CN103769755A - Dual-beam laser heat cracking cutting processing method and device for sandwich structure substrate - Google Patents

Abstract

The double-beam laser thermal cleavage cutting processing method and device for a sandwich structure substrate, laser scribing cannot avoid debris or even material rupture during the process of mechanical pressure. The method of the invention includes: clamping the workpiece vertically or horizontally on the workbench through a special fixture; adjusting the laser light path and the laser head steering device, and ensuring the coaxiality of the two laser beams by adjusting the positions and attitudes of the two laser heads; moving the workbench Go to the processing station, use the coaxial indicating beam to aim at the workpiece, and fine-tune the laser focal spot to the processing position; open the shutter so that both sides of the laser can process the workpiece at the same time; control the worktable to drive the workpiece to make the laser heat and cut according to the predetermined trajectory Sandwich structure substrate material, so as to achieve the required processing trajectory; clean up the processing residue, and remove the workpiece without cracks on the processing surface. The invention is used for double-beam laser thermal splitting cutting of substrates.

Description

Double-beam laser thermal splitting cutting processing method and device for sandwich structure substrate

technical field

The invention relates to a method for cutting and processing a "sandwich" structure substrate by means of a double-beam laser, in particular a method for simultaneously processing a workpiece by aligning the double-beam laser at the corresponding positions on both sides of the surface of the workpiece, and the invention also relates to the equipment used .

Background technique

The "sandwich" structure substrate material usually refers to the sintering or bonding of three layers of brittle materials, the upper and lower surface layers are glass plates, and the middle layer is silicon wafers, which can be called multi-layer brittle materials. The material has the characteristics of small deformation before fracture, low plastic index, and tensile strength much lower than compressive strength. In recent years, brittle materials with "sandwich" structure substrates have been widely used in different fields, but there are technical problems of low processing efficiency and high processing cost. Therefore, the development of efficient, low-consumption and environmentally friendly cutting and processing methods for multilayer brittle structural materials will effectively improve the practical application of such materials.

At present, multilayer brittle materials are mainly processed by mechanical processing and laser-assisted mechanical processing technology, but these technologies have shortcomings:

Machining: Machining directly acts on the surface of the multi-layer material. After the surface of the material is scratched with a knife wheel, pressure is applied on the surface of the material to break the material. However, due to the brittleness of the multi-layer brittle structure material, cracks, large chips and even material rupture are easily formed on the processing edge, which greatly reduces the surface quality of the material, and its processing yield is low and the processing cost is high.

Laser-assisted machining: The basic principle is to use a laser instead of a cutter wheel to scratch the surface of the material, and then apply pressure on the surface of the material to break the material. Compared with conventional processing methods, laser grooving can improve the processing quality of the edge of the groove without considering the problem of debris generated after the cutter wheel is processed. But there are two difficulties in it: one is the control of the laser beam parameters; the other is that this processing method still cannot avoid the debris or even the rupture of the material produced in the process of mechanical pressing.

With the increasing application of multi-layer brittle structural materials, the demand for processing accuracy, processing efficiency and surface quality of its products is also increasing, and the dual-beam laser processing method can effectively solve this problem.

Contents of the invention

The purpose of the present invention is to provide a cutting method and cutting equipment that can directly process "sandwich" structure substrate materials, improve its cutting quality, improve its cutting efficiency and reduce its processing cost.

The purpose of the present invention is achieved like this:

A double-beam laser thermal splitting processing method for a sandwich substrate, in which the workpiece is heated simultaneously by the laser heads on both sides, and the thermal stress causes the workpiece to be broken: 

Clamp the workpiece vertically or horizontally on the workbench through a special fixture;

Adjust the laser light path and the laser head steering device, and ensure that the two laser beams are coaxial by adjusting the position and attitude of the two laser heads;

Move the worktable to the processing station, use the coaxial indicator beam to aim at and locate the workpiece, and fine-tune the laser focal spot to the processing position;

Open the shutter so that the double-sided laser can process the workpiece at the same time;

Control the workbench to drive the workpiece to move, so that the laser can heat and cut the sandwich structure substrate material according to the predetermined trajectory, so as to achieve the required processing trajectory;

Clean up the machining residue and remove the workpiece without cracks on the machined surface.

