CN103748975B - Flexible printed wiring board and the manufacture method of this flexible printed wiring board - Google Patents
Flexible printed wiring board and the manufacture method of this flexible printed wiring board Download PDFInfo
- Publication number
- CN103748975B CN103748975B CN201280040897.XA CN201280040897A CN103748975B CN 103748975 B CN103748975 B CN 103748975B CN 201280040897 A CN201280040897 A CN 201280040897A CN 103748975 B CN103748975 B CN 103748975B
- Authority
- CN
- China
- Prior art keywords
- insulating barrier
- flexible printed
- printed wiring
- cladding region
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 69
- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 230000004888 barrier function Effects 0.000 claims abstract description 170
- 238000005253 cladding Methods 0.000 claims abstract description 116
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 22
- 230000001154 acute effect Effects 0.000 claims abstract description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 30
- 238000011161 development Methods 0.000 claims description 17
- 238000013036 cure process Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 5
- 238000006748 scratching Methods 0.000 claims description 2
- 230000002393 scratching effect Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 51
- 239000011347 resin Substances 0.000 description 51
- 238000009826 distribution Methods 0.000 description 18
- 208000037656 Respiratory Sounds Diseases 0.000 description 11
- 238000013461 design Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000012141 concentrate Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000018199 S phase Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0594—Insulating resist or coating with special shaped edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
nullA kind of flexible printed wiring board (10)，It is by substrate layer (11)、Wiring circuit (12a) and insulating barrier (13) are constituted，This insulating barrier (13) is made up of photoresist，In this flexible printed wiring board (10)，There is insulating barrier cladding region (Q1) being coated with by insulating barrier (13) and insulating barrier non-cladding region (Q2) not being coated with by insulating barrier (13)，When observing from the direction vertical with the surface of flexible printed wiring board (10) (H)，Insulating barrier cladding region (Q1) and the boundary line (K1) of insulating barrier non-cladding region (Q2)、The intersecting angle (A1) intersected with the line (T2) representing the side (12a-1) being coated with the wiring circuit (12a) that region (Q1) is coated with by insulating barrier and formed is formed as acute angle to intersecting angle (A4).
Description
Technical field
The present invention relates to the flexible printing of a kind of insulating barrier having and being made up of photoresist
Distributing board and the manufacture method of this flexible printed wiring board.
Background technology
In recent years, about the flexible printing of the inside configuration at the electronic equipment advancing miniaturization
Distributing board, is preferably used the flexible printed wiring board with the characteristic such as flexibility, bendability.
Above-mentioned flexible printed wiring board is generally formed by following part: substrate layer, and it is by insulating
Property resin constitute；Wiring circuit, it is made up of conductive metal, is formed on substrate layer；With
And insulating barrier, it is made up of insulative resin, is coated with substrate layer and wiring circuit.
It addition, in above-mentioned flexible printed wiring board, sometimes make photoresist be coated with base
After sheet material layers and wiring circuit, form insulation through exposure-processed, development treatment, cure process
Layer.
As the prior art of the above-mentioned flexible printed wiring board of expression, there is the most following patent
Document 1.
Patent documentation 1: Japanese Unexamined Patent Publication 10-321993 publication
Summary of the invention
But, as shown in above-mentioned patent documentation 1, formed insulating barrier by photoresist
In flexible printed wiring board, the most do not consider the circuit direction (wiring circuit with wiring circuit
Laying direction) relation, and design the end surface shape of insulating barrier.
Thus, according to the end surface shape of insulating barrier, there is the manufacture at flexible printed wiring board
In stage (specifically, in development treatment and the cure process for forming insulating barrier),
The problem that the claddings such as slight crack are bad is produced in the region forming insulating barrier.
