CN103764375A - Welded body manufacturing method - Google Patents
Welded body manufacturing method Download PDFInfo
- Publication number
- CN103764375A CN103764375A CN201280041740.9A CN201280041740A CN103764375A CN 103764375 A CN103764375 A CN 103764375A CN 201280041740 A CN201280041740 A CN 201280041740A CN 103764375 A CN103764375 A CN 103764375A
- Authority
- CN
- China
- Prior art keywords
- formed body
- resin
- insulation layer
- thermal insulation
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
- B29C65/8207—Testing the joint by mechanical methods
- B29C65/8215—Tensile tests
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/112—Single lapped joints
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
- B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
- B29C66/1224—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a butt joint-segment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/05—Particular design of joint configurations
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- B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
- B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Provided is a method for solving the problem of lowered laser transmissivity in molded bodies molded from crystalline thermoplastic resin composites even in cases where specific crystalline thermoplastic resins or specific additives are not used. Using a metal mold in which an insulating layer has been formed in one part of the cavity surface thereof, an optically transparent resin molded body used for joining by laser welding is produced under conditions in which the temperature of the metal mold is at least 10 DEG C lower than the cold crystallization temperature (Tc1) of the resin that forms the optically transparent resin molded body.
Description
Technical field
The present invention relates to the manufacture method with the fusion body of the translucent resin formed body welding through laser by the light absorptive resin-formed body of absorbing laser.
Background technology
Using in the product of resin-formed body, there is the product of complicated shape sometimes by multiple resin-formed bodies are engaged to manufacture.As joint method, known have utilize bonding agent joint, utilize mechanical engagement of nut etc. etc.
But, in the case of using the method that engages of bonding agent, the problem such as exist the cost of bonding agent high, adhesive strength cannot fully improve.In addition, in the case of using the method that nut etc. engages, the formation problems such as expense, fixing bothersome, weight increase.
On the other hand, about frictional heat weldings such as external heat welding, vibration welded, ultrasonic fusing such as laser welding, hot plate weldings, owing to realizing the joint between resin-formed body with the short time, and do not use bonding agent, metal parts, therefore can not produce the problems such as consumed cost or weight increase, environmental pollution.In the middle of above-mentioned welding process, particularly laser welding is the method that can carry out accurate welding, is one of effective joint method.
Wherein, polyphenylene sulfide balancedly possesses mechanical property, heat resistance, chemical proofing and thin-walled mobility, therefore as the raw material of electrical and electronic parts and automobile component etc. and be widely used.
But polyphenylene sulfide laser-transmissible is low, because must tackle by thin-walled property for the permeability that improves laser beam.As a result, be difficult to be applied to the purposes that needs intensity.
Therefore, attempting the laser-transmissible of polyarylene sulfide resin to improve.For example, the technology that solves the problem of laser-transmissible by the molecular weight of adjustment polyarylene sulfide resin is disclosed in patent documentation 1.In addition in patent documentation 2, disclose by using specific polyphenyl thioether resin composition to solve the technology of the problem of laser-transmissible.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2006-168221 communique
Patent documentation 2: TOHKEMY 2008-174657 communique
Summary of the invention
the problem that invention will solve
Patent documentation 1,2 all belongs to be wanted by using specific material to solve the technology of the problem of above-mentioned laser-transmissible.On the other hand, the object of the invention is to, even if provide the crystallinity thermoplastic resin of other kinds that can produce same problem in use, do not use specific additive and also can not be subject to material category to limit ground solution to the problems described above.
for the scheme of dealing with problems
The inventor etc. conduct in-depth research repeatedly in order to address the above problem.Found that, if form thermal insulation layer in a part of cavity surface of mould, and use this mould to manufacture resin-formed body, can in resin-formed body, form region and the high region of degree of crystallinity that degree of crystallinity is low.Based on this understanding, finding, by using the mould that is formed with thermal insulation layer in a part of cavity surface, is the cold crystallization temperature (T that forms the resin of translucent resin formed body in the condition of mold temperature
c1the translucent resin formed body of manufacturing the joint for utilizing laser welding under ℃ following condition of)-10, can address the above problem, thereby complete the present invention.More specifically, the invention provides following technical scheme.
(1) a kind of manufacture method of fusion body, it is characterized in that, the light absorptive resin-formed body of the method to absorbing laser and the translucent resin formed body that sees through laser carry out welding, it comprises following operation: welding preparatory process, and the predetermined face of weld that the predetermined face of weld of aforementioned light absorptive resin-formed body is absorbed to the predetermined face of weld of side and aforementioned translucent resin formed body is overlapping through the predetermined face of weld of side; Welding operation, after aforementioned welding preparatory process, irradiates and scan laser from the folded part of aforementioned translucent resin moulding side counterweight; Aforementioned translucent resin formed body use in a part of cavity surface be formed with the mould of thermal insulation layer, in mold temperature for forming the cold crystallization temperature (T of resin of aforementioned translucent resin formed body
c1under the following condition in)-10 ℃, manufacture, aforementioned thermal insulation layer be formed at aforementioned cavity surface except with the predetermined shadow surface of the surperficial predetermined irradiation aforementioned laser of aforementioned translucent resin formed body and the described part contacting through the predetermined face of weld of side roughly whole.
(2) according to the manufacture method of the fusion body (1) described, it is characterized in that, aforementioned light absorptive resin-formed body is used the mould manufacture that is formed with thermal insulation layer in a part of cavity surface, and aforementioned thermal insulation layer is formed at except the part contacting with the predetermined face of weld of aforementioned absorption side roughly whole of aforementioned cavity surface.