In the dual-beam laser thermal cleavage cutting processing method for the sandwich structure substrate, the two laser heads adjust the focal length respectively.

In the dual-beam laser thermal cleavage cutting processing method for the sandwich structure substrate, the fine-tuning ensures the processing coincidence of the two laser beams and realizes three-dimensional positioning.

In the dual-beam laser thermal cleavage cutting processing method for a sandwich structure substrate, the control workbench selects a suitable motion trajectory for the three-dimensional workbench according to the target trajectory and controls it by programming on the computer control system attached to the workbench. Before starting the laser generator, run the workbench to reciprocate the trajectory, so that it can run according to the predetermined trajectory program.

A double-beam laser thermal cleavage cutting processing device for a sandwich structure substrate, which consists of: a laser generating device, a fixture system installed on a workbench, the fixture system clamps a workpiece composed of a sandwich structure substrate material, and the workpiece clamp Between the two laser heads of the laser generator.

The dual-beam laser thermal cleavage cutting processing device for the sandwich structure substrate, the laser generating device includes: the laser head of the laser generator is installed on the laser head bracket, the laser head is connected to the steering device, and the laser optical path device The area focusing device for adjusting the laser spot is connected, and the fine-tuning device for ensuring the processing overlap of the two laser beams and realizing the fine-tuning in the three-dimensional direction, the laser optical path device and the laser head steering device are realized by the simultaneous steering of the two laser heads The workpiece is clamped between the two laser heads.

In the dual-beam laser thermal cleavage cutting processing device for the sandwich structure substrate, the laser optical path device is a hard optical path or an optical fiber.

In the dual-beam laser thermal cleavage cutting processing device for the sandwich structure substrate, the vertical processing clamp body and the horizontal processing clamp body of the clamp system are respectively installed on the workbench through bolts, and each clamp body is respectively arranged along the X-axis with the workbench. Guide rail, Y-axis guide rail, linkage in two directions.

In the dual-beam laser processing device for a sandwich structure substrate, the sandwich structure substrate material is a three-layer material, the upper and lower layers are light-transmitting layers, the middle layer is a non-light-transmitting layer, and the cutting profiles of each layer of material are the same .

Beneficial effect:

1. The basic principle of the present invention is to use the laser-induced thermal cracking cutting technology combining body heating and surface heating to cut the "sandwich" structure substrate. That is, the laser is used to heat the "sandwich" structure substrate material, the upper and lower surface materials of the "sandwich" structure substrate absorb the laser energy in the form of body heat absorption, and the middle layer material absorbs the laser energy in the form of surface heat absorption, so that the inner part of the material is heated during the heating process. Large temperature gradient, when the generated thermal stress exceeds the strength limit of the material, the material generates cracks on the laser scanning line, and naturally cracks along the laser scanning line, avoiding the chips generated in machining. Since the laser can penetrate the outer layer material of the "sandwich" structure substrate, the middle layer material can be processed effectively, and the material is uniformly heated in the thickness direction, so there will be no thermal stress concentration on the material surface, and the processed material surface Good quality without degrading the process performance of the material.

2. The present invention is mainly aimed at the cutting process of the "sandwich" structure substrate. According to the above principle, the laser is used as the laser emission source, and the focal length and laser energy of the laser are adjusted according to the cutting energy required by the workpiece. When cutting the workpiece, ensure that the distance between the laser output end and the processing position of the workpiece remains unchanged, and drive the workpiece to move through the worktable to realize two-dimensional curve cutting.

