CN103770468B - Liquid injection device and its integral molding manufacturing method - Google Patents

Abstract

The invention provides a liquid ejecting apparatus and an integrated manufacturing method thereof, wherein the method comprises forming a plurality of pressure generating components arranged at intervals on a first substrate; forming pressure chambers corresponding to the plurality of pressure generating parts and a common chamber communicating with the plurality of pressure chambers on the first surface of the first substrate; an orifice plate is formed on the pressure chamber through a bonding process and an orifice communicated with the pressure chamber is formed on the orifice plate through a photolithography process. The liquid ejecting apparatus and the integrated manufacturing method thereof provided by the invention form the pressure chambers and the common chamber on the first surface of the first substrate, and when the number of the pressure chambers of the high liquid ejecting apparatus needs to be increased, because the pressure chambers are separately formed on the first substrate in the embodiment, the mechanical strength of the first substrate is not reduced, and the first substrate can be prevented from being damaged in the manufacturing process, thereby improving the yield of the liquid ejecting apparatus and reducing the manufacturing cost.

Description

Liquid injection device and its integral molding manufacturing method

technical field

The invention relates to printer technology, in particular to a liquid ejecting device and an integrated manufacturing method thereof.

Background technique

The liquid ejecting device of the printer changes the volume of the pressure chamber through the deformation of the piezoelectric element and the vibrating plate, so that the ink in the pressure chamber is ejected from the nozzle hole.

An existing liquid injection device includes a base, a vibrating plate and a piezoelectric element arranged on the first surface of the base, and an orifice plate bonded on the second surface of the base (the side opposite to the first surface). The existing manufacturing method of the liquid ejecting device is: form a vibrating plate and a piezoelectric element on the first surface of the substrate, and etch a plurality of corresponding piezoelectric elements on the substrate through an etching process on the second surface of the substrate. The pressure chamber for storing the liquid and the common chamber corresponding to the position of the ink supply hole. Finally, the orifice plate is bonded on the second surface of the substrate, so that the multiple nozzle holes on the orifice plate are respectively connected with each pressure chamber. connected. When the liquid ejecting device is in operation, the piezoelectric element is driven by voltage to generate deformation, which is transmitted to the vibrating plate to cause the volume change of the pressure chamber, so that the liquid in the pressure chamber is ejected from the nozzle hole to complete printing.

However, in order to improve the printing resolution of the printer, it is necessary to increase the number of pressure chambers of the high-liquid ejection device. Since the pressure chambers of the existing liquid ejection device are formed by etching on the substrate, increasing the number of pressure chambers requires a corresponding reduction. The thickness of the side wall adjacent to the pressure chamber will inevitably lead to a decrease in the mechanical strength of the silicon wafer as the substrate, and the substrate is prone to damage during the manufacturing process, which reduces the yield of the liquid injection device and increases the manufacturing cost; on the other hand, Since the nozzle plate is bonded to the base of the pressure chamber by adhesive, if the adhesive flows into the pressure chamber, the printing quality will also be affected.

Contents of the invention

The present invention provides a liquid ejecting device and its integrated manufacturing method, which are used to solve the problems of low yield, high manufacturing cost and poor printing quality of the liquid ejecting device manufactured by the integrated manufacturing method of the liquid ejecting device in the prior art defect.

The invention provides a liquid injection device integral molding manufacturing method, including:

forming a plurality of spaced apart pressure generating components on the first substrate;

forming pressure chambers corresponding to the plurality of pressure generating components and a common chamber communicating with the plurality of pressure chambers on the first surface of the first substrate;

An orifice plate is formed on the pressure chamber through a bonding process, and an orifice communicating with the pressure chamber is formed on the orifice plate through a photolithography process.

The present invention also provides a liquid injection device, which is manufactured by using the above-mentioned liquid injection device integral molding manufacturing method.

The liquid ejection device and its integral molding manufacturing method provided by the present invention are to form pressure chambers and common chambers on the first surface of the first substrate. When it is necessary to increase the number of pressure chambers of the liquid ejection device, due to An embodiment is to separately form the pressure chamber on the first substrate, so that the mechanical strength of the first substrate will not be reduced, and damage to the first substrate can be avoided during the manufacturing process, thereby improving the yield of the liquid ejecting device and reducing the manufacturing cost. Moreover, forming the orifice plate through the bonding process and forming the orifice on the orifice plate through the photolithography process can prevent the adhesive from flowing into the pressure chamber and improve the printing quality of the liquid ejecting device.

