CN103753380A - Chemical mechanical polishing interface temperature detection and control system based on wireless transmission - Google Patents

Abstract

The invention discloses a chemical mechanical polishing interface temperature detection and control system based on wireless transmission. The key points of the technical solution of the present invention are: the chemical mechanical polishing interface temperature detection and control system based on wireless transmission, using a thermocouple temperature sensor to monitor the temperature of the substrate during the chemical mechanical polishing process, and using the current mainstream ARMSTM32F103 series microprocessor for processing , and transmit the temperature data to the computer and mobile phone through the NRF905 and GSM wireless module to realize the display and control of the temperature. The GSM wireless transceiver module and the microprocessor used in the present invention can operate continuously and stably for 24 hours without interruption for many years. The STM32F103 series microprocessor is adopted, which has high control precision, fast response speed and flexible control.

Description

Interface temperature detection and control system for chemical mechanical polishing based on wireless transmission

technical field

The invention relates to a chemical mechanical polishing interface temperature detection and control system, in particular to a chemical mechanical polishing interface temperature detection and control system based on wireless transmission. the

Background technique

Semiconductor lighting is one of the most promising high-tech fields in the 21st century. The LED lighting industry is facing unprecedented policy opportunities, unexpected technological upgrade space, huge market potential, and broad prospects for development. The new semiconductor material SiC single crystal substrate is not only widely used in semiconductor lighting, but also in civil, microelectronics, optoelectronics, military weapon systems, aerospace, automotive equipment, and petroleum geological exploration and other fields, with huge potential users and market. the

The performance and manufacturing cost of SiC-based devices are important factors restricting the development of microelectronics, optoelectronics and other industries. The processing of SiC single crystal substrates mainly follows the traditional processing technology of crystal substrates: internal circular sawing, free abrasive grinding and mechanical polishing. the

Chemical Mechanical Polishing (CMP) technology is a new technology developed in the past ten years to realize ultra-smooth and non-damaging surface processing by using chemical and mechanical composite effects. During CMP processing, a large amount of heat will inevitably be generated, resulting in temperature fluctuations. The heat mainly comes from the friction cutting and chemical reaction during the processing, and the change of temperature has a great influence on chemical mechanical polishing. SiC single crystal substrates with ultra-smooth and non-damaged surfaces have broad application prospects, and temperature is a key factor affecting the quality of SiC single crystal substrates. Therefore, it is of great significance to monitor and control the processing temperature of substrates. the

At present, only a few foreign scholars have carried out online measurement of the surface temperature of the polishing pad and the backside temperature of the processed surface of the silicon wafer. Hocheng et al. measured the temperature change of the surface of the polishing pad by using an infrared camera. The emissivity of the object is restricted by the emissivity, and the surface emissivity of the object is related to the material, surface roughness, oxidation degree and oil stain of the measured object. These parameters are volatile and difficult to determine quantitatively and accurately, thus reducing the accuracy of the measurement. At the same time, the infrared camera is greatly affected by the ambient temperature, the radiation energy of the camera itself, the characteristics of the lens and other factors, so the error of the measured temperature is relatively large. The temperature signal on the polishing pad is easily affected by the interference of mechanical noise, and the temperature value is not easy to measure due to the presence of polishing fluid and other factors. Limited by the position of the temperature measurement signal, it cannot truly reflect the temperature of the polishing solution in the silicon wafer chemical mechanical polishing processing area. the

Sampum et al. glued the silicon wafer to a special polishing head with two different grooves, and measured the temperature change at different positions on the back of the silicon wafer during the CMP process with an infrared camera. The accuracy of the result is more accurate than the method of directly measuring the temperature of the polishing pad. There are some improvements, but there are still shortcomings: the temperature measurement accuracy of the infrared camera is low, the silicon wafer to be thrown is non-metallic and has a certain thickness, which cannot be ignored in the heat conduction process, and the surface to be polished during the polishing process The temperature rises first, and then the heat is transferred from the thrown surface to the back surface of the thrown surface, and a temperature gradient descends in the thickness direction of the silicon wafer. At this time, the measured back surface temperature is lower than the actual temperature of the thrown surface. To sum up, the above methods have their own characteristics, and many beneficial studies have been carried out on the temperature of the polishing pad and the workpiece during the CMP processing of silicon wafers. However, these methods cannot directly reflect the temperature change of the polishing liquid in the actual CMP processing area of silicon wafers. It is necessary to study methods that directly reflect the temperature measurement of the polishing liquid in real time in order to better analyze the effect of the polishing liquid temperature on the CMP processing mechanism of silicon wafers. Influence. the

Therefore, studying the change and distribution of temperature during the entire polishing process, monitoring and controlling temperature has become an important issue for studying the polishing mechanism and improving the integrity of the working surface. the

Contents of the invention

The technical problem solved by the present invention is to provide a chemical mechanical polishing interface temperature detection and control system based on wireless transmission. The system uses a thermocouple temperature sensor to monitor the temperature of the substrate in the chemical mechanical polishing process, and adopts the current mainstream ARM STM32F103 A series of microprocessors are used for processing, and the temperature data is transmitted to the computer and mobile phone through the NRF905 and GSM wireless module to realize the display and control of the temperature. the

The technical solution of the present invention is: a chemical mechanical polishing interface temperature detection and control system based on wireless transmission, which is characterized in that it includes a sending end and a receiving end, and the sending end includes a polishing machine, a thermocouple temperature sensor, a lithium ion battery at the sending end, Grinding disc, transmitting end circuit shell, NRF905 transmitting antenna, transmitting end processor reset key, transmitting end power switch, the upper part of the polishing machine is equipped with a grinding disc, the sending end lithium ion battery is installed inside the polishing machine, and the upper part of the grinding disc is installed with The transmitting end circuit housing, the upper part of the grinding disc and the lower part of the transmitting end circuit housing are respectively equipped with seven sets of thermocouple temperature sensors along the radial direction of the grinding disc, and the exposed hot end of the thermocouple temperature sensor is parallel or equal to the lower surface of the grinding disc wafer, The surrounding of the dual temperature sensor is coated with insulating glue, the transmitter circuit shell is equipped with the transmitter control circuit through the circuit board, the upper part of the transmitter circuit housing is equipped with NRF905 transmitting antenna IC19, and one side of the transmitter circuit housing is installed side by side with the transmitter power supply The switch K1 and the processor reset key SAW2 at the sending end; the receiving end includes the receiving end circuit shell, the receiving end power switch, the receiving end processor reset key, the LCD screen, the EM310 antenna, the NRF905 receiving antenna, and the first communication indicator light , the second communication indicator light, main function button, up button, down button, query button, serial port, receiving end lithium ion battery and power plug, in which the EM310 antenna and NRF905 receiving antenna are installed side by side on the upper part of the receiving end circuit shell, and the receiving end The front part of the circuit housing is equipped with a liquid crystal display, a first communication indicator light, a second communication indicator light, a processor reset key SAW1 at the receiving end, a power switch K2 at the receiving end, a lithium-ion battery at the receiving end, a main function button SAW3, and an upward adjustment button SAW4, downward adjustment button SAW5, query button SAW6 and serial port J1, the left side of the receiving end circuit shell is equipped with a power plug CT, and the receiving end circuit shell is equipped with a receiving end control circuit through a circuit board. the