3. The cutting and processing method of the "sandwich" structure substrate material proposed by the present invention mainly has the following advantages:

(1) The dual-beam laser cutting and processing of "sandwich" structure substrate materials proposed by the present invention is simple and easy to implement, and can achieve high-quality cut surfaces and high-efficiency cutting surfaces of the workpiece without affecting the process performance of the workpiece. Processing, can guarantee the cutting edge and workpiece quality;

(2) The processing method proposed by the present invention is suitable for the cutting processing of any plane curve;

(3) The device of the present invention can position the workpiece to be processed by controlling the two-dimensional workbench, and the fine-tuning device can well adjust the processing overlap of the double-beam laser, and can adjust the laser optical path and laser head steering device by replacing the fixture To realize the cutting process of vertical or horizontal test pieces.

Four, the cutting processing device of the sandwich structure substrate proposed by the present invention mainly has the following advantages:

(1) The fine-tuning device of the laser head described in the present invention can realize the adjustment of the laser head in three-dimensional space to ensure the coaxiality of the laser;

(2) The laser focusing device of the present invention can clearly display the adjustment distance, which is convenient for repeated adjustment and ensures repeatability;

(3) The workbench described in the present invention can realize two-dimensional coordinate movement, and the material of the workbench is stainless steel;

(4) The two sets of clamp bodies described in the present invention are respectively installed on the workbench through bolts, and the clamp bodies are made of metal materials and flexible heat insulation materials;

(5) The lighting device of the present invention needs to be wrapped with stainless steel thin mesh, installed on the laser light path device, and the lighting angle can be adjusted at will;

(6) The laser generating device of the present invention can change the power to meet the processing requirements of materials and ensure the energy density required for cutting.

(7) The present invention can adjust the laser light path and the laser head steering device according to the processing requirements to realize the vertical or horizontal processing of the specimen.

(8) The present invention can use hard optical path or soft optical path (optical fiber) to build the laser optical path.

Description of drawings

Figure 1 is a schematic diagram of the structure of the device when the double-beam laser performs vertical processing on the sandwich structure substrate;

Fig. 2 is the top view of the device of accompanying drawing 1;

Fig. 3 is the schematic diagram of clamp body during vertical processing;

Fig. 4 is a schematic diagram of the clamp body during horizontal processing.

In the figure: 1—laser generator, 2—laser optical path and laser head steering device, 3—lighting equipment, 4—laser head bracket, 5—fine adjustment device, 6—workpiece (sandwich structure substrate test piece), 7—X Axis guide rail, 8—Y axis guide rail, 9—Z axis guide rail, 10—laser head, 11—vertical clamp body, 12—worktable, 13—focusing device, 14—machine tool body, 15—horizontal clamp body.

The lighting device is installed on the laser generator, and the lighting angle can be adjusted at will.

Detailed ways

Example 1:

A double-beam laser thermal splitting cutting processing method for a sandwich structure substrate, in which the workpiece is heated simultaneously by the laser heads on both sides, and the thermal stress causes the workpiece to be processed to break. The invention is suitable for cutting and processing the sandwich structure substrate material at normal temperature .

Specific processing methods include:

Clamp the workpiece vertically or horizontally on the workbench through a special fixture;

Adjust the laser light path and the laser head steering device, and ensure that the two laser beams are coaxial by adjusting the position and attitude of the two laser heads;

Move the worktable to the processing station, use the coaxial indicator beam to aim at and locate the workpiece, and fine-tune the laser focal spot to the processing position;

Open the shutter so that the double-sided laser can process the workpiece at the same time;

Control the workbench to drive the workpiece to move, so that the laser can heat and cut the sandwich structure substrate material according to the predetermined trajectory, so as to achieve the required processing trajectory;

Clean up the machining residue and remove the workpiece without cracks on the machined surface.

Example 2:

In the double-beam laser thermal cleavage cutting processing method for a sandwich structure substrate described in Embodiment 1, the focal lengths of the two laser heads are adjusted respectively.

