CN103779316A - Power module soldering structure - Google Patents
Power module soldering structure Download PDFInfo
- Publication number
- CN103779316A CN103779316A CN201410034552.4A CN201410034552A CN103779316A CN 103779316 A CN103779316 A CN 103779316A CN 201410034552 A CN201410034552 A CN 201410034552A CN 103779316 A CN103779316 A CN 103779316A
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- China
- Prior art keywords
- heat
- substrate
- heat dissipation
- radiating
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005476 soldering Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000004519 grease Substances 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract 15
- 230000004907 flux Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 101000709025 Homo sapiens Rho-related BTB domain-containing protein 2 Proteins 0.000 description 1
- 102100032658 Rho-related BTB domain-containing protein 2 Human genes 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A power module soldering structure comprises a heat dissipation substrate mounted on a radiator through fasteners. A copper-covered ceramic substrate with a chip is soldered on the upper face of the heat dissipation substrate, the normal state of the heat dissipation substrate before the heat dissipation substrate is soldered with the copper-covered ceramic substrate into a whole is that the middle of the heat dissipation substrate is bent and deformed downwards in a certain outward protruding mode, the thermal expansivity of the heat dissipation substrate is larger than that of the copper-covered ceramic substrate (2) soldered on the heat dissipation substrate, and after the heat dissipation substrate is soldered with the copper-covered ceramic substrate into the whole, a heat dissipation face where the lower face of the heat dissipation substrate makes contact with the radiator is a smooth surface. The copper-covered ceramic substrate is soldered on the soldering face of the upper face of the heat dissipation substrate through soldering flux. Heat conductive grease with a certain thickness coats the heat dissipation face on the lower face of the heat dissipation substrate, and the heat dissipation substrate is mounted on the radiator through the fasteners. After the power module is soldered, the heat dissipation substrate can make good contact with the radiator, heat generated by the power module in work can be conducted and given out effectively, and the power module soldering structure can improve the stability of the power module and prolong the service life of the power module effectively.
Description
Technical field
What the present invention relates to is a kind of power model Welding Structure that deformation-compensated welded heat-radiating substrate is installed, and belongs to design and the encapsulation technology field of semi-conductor power module.
Technical background
Semi-conductor power module is chip, cover copper ceramic substrate (Direct Bonded Copper, DBC), heat-radiating substrate is connect and is assembled into together by soldering.Semi-conductor power module is in the time of work, and chip can produce heat, and most of caloric requirement is distributed by the transmission of scolder → DBC → scolder → heat-radiating substrate → thermal grease conduction → radiator.
Semi-conductor power module is first at heat-radiating substrate surface-coated one deck heat-conducting silicone grease before installation, then is arranged on radiator; The thickness of heat-conducting silicone grease is generally between 0.08mm ~ 0.15mm, and the thermal conductivity ratio of heat-conducting silicone grease heat-radiating substrate conductive coefficient made of copper is large, so requiring itself just has good contact between heat-radiating substrate and radiator, realize effective transmission of heat, thereby guaranteed output module there is good electric property.
And generally, DBC and heat-radiating substrate are to use the different material of thermal coefficient of expansion to manufacture, after high-temperature soldering, in cooling process, due to coefficient of thermal expansion difference, heat-radiating substrate is stressed, can occur bending and deformation.So in order to there is in use good contact between the heat-radiating substrate of guaranteed output module and radiator, reach good radiating effect, before welding, make heat-radiating substrate there is the contrary predeformation of flexural deformation when cooling with welding.
Summary of the invention
The object of the invention is to overcome the deficiency that prior art exists, and provide a kind of power model after welding, its heat-radiating substrate can have good contact with radiator, and make the heat that power model when work produces can effectively conduct, distribute, can effectively improve the stability of power model and the power model Welding Structure in useful life.
The object of the invention is to complete by following technical solution, described power model Welding Structure, it includes one and is arranged on the heat-radiating substrate on a radiator by securing member, above this heat-radiating substrate, be welded with one and cover copper ceramic substrate with chip, described heat-radiating substrate with cover the normal state of copper ceramic substrate before integrally welded and be: middle for being the flexural deformation of certain evagination downwards, and the large soldered thereon thermal coefficient of expansion that covers copper ceramic substrate 2 of the thermal coefficient of expansion of described heat-radiating substrate, and make described heat-radiating substrate with cover copper ceramic substrate integrally welded after, the radiating surface contacting with radiator below heat-radiating substrate is burnishing surface.
The described copper ceramic substrate of covering is welded in the solder side above heat-radiating substrate by scolder; On radiating surface below described heat-radiating substrate, apply certain thickness thermal grease conduction, and be arranged on radiator by securing member.
Described heat-radiating substrate is mainly made by red copper, and thickness is between 3-5mm, and surface electrical is coated with Cu, Ni, and Au, Sn metal, guarantee fund's metal surface has good welded activity and non-oxidizability, and good outward appearance.