(3) according to the manufacture method of the fusion body (1) or (2) described, it is characterized in that, aforementioned light absorptive resin-formed body and aforementioned translucent resin formed body consist of poly arylidene thio-ester based resin composition.
(4) fusion body, it uses the method manufacture described in any one in (1)～(3).
the effect of invention
According to the present invention, by using the problem that solves the laser-transmissible of the resin-formed body that the moulding of crystalline thermoplastic resin combination is formed with the translucent resin formed body of specific method manufacture, therefore can not be subject to material category to limit the problem that solves above-mentioned laser-transmissible.
Accompanying drawing explanation
Fig. 1 is the figure that schematically shows an example of fusion body, (a) is stereogram, is (b) cutaway view of MM section.
Fig. 2 is the figure that schematically shows cap, is (a) upward view of cap, (b) is top view.
Fig. 3 is the top view that schematically shows main part 20.
Fig. 4 is the schematic diagram that the scan method of laser is shown, is (a) figure that the method to whole predetermined shadow surface 2 scan lasers is shown, (b) is the figure that the method to a part of scan laser is shown, is (c) figure that the method for ground spaced apart scan laser is shown.
Fig. 5 is the figure schematically showing for the manufacture of the section of the die cavity of the mould of cap.
Fig. 6 is the figure schematically showing for the manufacture of the section of the die cavity of the second mould of main part.
Fig. 7 is the stereogram that schematically shows the fusion body of making in embodiment 1～8, comparative example 1～5.
Fig. 8 is the figure that schematically shows the fusion body of making in embodiment 9,10, comparative example 6～12, (a) be the upward view schematically showing as the translucent resin formed body of lid, (b) be the side view schematically showing as the translucent resin formed body of lid, (c) being the top view schematically showing as the light absorptive resin-formed body of main body, is (d) side view schematically showing as the light absorptive resin-formed body of main body.
The specific embodiment
Below embodiments of the present invention are described.It should be noted that, the present invention is not limited to following embodiment.
The manufacture method > of < fusion body
The manufacture method of fusion body of the present invention is to the light absorptive resin-formed body of absorbing laser and makes translucent resin formed body that laser sees through carry out the manufacture method of the fusion body of welding.
One of feature of the present invention is to manufacture light transmission side resin-formed body by specific manufacture method.In addition, one of feature of the present invention is preferably by specific manufacture method, to manufacture light absorption side resin-formed body.Then, in the present invention, for shape, the creating conditions of fusion body of fusion body, be not particularly limited.Below, after the manufacture method of conventional fusion body being described as an example of concrete fusion body example, as an example of light transmission side resin-formed body used in above-mentioned concrete fusion body, light absorption side resin-formed body example, their manufacture method is described.
Take the situation of the fusion body shown in shop drawings 1 as example, the manufacture method of fusion body of the present invention is described.(a) of Fig. 1 is the stereogram that schematically shows fusion body, is (b) cutaway view that schematically shows the MM section of fusion body.
As shown in Figure 1, for the fusion body illustrating, be container 1 in the present embodiment, it has cap 10 and main part 20.Cap 10 is the members that are equivalent to translucent resin formed body.In addition, main part 20 is the members that are equivalent to light absorptive resin-formed body.The edge of opening of the recess having by outer peripheral portion and the main part 20 of the bottom surface to discoid cap 10 in the present embodiment, carries out welding and forms container 1.
Fig. 2 is the figure that schematically shows cap 10, and the upward view of cap 10 (a) is shown, the top view of cap 10 (b) is shown.As shown in Figure 2, cap 10 has through the predetermined face of weld 101 of side and predetermined shadow surface 102.
See through the position that the predetermined face of weld 101 of side contacts with the edge of opening of the recess of main part 20 while referring to welding.As shown in Fig. 2 (a), in present embodiment are the circular faces (representing with dot pattern in Fig. 2 (a)) that are present in the bottom surface side of discoid cap 10 through the predetermined face of weld 101 of side.
Fig. 3 is the top view that schematically shows main part 20.Main part 20 has the predetermined face of weld 201 of the side of absorption at the edge of opening of recess.
When absorbing side predetermined face of weld 201 and being welding with the position contacting through the predetermined face of weld 101 of side.As shown in Figure 3, the predetermined face of weld 201 of the absorption side in present embodiment is formed in the circular face of the edge of opening of main part 20.
Then, the method for above-mentioned cap 10 and aforementioned body portion 20 being carried out welding and manufactured container 1 is described.As welding process, can adopt conventional laser welding method.Conventional laser welding method possesses for example welding preparatory process and welding operation.
Welding preparatory process refers to that the predetermined face of weld of cap 10 is seen through to the predetermined face of weld 101 of side absorbs the overlapping operation of the predetermined face of weld 201 of side with the predetermined face of weld of main part 20.
Predetermined shadow surface 102 scan lasers of welding operation to cap 10.First the laser scanning see through predetermined shadow surface 102, sees through cap 10 and arrival faying surface (by seeing through the predetermined face of weld 101 of side and the overlapping face forming that absorbs the predetermined face of weld 201 of side).Arrived the laser of faying surface by main part 20(light absorptive resin-formed body) absorb and generate heat.This heat makes to see through the predetermined face of weld 101 of side and absorbs predetermined face of weld 201 meltings of side, result cap 10 and main part 20 weldings.
