the graphics processor. However, such a method not only increases the cost of the heat dissipation components, but also requires a larger space for the electronic device to accommodate two sets of heat dissipation components.

For another example, the designer can use a single heat pipe to contact the CPU and the GPU at the same time, and install a fan at one end of the heat pipe to simultaneously discharge heat from the CPU and the GPU. Although this method can save the cost of cooling components and the space of the electronic device, the temperatures of the CPU and the GPU will affect each other, making it difficult for the temperature sensor to monitor the actual temperatures of the CPU and the GPU.

Contents of the invention

The invention provides a heat dissipation device, which is applied to an electronic device with a first heat source and a second heat source.

In one embodiment, the heat dissipation device of the present invention includes a casing, an impeller, a first heat conduction component, a second heat conduction component, and an opening and closing device. The housing has an accommodating space, a first air outlet and a second air outlet. The first air outlet communicates with the accommodating space with the second air outlet. The impeller is arranged in the accommodation space. The first heat conduction component is connected to the first air outlet and the first heat source. The second heat conduction component is connected to the second air outlet and the second heat source. The opening and closing device is arranged at the first air outlet for opening or closing the first air outlet.

In the above-mentioned embodiments of the present invention, since the casing has a first air outlet and a second air outlet, and the opening and closing device is arranged at the first air outlet, when the impeller rotates, the opening and closing device of the first air outlet can be opened or closed. It will affect the air volume of the first air outlet and the second air outlet. When the opening and closing device opens the first air outlet, the airflow will flow out from the first air outlet and the second air outlet, so that the first heat source and the second heat source can be dissipated synchronously. When the opening and closing device closes the first air outlet, the air flows out from the second air outlet, so the air volume of the second air outlet can be increased, thereby improving the heat dissipation efficiency of the second heat source.

The heat dissipation device of the present invention can adjust the state of the opening and closing device at the first air outlet according to the temperature of the first heat source and the second heat source, so that the heat dissipation device can exhaust heat from the first heat source and the second heat source synchronously through a single impeller, or only The second heat source dissipates heat, thus saving cost and space for the heat sink.

Description of drawings

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the accompanying drawings are as follows:

FIG. 1 is a perspective view of a heat dissipation device according to an embodiment of the present invention.

FIG. 2 is a perspective view of the heat sink of FIG. 1 when the upper cover of the housing is removed.

Fig. 3 is a partial enlarged view of the opening and closing device in Fig. 2 when closing the first air outlet.

Fig. 4 is a perspective view of the opening and closing device in Fig. 2 when the first air outlet is partially opened.

Fig. 5 is a perspective view of the opening and closing device in Fig. 2 when the first air outlet is fully opened.

Fig. 6 is a perspective view of a heat sink according to another embodiment of the present invention.

FIG. 7 is a perspective view of the heat dissipation device of FIG. 6 when the upper cover of the housing is removed.

Fig. 8 is a perspective view of the opening and closing device in Fig. 7 when opening the first air outlet.

Detailed ways

FIG. 1 is a perspective view of a heat sink 100 according to an embodiment of the present invention. FIG. 2 is a perspective view of the heat sink 100 in FIG. 1 when the upper cover 112 of the casing 110 is removed. Referring to FIG. 1 and FIG. 2 at the same time, the heat dissipation device 100 is applied to an electronic device having a first heat source 210 and a second heat source 220 . The electronic device can be a laptop computer, a desktop computer or a tablet computer. The first heat source 210 and the second heat source 220 are units that can be disposed on a circuit board (such as a motherboard). In this embodiment, the first heat source 210 can be a graphics processing unit (Graphics Processing Unit; GPU), and the second heat source 220 can be a central processing unit (Central Processing Unit; CPU), but the first heat source 210 and the second heat source 220 The types are not intended to limit the present invention.