Example 3:

In the double-beam laser thermal cleavage cutting processing method of the sandwich structure substrate described in Embodiment 1 or 2, the processing coincidence degree of the two laser beams is ensured through the fine-tuning described above, and three-dimensional positioning is realized.

Example 4:

The double-beam laser thermal cleavage cutting processing method of the sandwich structure substrate described in embodiment 1 or 2 or 3, the control workbench is to select a suitable movement trajectory for the three-dimensional workbench according to the target trajectory, and the computer on the workbench Controlled by programming on the control system. Before starting the laser generator, run the workbench to reciprocate the trajectory, so that it can run according to the predetermined trajectory program.

Example 5:

A double-beam laser thermal cleavage cutting processing device for a sandwich structure substrate, which consists of: a laser generating device, a fixture system installed on a workbench, the fixture system clamps a workpiece composed of a sandwich structure substrate material, and the workpiece clamp Between the two laser heads of the laser generator.

Embodiment 6:

The double-beam laser thermal cleavage cutting processing device for a sandwich structure substrate described in Embodiment 5, the laser generating device includes: the laser head of the laser generator is installed on the laser head bracket, and the laser head is connected to the steering device, The lighting device is installed on the laser generator, and the laser optical path device is connected to the area focusing device for adjusting the laser spot, and the fine-tuning device for ensuring the processing overlap of the two laser beams and realizing the three-dimensional direction fine-tuning. The laser optical path device and the described The laser head steering device realizes that the workpiece is clamped between the two laser heads through the simultaneous steering of the two laser heads.

Embodiment 7:

In the double-beam laser thermal cleavage cutting processing device for a sandwich structure substrate described in Embodiment 6, the laser optical path device is a hard optical path or an optical fiber.

Embodiment 8:

In the double-beam laser thermal cleavage cutting processing device for a sandwich structure substrate described in Embodiment 5 or 6 or 7, the vertical processing clamp body and the horizontal processing clamp body of the clamp system are respectively installed on the workbench by bolts, and each clamp body Respectively with the worktable along the X-axis guide rail, Y-axis guide rail, and Z-axis guide rail are linked in three directions.

Embodiment 9:

The double-beam laser thermal cleavage cutting processing device for a sandwich structure substrate described in embodiment 5 or 6 or 7, the sandwich structure substrate material is a three-layer material, the upper and lower layers are light-transmitting layers, and the middle layer is a non-light-transmitting layer layer, and the cutting profile of each layer of material is the same.

Example 10:

Firstly, according to the material properties and processing technology of the sandwich structure substrate specimen 6, the appropriate laser cutting parameters are selected to process the specimen, and then the sandwich structure substrate material 6 is clamped on the vertical clamp body 11 by mechanical clamping, and the clamping degree needs to be Control within a certain limit: the test piece should not swing with the movement of the worktable 12 and the test piece should not be pinched. The clamp body is fixed on the workbench 12 by bolts, and the workbench can drive the clamp body to move along the three directions of guide rail 7, guide rail 8, and guide rail 9, so as to realize the predetermined trajectory processing of materials. The area of the laser spot can be adjusted by the focusing device, and the processing overlap of the two laser beams can be guaranteed by the fine-tuning device.

According to the target trajectory, an appropriate motion trajectory is selected for the three-dimensional workbench 12 and controlled by programming on the computer control system attached to the workbench. Before starting the laser generator 1, first run the workbench 12 to perform trajectory reciprocating motion, so that it runs according to the predetermined trajectory program.

Example 11:

First, according to the material properties and processing technology of the sandwich structure substrate test piece 6, select the appropriate laser cutting parameters to process the test piece, and then put the sandwich structure substrate material 6 on the horizontal clamp body 15, so that the test piece can not move with the workbench 12 swing by movement. The clamp body is fixed to the workbench 12 by bolts, and the workbench can drive the clamp body to move along the three directions of guide rail 7, guide rail 8, and guide rail 9. At the same time, the laser optical path and laser head steering device 2 in scheme 1 are changed to make the two laser beams The head is placed vertically to the test piece, so that the predetermined track processing of the material can be realized. The area of the laser spot can be adjusted by the focusing device, and the processing overlap of the two laser beams can be guaranteed by the fine-tuning device.