The sending end control circuit of the present invention includes temperature acquisition circuit IC16, clock drive circuit IC22, storage circuit IC21, sending end 3.3V power supply circuit IC20, sending end microprocessor reset circuit IC17, NRF905 wireless transmitting circuit IC19, sending end crystal oscillator Circuit IC18, sending end microprocessor IC23, sending end microprocessor IC23 are respectively connected with temperature acquisition circuit IC16, clock driving circuit IC22, storage circuit IC21, sending end 3.3V power supply circuit IC20, sending end microprocessor reset circuit IC17, NRF905 The wireless transmitting circuit IC19 is connected with the crystal oscillator circuit IC18 of the sending end; the 6 pins and 7 pins of the first K-type thermocouple serial analog-to-digital converter of the temperature acquisition circuit IC16 are respectively connected to the 45 pins of the sending end microprocessor IC23 , 46 pins, 6 pins and 7 pins of the second K-type thermocouple serial analog-to-digital converter are respectively connected to 43 pins and 44 pins of the sending end microprocessor IC23, and the third K-type thermocouple serial analog-to-digital converter Pins 6 and 7 are respectively connected to pins 41 and 42 of the microprocessor IC23 at the sending end, and pins 6 and 7 of the fourth K-type thermocouple serial analog-to-digital converter are respectively connected to pins 39 and 42 of the microprocessor IC23 at the sending end. 40 pins, 6 pins and 7 pins of the fifth K-type thermocouple serial analog-to-digital converter are respectively connected to 5 pins and 38 pins of the sending end microprocessor IC23, and 6 pins of the sixth K-type thermocouple serial analog-to-digital converter Pins 1 and 7 are respectively connected to pins 3 and 4 of the microprocessor IC23 at the sending end, and pins 6 and 7 of the seventh K-type thermocouple serial analog-to-digital converter are respectively connected to pins 1 and 2 of the microprocessor IC23 at the sending end. Pin; pin 5 of the first K-type thermocouple serial analog-to-digital converter is connected to pin B6 of the clock driver IC22, pin 5 of the second K-type thermocouple serial analog-to-digital converter is connected to pin B5 of the clock driver IC22, and the third Pin 5 of the K-type thermocouple serial analog-to-digital converter is connected to pin B4 of the clock driver IC22, pin 5 of the fourth K-type thermocouple serial analog-to-digital converter is connected to pin B3 of the clock driver IC22, and the fifth K-type thermocouple Pin 5 of the serial analog-to-digital converter is connected to pin B2 of the clock driver IC22, pin 5 of the serial analog-to-digital converter of the sixth K-type thermocouple is connected to pin B1 of the clock driver IC22, and the serial modulus of the sixth K-type thermocouple The 5 pins of the converter are connected to the B0 pin of the clock driver IC22; the A pin of the clock driver IC22 is connected to the 52 pins of the sending end microprocessor IC23; one end of the capacitor C32 of the sending end microprocessor reset circuit and the sending end microprocessor One end of the reset key SAW2 of the transmitter is connected to the ground in parallel, the other end of the capacitor C32, the other end of the reset key SAW2 of the microprocessor at the sending end, and one end of the resistor R24 are connected to pin 16 of the microprocessor IC23 at the sending end, and the other end of the resistor R24 is connected to the sending end 3.3V power supply; one end of the capacitor C33 and one end of the capacitor C34 of the crystal oscillator circuit at the sending end are connected in parallel to the ground, the other end of the capacitor C33 and one end of the crystal oscillator TX3 are connected to pin 9 of the microprocessor IC23 at the sending end, and the other end of the capacitor C34 is connected to the crystal oscillator TX3 The other end of the sender micro The 8-pin of the processor IC23, one end of the capacitor C35 and one end of the capacitor C36 are connected in parallel to the ground, the other end of the capacitor C35 and one end of the crystal oscillator TX4 are connected to the 12-pin of the sending end microprocessor IC23, the other end of the capacitor C36 is connected to the other end of the crystal oscillator TX4 One end is connected to the 13 pins of the sending end microprocessor IC23; the 13 pins and 14 pins of the NRF905 wireless transmitting circuit IC19 are connected to the ground in parallel, 1 pin is connected to the power supply, 2 pins, 3 pins, 4 pins, 5 pins, 6 pins, 7 pins Pins, 8 pins, 9 pins, 10 pins, 11 pins, 12 pins are respectively connected to 25 pins, 26 pins, 23 pins, 29 pins, 30 pins, 71 pins, 32 pins, 72 pins, 76 pins of the sending end microprocessor IC23 Pins, 31 pins, 24 pins; 1 pin, 2 pins, 3 pins, 4 pins and 7 pins of the storage circuit IC21 are connected in parallel to the ground, one end of the resistor R25, one end of the resistor R26 are connected in parallel with the 8 pins of the storage circuit IC21 Power supply, the other end of the resistor R26 and pin 6 of the storage circuit IC21 are connected to pin 47 of the microprocessor IC23 at the sending end, and the other end of the resistor R25 and pin 5 of the storage circuit IC21 are connected to pin 48 of the microprocessor IC23 at the sending end; The 19 pins of the microprocessor IC23 are grounded, the 10 pins, 27 pins, 99 pins, 74 pins and 49 pins are connected to the ground in parallel, the 22 pins are connected to the power supply, and the 11 pins, 28 pins, 100 pins, 75 pins and 50 pins are connected to the power supply in parallel; The receiving end control circuit includes receiving end 3.3V power supply circuit IC1, receiving end microprocessor reset circuit IC14, SIM card holder circuit IC13, memory circuit IC2, driving circuit IC8, receiving end crystal oscillator circuit IC9, button circuit IC10, sending and receiving data Signal indication circuit IC11, SIM card socket connection circuit IC12, NRF905 wireless receiving circuit IC7, liquid crystal display circuit IC15, EM310 power supply circuit IC5, EM310 circuit IC4, serial port circuit IC6 and receiving end microprocessor IC3, the receiving end microprocessor One end of the capacitor C1 of the device reset circuit IC14 and one end of the reset key SAW1 of the receiving end microprocessor are connected in parallel to the ground, and the other end of the capacitor C1, the other end of the receiving end microprocessor reset key SAW1 and one end of the resistor R1 are connected to the receiving end microprocessor 16 pins of the device, the other end of the resistor R1 is connected to the 3.3V power supply of the receiving end; one end of the resistor R5 of the drive circuit IC8 and the emitter of the transistor Q1 are connected in parallel to the ground, one end of the resistor R4, one end of the resistor R5 and the transistor Q1 The base is connected, the other end of the resistor R4 is connected to the 68-pin of the receiving end microprocessor IC3, the collector of the transistor Q1 is connected to the 41-pin of the EM310 circuit IC4; the 1-pin, 2-pin, 3-pin, 4-pin of the memory circuit IC2 Pin and pin 7 are connected in parallel to the ground, one end of resistor R2 and pin 5 of the memory circuit IC2 are connected to pin 48 of the receiving end microprocessor, one end of resistor R3 and pin 6 of the memory circuit IC2 are connected to pin 47 of the receiving end processor, and the resistor The other end of R2 and the other end of resistor R3 are connected to 3.3V power supply with pin 8 of the receiving microprocessor. Source; one end of the capacitance C2 of the receiving end crystal oscillator circuit IC9, one end of the capacitance C3, one end of the capacitance C4 and one end of the capacitance C5 are connected in parallel to the ground, and the other end of the capacitance C2 and one end of the crystal oscillator TX1 are connected to the receiving end microprocessor Pin 9, the other end of capacitor C3 and the other end of crystal oscillator TX1 are connected to pin 8 of the receiving end microprocessor, the other end of capacitor C4 and one end of crystal oscillator TX2 are connected to pin 12 of the receiving end microprocessor, the other end of capacitor C5 and The other end of the crystal oscillator TX2 is connected to pin 13 of the receiving end microprocessor; one end of the capacitor C6 of the button circuit IC10, one end of the main function button SAW3, one end of the capacitor C7, one end of the upward adjustment button SAW4, one end of the capacitor C8, One end of the downward adjustment button SAW5, one end of the capacitor C9 and one end of the query button SAW6 are connected in parallel to the ground, the other end of the capacitor C6, the other end of the main function button SAW3 and one end of the resistor R6 are connected to pin 84 of the receiving end microprocessor, and the capacitor C7 is The other end, the other end of the upward adjustment button SAW4, one end of the resistor R7 are connected to pin 83 of the receiving end microprocessor, the other end of the capacitor C8, the other end of the downward adjustment button SAW5 and one end of the resistor R8 are connected to pin 82 of the receiving end microprocessor , the other end of capacitor C9, the other end of query button SAW6, one end of resistor R9 connected to pin 81 of the receiving end microprocessor, the other end of resistor R6, the other end of resistor R7, the other end of resistor R8 and the other end of resistor R9 One end is connected to the 3.3V power supply of the receiving end in parallel; one end of the resistor R12 of the sending and receiving data signal indicating circuit IC11, the emitter of the transistor Q3, one end of the resistor R15 and the emitter of the transistor Q2 are connected in parallel to the ground, one end of the resistor R11, and the other end of the resistor R12 , The base of the triode Q3 is connected, the other end of the resistor R11 is connected to the 32 pin of the EM310 circuit IC4, the collector of the triode Q3 receives the negative pole of the sending data signal indicator LED1 through the resistor R10, and the positive pole of the sending and receiving data signal indicator LED1 is connected to the 5V power supply , one end of the resistor R14, one end of the resistor R15, and the base of the triode Q2 are connected, the other end of the resistor R14 is connected to pin 13 of the EM310 circuit IC4, and the collector of the triode Q2 receives and sends data signals through the resistor R13. The anode of the data signal indicator LED2 is connected to a 5V power supply. the