The present invention utilizes to have deformation-compensated heat-radiating substrate for semi-conductor power module, the radiating surface that is heat-radiating substrate is the curved surface with certain radian before welding, copper ceramic substrate (Direct Bonded Copper is covered in solder side welding at heat-radiating substrate, DBC), after, the radiating surface of heat-radiating substrate has good contact with assembling radiator.
Power model of the present invention is after welding, and its heat-radiating substrate can have good contact with radiator, and makes the heat that power model when work produces can effectively conduct, distribute, and can effectively improve stability and the useful life of power model.
Accompanying drawing explanation
Fig. 1 is sectional drawing before the heat-radiating substrate welding that is curved surface of described chip, DBC, solder side.
Fig. 2 is sectional drawing after the heat-radiating substrate welding that is curved surface of chip, DBC, solder side.
Fig. 3 is that power model is arranged on the sectional drawing on radiator.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be described in detail: power model is at effectively distribute heat of when work, and substrate radiating surface must have good contacting with radiator.And because power model welds in functional part process on heat-radiating substrate, both thermal coefficient of expansion differences, heat-radiating substrate radiating surface can produce Inward deflection.Make power model in use, between heat-radiating substrate and radiator, produce cavity, can not efficiently radiates heat.
So there is deformation-compensated heat-radiating substrate and substitute general heat-radiating substrate with a kind of, this deformation-compensated deflection being slightly larger than after heat-radiating substrate welding, power model is installed after radiating surface still can contact good with radiator; This deformation-compensated be that the radiating surface of heat-radiating substrate outwards has certain evagination flexural deformation.
Shown in Fig. 1-3, power model Welding Structure of the present invention, it includes one and is arranged on the heat-radiating substrate 3 on a radiator 4 by securing member, this heat-radiating substrate 3 is welded with one above and covers copper ceramic substrate 2 with chip 1, described heat-radiating substrate 3 with cover the normal state of copper ceramic substrate 2 before integrally welded and be: middle for being the flexural deformation of certain evagination downwards, and the large soldered thereon thermal coefficient of expansion that covers copper ceramic substrate 2 of the thermal coefficient of expansion of described heat-radiating substrate 3, and make described heat-radiating substrate 3 with cover copper ceramic substrate 2 integrally welded after, the radiating surface 31 that heat-radiating substrate 3 contacts with radiator 4 is below burnishing surface.
The described copper ceramic substrate 2 of covering is welded in heat-radiating substrate 3 solder side 32 above by scolder 21; On described heat-radiating substrate 3 radiating surface 31 below, apply certain thickness thermal grease conduction 41, and be arranged on radiator 4 by securing member 5.
Embodiment
As shown in Figure 1, the radiating surface 31 of heat-radiating substrate 3 outwards has certain evagination flexural deformation, and chip covers copper ceramic substrate (Direct Bonded Copper, DBC) 2 and be welded in by scolder the solder side 32 of heat-radiating substrate 3.
As shown in Figure 2, DBC2 is welded on heat-radiating substrate 3, due to both thermal coefficient of expansion differences, DBC thermal coefficient of expansion < copper material thermal coefficient of expansion, so in the cooling procedure after welding, heat-radiating substrate solder side tension stress, solder side projection, be radiating surface 31 Inward deflections, but still old certain outwardly convex or smooth.
As shown in Figure 3, on the heat-radiating substrate radiating surface of power model, apply certain thickness thermal grease conduction 41, use securing member 5 to be arranged on radiator 4, have certain projection or smooth radiating surface to contact with radiator better.
Claims (3)
1. a power model Welding Structure, it includes one and is arranged on the heat-radiating substrate (3) on a radiator (4) by securing member, this heat-radiating substrate (3) is welded with one above and covers copper ceramic substrate (2) with chip (1), it is characterized in that described heat-radiating substrate (3) with cover the normal state of copper ceramic substrate (2) before integrally welded and be: middle for being the flexural deformation of certain evagination downwards, and the large soldered thereon thermal coefficient of expansion that covers copper ceramic substrate 2 of the thermal coefficient of expansion of described heat-radiating substrate 3, and make described heat-radiating substrate 3 with cover copper ceramic substrate 2 integrally welded after, the radiating surface (31) that heat-radiating substrate 3 contacts with radiator 4 is below burnishing surface.
2. power model Welding Structure according to claim 1, is characterized in that the described copper ceramic substrate (2) of covering is welded in heat-radiating substrate (3) solder side (32) above by scolder (21); Described heat-radiating substrate (3) radiating surface (31) is below upper applies certain thickness thermal grease conduction (41), and is arranged on radiator (4) by securing member (5).