According to the target trajectory, an appropriate motion trajectory is selected for the three-dimensional workbench 12 and controlled by programming on the computer control system attached to the workbench. Before starting the laser generator 1, first run the workbench 12 to perform trajectory reciprocating motion, so that it runs according to the predetermined trajectory program.

The present invention consists of: laser generator, laser optical path and laser head steering device, laser focusing device, laser head fine-tuning device, two sets of clamping bodies, a control mechanism that enables materials to realize predetermined trajectory movement, and lighting equipment on the device .

Claims (9)

1. a double beams laser hot tearing cutting process method for sandwich structure substrate heats workpiece by the laser head of both sides simultaneously, and thermal stress makes workpiece to be machined fracture, it is characterized in that:

Workpiece is passed through to the horizontal or vertical clamping of special fixture on workbench;

Adjust laser optical path and laser head transfer, by adjusting position and the attitude of two laser heads, guarantee that two road laser beams are coaxial;

Travelling table, to processing stations, utilizes coaxial indication light beam acquiring positioning workpieces, and laser focal spot is fine-tuning to Working position;

Open optical gate makes bilateral laser process workpiece simultaneously;

Control workbench and drive workpiece motion s, make laser add thermal cutting sandwich structure baseplate material according to desired trajectory, thereby reach required machining locus;

Clearing up and processing clout, takes off the flawless workpiece of finished surface.

2. the double beams laser hot tearing cutting process method of sandwich structure substrate according to claim 1, is characterized in that: the laser head described in 2 is focused respectively.

3. the double beams laser hot tearing cutting process method of sandwich structure substrate according to claim 1 and 2, is characterized in that: guarantee the processing registration of two bundle laser by described fine setting, realize three-dimensional localization.

4. the double beams laser hot tearing cutting process method of sandwich structure substrate according to claim 1 and 2, it is characterized in that: described control workbench be according to target trajectory to three-dimensional working platform select suitable movement locus and workbench with computer control system on programme and control, before startup laser generator, first move workbench and carry out track reciprocating motion, it is moved by predetermined path of movement program.

5. the double beams laser hot tearing cutting processing device of a sandwich structure substrate, its composition comprises: generating device of laser, it is characterized in that: sectional fixture system on workbench, described chucking appliance system clamps the workpiece that sandwich structure baseplate material forms, and described workpiece clamp is in the middle of two laser heads of generating device of laser.

6. the double beams laser hot tearing cutting processing device of sandwich structure substrate according to claim 5, it is characterized in that: described generating device of laser comprises: the laser head of laser generator is arranged on laser head bracket, described laser head connects transfer, laser optical path device connects to be adjusted the area focus control of laser facula and guarantees that the processing registration of two bundle laser also realizes the micromatic setting of three-dimensional fine setting, and described laser optical path device and described laser head transfer turn to by two laser heads time and realize workpiece clamp in the middle of two laser heads.

7. the double beams laser hot tearing cutting processing device of sandwich structure substrate according to claim 6, is characterized in that: described laser optical path device is hard light path or optical fiber.

8. according to the double beams laser hot tearing cutting processing device of the sandwich structure substrate described in claim 5 or 6 or 7, it is characterized in that: the concrete and horizontal processed clip of vertical processed clip of described chucking appliance system is specifically arranged on workbench by bolt respectively, each clamp body respectively with workbench along X-axis guide rail, Y-axis guide rail, two direction interlocks.

9. according to the processing unit (plant) of the sandwich structure substrate double beams laser described in claim 5 or 6 or 7, it is characterized in that: described sandwich structure baseplate material is trilaminate material, it is upper and lower two-layer is photic zone, and intermediate layer is non-photic zone, and the cutting profile of layers of material is identical.

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