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CN103769995B - Lower grinding disc structure - Google Patents

Lower grinding disc structure Download PDF

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Publication number
CN103769995B
CN103769995B CN201310752315.7A CN201310752315A CN103769995B CN 103769995 B CN103769995 B CN 103769995B CN 201310752315 A CN201310752315 A CN 201310752315A CN 103769995 B CN103769995 B CN 103769995B
Authority
CN
China
Prior art keywords
grinding
grinding disc
pod apertures
lower grinding
lower wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310752315.7A
Other languages
Chinese (zh)
Other versions
CN103769995A (en
Inventor
于静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Zhong Yuan New Energy Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201310752315.7A priority Critical patent/CN103769995B/en
Publication of CN103769995A publication Critical patent/CN103769995A/en
Application granted granted Critical
Publication of CN103769995B publication Critical patent/CN103769995B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/12Lapping plates for working plane surfaces
    • B24B37/16Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The invention discloses a lower grinding disc structure which comprises a lower grinding disc. A plurality of S type blades are evenly distributed on the upper surface of the lower grinding disc in the circumferential direction, a plurality of flow guide holes are formed in the edge of the lower grinding disc along the circumference, sealing pieces are arranged on hole openings of the flow guide holes, an annular check block is arranged on the outer side of the lower grinding disc, and a sealing component is arranged at the connecting position of the annular check block and the lower grinding disc. The S type blades of the lower grinding disc can improve grinding time, and can greatly improve grinding efficiency. Grinding sand liquid and finely-divided wafers are blocked by the surrounding annular check block when splashing, and the surrounding environment is prevented from being polluted. In the cleaning process, a brush is used for sweeping the grinding sand liquid and the finely-divided wafers into the flow guide holes, and convenience and simplicity are achieved.

Description

A kind of grinding lower disc
Technical field
The present invention relates to a kind of grind lower disc, belong to wafer grinding manufacture field.
Background technology
When crystal block is dispatched from the factory, its surface is all relatively rough, needs to be ground by grinder.Grinder for wafer grinding processing, in process, grinding upper disc and grinding lower wall are in grinding wafers, have grinding sand liquid and chip in small, broken bits splashes, cause the pollution of working environment, because lapping liquid belongs to chemicals, wafer debris are again excessively broken little it is difficult to cleaning causes the pollution of surrounding.And developing rapidly with chip industry, the technical requirements more and more higher to wafer grinding at present.
Content of the invention
The technical problem to be solved be for above drawback provide a kind of grind lower disc, while improving grinding precision, it is to avoid the phenomenon that grinding sand liquid and chip in small, broken bits splash in process of lapping, improve working effect, improve work efficiency.
For solving above-mentioned technical problem, the technical scheme is that
A kind of grinding lower disc, including grinding lower wall, wherein, described grinding lower wall upper surface has been uniformly distributed circumferentially a plurality of " s " type blade, and between described " s " type blade, angulation θ is 30 degree;Described grind lower plate edge and be circumferentially provided with multiple pod apertures, described pod apertures are inclined to set in disk under milling, and described pod apertures are 45 degree with grinding lower wall lower surface angulation δ, and in described pod apertures, aperture is provided with sealed piece;It is provided with collar stop outside described grinding lower wall, described collar stop is provided with containment member with grinding lower wall junction, described containment member is made up of with " z " type sealing ring two " n " type sealing rings, and in multi-sealing structure, three sealing interannular gaps constitute labyrinth seal.
A kind of grinding lower disc, wherein, the quantity of described " s " type blade is 12.
A kind of grinding lower disc, wherein, described two " n " type sealing ring is located at " z " type sealing ring upper and lower ends.
Method of work: during use, grinding lower wall is in turn clockwise grindings, is stopped by the collar stop of surrounding when grinding sand liquid and chip in small, broken bits splashing, falls under milling on disk.After grinding terminates, ground chip is taken out, the sealed piece in pod apertures is taken off, place refuse bin under pod apertures, using brush, grinding sand liquid and chip in small, broken bits are swept pod apertures.
Beneficial effect;
1, " s " the type blade structure grinding lower wall can accelerate milling time, greatly improves grinding efficiency.
2, stopped by the collar stop of surrounding when grinding sand liquid and chip in small, broken bits splashing, it is to avoid surrounding environment pollutes.
3, during cleaning, using brush, grinding sand liquid and chip in small, broken bits are swept pod apertures, convenient and simple.
Brief description
Fig. 1 is the front view of the present invention.
Fig. 2 is the top view of the present invention.
Fig. 3 is the pod apertures schematic diagram of the present invention.
Fig. 4 is the seal member schematic diagram of the present invention.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.
Embodiment
As illustrated, a kind of grind lower disc, including grinding lower wall 1, wherein, described grinding lower wall 1 upper surface has been uniformly distributed circumferentially a plurality of " s " type blade 2, and 2 angulation θ of described " s " type blade are 30 degree;Described grinding lower wall 1 edge is circumferentially provided with multiple pod apertures 3, and described pod apertures 3 are inclined to set in disk under milling, and described pod apertures 3 are 45 degree with grinding lower wall 1 lower surface angulation δ, and in described pod apertures 1, aperture is provided with sealed piece 4;It is provided with collar stop 5 outside described grinding lower wall 1, described collar stop 5 is provided with containment member 6 with grinding lower wall 1 junction, described containment member 6 is made up of with " z " type sealing ring 62 two " n " type sealing rings 61, and in multi-sealing structure, three sealing interannular gaps constitute labyrinth seal.The quantity of described " s " type blade 2 is 12.Described two " n " type sealing ring 61 is located at " z " type sealing ring 62 upper and lower ends.Described pod apertures 3 quantity is 8.
Method of work: during use, grinding lower wall 1 is in turn clockwise grindings, is stopped by the collar stop 5 of surrounding when grinding sand liquid and chip in small, broken bits splashing, falls under milling on disk 1.After grinding terminates, ground chip is taken out, the sealed piece 4 in pod apertures 3 is taken off, in 3 times placement refuse bins of pod apertures, using brush, grinding sand liquid and chip in small, broken bits are swept pod apertures 3.
Beneficial effect;" s " the type blade structure grinding lower wall can accelerate milling time, greatly improves grinding efficiency.Grinding sand liquid and chip in small, broken bits are stopped by the collar stop of surrounding when splashing, it is to avoid surrounding environment pollutes.During cleaning, using brush, grinding sand liquid and chip in small, broken bits are swept pod apertures, convenient and simple.
The above; be only the present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto, any those familiar with the art the invention discloses technical scope in; the change or replacement that can readily occur in, all should cover within the scope of the present invention.Therefore, protection scope of the present invention should be defined by the protection domain of claims.