3. power model Welding Structure according to claim 1 and 2, the heat-radiating substrate (3) described in it is characterized in that is mainly made by red copper, and thickness is between 3-5mm, and surface electrical is coated with Cu, Ni, Au, Sn metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034552.4A CN103779316A (en) | 2014-01-25 | 2014-01-25 | Power module soldering structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034552.4A CN103779316A (en) | 2014-01-25 | 2014-01-25 | Power module soldering structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103779316A true CN103779316A (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410034552.4A Pending CN103779316A (en) | 2014-01-25 | 2014-01-25 | Power module soldering structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103779316A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140193A (en) * | 2015-05-04 | 2015-12-09 | 嘉兴斯达半导体股份有限公司 | Power module welding structure of copper-clad ceramic heat radiation substrate |
| CN105655307A (en) * | 2016-03-09 | 2016-06-08 | 上海道之科技有限公司 | Power module structure with vapor chamber heat radiation substrate |
| CN106856180A (en) * | 2015-12-08 | 2017-06-16 | 株洲南车时代电气股份有限公司 | A kind of method for welding IGBT module |
| CN107851617A (en) * | 2015-07-09 | 2018-03-27 | 株式会社东芝 | Ceramet circuit substrate and the semiconductor device for having used the ceramet circuit substrate |
| CN111787683A (en) * | 2020-06-30 | 2020-10-16 | 深圳市麦格米特焊接技术有限公司 | Main power board encapsulation integral structure and electric welding |
| CN111964149A (en) * | 2020-08-18 | 2020-11-20 | 石家庄格力电器小家电有限公司 | Radiator assembly, oil heater, shaping die of radiator assembly and shaping method |
| CN112331622A (en) * | 2019-08-05 | 2021-02-05 | 珠海格力电器股份有限公司 | A kind of packaging method and module of insulated gate bipolar transistor module |
| CN116275368A (en) * | 2023-03-21 | 2023-06-23 | 重庆云潼车芯电子科技有限公司 | A welding jig for an IGBT module and a preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327711A (en) * | 2003-04-24 | 2004-11-18 | Toyota Motor Corp | Semiconductor module |
| CN201508833U (en) * | 2009-04-02 | 2010-06-16 | 嘉兴斯达微电子有限公司 | Base plate for an insulation gate bipolar transistor module |
| CN102969283A (en) * | 2011-09-01 | 2013-03-13 | 英飞凌科技股份有限公司 | Elastic mounting of power modules |
| CN203746836U (en) * | 2014-01-25 | 2014-07-30 | 嘉兴斯达半导体股份有限公司 | Power module welding structure |
-
2014
- 2014-01-25 CN CN201410034552.4A patent/CN103779316A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327711A (en) * | 2003-04-24 | 2004-11-18 | Toyota Motor Corp | Semiconductor module |
| CN201508833U (en) * | 2009-04-02 | 2010-06-16 | 嘉兴斯达微电子有限公司 | Base plate for an insulation gate bipolar transistor module |
| CN102969283A (en) * | 2011-09-01 | 2013-03-13 | 英飞凌科技股份有限公司 | Elastic mounting of power modules |
| CN203746836U (en) * | 2014-01-25 | 2014-07-30 | 嘉兴斯达半导体股份有限公司 | Power module welding structure |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140193A (en) * | 2015-05-04 | 2015-12-09 | 嘉兴斯达半导体股份有限公司 | Power module welding structure of copper-clad ceramic heat radiation substrate |
| CN107851617A (en) * | 2015-07-09 | 2018-03-27 | 株式会社东芝 | Ceramet circuit substrate and the semiconductor device for having used the ceramet circuit substrate |
| CN107851617B (en) * | 2015-07-09 | 2021-04-30 | 株式会社东芝 | Ceramic metal circuit board and semiconductor device using the same |
| CN106856180A (en) * | 2015-12-08 | 2017-06-16 | 株洲南车时代电气股份有限公司 | A kind of method for welding IGBT module |
| CN105655307A (en) * | 2016-03-09 | 2016-06-08 | 上海道之科技有限公司 | Power module structure with vapor chamber heat radiation substrate |
| CN112331622A (en) * | 2019-08-05 | 2021-02-05 | 珠海格力电器股份有限公司 | A kind of packaging method and module of insulated gate bipolar transistor module |
| CN111787683A (en) * | 2020-06-30 | 2020-10-16 | 深圳市麦格米特焊接技术有限公司 | Main power board encapsulation integral structure and electric welding |
| CN111964149A (en) * | 2020-08-18 | 2020-11-20 | 石家庄格力电器小家电有限公司 | Radiator assembly, oil heater, shaping die of radiator assembly and shaping method |
| CN116275368A (en) * | 2023-03-21 | 2023-06-23 | 重庆云潼车芯电子科技有限公司 | A welding jig for an IGBT module and a preparation method thereof |
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Application publication date: 20140507 |
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| RJ01 | Rejection of invention patent application after publication |