The lasing light emitter using during as above-mentioned laser welding, is not particularly limited, and for example can utilize: pigment laser, gas laser (PRK, argon laser, krypton laser, helium-neon laser etc.), Solid State Laser (YAG laser etc.), semiconductor laser etc.As laser, conventionally utilize pulse laser.In used laser welding device, welding contact interface is carried out at the welding interface that can utilize as required lens combination to make laser concentrate on formed body.In the present invention, commercially available various laser welding devices all can be used.
For the scanning of laser, use Fig. 4 to describe here.The top view of the schematically illustrated cap 10 of Fig. 4.The circular face that dotted line (circle) shown in the periphery by cap 10 shown in Fig. 4 and cap 10 surrounds is predetermined shadow surface 102.In addition in Fig. 4, by the part of blacking, be the part that has scanned laser.
Both can be to whole predetermined shadow surface 102 scan lasers as shown in (a) of Fig. 4, also can be to a part of scan laser as shown in (b) of Fig. 4.In addition,, when not needing sealing to wait, also can, not with ring-type scan laser, for example, can as shown in (c) of Fig. 4, irradiate laser spaced apartly.
[translucent resin formed body]
Translucent resin formed body is the member that when carrying out laser welding, laser is seen through.In the present invention, translucent resin formed body consists of crystalline thermoplastic resin combination.
Conventionally, during using crystalline thermoplastic resin combination as raw material, in translucent resin formed body, crystalline resin can crystallization.According to the kind of resin, its degree there are differences, but the state of this crystallization can make laser be difficult to see through.The present invention be by the degree of crystallinity of the part that in translucent resin formed body, laser will see through is suppressed compared with the low laser that makes in the meable technology of translucent resin formed body content, the present invention all can implement using any crystalline thermoplastic resin in the situation that.
For example, polyarylene sulfide resin laser-transmissible when making resin-formed body such as polyphenylene sulfide can become very low.Even in the case of using the crystalline thermoplastic resin of this easy problem of explict occurrence laser-transmissible significantly, also can solve according to the present invention by the low problem causing of laser-transmissible.
In addition, crystalline thermoplastic resin combination can contain the additives such as other resins, existing known various inorganic organic fillers, fire retardant, ultra-violet absorber, heat stabilizer, light stabilizer, colouring agent, releasing agent, plasticizer in the scope of damaging not significantly effect of the present invention.In addition, crystalline thermoplastic resin combination can be also only containing this compositions being formed by crystalline resin in fact such as micro-impurity.
Then, the manufacture method of translucent resin formed body is described.The present invention, owing to manufacturing translucent resin formed body with specific method, therefore can solve the problem of above-mentioned laser-transmissible.Wherein, as an example of the situation of manufacturing cap 10 example, describe.
Cap 10(translucent resin formed body) use in a part of cavity surface be formed with the mould of thermal insulation layer, in mold temperature for forming the cold crystallization temperature (T of resin of translucent resin formed body
c1under ℃ following condition of)-10, manufacture.In addition, die cavity refers to the whole space that mould inside resin will be filled.
As mentioned above, thermal insulation layer is formed on a part of cavity surface.Particularly, be formed on cavity surface except with above-mentioned roughly whole of seeing through the predetermined face of weld 101 of the side part contacting and the part contacting with predetermined shadow surface 102.For example, form as illustrated in fig. 5 thermal insulation layer.Fig. 5 schematically shows the section for the manufacture of the die cavity of the mould 3 of cap 10.Mould 3 possesses the thermal insulation layer 5 that is used to form the die cavity 4 of the shape of covering 10 and forms in a part of cavity surface of mould 3.In the present embodiment, the surface of die cavity 4 consists of the surface of thermal insulation layer 5 and the metal covering that does not form thermal insulation layer 5 of above-mentioned mould 3.Wherein, in Fig. 5, thermal insulation layer 5 is formed on except seeing through the part that contacts with predetermined shadow surface 102 of the predetermined face of weld 101 of side and be connected whole the above-mentioned side that sees through the predetermined face of weld 101 of side and above-mentioned predetermined shadow surface 102 with above-mentioned.And, in the cavity surface of mould 3, do not form thermal insulation layer 5 with the whole face of the part of the contacts side surfaces of above-mentioned predetermined shadow surface 102 with seeing through the predetermined face of weld 101 of side and predetermined shadow surface 102 and be connected the above-mentioned predetermined face of weld 101 of side that sees through.In addition, roughly whole face comprises whole.
As thermal insulation layer 5, even as long as the heat resistance that thermal conductivity is low, resin combination that have contact high temperature also there will not be the degree of rough sledding is not particularly limited the material that forms thermal insulation layer 5.
As the material that meets the desired heat resistance of thermal insulation layer 5 and thermal conductivity, can list the porous ceramics such as the resin that the heat resistances such as polyimide resin are high, thermal conductivity is low, porous zirconia.Below these materials are described.
As the object lesson of polyimide resin, can list: PMA (PMDA) quasi-polyimide, biphenyltetracarboxyacid acid quasi-polyimide, the polyamidoimide that has used trimellitic acid, bismaleimide amine resins (BMI/triazines etc.), benzophenone tetrabasic carboxylic acid quasi-polyimide, acetylene end polyimides, TPI etc.Wherein, the thermal insulation layer 5 particularly preferably being formed by polyimide resin.As the preferred material except polyimide resin, can enumerate such as TFE etc.In addition, thermal insulation layer 5 can contain resin except polyimide resin, TFE, additive etc. in the scope of not damaging effect of the present invention.
