CN103756255A - LED (Light Emitting Diode) lamp - Google Patents
LED (Light Emitting Diode) lamp Download PDFInfo
- Publication number
- CN103756255A CN103756255A CN201310730330.1A CN201310730330A CN103756255A CN 103756255 A CN103756255 A CN 103756255A CN 201310730330 A CN201310730330 A CN 201310730330A CN 103756255 A CN103756255 A CN 103756255A
- Authority
- CN
- China
- Prior art keywords
- resin
- silane
- lamp
- led lamp
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- KCWYOFZQRFCIIE-UHFFFAOYSA-N ethylsilane Chemical compound CC[SiH3] KCWYOFZQRFCIIE-UHFFFAOYSA-N 0.000 claims abstract description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims abstract description 4
- 239000001095 magnesium carbonate Substances 0.000 claims abstract description 4
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 claims abstract description 4
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 claims abstract description 4
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 claims abstract description 4
- ZHOVAWFVVBWEGQ-UHFFFAOYSA-N tripropylsilane Chemical compound CCC[SiH](CCC)CCC ZHOVAWFVVBWEGQ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910000077 silane Inorganic materials 0.000 claims description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- 229960001708 magnesium carbonate Drugs 0.000 claims description 3
- 235000014380 magnesium carbonate Nutrition 0.000 claims description 3
- 150000004756 silanes Chemical class 0.000 abstract 3
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000176 photostabilization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- -1 silane compound Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Abstract
The invention aims to provide a resin material which has good mobility before being cured and is used for manufacturing an LED (Light Emitting Diode) lamp. The LED lamp comprises a lamp cap, a lamp base, a lamp cover and a light emitting diode, wherein a packaging material of the light emitting diode comprises following components: resin, fillers, a silane derivative and a hydrosilylation catalyst; the molecular weight of the silane derivative is less than 200; the resin accounts for 60%-80% of the weight and the silane derivative accounts for 5%-10% of the weight; the resin is epoxy resin or organic silicon resin. The hydrosilylation catalyst is chloroplatinic acid. The inorganic fillers are magnesium carbonate or calcium carbonate. A compound with a SiH group is methylsilane, ethylsilane, methoxysilane, tripropylsilane or phenylsilane.
Description
Technical field
The present invention relates to a kind of LED lamp.
Background technology
Recent years, along with the expansion of needs, when the surface encapsulation material that LED package is used is manufactured, it has encapsulated with material selection the good resin of thermotolerance and has coordinated the resin combination forming with inorganic fill material and illuminating colour.Conventional as epoxy resin or organosilicon resin composition, its heat-resisting photostabilization is relatively better, but the molding that LED package is used itself needs very thin, so need resin combination to there is good mobility in moulding process, and while adopting epoxy resin and silicone resin, its mobility relative deficiency, cannot evenly extend, easily produce filling inhomogeneous even in generation crack, middle part, be unfavorable for fixing, and the corresponding blocked up part of buildup of resin that also can produce, it is unfavorable for printing opacity, even hinders energising.
Summary of the invention
The object of the present invention is to provide a kind of curing front good resin material of mobility, and utilize it to make LED lamp.
The present invention is achieved by the following technical solutions:
Described LED lamp, comprise lamp holder, lamp socket, lampshade and photodiode, the packaged material of described photodiode comprises following component: derivative and the silicon hydrogen addition catalyst of resin, filling material, silane, the derivative molecular amount of silane is below 200, the shared part by weight of described resin is 60%～80%, and the derivative ratio of silane is 5%～10%.
Further, described resin is epoxy resin or silicone resin.
Further, described silicon hydrogen addition catalyst is Platinic chloride.
Further, described inorganic fill material is magnesiumcarbonate or calcium carbonate.
Further, the described compound with SiH group is methyl-monosilane, ethylsilane, methoxy silane, tripropyl silane or phenyl silane.
Beneficial effect of the present invention illustrates with relevant experimental data part in the lump in embodiment.
Embodiment
Below in conjunction with embodiment, the present invention is further elaborated:
Derivative and the silicon hydrogen addition catalyst of resin, filling material, silane are mixed into Preblend, the derivative molecular amount of silane is below 200, in described Preblend, the shared part by weight of resin is 60%～80%, the derivative ratio of silane is 5%～10%, described Preblend mixing early stage temperature remain on 20～30 ℃, continue more than 24 hours, the pressure of mixing later stage more than 10Mpa, carries out helicoidal flow more than 2 minutes at 120 ℃ of above temperature.
The stirring velocity of described helicoidal flow is more than 5rpm.Stir and be unfavorable for too slowly resin Uniform Flow.
Described resin is epoxy resin or silicone resin.
Described silicon hydrogen addition catalyst is Platinic chloride.The kind of catalyzer also has a lot, general silicon hydrogen addition catalyst all can, its role is to make the unsaturated link(age) in silicon and resin to carry out addition reaction.