Description of drawings

Fig. 1 is a flow chart of a manufacturing method for integral molding of a liquid injection device provided by an embodiment of the present invention;

FIG. 2 is a flowchart of a specific embodiment of step 200 in FIG. 1;

FIG. 3 is a flowchart of a specific implementation of step 300 in FIG. 1;

FIG. 4 is a flowchart of a specific implementation of step 100 in FIG. 1;

Fig. 5 is a flow chart of another integrated manufacturing method for a liquid injection device provided by an embodiment of the present invention;

6 is a schematic structural view of a liquid injection device manufactured in an embodiment of the present invention;

7A-7H are structural views of the product manufacturing process of a specific implementation of step 200 in the embodiment of the present invention;

8A-8G are structural views of the product manufacturing process in another embodiment of the present invention;

9A-9C are structural views of the product manufacturing process in another embodiment of the present invention;

10A-10B are structural views of the product manufacturing process in yet another embodiment of the present invention.

detailed description

Fig. 1 is a flow chart of a manufacturing method for integral molding of a liquid ejection device provided in an embodiment of the present invention. As shown in Fig. 1 , the manufacturing method for integral molding of a liquid ejecting device provided in this embodiment includes:

Step 100, forming a plurality of spaced apart pressure generating components on a first substrate.

Step 200, forming pressure chambers corresponding to the plurality of pressure generating components and a common chamber communicating with the plurality of pressure chambers on the first surface of the first substrate.

Specifically, FIG. 2 is a flowchart of a specific implementation of step 200 in FIG. 1; as shown in FIG. The pressure chamber and the common chamber communicating with a plurality of said pressure chambers may include:

Step 201, disposing and exposing a chamber layer on the first surface of the first substrate to define the shape and position of the pressure chamber and the common chamber.

Specifically, FIG. 6 is a schematic structural view of a liquid injection device manufactured in an embodiment of the present invention; FIGS. 7A-7H are structural views of a product manufacturing process of a specific implementation of step 200 in an embodiment of the present invention, as shown in FIGS. 6 and 7A As shown, the first substrate 1 can be a silicon substrate, the first surface of the first substrate 1 is the upper surface of the first substrate 1 shown in the figure, and the chamber layer 5a can be suspended on the first surface of the first substrate 1 , the material of the chamber layer 5a can be a negative photosensitive adhesive SU8 with good machinability, the chamber layer 5a can be coated with the entire upper surface of the first substrate 1, the thickness of the chamber layer 5a is consistent with the pressure chamber and the public chamber The height dimensions match.

As shown in Figures 6 and 7B, the chamber layer 5a can be exposed using the mask 12a, and the shape and position of the pressure chamber 5 and the common chamber 7 are defined by the structure of the mask 12a and the exposure process, wherein the cavity The chamber wall 5b is cured and will not be removed by the developing solution used in the subsequent process.

Step 202, developing to form a pressure chamber and a common chamber.

As shown in Figure 7C, the chamber layer 5a can be developed with developer 1,2 propylene glycol formate (PMEGA), the cured chamber wall 5b is retained, and the rest is removed to form the pressure chamber 5 and the common Chamber 7 (shown in Figure 6).

In step 300, an orifice plate is formed on the pressure chamber through a bonding process, and an orifice communicating with the pressure chamber is formed on the orifice plate through a photolithography process. Specifically, FIG. 3 is a flowchart of a specific implementation of step 300 in FIG. 1; as shown in FIG. 3, step 300 may include:

In step 301, a spray hole layer is hang-coated on a second substrate.

As shown in Fig. 7D, the material of the second substrate 1' can be plexiglass, etc., and the material of the orifice layer 6a can be a negative photosensitive adhesive SU8 with good machinability.

Step 302, bonding the chamber wall of the chamber layer and the orifice layer together through a bonding process, as shown in FIG. 7E .

Step 303, peeling off the second substrate, as shown in FIG. 7F.