The method that cavity surface at mould 3 is formed to thermal insulation layer 5 is not particularly limited.For example preferably by following method, in the cavity surface of mould 3, form thermal insulation layer 5.
Can list following method: can form the solution coat of the polymer precursors such as the polyimide precursor of macromolecule thermal insulation layer at the desired metal covering of mould 3, heating makes solvent evaporation, further polymerization materialization is carried out in heating, forms thus the thermal insulation layer 5 of polyimide film etc.; Make the high molecular monomer of heat resistance, for example PMA acid anhydride and the polymerization of 4,4-diaminodiphenyl ether evaporation; Or, about the mould of flat shape, use the macromolecule thermal isolation film of suitable adhering method or bonding band shape to attach macromolecule thermal isolation film in the required part of the metal covering of mould 3, form thermal insulation layer 5.In addition, also can form polyimide film, and in its surface formation, as metal, be further chromium (Cr) film, titanium nitride (TiN) film of dura mater.
The desired thermal conductivity of thermal insulation layer 5 consisting of above-mentioned resin also can be different according to purposes etc., are particularly preferably below 2W/mK.By the thermal conductivity of thermal insulation layer 5 is adjusted to above-mentioned scope, at the partially crystallizable degree contacting with thermal insulation layer 5 of resin-formed body, easily further improve.In addition, above-mentioned thermal conductivity refers to the thermal conductivity that the method recorded with embodiment records.
Thickness to thermal insulation layer 5 is not particularly limited, and can be set as suitable and preferred thickness according to the shape of the material that will use, products formed etc.When thermal insulation layer 5 consists of polyimide resin, as long as the thickness of thermal insulation layer is more than 20 μ m, can obtain sufficiently high effect of heat insulation, therefore preferably.The thickness of the thermal insulation layer 5 forming in the cavity surface of above-mentioned mould 3 can be uniformly, also can comprise the position that thickness is different.
As the zirconia containing in porous zirconia, be not particularly limited, for stabilized zirconia, partially stabilized zirconia, stabilized zirconia all can not.Stabilized zirconia refers to the at room temperature also material of stabilisation of cubic crystal zirconia, the mechanical properties such as intensity and toughness, abrasion performance excellence.In addition, partially stabilized zirconia refers at room temperature also some residual state of regular crystal zirconia, while being subject to external stress, can occur from regular crystal to monoclinic martensite transfor mation, particularly can suppress the be full of cracks of expanding due to the effect of tensile stress growth, there is high Po Huai Tough.In addition, stabilized zirconia does not refer to the zirconia of not using stabilization agent stabilisation.It should be noted that, also can be used in combination and be selected from stabilized zirconia, partially stabilized zirconia and at least two or more in stabilized zirconia not.
As contained stabilization agent in stabilized zirconia, partially stabilized zirconia, can adopt existing known conventional substances.For example can list: yittrium oxide, cerium oxide, magnesia etc.Consumption to stabilization agent is also not particularly limited, and its consumption can suitably be set according to purposes, use material etc.
In addition, also can use porous zirconia porous ceramics in addition, but porous zirconia durability compared with other porous ceramics is high.Therefore, if used, be formed with the mould 3 of the thermal insulation layer 5 consisting of porous zirconia, be not easy to produce the rough sledding such as distortion of thermal insulation layer 5, thereby the quantity of products formed that can be continuously shaped be many, the productivity ratio of products formed is very high.
For the raw material that is used to form thermal insulation layer 5, not damaging in the scope of effect of the present invention, except above-mentioned zirconia, stabilization agent, can also contain existing known additive etc.
The method of using above-mentioned raw materials to form thermal insulation layer 5 is not particularly limited, preferably adopts metallikon.By adopting metallikon, the thermal conductivity of porous zirconia is easily adjusted to desired scope.In addition, can not occur the problem such as significantly to reduce because the inside at porous zirconia excessively forms mechanical strength that bubble causes thermal insulation layer 5 yet.By so utilizing spraying plating to form thermal insulation layer, the structure of thermal insulation layer 5 can become and be suitable for purposes of the present invention.
The formation of the thermal insulation layer 5 based on spraying plating for example can be carried out as follows.First, make raw materials melt become liquid.This liquid is accelerated and collide the desired metal covering of mould 3.Finally, make collision and be attached to mould 3 desired metal covering raw material solidify.So, at the desired metal covering of mould 3, form very thin thermal insulation layer 5.By further making the raw material of melting collide and be solidificated on the thermal insulation layer 5 that this is very thin, can adjust the thickness of thermal insulation layer 5.Wherein, make the curing method of raw material can use existing known cooling way, also can it be solidified by simple placement.In addition, method of spray plating is not particularly limited, can from the existing known methods such as arc spraying, plasma spraying, flame coating, suitably selects preferred method.