Therefore, the present invention solves above-mentioned the problems of the prior art, it is considered to wiring circuit
The relation in circuit direction (the laying direction of wiring circuit), and design by photoresist structure
The end surface shape of the insulating barrier become.Thus, the problem of the present invention is, it is provided that a kind of flexible
Printing distributing board and the manufacture method of this flexible printed wiring board, it can be effectively prevented
In the fabrication stage of flexible printed wiring board, the region forming insulating barrier produces slight crack etc.
It is coated with bad.
The flexible printed wiring board of the present invention is made up of following part: substrate layer；Wiring circuit,
It is formed on this substrate layer；And insulating barrier, it is made up of photoresist, is coated with institute
State substrate layer and described wiring circuit.Further, the 1st feature of this flexible printed wiring board exists
In, in described flexible printed wiring board, there is the insulating barrier bag being coated with by described insulating barrier
Cover region and the insulating barrier non-cladding region not being coated with, described wiring circuit by described insulating barrier
Be made up of a plurality of, and, between width and the adjacent wiring circuit of wiring circuit between
In every at least some is less than or equal to 20 μm, and described photoresist is 150
DEG C to the temperature atmosphere of 350 DEG C carries out the photosensitive polyimide of heat treated, and,
When observing from the direction vertical with the surface of flexible printed wiring board, described insulating barrier is coated with
The boundary line in region and described insulating barrier non-cladding region is coated with by described insulating barrier with representing
The intersecting angle that the line of the side of the described wiring circuit of region cladding intersects and formed is formed
For acute angle, and this intersecting angle is for being less than 60 degree more than or equal to 30 degree, Er Qiesuo
The boundary line stating insulating barrier cladding region and described insulating barrier non-cladding region is waveform.
The 1st feature according to the invention described above, flexible printed wiring board is made up of following part:
Substrate layer；Wiring circuit, it is formed on this substrate layer；And insulating barrier, it is by photosensitive
Property resin constitute, be coated with described substrate layer and described wiring circuit.Further, in described flexibility
In printing distributing board, there is the insulating barrier cladding region being coated with by described insulating barrier and not by institute
Stating the insulating barrier non-cladding region of insulating barrier cladding, described wiring circuit is made up of a plurality of, and
And, the most a certain in the interval between width and the adjacent wiring circuit of wiring circuit
Individual 20 μm that are less than or equal to, and described photoresist is the temperature at 150 DEG C to 350 DEG C
Degree atmosphere carries out the photosensitive polyimide of heat treated, from flexible printed wiring board
Vertical direction, surface when observing, described insulating barrier cladding region and described insulating barrier non-packet
Cover the boundary line in region and represent by the described wired electric of described insulating barrier cladding region cladding
The intersecting angle that the line of the side on road intersects and formed is formed as acute angle, and this angle of the crossing
Degree is for being less than 60 degree more than or equal to 30 degree, and described insulating barrier cladding region and institute
The boundary line stating insulating barrier non-cladding region is waveform, thereby, it is possible to be effectively prevented
In the fabrication stage of flexible printed wiring board, the region forming insulating barrier produces slight crack etc.
It is coated with bad.Thereby, it is possible to realize manufacturing the flexible printing distribution that efficiency is high, yield rate is high
Plate.
It addition, the 2nd of the flexible printed wiring board of the present invention the is characterised by, send out at above-mentioned
On the basis of the 1st bright feature, described intersecting angle is for being less than more than or equal to 15 degree
90 degree.
The 2nd feature according to the invention described above, the 1st feature in the invention described above is realized
Action effect on the basis of, owing to described intersecting angle is for being less than more than or equal to 15 degree
90 degree, therefore, it is possible to effectively further prevent the fabrication stage at flexible printed wiring board
In, the region forming insulating barrier produces the claddings such as slight crack bad.Thereby, it is possible to realize
Manufacture the flexible printed wiring board that efficiency improves further, yield rate improves further.
It addition, the 3rd of the flexible printed wiring board of the present invention the is characterised by, send out at above-mentioned
On the basis of the 1st or the 2nd bright feature, described intersecting angle is for more than or equal to 30 degree
Less than 60 degree.