Further, as shown in FIG. 7G and FIG. 7H, the mask plate 12b can be used to expose the nozzle hole layer 6a, and the shape and position of the nozzle hole can be defined by the structure form of the mask template 12b and the exposure process, wherein the nozzle hole wall is Cured, it will not be removed by the developer used in the subsequent process. The orifice layer 6 a is developed with a developer solution 1,2 propylene glycol formate (PMEGA), the cured orifice wall remains, and the rest is removed to form the orifice 6 .

The integrated manufacturing method of the liquid ejection device provided in this embodiment is to form a pressure chamber and a common chamber on the first surface of the first substrate. When it is necessary to increase the number of pressure chambers of the liquid ejection device, due to For example, the pressure chamber is separately formed on the first substrate, so that the mechanical strength of the first substrate is not reduced, and damage to the first substrate can be avoided during the manufacturing process, thereby improving the yield of the liquid ejecting device and reducing the manufacturing cost. Moreover, forming the orifice plate through the bonding process and forming the orifice on the orifice plate through the photolithography process can prevent the adhesive from flowing into the pressure chamber and improve the printing quality of the liquid ejecting device.

FIG. 4 is a flow chart of a specific embodiment of step 100 in FIG. 1 , and FIGS. 8A-8G are structural views of a product manufacturing process in another embodiment of the present invention. As shown in Fig. 4, on the basis of the technical solutions of the above embodiments, step 100, forming a plurality of spaced apart pressure generating components on the first substrate may include:

Step 101, etching the first surface of the first substrate to form grooves.

As shown in FIG. 8A , specifically, a groove 2 is formed on the first surface of the first substrate 1 by dry etching or wet etching, and the groove 2 is used for accommodating a pressure generating component.

Step 102 , forming a piezoelectric element in the groove, the upper surface of the piezoelectric element being flush with the first surface of the first substrate.

As shown in Figure 8B, a lower electrode layer 3c, a piezoelectric layer 3b and an upper electrode layer 3a can be sequentially formed in the groove 2 by sputtering; wherein, the lower electrode layer 3c is a titanium (Ti) layer, platinum (Pt ) layer or a stack of multiple titanium layers; the piezoelectric body layer 3b is a lead zirconate titanate (PZT) layer; the upper electrode layer 3a is a platinum (Pt) layer or a gold layer.

Step 103 , forming a vibrating plate on the first surface of the first substrate, and the vibrating plate is covered outside the piezoelectric element.

As shown in Figure 8C, a vibrating plate 4 is formed on the first surface of the first substrate 1 by low pressure chemical vapor deposition or plasma enhanced chemical vapor deposition, and the material of the vibrating plate 4 can be SiO ₂ or Si ₃ N ₄ or SiO ₂ -Si ₃ N ₄ laminated layers; the vibrating plate 4 is covered on the outside of the upper electrode layer 3a, and the outer edge is covered on the first surface of the first substrate 1 .

Then, as shown in Figure 8D, the pressure chamber 5, the common chamber 7, and the nozzle hole 6 can be formed by using the integral molding manufacturing method provided by the above embodiment, and the printing resolution can be improved by using this method to form the above chamber and nozzle hole , and the miniaturization of the liquid ejecting device can be realized.

Fig. 5 is a flow chart of another integrated manufacturing method for a liquid injection device provided by an embodiment of the present invention; as shown in Fig. 5, further, after step 300 in the above-mentioned integrated manufacturing method, it may further include:

Step 400, etching the two surfaces of the first substrate to form an ink supply hole communicating with the common chamber and a cavity communicating with the pressure generating component.

As shown in Figure 8E, the second surface of the first substrate 1 (the lower surface of the first substrate shown in the figure) can be etched by dry etching to form the ink supply hole 8 communicating with the common chamber 7 and the piezoelectric element. The lower electrode layer 3c in 3 communicates with the cavity 9, wherein the cavity 9 can increase the vibration amplitude of the piezoelectric element 3.

In order to further improve the vibration performance of the piezoelectric element 3, as shown in FIG. 8F, a gap 10 can be formed between both sides of the piezoelectric element 3 and the first substrate 1, and the gap 10 can ensure that the piezoelectric element 3 is not affected by vibration during vibration. The confinement of the first substrate 1 increases the vibration amplitude.

Step 500, disposing a cover plate on the second surface of the first base, the cover plate covers the cavity and keeps the ink supply hole unblocked.