The thermal conductivity of the thermal insulation layer 5 consisting of porous ceramics can suitably be adjusted according to the purposes of products formed etc.In the present invention, be preferably below 2W/mK, more preferably more than 0.3W/mK and below 2W/mK.If thermal conductivity is more than 0.3W/mK, the strength decreased of the thermal insulation layer 5 that can too much cause due to the bubble in thermal insulation layer 5 hardly causes the productivity ratio of injection-molded article significantly to reduce, therefore preferably.Especially, if the thermal conductivity of thermal insulation layer is more than 0.7W/mK, existence meeting is suppressed at the strength decreased of the thermal insulation layer too much being caused by the bubble in thermal insulation layer 55 tendency of very little scope, therefore preferably.It should be noted that, above-mentioned thermal conductivity adopts the value obtaining with the assay method of recording in embodiment.In addition, when thermal insulation layer forms sandwich construction, the thermal conductivity (λ) of thermal insulation layer can be obtained as follows: obtain low-density layer and high-density layer thermal conductivity separately, if the thermal conductivity of low-density layer is that (λ l), the thermal conductivity of high-density layer is for (λ h), the thickness of low-density layer is with respect to the ratio of the thickness of thermal insulation layer entirety during for (t), use the formula of [1/ λ]=[t/ λ l]+[(1-t)/λ h] to calculate, obtain thus.
Thickness when thermal insulation layer 5 is consisted of porous zirconia, thermal insulation layer 5 is not particularly limited, more than being preferably 200 μ m, more preferably more than 500 μ m and below 1000 μ m.More than 500 μ m, the intensity of zirconia thermal insulation layer increases if, therefore preferably.In addition, if the thickness of thermal insulation layer 5 is below 1000 μ m, molding cycle can be not elongated, therefore preferably.
Then, as an example of the situation of the use mould 3 shown in Fig. 5 example, illustrate the manufacture method of cap 10.To the crystalline thermoplastic resin combination of injecting molten condition in mould 3.The crystalline thermoplastic resin combination of injecting and the Surface Contact of die cavity 4.
For with the crystalline thermoplastic resin combination of the Surface Contact of thermal insulation layer 5, due to effect of heat insulation, become the hot type that is difficult to the crystalline thermoplastic resin combination of molten condition to have to mould 3.As a result, sufficient crystallising is curing on one side on one side for crystalline thermoplastic resin combination.
The heat that the crystalline thermoplastic resin combination of the molten condition contacting with the metal covering that does not form thermal insulation layer of mould 3 on the other hand, has drains into rapidly outside mould by mould 3.As a result, cooling rapidly with the crystalline thermoplastic resin combination that the metal covering that does not form thermal insulation layer of mould 3 contacts, do not carry out crystallization and directly solidify.
In order to be divided into as mentioned above high part and the low part of degree of crystallinity of degree of crystallinity of crystalline thermoplastic resin, mold temperature need to be adjusted to the cold crystallization temperature (T of crystalline thermoplastic resin
c1below)-10 ℃.More preferably (T
c1)-80 ℃ above and (T
c1below)-20 ℃.Here, when crystalline thermoplastic resin combination contains two or more crystalline resins, the crystalline thermoplastic resin that is conceived to main component decides the condition of mold temperature.
As mentioned above, become laser light path see through near of the predetermined face of weld 101 of side and predetermined shadow surface 102 near the degree of crystallinity reduction of crystalline resin of existence.As a result, laser becomes and easily sees through cap 10.By being become easily, laser sees through, also can be by cap 10 and main part 20 weldings even if reduce the energy of laser.In addition, by laser is become, easily see through cap 10, even if increase the thickness (laser sees through the thickness of direction) of cap 10, also can carry out welding.
In addition, owing to seeing through the predetermined face of weld 101 of side also in the low state of degree of crystallinity, therefore easily due to the heat melting producing because of laser.As a result, translucent resin formed body (being to cover 10 in present embodiment) further strengthens with the dhering strength of light absorptive resin-formed body (being main part 20 in present embodiment).
In addition, not becoming the part of light path of laser, due to the effect of thermal insulation layer, crystalline thermoplastic resin sufficient crystallising.As a result, even if it is inferior to be exposed to hot environment as the cap 10 of gained resin-formed body, the change in size being caused by the crystallization of crystalline thermoplastic resin is also little.
It should be noted that, in the above-described embodiment, the situation that is a place to weld portion is illustrated, and the part of institute's welding can be also many places.In this case, preferably at the roughly whole face cavity surface of the mould for the manufacture of translucent resin formed body, except the part that the region being merged into the whole region that sees through the predetermined face of weld of side with the whole region of predetermined shadow surface that will irradiate laser contacts, be formed with thermal insulation layer.
[light absorptive resin-formed body]
As forming light absorptive resin-formed body, the i.e. resin of the resin-formed body of the subject material of laser welding, be not particularly limited, can list various thermoplastic resins, such as olefine kind resin, vinyl-based resin, styrene resin, acrylic resin, polyester resin, polycarbonate resin, polyarylate resinoid, polysulfones resin, polyphenylene oxide resinoid, polyether sulfone resin, PEI resinoid, polyether-ketone resinoid, heat-resisting ring-type olefine kind resin, various liquid-crystalline polymers etc.In the middle of these resins, preferably by with form the resin identical type of translucent resin formed body or the resin of same system or its composition and form the light absorptive resin-formed body as subject material.
In the resin combination that forms above-mentioned light absorptive resin-formed body, can contain absorbent or the colouring agent (dyestuff or pigment) of absorbing laser.Colouring agent can be selected according to sharp light wavelength, can list: inorganic pigment [Chinese whites such as the orange pigments such as the red pigments such as black pigment, iron oxide red, molybdate orange, titanium oxide such as carbon black (such as acetylene black, dim, thermal black, furnace black, channel black, Ketjen black etc.) etc.], organic pigment [yellow uitramarine, orange pigment, red pigment, blue pigment, viridine green etc.] and various dyestuffs etc.The absorbent of these laser can be used singly or in combination two or more.The content of the colouring agent in light absorptive resin-formed body is preferably 0.1～10 % by weight with respect to entirety, more preferably 0.5～5 % by weight (for example 0.5～3 % by weight) left and right.