The receiving end microprocessor processing IC3 of the present invention comprises a microprocessor and a backup lithium battery VBAT, wherein 10 pins, 27 pins, 99 pins, 74 pins, 49 pins and 19 pins of the microprocessor are connected in parallel to the ground, and the microprocessor The 22 pins, 11 pins, 28 pins, 100 pins, 75 pins and 50 pins are connected to the 3.3V power supply of the receiving end, the negative pole of the backup lithium battery VBAT is grounded, and the positive pole of the backup lithium battery VBAT is connected to the 6 pins of the microprocessor. the

The negative electrode of the lithium-ion battery Li-ion1 of the sending end power supply circuit IC20 of the present invention is grounded, the positive electrode of the lithium-ion battery Li-ion1 is connected to the 3-pin of the ultra-low dropout current regulator U1A via K2, and the ultra-low dropout current regulator U1A 2 pins are grounded, and 1 pin is the power output terminal; the receiving end 3.3V power supply circuit IC1 includes an ultra-low dropout current regulator U14 and a battery charger U15, 2 pins of the ultra-low dropout current regulator U14 and a lithium-ion battery The negative pole of Li-ion2 is connected to ground in parallel, and the positive pole of Li-ion battery Li-ion2 is respectively connected to one end of K2, pin 3 of the battery charger, pin 5 of linear regulator U13 of EM310 power supply circuit IC5, the other end of capacitor C12 and The 6-pin and 7-pin of the linear voltage regulator U13 of the EM310 power supply circuit IC5, the negative electrode of the lithium-ion battery Li-ion2 are grounded, the other end of K2 is connected to the 3-pin of the ultra-low dropout current regulator U14, and the two ends of the 220V power plug CT Connect to pin 1 and pin 2 of the battery charger U15 respectively. the

The temperature acquisition circuit IC16 of the present invention comprises seven groups of thermocouple temperature sensors and seven groups of K-type thermocouple serial analog-to-digital converters, the first thermocouple temperature sensor, the second thermocouple temperature sensor, the third thermocouple temperature sensor , the fourth thermocouple temperature sensor, the fifth thermocouple temperature sensor, the sixth thermocouple temperature sensor, and the seventh thermocouple temperature sensor are respectively connected to the first K-type thermocouple serial analog-to-digital converter and the second K-type thermocouple Thermocouple serial analog-to-digital converter, third K-type thermocouple serial analog-to-digital converter, fourth K-type thermocouple serial analog-to-digital converter, fifth K-type thermocouple serial analog-to-digital converter, sixth K-type thermocouple serial analog-to-digital converter, pin 2 and pin 3 of the seventh K-type thermocouple serial analog-to-digital converter; pin 4 of the first K-type thermocouple serial analog-to-digital converter, second K-type thermocouple serial analog-to-digital converter 4 pins of the thermocouple serial analog-to-digital converter, 4 pins of the third K-type thermocouple serial analog-to-digital converter, 4 pins of the fourth K-type thermocouple serial analog-to-digital converter, and the fifth K-type thermocouple Pin 4 of the serial analog-to-digital converter, pin 4 of the sixth K-type thermocouple serial analog-to-digital converter, pin 4 of the seventh K-type thermocouple serial analog-to-digital converter, one end of capacitor C25, and one end of capacitor C26 One end, one end of capacitor C27, one end of capacitor C28, one end of capacitor C29, one end of capacitor C30 and one end of capacitor C31 are connected to the power supply in parallel, the other end of capacitor C25, the other end of capacitor C26, the other end of capacitor C27, capacitor C28 The other end of the capacitor C29, the other end of the capacitor C30, the other end of the capacitor C31, pin 1 of the first K-type thermocouple serial analog-to-digital converter, the second K-type thermocouple serial analog-to-digital converter 1 pin of the third K-type thermocouple serial analog-to-digital converter, 1 pin of the fourth K-type thermocouple serial analog-to-digital converter, 1 pin of the fifth K-type thermocouple serial analog-to-digital converter pin, pin 1 of the sixth K-type thermocouple serial analog-to-digital converter, and pin 1 of the seventh K-type thermocouple serial analog-to-digital converter are connected in parallel to the ground. the

The SIM card socket connection circuit IC12 of the present invention includes a card socket connector SMFI, 2 pins of the card socket connector SMFI are grounded, 3 pins of the card socket connector SMFI are connected to a 5V power supply, 4 pins of the card socket connector SMFI, EM310 Connect pin 4 of circuit IC4 and one end of R17, pin 5 of card socket connector SMFI, pin 1 of EM310 circuit IC4 and one end of resistor R18, pin 6 of card socket connector SMFI, pin 3 of EM310 circuit IC4 and resistor One end of R16 is connected; the SIM card holder circuit IC13 includes a SIM card socket SIM-SOCKET-8, 2 pins of the SIM card socket SIM-SOCKET-8 are grounded, 1 pin of the SIM card socket SIM-SOCKET-8, capacitor C10 One end of the capacitor C10 is connected to the 5V power supply, the other end of the capacitor C10 is grounded, the 3-pin of the SIM card socket SIM-SOCKET-8 is connected to the other end of R17, the 5-pin of the SIM card socket SIM-SOCKET-8 is connected to the other end of R18, and the SIM card socket Pin 6 of SIM-SOCKET-8 is connected to the other end of resistor R16. the