As shown in FIG. 8G , a cover plate 11 is bonded on the second surface of the first substrate 1 to complete the manufacturing process of the liquid ejecting device. The material of the cover plate 11 may be polymethyl acrylate (PMMA).

In the technical solution of the above embodiment, step 100, forming a plurality of spaced apart pressure generating components on the first substrate, can also be realized in other ways. Specifically, step 100 may include:

Step 101', forming a vibrating plate on the first surface of the first substrate.

As shown in FIG. 9A, a vibrating plate can be formed on the first surface of the first substrate 1 by low-pressure chemical vapor deposition or plasma-enhanced chemical vapor deposition; wherein, the material of the vibrating plate is SiO ₂ or Si ₃ N ₄ Or SiO ₂ -Si ₃ N ₄ stack.

Step 102', forming piezoelectric elements on the vibrating plate.

As shown in Figure 9B, the lower electrode layer 3c can be formed by the sputtering method, the piezoelectric layer 3b can be formed by the sol-gel method, and the upper electrode layer 3a can be formed by the sputtering method; wherein, the lower electrode layer 3c can be a titanium (Ti) layer , a platinum (Pt) layer or a stack of multiple titanium layers; the piezoelectric layer can be a lead zirconate titanate (PZT) layer; the upper electrode layer can be a platinum (Pt) layer or a gold layer.

As shown in FIG. 9C , then, the pressure chamber 5 , the common chamber 7 and the injection hole 6 can be formed on the first surface of the first substrate 1 by using the integral molding manufacturing method provided in the above-mentioned embodiments. An ink supply hole 8 communicating with the common chamber 7 and a cavity 9 communicating with the lower electrode layer 3 c of the pressure element 3 are formed by etching on the second surface of the first substrate 1 . A cover plate 11 is provided on the second surface of the first base 1 , and the cover plate 11 covers the cavity 9 and keeps the ink supply hole 9 unblocked.

10A-10B are structural views of the product manufacturing process in yet another embodiment of the present invention. As shown in Fig. 10A, on the basis of the technical solutions of the above embodiments, in step 100, a plurality of spaced apart pressure generating components are formed on the first substrate, specifically:

A thin film resistance layer 3' is deposited on the first surface of the first substrate 1, and the material of the thin film resistance layer 3' is tantalum aluminum alloy or nickel chromium alloy or tungsten silicon nitride or titanium nitride.

As shown in FIG. 10B , further, the second surface of the first substrate 1 is etched to form an ink supply hole 8 communicating with the common chamber 7 .

The specific liquid ejecting process of the liquid ejecting device manufactured in this embodiment is: the liquid reaches the common chamber 7 through the ink supply hole 8, and at the same time, the thin film resistance layer 3' heats the liquid at a speed of 1000 °C/μs after applying the pulse signal, about At about 340°C, the volatile components in the liquid are vaporized to generate bubbles, and the bubbles push the ink droplets out of the nozzle hole 6 from the original position; the formation of the bubbles is reversible. When the pulse signal is released, the passive cooling will cause the bubbles to instantly At this time, ink droplets will be completely ejected from the nozzle hole 6.

The present invention also provides a liquid injection device, which is manufactured by using the liquid injection device integrated manufacturing method provided in the above embodiments. The liquid ejection device provided by this embodiment forms pressure chambers and common chambers on the first surface of the first substrate. When it is necessary to increase the number of pressure chambers of the liquid ejection device, since this embodiment is A separate pressure chamber is formed on a substrate, so the mechanical strength of the first substrate is not reduced, and damage to the first substrate can be avoided during the manufacturing process, thereby improving the yield of the liquid ejecting device and reducing the manufacturing cost. Moreover, forming the orifice plate through the bonding process and forming the orifice on the orifice plate through the photolithography process can prevent the adhesive from flowing into the pressure chamber and improve the printing quality of the liquid ejecting device.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (11)