Claims (1)

1. a kind of grind lower disc, include grinding lower wall it is characterised in that under described grinding Disk upper surface has been uniformly distributed circumferentially a plurality of " s " type blade, institute between described " s " type blade Angled θ is 30 degree;Under described grinding, plate edge is circumferentially provided with multiple pod apertures, institute State pod apertures to be inclined to set in disk under milling, described pod apertures with grind lower wall lower surface institute Angled δ is 45 degree, and in described pod apertures, aperture is provided with sealed piece;Outside described grinding lower wall Side is provided with collar stop, and described collar stop is provided with containment member with grinding lower wall junction, institute State containment member to be made up of with " z " type sealing ring two " n " type sealing rings, in multiple Sealing structure, three sealing interannular gaps constitute labyrinth seal;The number of described " s " type blade Measure as 12;Described two " n " type sealing ring is located at " z " type sealing ring upper and lower ends.
CN201310752315.7A 2013-12-31 2013-12-31 Lower grinding disc structure Expired - Fee Related CN103769995B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310752315.7A CN103769995B (en) 2013-12-31 2013-12-31 Lower grinding disc structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310752315.7A CN103769995B (en) 2013-12-31 2013-12-31 Lower grinding disc structure

Publications (2)

Publication Number Publication Date
CN103769995A CN103769995A (en) 2014-05-07
CN103769995B true CN103769995B (en) 2017-01-25

Family

ID=50563002

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310752315.7A Expired - Fee Related CN103769995B (en) 2013-12-31 2013-12-31 Lower grinding disc structure

Country Status (1)

Country Link
CN (1) CN103769995B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299516B1 (en) * 1999-09-28 2001-10-09 Applied Materials, Inc. Substrate polishing article
CN1712187A (en) * 2004-06-16 2005-12-28 Cmp罗姆和哈斯电子材料控股公司 Polishing pad with grooved structure that promotes mixing wakes during polishing
CN2838473Y (en) * 2005-09-29 2006-11-22 张明仕 grinder for juicer
CN101125415A (en) * 2006-08-14 2008-02-20 中芯国际集成电路制造(上海)有限公司 Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment
CN102107392A (en) * 2010-12-24 2011-06-29 江苏大学 Wafer grinding tray supporting device
CN102814831A (en) * 2012-08-29 2012-12-12 中国石油大学(北京) Stripping blade and stripping tool having same
CN203696719U (en) * 2013-12-31 2014-07-09 镇江市港南电子有限公司 Novel lower grinding disc structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299516B1 (en) * 1999-09-28 2001-10-09 Applied Materials, Inc. Substrate polishing article
CN1712187A (en) * 2004-06-16 2005-12-28 Cmp罗姆和哈斯电子材料控股公司 Polishing pad with grooved structure that promotes mixing wakes during polishing
CN2838473Y (en) * 2005-09-29 2006-11-22 张明仕 grinder for juicer
CN101125415A (en) * 2006-08-14 2008-02-20 中芯国际集成电路制造(上海)有限公司 Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment
CN102107392A (en) * 2010-12-24 2011-06-29 江苏大学 Wafer grinding tray supporting device
CN102814831A (en) * 2012-08-29 2012-12-12 中国石油大学(北京) Stripping blade and stripping tool having same
CN203696719U (en) * 2013-12-31 2014-07-09 镇江市港南电子有限公司 Novel lower grinding disc structure

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Publication number Publication date
CN103769995A (en) 2014-05-07

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
CB03 Change of inventor or designer information

Inventor after: Yu Jing

Inventor before: Nie Jingen

COR Change of bibliographic data
TA01 Transfer of patent application right

Effective date of registration: 20160918

Address after: 225300 Taizhou medicine high tech Zone, China medicine city, Oriental Town, room 14, No. 705, room

Applicant after: Yu Jing

Address before: 212132 Dongfang Road, Dagang mechanical and Electrical Industrial Park, Dagang District, Zhenjiang, Jiangsu

Applicant before: Zhenjiang Gangnan Electric Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20170804

Address after: 225700 science and technology center of Xinghua Economic Development Zone, Jiangsu, Taizhou

Patentee after: Jiangsu Zhong Yuan new energy Co., Ltd.

Address before: 225300 Taizhou medicine high tech Zone, China medicine city, Oriental Town, room 14, No. 705, room

Patentee before: Yu Jing

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170125

Termination date: 20181231