EM310 circuit IC4 of the present invention comprises EM310 processor, 6 pins, 8 pins, 42 pins, 21 pins, 22 pins, 23 pins, 24 pins, 25 pins of EM310 processor, one end of electric capacity C20, one end of electric capacity C21 , One end of capacitor C22, one end of capacitor C23 and one end of capacitor C24 are connected in parallel to the ground, and the 30 pins, 29 pins, 28 pins, 27 pins and 26 pins of the EM310 processor are connected in parallel with the other end of capacitor C20, the other end of capacitor C21, The other end of the capacitor C22, the other end of the capacitor C23, and the other end of the capacitor C24 are connected. The 2 pins and 31 pins of the EM310 processor are connected to the 5V power supply, and the 15 pins of the EM310 processor are connected to the 69 pins of the receiving end microprocessor through the resistor R19. , the 17 pins of the EM310 processor are connected to the 68 pins of the receiving end microprocessor through the resistor R20, and the 40 pins of the EM310 processor are grounded through the capacitor C11; the EM310 power supply circuit IC5 includes a linear voltage regulator U13, a linear voltage regulator U13 The 6-pin, 7-pin and one end of the capacitor C12 are connected in parallel to the negative electrode of the lithium-ion battery Li-ion2, one end of the capacitor C13, one end of the resistor R21, one end of the resistor R23, one end of the inductor L2 and one end of the capacitor C15 are connected in parallel to the ground, and the capacitor The other end of C13 and the other end of resistor R21 are connected in parallel to pin 1 of the linear voltage regulator, the other end of resistor R23 is connected to pin 2 of the linear voltage regulator and one end of resistor R22, and the other end of resistor R22 is respectively connected to the other end of capacitor C15 One end and the negative pole of the diode D2, the positive pole of the diode D2 are respectively connected to the other end of the inductor L2 and one end of the capacitor C14, and the other end of the capacitor C14 is respectively connected to one end of the inductor L1 and the pin 8 of the linear regulator, and the other end of the inductor L1 is connected to Pin 5 of the voltage regulator, the other end of the capacitor C12 and the positive pole of the Li-ion battery Li-ion2. the

The serial port circuit IC6 of the present invention comprises a serial port level conversion chip U9, a serial port female socket J1, the 6 pins of the serial port level conversion chip U9 are grounded through a capacitor C18, and one end of the capacitor C19 is connected to the 5 pins of the serial port level conversion chip, The other end of capacitor C19 is connected to pin 4 of the serial port level conversion chip, one end of capacitor C17 is connected to pin 3 of the serial port level conversion chip, the other end of capacitor C17 is connected to pin 1 of the serial port level conversion chip, and one end of capacitor C16 is connected to the serial port Pin 2 of the level conversion chip, the other end of capacitor C16 is connected to pin 16 of the serial port level conversion chip, pin 13 of the serial port level conversion chip is connected to pin 3 of the serial port female socket J1, and pin 14 of the serial port level conversion chip is connected to The 2 pins of the serial port female socket J1, the 12 pins of the serial port level conversion chip are connected to the 69 pins of the receiving end microprocessor, and the 11 pins of the serial port level conversion chip are connected to the 68 pins of the receiving end microprocessor. the

The NRF905 wireless receiving circuit IC7 of the present invention comprises a wireless receiving module, 1 pin of the wireless receiving module is connected to the receiving terminal 3.3V power supply, 13 pins and 14 pins of the wireless receiving module are connected in parallel to the ground, 2 pins, 3 pins, 4 pins, 5 pins, 6 pins, 7 pins, 8 pins, 9 pins, 10 pins, 11 pins and 12 pins are respectively connected to 25 pins, 26 pins, 23 pins, 29 pins, 30 pins, 71 pins of the receiving end microprocessor feet, 32 feet, 72 feet, 76 feet, 31 feet and 14 feet. the

The liquid crystal display circuit IC15 of the present invention comprises a liquid crystal display module, and pin 1 and pin 16 of the liquid crystal display module are connected in parallel to the ground, pin 15 of the liquid crystal display module is connected to a 5V power supply, and pin 2 of the liquid crystal display module and one end of PR1 are connected in parallel to a 5V power supply , the other end of PR1 is grounded, the sliding end of PR1 is connected to pin 3 of the LCD module, pin 4, pin 5, pin 6, pin 7, pin 8, pin 9, pin 10, pin 11, pin 12, 13 pins and 14 pins are respectively connected to 86 pins, 87 pins, 88 pins, 55 pins, 56 pins, 57 pins, 58 pins, 59 pins, 60 pins, 61 pins and 62 pins of the receiving end microprocessor. the

The main functions realized by the system of the present invention include the following aspects: one is to collect temperature data in real time and transmit and monitor it wirelessly; the other is to detect and display the characteristic curve of the temperature signal of the polishing part in real time, and it can automatically alarm or send it to the mobile phone when the temperature reaches Realize remote monitoring of machine status. the

The present invention has the following beneficial effects: 1, the GSM wireless transceiver module and the microprocessor adopted by the system are sustainable, stable, 24 hours uninterrupted and reliable for many years; 3. The original long-distance unlimited remote control technology only needs a mobile phone to initialize the system. All configurations of the system are realized through mobile phone text messages, breaking through the time and space constraints. System maintenance is very simple; 4. The system uses STM32F103 series microprocessor, which has high control precision, fast response and flexible control. the

Description of drawings

Fig. 1 is a structural schematic diagram of the transmitting end of the present invention, Fig. 2 is a structural schematic diagram of the receiving end of the present invention, Fig. 3 is a circuit module diagram of the transmitting end of the present invention, Fig. 4 is a circuit module diagram of the receiving end of the present invention, and Fig. 5 is a clock drive circuit diagram of the present invention , Fig. 6 is a circuit diagram of the memory 24C04 of the sending end of the present invention, Fig. 7 is a circuit diagram of the 3.3V power supply of the sending end of the present invention, Fig. 8 is a circuit diagram of the NRF905 wireless transmission of the present invention, Fig. 9 is a circuit diagram of the temperature acquisition of the present invention, and Fig. 10 is a sending end of the present invention Microprocessor reset circuit diagram, Figure 11 is the crystal oscillator circuit diagram of the sending end of the present invention, Figure 12 is a circuit diagram of the microprocessor at the sending end of the present invention, Figure 13 is a 3.3V power supply circuit diagram of the receiving end of the present invention, and Figure 14 is a reset of the receiving end processor of the present invention Circuit diagram, Fig. 15 is the circuit diagram of the receiving end memory 24C04 of the present invention, Fig. 16 is the driving circuit diagram of the present invention, Fig. 17 is the crystal oscillator circuit diagram of the receiving end of the present invention, Fig. 18 is the SIM card holder circuit diagram of the present invention, and Fig. 19 is the microprocessing of the receiving end of the present invention Figure 20 is a key circuit diagram of the present invention, Figure 21 is a transmission data signal indication circuit diagram of the present invention, Figure 22 is a SIM card socket connection circuit diagram of the present invention, Figure 23 is a NRF905 wireless receiving circuit diagram of the present invention, and Figure 24 is an LCD1602 display of the present invention Circuit diagram, Fig. 25 is the EM310 power supply circuit of the present invention, Fig. 26 is the EM310 circuit diagram of the present invention, Fig. 27 is the serial port circuit diagram of the present invention. the

Drawing description: 1. Polishing machine, 2. Lithium-ion battery at the sending end, 3. Grinding plate, 4. Circuit shell at the sending end, 5. NRF905 transmitting antenna, 6. Reset key of the sending end processor, 7. Power switch at the sending end, 8. LCD display, 9. EM310 antenna, 10. NRF905 receiving antenna, 11. First communication indicator light, 12. Main function button, 13. Up button, 14. Down button, 15. Inquiry button, 16. Serial port, 17 1. Receiver circuit shell, 18. Receiver power switch, 19. Receiver processor reset key, 20. Second communication indicator light, 21. Receiver lithium ion battery. the