1. A manufacturing method for integral molding of a liquid injection device, characterized in that it comprises: forming a plurality of spaced apart pressure generating components on the first substrate; forming pressure chambers corresponding to the plurality of pressure generating components and a common chamber communicating with the plurality of pressure chambers on the first surface of the first substrate; An orifice plate is formed on the pressure chamber by a bonding process, and an orifice communicating with the pressure chamber is formed on the orifice plate by a photolithography process; The formation of pressure chambers corresponding to the plurality of pressure generating components and a common chamber communicating with the plurality of pressure chambers on the first surface of the first substrate includes: on the first surface of the first substrate The chamber layer is set and exposed to define the shape and position of the pressure chamber and the common chamber, and the material of the chamber layer is a negative photosensitive adhesive; developing to form the pressure chamber and the public chamber; The formation of an orifice plate on the pressure chamber through a bonding process includes: coating an orifice layer on the second substrate, and the material of the orifice layer is a negative photosensitive adhesive; The chamber wall of the chamber layer is bonded to the orifice layer; the second substrate is peeled off. 2. The manufacturing method of integral molding of the liquid injection device according to claim 1, wherein the formation of a plurality of spaced apart pressure generating components on the first substrate comprises: etching the first surface of the first substrate to form grooves; forming a piezoelectric element in the groove, the upper surface of the piezoelectric element is flush with the first surface of the first substrate; A vibrating plate is formed on the first surface of the first substrate, the vibrating plate is covered outside the piezoelectric element. 3. The integral molding manufacturing method of the liquid injection device according to claim 2, wherein the forming the piezoelectric element in the groove comprises: A lower electrode layer, a piezoelectric body layer, and an upper electrode layer are sequentially formed in the groove by sputtering; wherein, the lower electrode layer is a titanium layer, a platinum layer, or a stack of multiple titanium layers; the piezoelectric The body layer is a lead zirconate titanate layer; the upper electrode layer is a platinum layer or a gold layer. 4. The liquid injection device integral molding manufacturing method according to claim 2 or 3, characterized in that, an orifice plate is formed on the pressure chamber through a bonding process and an orifice plate is formed on the nozzle through a photolithography process. After the nozzle hole communicating with the pressure chamber is formed on the orifice plate, it also includes: etching the second surface of the first substrate to form an ink supply hole communicating with the common chamber and a cavity communicating with the pressure generating component; A cover plate is arranged on the second surface of the first base, and the cover plate covers the cavity and keeps the ink supply hole unblocked. 5. The liquid injection device integrated molding manufacturing method according to claim 4, characterized in that said etching the second surface of the first substrate forms an ink supply hole communicating with the common chamber and a cavity communicating with the pressure generating component After that, also include: A gap is formed between both sides of the piezoelectric element and the first substrate. 6. The manufacturing method of integral molding of the liquid injection device according to claim 1, wherein the formation of a plurality of spaced apart pressure generating components on the first substrate comprises: forming a vibrating plate on the first surface of the first substrate; A piezoelectric element is formed on the vibrating plate. 7. The liquid injection device integral molding manufacturing method according to claim 2, 3 or 6, characterized in that: The forming the vibrating plate on the first surface of the first substrate includes: forming the vibrating plate by low pressure chemical vapor deposition or plasma enhanced chemical vapor deposition; wherein, the material of the vibrating plate is SiO ₂ or Si ₃ N ₄ or SiO ₂ -Si ₃ N ₄ stack. 8. The liquid injection device integrated molding manufacturing method according to claim 6, characterized in that, the orifice plate is formed on the pressure chamber through the bonding process and the orifice plate is formed on the orifice plate through the photolithography process. After forming a spray hole communicating with the pressure chamber, it also includes: etching on the second surface of the first substrate to form an ink supply hole communicating with the common chamber and a cavity communicating with the pressure generating component; A cover plate is arranged on the second surface of the first base, and the cover plate covers the cavity and keeps the ink supply hole unblocked. 9. The manufacturing method of integral molding of the liquid injection device according to claim 1, wherein the formation of a plurality of spaced apart pressure generating components on the first substrate comprises: A thin film resistance layer is deposited on the first surface of the first substrate, and the material of the thin film resistance layer is tantalum aluminum alloy or nickel chromium alloy or tungsten silicon nitride or titanium nitride. 10. The integrated manufacturing method of liquid ejection device according to claim 9, characterized in that an orifice plate is formed on the pressure chamber by a bonding process, and an orifice plate is formed on the orifice plate by a photolithography process. After having the orifice in communication with the pressure chamber, it also includes: Etching the second surface of the first substrate forms an ink supply hole in communication with the common chamber. 11. A liquid ejecting device, characterized in that the liquid ejecting device is manufactured by the method for integrally forming a liquid ejecting device according to any one of claims 1 to 10.