The method of manufacturing light absorptive resin-formed body is not particularly limited, can adopts the conventional methods such as injection mo(u)lding, extrusion molding, compression forming, blow molding, compression molding, transfer molding, vacuum forming.Here, in the present invention, for light absorptive resin-formed body, preferably, use crystalline thermoplastic resin combination as raw material and use the mould injection moulding that is formed with thermal insulation layer to manufacture.Below to manufacture the situation of main part 20 with injection moulding as the manufacture method of example explanation light absorptive resin-formed body.
Fig. 6 is the figure that schematically shows the section of the die cavity that is suitable for the second mould of manufacturing main part 20.The second thermal insulation layer 8 that the second mould 6 possesses the second die cavity 7 and forms in the cavity surface of the second mould 6.As shown in Figure 6, the surface of the second die cavity 7 consists of the surface of the second thermal insulation layer 8 and the metal covering that does not form the second thermal insulation layer 8 of the second mould 6.
The second thermal insulation layer 8 except the cavity surface of the second mould 6 with absorb the part of the part that the predetermined face of weld 201 of side contacts roughly whole the formation of cavity surface.For the second thermal insulation layer 8, can use the material same with thermal insulation layer 5 formation that uses the same method, therefore omit the explanation to material, formation method.In addition, roughly whole face comprises whole.
Same with the explanation of the manufacture method of the cap 10 of an example as translucent resin formed body, main part 20 as an example of light absorptive resin-formed body improves in the degree of crystallinity of the partially crystalline thermoplastic resin contacting with the second thermal insulation layer 8, the degree of crystallinity of the partially crystalline thermoplastic resin not contacting with the second thermal insulation layer 8 is suppressed must be lower.In addition, as described in the explanation in the manufacture method of cap 10, in the manufacture of main part 20, also need mold temperature to be adjusted to the cold crystallization temperature (T of crystalline thermoplastic resin
c1below)-10 ℃.
In the part of carrying out welding, due to the degree of crystallinity of crystalline thermoplastic resin is suppressed must be lower, therefore easily by the heat melting producing because of absorbing laser, cap 10 becomes more firm with the welding of main part 20.
In addition, as shown in Figure 6, because most of cavity surface of the second mould 6 is formed with the second thermal insulation layer, though therefore after moulding main part 20 to be exposed to hot environment inferior, the change in size being caused by the crystallization of crystalline thermoplastic resin is also little.As mentioned above, in the present embodiment, in most of cavity surface of the second mould 6, being formed with thermal insulation layer is the change in size in order to prevent main part 20, determines the area of the thermal insulation layer of the cavity surface that will form in the scope of this effect of performance.
In addition, as mentioned above, the situation that the second mould 6 that is formed with the second thermal insulation layer 8 to using is manufactured main part 20 is illustrated, but main part 20 also can be used the mould manufacture that does not form thermal insulation layer.In this situation, in order fully to improve the degree of crystallinity of crystalline thermoplastic resin, the condition of mold temperature is generally set as T
c1+ 15 ℃ of left and right.Here, degree of crystallinity refers to that use does not form the mould of thermal insulation layer, the condition of mold temperature is set as to T fully
c1the degree of crystallinity of+15 ℃ of resins of crystalline thermoplastic while carrying out moulding crystalline thermoplastic resin combination.
Embodiment
Based on embodiment, further illustrate the present invention below, but the present invention is not subject to the restriction of these embodiment.
< material >
Form the material of translucent resin formed body: polyphenylene sulfide (Polyplastics Co., Ltd. manufacture, " FORTRON(registration mark) 1140A64(nature (natural), look number: HF2000) ", cold crystallization temperature (T
c1) be 125 ℃)
Form the material of light absorptive resin-formed body: 1140A64(is black for polyphenylene sulfide (Polyplastics Co., Ltd. manufacture, " FORTRON(registration mark), look number: HD9100) ", cold crystallization temperature (T
c1) be 125 ℃)
Thermal insulation layer formation material: polyimides (thermal conductivity 0.22(W/mK))
(mensuration of thermal conductivity)
Measurement By Laser Flash thermal diffusion coefficient for the thermal conductivity of thermal insulation layer, with DSC, measure displacement method in specific heat, water (according to JIS Z8807 solid gravity test method) and measure proportion, by [thermal conductivity]=[thermal diffusion coefficient × specific heat × proportion], calculate.
< embodiment 1～8, comparative example 1～5>
The size of translucent resin formed body has these two kinds of long 131mm × wide 12.7mm × thick 0.8mm and long 131mm × wide 12.7mm × thick 1.6mm (the former uses in embodiment 1～4, comparative example 1～3, the latter use in embodiment 5～8, comparative example 4 and 5).Preparation has the mould of the die cavity of size separately.In addition,, for each mould, prepare the mould that possesses the mould of thermal insulation layer and do not possess thermal insulation layer.For the mould that possesses thermal insulation layer, the part of joining in the part that contacts light absorptive resin-formed body when in laser welding does not form thermal insulation layer, in other parts, forms thermal insulation layer.In addition, the thickness of thermal insulation layer adopts 200 μ m.Use the required translucent resin formed body of these mould manufacture embodiment and comparative example.During for manufacture translucent resin formed body, the condition of mold temperature, is shown in table 1～table 3.