Detailed ways

The specific implementation manners of the present invention will be described in further detail below in conjunction with the accompanying drawings. The chemical mechanical polishing interface temperature detection and control system based on wireless transmission includes a sending end and a receiving end. The sending end includes a polishing machine 1, a thermocouple temperature sensor, a lithium ion battery 2 at the sending end, a grinding disc 3, and a circuit housing 4 at the sending end. , NRF905 transmitting antenna 5, sending end processor reset key 6, sending end power switch 7, described polishing machine 1 top is equipped with grinding disc 3, and transmitting end lithium-ion battery 2 is installed in the inside of polishing machine 1, and the top of grinding disc 3 The transmitting end circuit housing 4 is installed, and the upper part of the grinding disc 3 and the lower part of the transmitting end circuit housing 4 are respectively equipped with seven sets of thermocouple temperature sensors along the radial direction of the grinding disc 3, and the exposed hot ends of the thermocouple temperature sensors are parallel to the lower surface of the grinding disc 3 wafer. or the same height, and coated with insulating glue around the thermocouple temperature sensor, the transmitting end circuit shell 4 is equipped with the transmitting end control circuit through the circuit board, the upper part of the transmitting end circuit shell 4 is equipped with the NRF905 transmitting antenna 5, the transmitting end circuit shell 4 One side of 4 is equipped with sending end power switch 7 and sending end processor reset key 6 side by side; Described receiving end includes receiving end circuit shell 17, receiving end power switch 18, receiving end processor reset key 19, liquid crystal display 8. EM310 antenna 9, NRF905 receiving antenna 10, first communication indicator light 11, second communication indicator light 20, main function button 12, up button 13, down button 14, query button 15, serial port 16, receiving end lithium-ion battery 21 and a power plug, wherein the EM310 antenna 9 and the NRF905 receiving antenna 10 are arranged side by side on the upper part of the receiving end circuit housing 17, and the front part of the receiving end circuit housing 17 is equipped with a liquid crystal display 8, a first communication indicator light 11, a second communication Indicator light 20, receiver processor reset key 19, receiver power switch 18, receiver lithium ion battery 21, main function button 12, up button 13, down button 14, query button 15 and serial port 16, receiver circuit case 17 The left side of the power supply plug CT is equipped with, and the receiving end control circuit is housed through the circuit board in the receiving end circuit shell 17. the

The main functions realized by the system of the present invention include the following aspects: one is to collect temperature data in real time and transmit and monitor it wirelessly; the other is to detect and display the characteristic curve of the temperature signal of the polishing part in real time, and it can automatically alarm or send it to the mobile phone when the temperature reaches Realize remote monitoring of machine status. The connection block diagram and circuit schematic diagram of each functional module of the chemical mechanical polishing interface temperature detection and control system are shown in the figure. the

After the temperature signal is detected by the K-type thermocouple, the temperature signal is converted into a voltage signal, processed by MAX6675, and the weak signal sent by the thermocouple temperature sensor is amplified to improve the stability of the circuit signal. Digital conversion, which converts the analog temperature voltage or current signal (analog quantity) into an equivalent digital quantity that the computer can recognize and process. The signal acquisition part is connected with the ARM STM32F103 series microprocessor. After the microprocessor detects the temperature signal, it sends the detected temperature information to the receiving end through the NRF905 wireless transmission network. The flat conversion chip MAX232 conversion chip transmits the relevant information of the temperature to the computer, uses the VB6.0 interface as the display window, and displays the temperature signal in the form of coordinates to display the temperature curve. When the temperature signal exceeds the set upper limit, the upper The machine interface will automatically send a text message to the set mobile phone number through the EM310 module. When the personnel is not at the machine, if you want to know the current temperature information, you can send a query message to the EM310 module to obtain the current working condition of the machine, so that For remote monitoring. the

The system communicates with the computer through the serial port of the ARM controller for the real-time control of the temperature signal. The display of the temperature signal is monitored in real time and dynamically on the computer by the host computer interface. The upper computer uses VB6.0 as the control interface, and records the temperature at this time and draws a curve every interval. When the temperature is lower or higher than the temperature value we set, the system will pop up a prompt window and send out When this process occurs, the system will continue to record temperature curves and dynamic data and save them in the database for user query and analysis. The system can also automatically adjust the speed of the machine tool motor or the contact pressure of the silicon wafer according to the temperature value set by the host computer, thereby adjusting the temperature of the polishing body to make it work normally within a certain range. the

In order to make the system more secure and intelligent, the SMS alarm function and remote SMS control function are also expanded in the design. When the operator leaves the monitoring computer, he can click the "lock" button on the host computer interface to monitor the SMS. When "locked", the mobile phone number and temperature limit cannot be changed again, in case of wrong operation, causing the device to send text messages or wrong text messages by mistake. This function can be freely selected to operate. When unlocked, there will be no automatic SMS sending function. At this time, the EM310 module connected with the ARM STM32F103 series microprocessor starts the monitoring work. When the temperature exceeds the set value, the EM310 module will automatically send an alarm message to the designated user's mobile phone, and the user can also realize remote control of the device by replying to the SMS control code. the

In this system, the upper computer is set to monitor the temperature by controlling the GSM module through the ARM STM32F103 series microprocessor. SMS remote control adopts EM310 wireless communication module to monitor the temperature of the mobile phone. The EM310 module is an industrial-grade GSM and GPRS module produced by China Huawei. It is embedded with TCP/IP protocol and supports data, voice, short message and fax. and GSM1800 two frequency bands, the power supply range is DC 3.4~4.7V. The average standby current is 3.5mA, the shutdown leakage current is 40uA, the SIM card voltage supports 3V and 1.8V, and supports sending and receiving short messages in TEXT and PDU formats. The EM310 module has 50 pins. In this design, the EM310 module is connected with the mobile phone card circuit, power supply circuit, power-on circuit, power indicator circuit, network indicator circuit, serial port communication circuit and other auxiliary components. The EM310 module provides a serial interface and supports 8 lines Serial bus interface or 4-wire serial bus interface or 2-wire serial interface. The EM310 GSM module performs serial communication and AT command input with the outside world through the UART interface. UART supports programmable data width, programmable data stop bit, programmable odd/even parity or no parity, the UART port supports a maximum baud rate of 115.2kbit/s and a minimum support of a baud rate of 300bit/s , supports 9600bit/s rate by default, and supports baud rate power-off save. the

At the receiving end of temperature signal collection, an LCD1602 display is set up as an auxiliary display of the upper computer interface display module. When the computer is turned off (the upper computer is turned off), it is used to display the temperature and current time of the silicon wafer processing area in real time. The character liquid crystal display module adopts dot matrix liquid crystal display, referred to as LCD, which is a display device specially used to display letters, numbers, symbols and other ASCII code symbols. The display device adopts soft packaging, most of the controllers are HD44780, and the interface is a standard SIP16 pin, which is divided into three parts: power supply, communication data and control. The operating voltage of the 1602 chip and the backlight circuit is compatible with the microprocessor, and can be easily connected with the microprocessor. the

The GSM wireless transceiver module and microprocessor used in the system can operate continuously and stably for 24 hours without interruption for many years. The communication between the GSM module and the computer can be connected by RS232 serial port or USB interface to facilitate the adjustment of the control program. The original long-distance unlimited remote control technology requires only a mobile phone to initialize the system. All configurations of the system are realized through mobile phone text messages, breaking through the limitations of time and space, and the system maintenance is very simple. The system adopts STM32F103 series microprocessor, which has high control precision, fast response and flexible control. the