The heat dissipation device 100 includes a casing 110 , an impeller 120 , a first heat conduction component 130 , a second heat conduction component 140 and an opening and closing device 150 . Wherein, the casing 110 and the impeller 120 constitute a fan device. The casing 110 has an accommodating space 114 , a first air outlet 116 and a second air outlet 118 . The first air outlet 116 communicates with the second air outlet 118 in the accommodating space 114 . The impeller 120 is disposed in the accommodating space 114 for rotating in the casing 110 to generate air flow. In this embodiment, the opening direction of the first air outlet 116 is substantially perpendicular to the opening direction of the second air outlet 118 , but this is not intended to limit the present invention.

The first heat conducting component 130 is connected between the first air outlet 116 and the first heat source 210 . The first heat conducting component 130 includes a first heat sink 132 and a first heat pipe 134 . Wherein, the first heat sink 132 is located at the first air outlet 116 , and the first heat pipe 134 is connected between the first heat sink 132 and the first heat source 210 to accelerate heat conduction between the first heat sink 132 and the first heat source 210 . In this way, the operating temperature of the first heat source 210 can be reduced by the airflow flowing out of the first air outlet 116 and the first heat conducting component 130 .

In addition, the second heat conduction component 140 is connected between the second air outlet 118 and the second heat source 220 . The second heat conducting component 140 includes a second heat sink 142 and a second heat pipe 144 . Wherein, the second heat sink 142 is located at the second air outlet 118 , and the second heat pipe 144 is connected between the second heat sink 142 and the second heat source 220 to accelerate heat conduction between the second heat sink 142 and the second heat source 220 . In this way, the operating temperature of the second heat source 220 can be reduced by the airflow flowing out of the second air outlet 118 and the second heat conducting component 140 .

The opening and closing device 150 is disposed on the first air outlet 116 and can be used to open (including fully open or partially open) or close the first air outlet 116 . In this embodiment, the opening and closing device 150 includes a windshield 152 and a control device 154 , and the control device in this embodiment is a motor. The wind deflector 152 is movably located in the first air outlet 116 . The motor 154 is connected to one end of the windshield 152 . When the motor 154 is running, it can drive the windshield 152 to rotate in the first air outlet 116 . In the following description, the structure in which the windshield 152 is connected to the housing 110 and the motor 154 will be described.

FIG. 3 is a partially enlarged view when the opening and closing device 150 of FIG. 2 closes the first air outlet 116 . Referring to FIG. 2 and FIG. 3 at the same time, the opening and closing device 150 is in a state of closing the first air outlet 116 . The casing 110 has positioning slots 113 and through holes 115 on opposite sides of the first air outlet 116 . Opposite ends of the windshield 152 have rotating shafts 153 , 155 respectively. Wherein, the rotating shaft 153 is coupled to the positioning slot 113 . The rotating shaft 155 is coupled to the through hole 115 and connected to the motor 154 . When the motor 154 rotates, the windshield 152 rotates synchronously with the shaft 155 connected to the motor 154 .

In this way, the included angle between the windshield 152 and the opening direction D of the first air outlet 116 can range from 0 to 90 degrees. When the angle between the windshield 152 and the opening direction D is 90 degrees, the windshield 152 closes the first air outlet 116 so that the airflow generated by the impeller 120 only flows out through the second air outlet 118 . When the angle between the windshield 152 and the opening direction D is less than 90 degrees, the windshield 152 can partially or completely open the first air outlet 116, so that the airflow generated by the impeller 120 can be passed through the first air outlet 116 and the second air outlet. 118 flow out.

FIG. 4 is a perspective view of the opening and closing device 150 in FIG. 2 when the first air outlet 116 is partially opened. Referring to FIG. 2 and FIG. 4 at the same time, the heat dissipation device 100 may further include a temperature sensor 170 . The temperature sensor 170 is electrically connected to the motor 154 of the opening and closing device 150, and can monitor the temperature of the first heat source 210 and the second heat source 220, and control the temperature through the Basic Input/Output System (BIOS) or other applications and software The rotation timing and magnitude of the motor 154.