Light absorptive resin-formed body is of a size of long 131mm × wide 12.7mm × thick 1.6mm.For the mould of die cavity with this size, prepare the mould that possesses the mould of thermal insulation layer and do not possess thermal insulation layer.For the mould that possesses thermal insulation layer, the part of joining in the part that contacts translucent resin formed body when in laser welding does not form thermal insulation layer, in other parts, forms thermal insulation layer.In addition, the thickness of thermal insulation layer is made as 200 μ m.Use the required translucent resin formed body of these mould manufacture embodiment and comparative example.The condition of the mold temperature during for manufacture light absorptive resin-formed body, is shown in table 1～table 3.
With the combination production welding body by the following method of the translucent resin formed body shown in table 1～table 3 and light absorptive resin-formed body.
(welding process)
As shown in Figure 7, by overlapping to translucent resin formed body and light absorptive resin-formed body (translucent resin formed body at upside, light absorptive resin-formed body at downside), with sweep speed 5mm/ second to being carried out welding by the laser of the part illumination wavelength 940nm of blacking in Fig. 7.Wherein, irradiate diameter and adopt φ 1.0mm.In addition, the power output of the laser during for welding, the embodiment of table 1 and comparative example are 8.1W, and the comparative example of table 2 is 11.1W, and the embodiment of table 3 and comparative example are 21W.
For heat seal strength, use stretching thermal conductivity (ORIENTEC Co., Ltd. manufacture, RTC-1325), with 5mm/ minute, the translucent resin formed body and the light absorptive resin-formed body that have carried out laser welding are carried out to tensile shear, measure heat seal strength.Measurement result is shown in table 1～table 3.
[table 1]
[table 2]
[table 3]
The translucent resin formed body of embodiment 1 and 2, due to the mould manufacture with being formed with thermal insulation layer, is therefore divided into low-crystallinity region and high-crystallinity region.The mould manufacture that does not form thermal insulation layer for the translucent resin formed body of comparative example 1, but owing to manufacturing under the high condition of mold temperature, therefore the degree of crystallinity of crystalline thermoplastic resin is high on the whole.According to embodiment 1 and 2 and the results verification of comparative example 1 arrive, by the part that makes will to see through in translucent resin formed body laser, be low-crystallinity part, can improve heat seal strength.
According to the comparative example 3 of table 2, confirm, in comparative example 1, want fully to improve heat seal strength, need to improve the power output of laser.During with the fusion body of Visual Confirmation comparative example 3, when the power output of laser is set byer force than 11.1W, confirm light absorptive resin-formed body and produced and burn part.This result means, under the upper limit of laser output power, reach and can regard the 200N left and right of having carried out the lower limit of the scope of the heat seal strength of welding with sufficient intensity as, when therefore further thickening sees through the thickness of part of laser, cannot carry out welding with sufficient intensity.
Table 3 is embodiment and comparative examples of the situation that thickness is thicker (situation of optical path length).Confirming, even if it is also same with table 1 to increase thickness, is low-crystallinity part by the part that sees through laser that makes translucent resin formed body, can improve heat seal strength.In addition confirm, by near the degree of crystallinity absorption side contact surface fusion of light absorptive resin-formed body is also suppressed lowlyer, can further improve bond strength.
< embodiment 9,10, comparative example 6～12>
Manufacture possesses the container that has the translucent resin formed body (lid) of the shape as shown in the (a) and (b) of Fig. 8 and have the light absorptive resin-formed body (main body) of the shape as shown in Fig. 8 (c), (d).
Shown in Fig. 8 (a) is the upward view schematically showing as the translucent resin formed body of lid.(b) be the side view schematically showing as the translucent resin formed body of lid.The edge surface of width 5mm shown in Fig. 8 (a) is for seeing through the predetermined face of weld of side.For the lid using in embodiment, use cavity surface except with the mould that is formed with thermal insulation layer the above-mentioned part contacting through the predetermined face of weld of side.For the lid using in comparative example, use the mould that does not form thermal insulation layer.Concrete mold temperature when manufacturing the lid using in each embodiment, each comparative example, is shown in table 4.
Shown in Fig. 8 (c) is the top view schematically showing as the light absorptive resin-formed body of main body.(d) be the side view schematically showing as the light absorptive resin-formed body of main body.The edge of opening face of width 5mm shown in Fig. 8 (c) is for absorbing the predetermined face of weld of side.As shown in table 4, in embodiment and comparative example, use at the mould that is formed with thermal insulation layer except the part contacting with the predetermined face of weld of above-mentioned absorption side of cavity surface, do not form any in the mould of thermal insulation layer.Concrete mold temperature while manufacturing the main body of using in each embodiment, each comparative example is shown in table 4.
By overlapping the predetermined face of weld of absorption side shown in (c) that see through the predetermined face of weld of side and Fig. 8 shown in Fig. 8 (a), with sweep speed 5mm/, second the laser of lap illumination wavelength 940nm is carried out to welding.It should be noted that, irradiate diameter and adopt φ 1.0mm.In addition, the power output of laser during welding is 10.1W.
The fusion body of embodiment to the condition manufacture of recording by table 4 and the fusion body of comparative example have carried out annealing in process (140 ℃ × 1 hour).With the fusion body after Visual Confirmation annealing in process, confirm to have flawless to produce, have or not face of weld to peel off.It should be noted that the evaluation of recording for table 4 in the evaluation of the evaluation of " flawless ", " having crackle ", face of weld does not occur and peels off.