The 3rd feature according to the invention described above, in the 1st or the 2nd feature of the invention described above
On the basis of the action effect realized, owing to described intersecting angle is more than or equal to 30
Spend and be less than 60 degree, therefore, it is possible to effectively further prevent at flexible printed wiring board
In fabrication stage, the region forming insulating barrier produces the claddings such as slight crack bad.Thus,
It is capable of manufacturing the flexible printing distribution that efficiency improves further, yield rate improves further
Plate.
It addition, the 4th of the flexible printed wiring board of the present invention the is characterised by, send out at above-mentioned
On the basis of any one feature of 1 bright to the 3rd, described wiring circuit is made up of a plurality of,
Further, in the interval between width and the adjacent wiring circuit of wiring circuit at least certain
One is less than or equal to 20 μm.
The 4th feature according to the invention described above, the invention described above the 1st to the 3rd appoint
On the basis of the action effect that one feature is realized, owing to described wiring circuit is by a plurality of structure
Become, and, in the interval between width and the adjacent wiring circuit of wiring circuit extremely
Some is less than or equal to 20 μm less, can realize wiring circuit therefore, it is possible to produce
Granular and the flexible printed wiring board of high density distribution.
It addition, the 5th of the flexible printed wiring board of the present invention the is characterised by, send out at above-mentioned
On the basis of any one feature of 1 bright to the 4th, described insulating barrier cladding region and institute
The boundary line stating insulating barrier non-cladding region is waveform.
The 5th feature according to the invention described above, the invention described above the 1st to the 4th appoint
On the basis of the action effect that one feature is realized, described insulating barrier cladding region and described
The boundary line in insulating barrier non-cladding region is waveform.Thereby, it is possible to insulating barrier is coated with district
Territory and the boundary line in insulating barrier non-cladding region and the distribution by insulating barrier cladding region cladding
The angle that the side of circuit intersects and formed, on the side of wiring circuit both sides effectively
Be formed as acute angle.Thereby, it is possible to realization manufacture efficiency improves further, yield rate is further
The flexible printed wiring board improved.
It addition, the manufacture method of the flexible printed wiring board of the present invention is to having above-mentioned
The method that the flexible printed wiring board of the 1st bright feature carries out manufacturing.Further, this flexibility print
The 6th of the manufacture method of brush distributing board is characterised by, at least has a following operation: substrate layer
Formation process, in this operation, forms substrate layer；Wiring circuit formation process, in this work
In sequence, described substrate layer forms wiring circuit；And insulating barrier formation process, at this
In operation, after photoresist being coated on described substrate layer and described wiring circuit, warp
Overexposure process, development treatment, cure process, form the insulating barrier cladding being coated with by insulating barrier
Region and the insulating barrier non-cladding region not being coated with by insulating barrier, form work at described wiring circuit
In sequence, with in the interval between width and the adjacent wiring circuit of wiring circuit at least
Some forms a plurality of wiring circuit less than or equal to the mode of 20 μm, and so that
The boundary member in the cladding region non-with described insulating barrier in described insulating barrier cladding region does not produces
Slight crack.As its measure, in described insulating barrier formation process, from flexible printing distribution
When vertical direction, the surface of plate is observed, non-with described insulating barrier cladding region and described insulating barrier
The boundary line in cladding region and expression are by the described wired electric of described insulating barrier cladding region cladding
The intersecting angle that the line of the side on road intersects and formed is acute angle, and this intersecting angle is big
In or equal to 30 degree less than 60 degree, and described insulating barrier is coated with region and described insulation
The boundary line in the non-cladding region of layer becomes corrugated mode, is existed by photosensitive polyimide
The temperature atmosphere of 150 DEG C to 350 DEG C carries out heat treated and forms insulating barrier.