Described inorganic fill material is magnesiumcarbonate or calcium carbonate.Or other conventional chemical industry resin filling materials also can.
The described compound with SiH group is methyl-monosilane, ethylsilane, methoxy silane, tripropyl silane or phenyl silane.
Of the present inventionly be mainly used in encapsulating diode.
Photodiode of the present invention can be manufactured corresponding LED luminaire after adding power supply and lampshade.
Below by experimental data comparative illustration beneficial effect of the present invention:
After having added the additive of silane compound in resin, and be aided with helical stir, contribute to improve its unit elongation, make encapsulation more even.
The detailed description of this patent being made according to above specification sheets; its object is to be convenient to those skilled in the art better understands application mode and the scope of this patent; can not be interpreted as limitation of the present invention; in conjunction with the general knowledge of above content and this area; under the prerequisite of aim that does not depart from this patent, the alternative that is equal to that those skilled in the art make the technical scheme of recording in this patent document still falls into protection scope of the present invention.
Claims (5)
1. a LED lamp, it is characterized in that, comprise lamp holder, lamp socket, lampshade and photodiode, the packaged material of described photodiode comprises following component: derivative and the silicon hydrogen addition catalyst of resin, filling material, silane, the derivative molecular amount of silane is below 200, the shared part by weight of described resin is 60%～80%, and the derivative ratio of silane is 5%～10%.
2. LED lamp according to claim 1, is characterized in that: described resin is epoxy resin or silicone resin.
3. LED lamp according to claim 1, is characterized in that: described silicon hydrogen addition catalyst is Platinic chloride.
4. LED lamp according to claim 1, is characterized in that: described inorganic fill material is magnesiumcarbonate or calcium carbonate.
5. LED lamp according to claim 1, is characterized in that: the described compound with SiH group is methyl-monosilane, ethylsilane, methoxy silane, tripropyl silane or phenyl silane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310730330.1A CN103756255A (en) | 2013-12-26 | 2013-12-26 | LED (Light Emitting Diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310730330.1A CN103756255A (en) | 2013-12-26 | 2013-12-26 | LED (Light Emitting Diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103756255A true CN103756255A (en) | 2014-04-30 |
Family
ID=50523592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310730330.1A Pending CN103756255A (en) | 2013-12-26 | 2013-12-26 | LED (Light Emitting Diode) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103756255A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1424363A1 (en) * | 2002-11-29 | 2004-06-02 | Shin-Etsu Chemical Co., Ltd. | Silicone resin composition for led devices |
| CN1531574A (en) * | 2001-08-21 | 2004-09-22 | Silicone composition and cured silicone product | |
| JP2006213899A (en) * | 2005-02-07 | 2006-08-17 | Kaneka Corp | Curable composition and semiconductor device encapsulated with the composition |
| JP2007197511A (en) * | 2006-01-24 | 2007-08-09 | Momentive Performance Materials Japan Kk | Method for producing silicone cured product |
| WO2008047892A1 (en) * | 2006-10-19 | 2008-04-24 | Momentive Performance Materials Japan Llc | Curable polyorganosiloxane composition |
| CN101636450A (en) * | 2007-03-19 | 2010-01-27 | 三友瑞克株式会社 | Silicone resin composition for light-emitting element encapsulation and method for producing optical semiconductor electronic parts by casting method using the same |
-
2013
- 2013-12-26 CN CN201310730330.1A patent/CN103756255A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1531574A (en) * | 2001-08-21 | 2004-09-22 | Silicone composition and cured silicone product | |
| EP1424363A1 (en) * | 2002-11-29 | 2004-06-02 | Shin-Etsu Chemical Co., Ltd. | Silicone resin composition for led devices |
| JP2006213899A (en) * | 2005-02-07 | 2006-08-17 | Kaneka Corp | Curable composition and semiconductor device encapsulated with the composition |
| JP2007197511A (en) * | 2006-01-24 | 2007-08-09 | Momentive Performance Materials Japan Kk | Method for producing silicone cured product |
| WO2008047892A1 (en) * | 2006-10-19 | 2008-04-24 | Momentive Performance Materials Japan Llc | Curable polyorganosiloxane composition |
| CN101636450A (en) * | 2007-03-19 | 2010-01-27 | 三友瑞克株式会社 | Silicone resin composition for light-emitting element encapsulation and method for producing optical semiconductor electronic parts by casting method using the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 523000 Guangdong Province, Dongguan City Zhangmutou town Baiguo cave village Baida Industrial Street Panlong Road No. 8 Applicant after: DONGGUAN GRAND-HI INDUSTRY CO., LTD. Address before: 523000 Guangdong Province, Dongguan City Zhangmutou town Baiguo cave village Baida Industrial Street Panlong Road No. 8 Applicant before: Dongguan Guanghaida Rubber & Plastic Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: DONGGUAN GUANGHAIDA RUBBER + PLASTIC CO., LTD. TO: GUANGDONG GUANGHAIDA INDUSTRIAL CO., LTD. |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140430 |