The present invention analyzes and compares the two temperature measurement methods of contact method and non-contact method according to the use mode of the temperature sensor, comprehensively considers many factors that restrict the temperature measurement of the polishing solution in the chemical mechanical polishing processing area of silicon wafers, and proposes a method based on contact method. The method of multi-point in-situ real-time measurement of the temperature of the polishing solution in the chemical mechanical polishing processing area of the silicon wafer uses a laser to drill holes in the silicon wafer, and distributes three thermocouple temperature sensors along the radial direction of the silicon wafer to realize the silicon wafer chemistry. The dynamic measurement of the temperature of the polishing liquid in the mechanical polishing processing area, and the use of GPS technology to realize the direct display and remote monitoring of the temperature characteristic curve. This method is non-contact with the polishing liquid temperature in the silicon wafer chemical mechanical polishing processing area. Compared with the measurement method, it has the following advantages: (1) The measurement method proposed in this paper has higher precision, and it can build a network by itself, which is convenient for multi-point centralized measurement; (2) Compared with the non-contact measurement method using transparent plexiglass discs, The method of sticking a silicon wafer on the head to measure the temperature of the polishing solution is closer to the process of chemical mechanical polishing of silicon wafers. Secondly, on the basis of the chemical mechanical polishing test bench for silicon wafers, a chemical mechanical polishing process for silicon wafers consisting of thermocouple temperature sensors, signal conditioning amplifiers, signal processors, data acquisition instruments, GSM network systems, mobile phones and computers was established. Polishing liquid temperature measurement system and device in the area. The measurement system and device realize the radial distribution of seven thermocouple temperature sensors along the polishing head. The exposed hot end of the thermocouple temperature sensor directly senses the temperature change of the polishing solution in the processing area through the silicon chip, and the measurement signal is conditioned and amplified. After data conversion and information collection and processing, it is sent to the microprocessor, communicated by NRF905 and EM310 modules, and real-time collection and control are carried out through the interface of the host computer, which realizes the measurement of the temperature change of the polishing liquid in the processing area. The error of the measurement system is less than ±0.47%. Based on the HART protocol, the temperature transmitter is configured and calibrated, and the error of the temperature measurement of the polishing liquid in the silicon wafer chemical mechanical polishing processing area is analyzed, and corresponding measures are taken to reduce the interference and reduce the error. the

Claims (10)

1. the chemically mechanical polishing interface temperature based on wireless transmission detects control system, it is characterized in that comprising transmitting terminal and receiving terminal, described transmitting terminal comprises polishing machine, thermocouple temperature sensor, transmitting terminal lithium ion battery, mill, transmitting terminal circuit case, NRF905 transmitting antenna, transmitting terminal processor reset key, transmitting terminal power switch, described polishing machine top is provided with mill, transmitting terminal lithium ion battery is arranged on the inside of polishing machine, the top of mill is provided with transmitting terminal circuit case, seven groups of thermocouple temperature sensors are radially equipped with respectively along mill in the bottom of the top of mill and transmitting terminal circuit case, the hot junction that thermocouple temperature sensor is exposed is parallel or contour with mill wafer lower surface, and scribble insulating cement in the surrounding of thermocouple temperature sensor, in transmitting terminal circuit case, through circuit board, transmitting terminal control circuit is housed, NRF905 transmitting antenna is equipped with on the top of transmitting terminal circuit case, one side of transmitting terminal circuit case is provided with transmitting terminal power switch and transmitting terminal processor reset key side by side, described receiving terminal comprises receiving terminal circuit shell, receiving terminal power switch, receiving terminal processor reset key, LCDs, EM310 antenna, NRF905 reception antenna, the first communication indicator lamp, the second communication indicator lamp, function of tonic chord button, raise button, lower button, inquiry button, serial ports, receiving terminal lithium ion battery and attaching plug, wherein EM310 antenna and NRF905 reception antenna are contained in the top of receiving terminal circuit shell side by side, LCDs is equipped with in the front portion of receiving terminal circuit shell, the first communication indicator lamp, the second communication indicator lamp, receiving terminal processor reset key, receiving terminal power switch, receiving terminal lithium ion battery, function of tonic chord button, raise button, lower button, inquiry button and serial ports, attaching plug is equipped with in the left side of receiving terminal circuit shell, in receiving terminal circuit shell, through circuit board, receiving terminal control circuit is housed.

2. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described transmitting terminal control circuit comprises temperature collection circuit IC16, clock driver circuit IC22, memory circuit IC21, transmitting terminal 3.3V power circuit IC20, transmitting terminal microprocessor reset circuit IC17, NRF905 radio transmitter IC19, transmitting terminal crystal oscillating circuit IC18, transmitting terminal microprocessor IC23, transmitting terminal microprocessor IC23 respectively with temperature collection circuit IC16, clock driver circuit IC22, memory circuit IC21, transmitting terminal 3.3V power circuit IC20, transmitting terminal microprocessor reset circuit IC17, NRF905 radio transmitter IC19 is connected with transmitting terminal crystal oscillating circuit IC18, 6 pin of a K type thermocouple serial analog-digital converter of described temperature collection circuit IC16, 7 pin are 45 pin of sending and receiving sending end microprocessor IC23 respectively, 46 pin, 6 pin of the 2nd K type thermocouple serial analog-digital converter, 7 pin are 43 pin of sending and receiving sending end microprocessor IC23 respectively, 44 pin, 6 pin of the 3rd K type thermocouple serial analog-digital converter, 7 pin are 41 pin of sending and receiving sending end microprocessor IC23 respectively, 42 pin, 6 pin of the 4th K type thermocouple serial analog-digital converter, 7 pin are 39 pin of sending and receiving sending end microprocessor IC23 respectively, 40 pin, 6 pin of the 5th K type thermocouple serial analog-digital converter, 7 pin are 5 pin of sending and receiving sending end microprocessor IC23 respectively, 38 pin, 6 pin of the 6th K type thermocouple serial analog-digital converter, 7 pin are 3 pin of sending and receiving sending end microprocessor IC23 respectively, 4 pin, 6 pin of the 7th K type thermocouple serial analog-digital converter, 7 pin are 1 pin of sending and receiving sending end microprocessor IC23 respectively, 2 pin, 5 pin of the one K type thermocouple serial analog-digital converter connect the B6 pin of clock driver IC22, 5 pin of the 2nd K type thermocouple serial analog-digital converter connect the B5 pin of clock driver IC22, 5 pin of the 3rd K type thermocouple serial analog-digital converter connect the B4 pin of clock driver IC22, 5 pin of the 4th K type thermocouple serial analog-digital converter connect the B3 pin of clock driver IC22, 5 pin of the 5th K type thermocouple serial analog-digital converter connect the B2 pin of clock driver IC22, 5 pin of the 6th K type thermocouple serial analog-digital converter connect the B1 pin of clock driver IC22, 5 pin of the 7th K type thermocouple serial analog-digital converter connect the B0 pin of clock driver IC22, 52 pin of the A pin sending and receiving sending end microprocessor IC23 of described clock driver IC22, one end of the capacitor C 32 of described transmitting terminal microprocessor reset circuit IC17 and one end earth of transmitting terminal microprocessor reset key SAW2,16 pin of one end sending and receiving sending end microprocessor IC23 of the other end of the other end of capacitor C 32, transmitting terminal microprocessor reset key SAW2 and resistance R 24, the other end sending and receiving sending end 3.3V power supply of resistance R 24, one end of the capacitor C 33 of transmitting terminal crystal oscillating circuit and one end earth of capacitor C 34,9 pin of one end sending and receiving sending end microprocessor IC23 of the other end of capacitor C 33 and crystal oscillator TX3,8 pin of the other end sending and receiving sending end microprocessor IC23 of the other end of capacitor C 34 and crystal oscillator TX3, one end earth of one end of capacitor C 35 and capacitor C 36,12 pin of one end sending and receiving sending end microprocessor IC23 of the other end of capacitor C 35 and crystal oscillator TX4,13 pin of the other end sending and receiving sending end microprocessor IC23 of the other end of capacitor C 36 and crystal oscillator TX4, 13 pin of described NRF905 radio transmitter IC19 and 14 pin earths, 1 pin connects power supply, and 2 pin, 3 pin, 4 pin, 5 pin, 6 pin, 7 pin, 8 pin, 9 pin, 10 pin, 11 pin, 12 pin are 25 pin, 26 pin, 23 pin, 29 pin, 30 pin, 71 pin, 32 pin, 72 pin, 76 pin, 31 pin, 24 pin of sending and receiving sending end microprocessor IC23 respectively, 1 pin of described memory circuit IC21,2 pin, 3 pin, 4 pin and 7 pin earths, 8 pin the joining power of one end of one end of resistance R 25, resistance R 26 and memory circuit IC21,47 pin of the 6 pin sending and receiving sending end microprocessor IC23 of the other end of resistance R 26 and memory circuit IC21,48 pin of the 5 pin sending and receiving sending end microprocessor IC23 of the other end of resistance R 25 and memory circuit IC21, the 19 pin ground connection of transmitting terminal microprocessor IC23,10 pin, 27 pin, 99 pin, 74 pin and 49 pin earths, 22 pin connect power supply, 11 pin, 28 pin, 100 pin, 75 pin and 50 pin joining power, described receiving terminal control circuit comprises receiving terminal 3.3V power circuit IC1, receiving terminal microprocessor reset circuit IC14, SIM seat IC circuit 13, memory circuitry IC2, drive circuit IC8, receiving terminal crystal oscillating circuit IC9, key circuit IC10, receiving and transmitting data signals indicating circuit IC11, SIM seat connecting circuit IC12, NRF905 wireless receiving circuit IC7, liquid crystal display circuit IC15, EM310 power circuit IC5, EM310 IC circuit 4, serial port circuit IC6 and receiving terminal microprocessor IC3, one end of the capacitor C 1 of described receiving terminal microprocessor reset circuit IC14 and one end earth of receiving terminal microprocessor reset key SAW1, the other end of capacitor C 1, 16 pin of the other end of receiving terminal microprocessor reset key SAW1 and a termination receiving terminal microprocessor of resistance R 1, another termination receiving terminal 3.3V power supply of resistance R 1, one end of the resistance R 5 of described drive circuit IC8 and the emitter stage earth of triode Q1, one end of one end of resistance R 4, resistance R 5 is connected with the base stage of triode Q1,68 pin of another termination receiving terminal microprocessor IC3 of resistance R 4, the colelctor electrode of triode Q1 connects 41 pin of EM310 IC circuit 4, 1 pin of described memory circuitry IC2,2 pin, 3 pin, 4 pin and 7 pin earths, 5 pin of one end of resistance R 2 and memory circuitry IC2 are connected 48 pin of receiving terminal microprocessor, 6 pin of one end of resistance R 3 and memory circuitry IC2 connect 47 pin of micro-receiving terminal processor, the other end of resistance R 2 and the other end of resistance R 3 and 8 pin of the receiving terminal microprocessor 3.3V power supply that is connected, one end of capacitor C 2 of described receiving terminal crystal oscillating circuit IC9 is, one end of one end of capacitor C 3, capacitor C 4 and one end earth of capacitor C 5,9 pin of a termination receiving terminal microprocessor of the other end of capacitor C 2 and crystal oscillator TX1,8 pin of another termination receiving terminal microprocessor of the other end of capacitor C 3 and crystal oscillator TX1,12 pin of a termination receiving terminal microprocessor of the other end of capacitor C 4 and crystal oscillator TX2,13 pin of another termination receiving terminal microprocessor of the other end of capacitor C 5 and crystal oscillator TX2, one end of the capacitor C 6 of described key circuit IC10, one end of function of tonic chord button SAW3, one end of capacitor C 7, raise one end of button SAW4, one end of capacitor C 8, lower one end of button SAW5, one end earth of one end of capacitor C 9 and inquiry button SAW6, the other end of capacitor C 6, 84 pin of one termination receiving terminal microprocessor of the other end of function of tonic chord button SAW3 and resistance R 6, the other end of capacitor C 7, raise the other end of button SAW4, 83 pin of one termination receiving terminal microprocessor of resistance R 7, the other end of capacitor C 8, lower 82 pin of the other end of button SAW5 and a termination receiving terminal microprocessor of resistance R 8, the other end of capacitor C 9, the other end of inquiry button SAW6, 81 pin of one termination receiving terminal microprocessor of resistance R 9, the other end of resistance R 6, the other end of resistance R 7, the other end of the other end of resistance R 8 and resistance R 9 also connects receiving terminal 3.3V power supply, one end of the resistance R 12 of receiving and transmitting data signals indicating circuit IC11, the emitter stage of triode Q3, the emitter stage earth of one end of resistance R 15 and triode Q2, one end of resistance R 11, the other end of resistance R 12, the base stage of triode Q3 is connected, 32 pin of another termination EM310 IC circuit 4 of resistance R 11, the colelctor electrode of triode Q3 connects the negative pole of receiving and transmitting data signals indicator lamp LED1 through resistance R 10, the positive pole of receiving and transmitting data signals indicator lamp LED1 connects 5V power supply, one end of resistance R 14, one end of resistance R 15, the base stage of triode Q2 is connected, 13 pin of another termination EM310 IC circuit 4 of resistance R 14, the colelctor electrode of triode Q2 connects the negative pole of receiving and transmitting data signals indicator lamp LED2 through resistance R 13, the positive pole of receiving and transmitting data signals indicator lamp LED2 connects 5V power supply.

3. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 2 detects control system, it is characterized in that: described receiving terminal microprocessor reason IC3 comprises microprocessor and standby lithium battery VBAT, wherein 10 pin of microprocessor, 27 pin, 99 pin, 74 pin, 49 pin and 19 pin earths, 22 pin of microprocessor, 11 pin, 28 pin, 100 pin, 75 pin and 50 pin connect receiving terminal 3.3V power supply, the minus earth of standby lithium battery VBAT, the positive pole of standby lithium battery VBAT connects 6 pin of microprocessor.

4. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: the minus earth of the lithium ion battery Li-ion1 of described transmitting terminal power circuit IC20, the positive pole of lithium ion battery Li-ion1 connects 3 pin of ultra low differential pressure flow straightener U1A through K2, the 2 pin ground connection of ultra low differential pressure flow straightener U1A, 1 pin is power output end, described receiving terminal 3.3V power circuit IC1 comprises ultra low differential pressure flow straightener U14 and battery charger U15, 2 pin of ultra low differential pressure flow straightener U14 and the negative pole of lithium ion battery Li-ion2 also connect ground connection, the positive pole of lithium ion battery Li-ion2 connects respectively one end of K2, 3 pin of battery charger, 5 pin of the linear voltage regulator U13 of EM310 power circuit IC5, 6 pin of the linear voltage regulator U13 of the other end of capacitor C 12 and EM310 power circuit IC5, 7 pin, the minus earth of lithium ion battery Li-ion2, 3 pin of another termination ultra low differential pressure flow straightener U14 of K2, the two ends of 220V attaching plug CT connect respectively 1 pin of battery charger U15, 2 pin.

5. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described temperature collection circuit IC16 comprises seven groups of thermocouple temperature sensors and seven groups of K type thermocouple serial analog-digital converters, the first thermocouple temperature sensor, the second thermocouple temperature sensor, three thermocouple temperature sensor, the 4th thermocouple temperature sensor, the 5th thermocouple temperature sensor, the 6th thermocouple temperature sensor, the two ends of the 7th thermocouple temperature sensor connect respectively a K type thermocouple serial analog-digital converter, the 2nd K type thermocouple serial analog-digital converter, the 3rd K type thermocouple serial analog-digital converter, the 4th K type thermocouple serial analog-digital converter, the 5th K type thermocouple serial analog-digital converter, the 6th K type thermocouple serial analog-digital converter, 2 pin of the 7th K type thermocouple serial analog-digital converter, 3 pin, 4 pin of the one K type thermocouple serial analog-digital converter, 4 pin of the 2nd K type thermocouple serial analog-digital converter, 4 pin of the 3rd K type thermocouple serial analog-digital converter, 4 pin of the 4th K type thermocouple serial analog-digital converter, 4 pin of the 5th K type thermocouple serial analog-digital converter, 4 pin of the 6th K type thermocouple serial analog-digital converter, 4 pin of the 7th K type thermocouple serial analog-digital converter, one end of capacitor C 25, one end of capacitor C 26, one end of capacitor C 27, one end of capacitor C 28, one end of capacitor C 29, one end of one end of capacitor C 30 and capacitor C 31 joining power, the other end of capacitor C 25, the other end of capacitor C 26, the other end of capacitor C 27, the other end of capacitor C 28, the other end of capacitor C 29, the other end of capacitor C 30, the other end of capacitor C 31, 1 pin of the one K type thermocouple serial analog-digital converter, 1 pin of the 2nd K type thermocouple serial analog-digital converter, 1 pin of the 3rd K type thermocouple serial analog-digital converter, 1 pin of the 4th K type thermocouple serial analog-digital converter, 1 pin of the 5th K type thermocouple serial analog-digital converter, 1 pin of the 6th K type thermocouple serial analog-digital converter, 1 pin earth of the 7th K type thermocouple serial analog-digital converter.

6. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described SIM seat connecting circuit IC12 comprises card holder connector SMFI, the 2 pin ground connection of card holder connector SMFI, 3 pin of card holder connector SMFI connect 5V power supply, 4 pin of card holder connector SMFI, 4 pin of EM310 IC circuit 4, one end of R17 is connected, 5 pin of card holder connector SMFI, 1 pin of EM310 IC circuit 4 is connected with one end of resistance R 18, 6 pin of card holder connector SMFI, 3 pin of EM310 IC circuit 4 are connected with one end of resistance R 16, described SIM seat IC circuit 13 comprises sim card socket SIM-SOCKET-8, the 2 pin ground connection of sim card socket SIM-SOCKET-8, one termination 5V power supply of 1 pin of sim card socket SIM-SOCKET-8, capacitor C 10, the other end ground connection of capacitor C 10,3 pin of sim card socket SIM-SOCKET-8 connect the other end of R17,5 pin of sim card socket SIM-SOCKET-8 connect the other end of R18, the other end of the 6 pin connecting resistance R16 of sim card socket SIM-SOCKET-8.

7. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described EM310 IC circuit 4 comprises EM310 processor, 6 pin of EM310 processor, 8 pin, 42 pin, 21 pin, 22 pin, 23 pin, 24 pin, 25 pin, one end of capacitor C 20, one end of capacitor C 21, one end of capacitor C 22, one end earth of one end of capacitor C 23 and capacitor C 24, 30 pin of EM310 processor, 29 pin, 28 pin, the other end of 27 pin and the parallel connection of 26 pin and capacitor C 20, the other end of capacitor C 21, the other end of capacitor C 22, the other end of capacitor C 23, the other end of capacitor C 24 is connected, 2 pin and 31 pin of EM310 processor connect 5V power supply, 15 pin of EM310 processor connect 69 pin of receiving terminal microprocessor through resistance R 19, 17 pin of EM310 processor connect 68 pin of receiving terminal microprocessor through resistance R 20, 40 foot meridian capacitor C11 ground connection of EM310 processor, described EM310 power circuit IC5 comprises linear voltage regulator U13, 6 pin of linear voltage regulator U13, one end of 7 pin and capacitor C 12 also connects the negative pole of lithium ion battery Li-ion2, one end of capacitor C 13, one end of resistance R 21, one end of resistance R 23, one end earth of one end of inductance L 2 and capacitor C 15, 1 pin of the other end of the other end of capacitor C 13 and resistance R 21 tie voltage-stablizer, the other end of resistance R 23 connects 2 pin of linear voltage regulator and one end of resistance R 22, the other end of resistance R 22 connects respectively the other end of capacitor C 15 and the negative pole of diode D2, the positive pole of diode D2 connects respectively the other end of inductance L 2 and one end of capacitor C 14, the other end of capacitor C 14 connects respectively one end of inductance L 1 and 8 pin of linear voltage regulator, the other end of inductance L 1 connects 5 pin of linear voltage regulator, the positive pole of the other end of capacitor C 12 and lithium ion battery Li-ion2.

8. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described serial port circuit IC6 comprises serial ports electrical level transferring chip U9, serial ports female socket J1, the 6 foot meridian capacitor C18 ground connection of serial ports electrical level transferring chip U9, 5 pin of the flat conversion chip of one termination serial port power of capacitor C 19, 4 pin of the flat conversion chip of another termination serial port power of capacitor C 19, 3 pin of the flat conversion chip of one termination serial port power of capacitor C 17, 1 pin of the flat conversion chip of another termination serial port power of capacitor C 17, 2 pin of the flat conversion chip of one termination serial port power of capacitor C 16, 16 pin of the flat conversion chip of another termination serial port power of capacitor C 16, 13 pin of serial ports electrical level transferring chip connect 3 pin of serial ports female socket J1, 14 pin of serial ports electrical level transferring chip connect 2 pin of serial ports female socket J1, 12 pin of serial ports electrical level transferring chip connect 69 pin of receiving terminal microprocessor, 11 pin of serial ports electrical level transferring chip connect 68 pin of receiving terminal microprocessor.

9. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described NRF905 wireless receiving circuit IC7 comprises wireless receiving module, 1 pin of wireless receiving module connects receiving terminal 3.3V power supply, 13 pin of wireless receiving module and 14 pin earths, 2 pin of wireless receiving module, 3 pin, 4 pin, 5 pin, 6 pin, 7 pin, 8 pin, 9 pin, 10 pin, 11 pin and 12 pin connect respectively 25 pin of receiving terminal microprocessor, 26 pin, 23 pin, 29 pin, 30 pin, 71 pin, 32 pin, 72 pin, 76 pin, 31 pin and 14 pin.

10. the chemically mechanical polishing interface temperature based on wireless transmission according to claim 1 detects control system, it is characterized in that: described liquid crystal display circuit IC15 comprises LCD MODULE, 1 pin of LCD MODULE and 16 pin earths, 15 pin of LCD MODULE connect 5V power supply, 2 pin of LCD MODULE and one end of PR1 also connect 5V power supply, the other end ground connection of PR1, 3 pin of the slip termination LCD MODULE of PR1, 4 pin of LCD MODULE, 5 pin, 6 pin, 7 pin, 8 pin, 9 pin, 10 pin, 11 pin, 12 pin, 13 pin and 14 pin connect respectively 86 pin of receiving terminal microprocessor, 87 pin, 88 pin, 55 pin, 56 pin, 57 pin, 58 pin, 59 pin, 60 pin, 61 pin and 62 pin.

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