For example, when the first heat source 210 is under low load or zero load, the temperature sensor 170 can monitor the first heat source 210 at a low temperature (eg, 30 to 40° C.). At this time, the motor 154 can turn the windshield 152 to the position of closing the first air outlet 116 (as shown in FIG. 2 ), so that all the air flows out from the second air outlet 118 , so the output of the second air outlet 118 can be increased. The air volume, thereby improving the heat dissipation efficiency of the second heat source 220 .

When the first heat source 210 is under normal load, the temperature sensor 170 can monitor the first heat source 210 at a medium temperature (eg, 60 to 70° C.). At this time, the motor 154 can turn the windshield 152 to a position where the first air outlet 116 is partially opened (as shown in FIG. The first air outlet 116 and the second air outlet 118 flow out to dissipate heat to the first heat source 210 and the second heat source 220 synchronously.

In this embodiment, although the temperature sensor 170 is arranged outside the first heat source 210 and the second heat source 220, in other embodiments, the number and position of the temperature sensor 170 can be determined according to the designer's needs, for example, the temperature sensor 170 The quantity can be two, and they are respectively located in the first heat source 210 and the second heat source 220 .

FIG. 5 is a perspective view of the opening and closing device 150 in FIG. 2 when the first air outlet 116 is fully opened. As shown in the figure, when the first heat source 210 is under high load, the temperature sensor 170 can monitor the first heat source 210 at a high temperature (eg, 90 to 100° C.). At this time, the motor 154 can turn the windshield 152 to the position where the first air outlet 116 is fully opened, so that the airflow can flow out from the first air outlet 116 and the second air outlet 118, and then the first heat source 210 and the second air outlet 118 are simultaneously heated. The heat source 220 dissipates heat. In this embodiment, the included angle between the windshield 152 and the opening direction D is 0 degrees, so the amount of air flowing out of the first air outlet 116 in FIG. 5 is larger than that in FIG.

Figure 2, Figure 4 and Figure 5 respectively show the three states of the opening and closing device 150, but not limited to these three states, the designer can adjust the state of the windshield 152 and the temperature of the first heat source 210 according to actual needs corresponding relationship. For example, when the temperature sensor 170 detects that the temperature of the first heat source 210 is 80° C., the motor 154 can control the angle between the windshield 152 and the opening direction D to be 60 degrees.

The cooling device 100 can adjust the state of the opening and closing device 150 at the first air outlet 116 according to the temperature of the first heat source 210 and the second heat source 220 , so that the cooling device 100 can synchronize the first heat source 210 and the second heat source 220 through a single impeller 120 The heat is discharged, or only the second heat source 220 is discharged, so the cost and space of the heat sink 100 can be saved.

It should be understood that, in the above description, the described component connection relationship will not be repeated, and it is the same as the foregoing description. In the following description, heat sinks with other forms of opening and closing devices will be described.

Fig. 6 is a perspective view of a heat sink 100' according to another embodiment of the present invention. FIG. 7 is a perspective view of the heat sink 100' in FIG. 6 when the upper cover 112 of the casing 110 is removed. Referring to FIG. 6 and FIG. 7 at the same time, the heat dissipation device 100' includes a housing 110, an impeller 120, a first heat conduction component 130, a second heat conduction component 140, and an opening and closing device 160. The difference from the embodiment shown in FIGS. 1 and 2 is that the opening and closing device 160 includes a windshield 162 and an electromagnet 164 . One end of the windshield 162 is pivotally connected to the casing 110 , and the other end is a free end. The electromagnet 164 is separated from the free end of the windshield 162 by a distance.

When the electromagnet 164 is energized, the state of the windshield 162 is shown in FIG. 7 . The free end of the windshield 162 is moved toward the electromagnet 164 by the magnetic force to close the first air outlet 116 . The wind deflector 162 may be an arc-shaped flexible metal sheet (such as a copper sheet), and the length of the wind deflector 162 is greater than the length of the first air outlet 116 .