The 6th feature according to the invention described above, the manufacture method of flexible printed wiring board is right
The method that the flexible printed wiring board of the 1st feature with the invention described above carries out manufacturing.And
And, the manufacture method of this flexible printed wiring board at least has following operation: substrate layer is formed
Operation, in this operation, forms substrate layer；Wiring circuit formation process, in this operation,
Described substrate layer is formed wiring circuit；And insulating barrier formation process, in this operation,
After photoresist being coated on described substrate layer and described wiring circuit, at overexposure
Reason, development treatment, cure process, form the insulating barrier cladding region and not being coated with by insulating barrier
The insulating barrier non-cladding region being coated with by insulating barrier, in described wiring circuit formation process, with
In interval between width and the adjacent wiring circuit of wiring circuit at least some is little
In or form a plurality of wiring circuit equal to the mode of 20 μm, and, as in order to described absolutely
The boundary member in cladding region non-with described insulating barrier in edge layer cladding region do not produce slight crack and
The measure taked, in described insulating barrier formation process, from the table with flexible printed wiring board
When vertical direction, face is observed, with described insulating barrier cladding region and described insulating barrier non-cladding district
The boundary line in territory and expression are by the side of the described wiring circuit of described insulating barrier cladding region cladding
The intersecting angle that the line in face intersects and formed is acute angle, and this intersecting angle for more than or etc.
In 30 degree less than 60 degree, and described insulating barrier cladding region and described insulating barrier non-packet
The boundary line covering region becomes corrugated mode, by photosensitive polyimide at 150 DEG C extremely
The temperature atmosphere of 350 DEG C carries out heat treated and forms insulating barrier.Thereby, it is possible to effectively
Prevent in insulating barrier formation process, in insulating barrier cladding region, produce the claddings such as slight crack not
Good.Thereby, it is possible to realize manufacturing the system of the flexible printed wiring board that efficiency is high and yield rate is high
Make method.
The effect of invention
Flexible printed wiring board according to the present invention, it is possible to be effectively prevented and join at flexible printing
In the fabrication stage of line plate, produce in the region forming the insulating barrier being made up of photoresist
The claddings such as raw slight crack are bad.Thereby, it is possible to realize manufacturing the flexibility that efficiency is high, yield rate is high
Printing distributing board.It addition, granular and the high density that can realize wiring circuit can be produced
The flexible printed wiring board of distribution.
It addition, the manufacture method of the flexible printed wiring board according to the present invention, it is possible to effectively
Prevent in insulating barrier formation process, in the region forming the insulating barrier being made up of photoresist
The cladding such as middle generation slight crack is bad.Thereby, it is possible to realize manufacturing efficiency height and high the scratching of yield rate
The manufacture method of property printing distributing board.
Accompanying drawing explanation
Figure 1A is to represent the flexible printed wiring board involved by embodiments of the present invention
Figure, is the overall top view representing flexible printed wiring board.
Figure 1B is the figure representing the flexible printed wiring board involved by embodiments of the present invention,
Be Fig. 4 A a-a line direction want portion's profile.
Fig. 2 is to simplify the flexible printed wiring board represented involved by embodiments of the present invention
The profile of manufacture method.
Fig. 3 is to simplify the flexible printed wiring board represented involved by embodiments of the present invention
The profile of manufacture method.
Fig. 4 A is to simplify the flexible printed wiring board represented involved by embodiments of the present invention
The figure of manufacture method, be to represent, in exposure-processed, pattern mask 20 is arranged in resin bed
Above 13a, this state wants portion's top view.
Fig. 4 B is to simplify the flexible printed wiring board represented involved by embodiments of the present invention
The figure of manufacture method, be to represent the substrate layer after being developed 11, distribution by development treatment
Circuit 12a, resin bed 13a want portion's top view.
Fig. 4 C is to simplify the flexible printed wiring board represented involved by embodiments of the present invention
The figure of manufacture method, be the profile in the b-b line direction of Fig. 4 B.