[table 4]
As shown in Table 4, the resin-formed body of the formation fusion body obtaining by manufacture method of the present invention is to use the mould that is formed with thermal insulation layer to manufacture, and therefore, the degree of crystallinity of the crystalline thermoplastic resin in resin-formed body has obtained abundant raising.Therefore,, even fusion body is implemented to annealing in process, the change in size of resin-formed body is also little, is not easy to crack etc.
description of reference numerals
1 container
10 caps
101 see through the predetermined face of weld of side
102 predetermined shadow surfaces
20 main parts
201 absorb the predetermined face of weld of side
3 moulds
4 die cavitys
5 thermal insulation layers
6 second moulds
7 second die cavitys
8 second thermal insulation layers
Claims (4)
1. a manufacture method for fusion body, is characterized in that, the light absorptive resin-formed body of the method to absorbing laser and the translucent resin formed body that sees through laser carry out welding, and it comprises following operation:
Welding preparatory process, the predetermined face of weld that the predetermined face of weld of described light absorptive resin-formed body is absorbed to the predetermined face of weld of side and described translucent resin formed body is overlapping through the predetermined face of weld of side;
Welding operation, after described welding preparatory process, irradiates and scan laser from the folded part of described translucent resin moulding side counterweight;
Described translucent resin formed body be use in a part of cavity surface be formed with the mould of thermal insulation layer, in mold temperature for forming the cold crystallization temperature (T of resin of described translucent resin formed body
c1under ℃ following condition of)-10, manufacture,
Described thermal insulation layer as below form: as described in cavity surface except with as described in as described in the surperficial predetermined irradiation of translucent resin formed body laser predetermined shadow surface with as described in the part that contacts through the predetermined face of weld of side roughly whole.
2. the manufacture method of fusion body according to claim 1, is characterized in that, described light absorptive resin-formed body is used the mould manufacture that is formed with thermal insulation layer in a part of cavity surface,
Described thermal insulation layer as below form: as described in cavity surface except with as described in the part that contacts of the predetermined face of weld of absorption side roughly whole.
3. the manufacture method of fusion body according to claim 1 and 2, is characterized in that, described light absorptive resin-formed body and described translucent resin formed body consist of poly arylidene thio-ester based resin composition.
4. a fusion body, it uses the method manufacture described in any one in claim 1～3.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-188343 | 2011-08-31 | ||
| JP2011188343 | 2011-08-31 | ||
| PCT/JP2012/070209 WO2013031505A1 (en) | 2011-08-31 | 2012-08-08 | Welded body manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103764375A true CN103764375A (en) | 2014-04-30 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280041740.9A Pending CN103764375A (en) | 2011-08-31 | 2012-08-08 | Welded body manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2013031505A1 (en) |
| KR (1) | KR20140057205A (en) |
| CN (1) | CN103764375A (en) |
| WO (1) | WO2013031505A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463161A (en) * | 2016-01-04 | 2018-08-28 | 欧姆龙健康医疗事业株式会社 | Cuff for blood pressure monitor and its manufacturing method and sphygmomanometer |
| CN111965078A (en) * | 2020-08-18 | 2020-11-20 | 合肥工业大学 | Melt diffusion device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7313947B2 (en) * | 2019-07-19 | 2023-07-25 | ニデックコンポーネンツ株式会社 | Electronic component and its manufacturing method |
| JP7313946B2 (en) * | 2019-07-19 | 2023-07-25 | ニデックコンポーネンツ株式会社 | Electronic component and its manufacturing method |
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| JP2006205619A (en) * | 2005-01-31 | 2006-08-10 | Toyoda Gosei Co Ltd | Resin molded product and manufacturing method thereof |
| JP2011056753A (en) * | 2009-09-09 | 2011-03-24 | Polyplastics Co | Method for producing injection molded product |
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2012
- 2012-08-08 WO PCT/JP2012/070209 patent/WO2013031505A1/en active Application Filing
- 2012-08-08 CN CN201280041740.9A patent/CN103764375A/en active Pending
- 2012-08-08 KR KR1020137032120A patent/KR20140057205A/en not_active Withdrawn
- 2012-08-08 JP JP2013531195A patent/JPWO2013031505A1/en active Pending
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| JP2002120293A (en) * | 2000-10-13 | 2002-04-23 | Toyota Motor Corp | Method for producing resin molding |
| CN1771117A (en) * | 2003-06-24 | 2006-05-10 | Tdk股份有限公司 | Optical disc molding die having stamper holding surface applied with heat insulating layer and diamond-like carbon film, and molding method using it |
| CN1715033A (en) * | 2004-06-29 | 2006-01-04 | 柯尼卡美能达精密光学株式会社 | Injection mold and method for molding an optical element |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108463161A (en) * | 2016-01-04 | 2018-08-28 | 欧姆龙健康医疗事业株式会社 | Cuff for blood pressure monitor and its manufacturing method and sphygmomanometer |
| CN108463161B (en) * | 2016-01-04 | 2019-12-17 | 欧姆龙健康医疗事业株式会社 | cuff for blood pressure monitor, method for manufacturing same, and blood pressure monitor |
| CN111965078A (en) * | 2020-08-18 | 2020-11-20 | 合肥工业大学 | Melt diffusion device |
| CN111965078B (en) * | 2020-08-18 | 2023-06-16 | 合肥工业大学 | A melt diffusion device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013031505A1 (en) | 2013-03-07 |
| KR20140057205A (en) | 2014-05-12 |
| JPWO2013031505A1 (en) | 2015-03-23 |
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Application publication date: 20140430 |