FIG. 8 is a perspective view of the opening and closing device 160 in FIG. 7 when the first air outlet 116 is opened. Referring to FIG. 7 and FIG. 8 at the same time, the casing 110 may further include a blocking member 111 . The baffle 111 is located between the impeller 120 and the wind deflector 162 .

When the electromagnet 164 is not energized, the state of the windshield 162 is shown in FIG. 8 . The wind deflector 162 moves away from the electromagnet 164 through its own elasticity, so that the wind deflector 162 can lean against the blocking member 111 to open the first air outlet 116 . However, in order to ensure that the wind deflector 162 can abut against the blocking member 111 when the electromagnet 164 is not energized, the material of the blocking member 111 may include a magnetic material, so that the blocking member 111 has the function of attracting the wind deflector 162 . When the electromagnet 164 is energized, the magnetic force between the electromagnet 164 and the windshield 162 is greater than the magnetic force between the stopper 111 and the windshield 162, so that the windshield 162 can be attracted to the shell next to the electromagnet 164 from the stopper 111 Body 110.

Although the specific embodiments of the present invention are disclosed in the above embodiments, they are not intended to limit the present invention. Those with common knowledge in the technical field of the present invention, without departing from the principle and spirit of the present invention, Various changes and modifications can be made thereto, so the protection scope of the present invention should be defined by the claims.

Claims (10)

1. a heat abstractor, it is applied to the electronic installation with the first thermal source and Secondary Heat Source, it is characterized in that, and this heat abstractor comprises:

Housing, it has accommodation space, the first air outlet and the second air outlet, and this first air outlet is communicated with this accommodation space with this second air outlet;

Impeller, it is arranged in above-mentioned accommodation space;

The first heat-conductive assembly, it is connected in above-mentioned the first air outlet and above-mentioned the first thermal source;

The second heat-conductive assembly, it is connected in above-mentioned the second air outlet and above-mentioned Secondary Heat Source; And

Closing device, it is arranged at above-mentioned the first air outlet, in order to above-mentioned the first air outlet of opening and closing of fault.

2. heat abstractor according to claim 1, is characterized in that, described closing device comprises: deep bead, it is arranged at described the first air outlet movably.

3. heat abstractor according to claim 2, is characterized in that, described closing device also comprises: control device, it is connected in described deep bead.

4. heat abstractor according to claim 3, it is characterized in that, described housing has location notch and perforation, and the opposite end of described deep bead has respectively rotating shaft, one in these two rotating shafts is coupled in this location notch, and another is coupled in this perforation and connects described control device.

5. heat abstractor according to claim 2, is characterized in that, the angle of the opening direction of described deep bead and described the first air outlet is between 0 to 90 degree.

6. heat abstractor according to claim 2, is characterized in that, one end of described deep bead is articulated in described housing, and described closing device also comprises:

Electromagnet, the other end of itself and the described deep bead spacing of being separated by, in the time of this electromagnet energising, described deep bead moves and seals described the first air outlet towards this electromagnet.

7. heat abstractor according to claim 6, is characterized in that, described housing also comprises:

Block piece, it is between described impeller and described deep bead, and in the time that described electromagnet is not switched on, described deep bead is resisted against this block piece and opens described the first air outlet.

8. heat abstractor according to claim 6, is characterized in that, the flexible sheet metal that described deep bead is arc, and the length of described deep bead is greater than the length of described the first air outlet.

9. heat abstractor according to claim 1, is characterized in that, also comprises:

Temperature sensor, it is electrically connected described closing device, in order to monitor the temperature of described the first thermal source and described Secondary Heat Source.

10. heat abstractor according to claim 1, it is characterized in that, described the first heat-conductive assembly comprises the first fin and the first heat pipe, and this first fin is positioned at described the first air outlet, and this first heat pipe is connected between this first fin and described the first thermal source; Described the second heat-conductive assembly comprises the second fin and the second heat pipe, and this second fin is positioned at described the second air outlet, and this second heat pipe is connected between this second fin and described Secondary Heat Source.

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