Fig. 5 be represent flexible printed wiring board involved by embodiments of the present invention want portion
Top view.
Fig. 6 A is to simplify to represent that existing flexible printed wiring board and existing flexible printing are joined
The figure of the manufacture method of line plate, is the vertical view wanting portion representing existing flexible printed wiring board
Figure.
Fig. 6 B is to simplify to represent that existing flexible printed wiring board and existing flexible printing are joined
The figure of the manufacture method of line plate, is the figure of the profile in the c-c line direction representing Fig. 6 A,
It is to show schematically the development treatment in the fabrication stage by existing flexible printed wiring board
And cure process and on resin bed 130a, produce the figure of state of slight crack (crackle).
The explanation of label
10 flexible printed wiring boards
11 substrate layers
12 conductive layers
12a wiring circuit
12a-1 side
13 insulating barriers
13-1 end face
13a resin bed
20 pattern masks
30 exposing units
40 thermmohardening unit
100 flexible printed wiring boards
110 substrate layers
120 conductive layers
120a wiring circuit
120a-1 side
130 insulating barriers
130-1 end face
130a resin bed
A1 intersecting angle
A2 intersecting angle
A3 intersecting angle
A4 intersecting angle
B1 intersecting angle
B2 intersecting angle
B3 intersecting angle
B4 intersecting angle
C1 slight crack
D1 substrate layer formation process
E wiring circuit formation process
F insulating barrier formation process
F1 resin bed formation processes
F2 exposure-processed
F3 cure process
K1 boundary line
K2 boundary member
L width
M height
Q1 insulating barrier cladding region
Q2 insulating barrier non-cladding region
R wiring circuit exposed area
S is spaced
T1 line
T2 line
Detailed description of the invention
With reference to the following drawings, to the flexible printed wiring board involved by embodiments of the present invention
10 and the manufacture method of this flexible printed wiring board 10 illustrate, enter for the present invention
Row understands.But, the following description is only embodiments of the present invention, does not limit right
Content described in claim.
Flexible printed wiring board 10 involved by embodiments of the present invention, as shown in Figure 1B,
It it is the so-called one side flexible printing distribution that only one side at substrate layer 11 arranges wiring circuit 12a
Plate.
It addition, as shown in Figure 1A, it is to have to make wiring circuit 12a expose from insulating barrier 13
The flexible printed wiring board of wiring circuit exposed area R.This wiring circuit exposed area R
Utilize as portion of terminal etc..
Below, with further reference to Fig. 2 to Fig. 5, to involved by embodiments of the present invention
The manufacture method of flexible printed wiring board 10 illustrates, and to flexible printed wiring board 10
It is described in detail.
With reference to Fig. 2 A, by substrate layer formation process D1, formed and be made up of insulative resin
Substrate layer 11.
Additionally, as insulative resin, as long as such as polyimides, polyester etc. are generally made
By forming the material that the insulative resin of the substrate layer of flexible printed wiring board is used, can make
Use any material.
It addition, in particular it is preferred to use the material also in addition to flexibility with high-fire resistance
Material.Such as polyamide-based resin or polyimides, polyamidoimide etc. can be preferably used
Polyimide based resin or PEN.
It addition, as heat-resistant resin, as long as polyimide resin, epoxy resin etc. are logical
The material used frequently as the heat-resistant resin of the substrate layer forming flexible printed wiring board, can
To use any material.
Additionally, the thickness of substrate layer 11 is preferably set to about 5 μm to 50 μm.
Below, with reference to Fig. 2 B, by wiring circuit formation process E, first at substrate layer
Stacking conductive metal on 11 and form conductive layer 12.
This conductive layer 12 can use known forming method to be formed.For instance, it is possible to pass through
Plated conductive metal forming on substrate layer 11 and form (so-called addition (additive) method).
Additionally, as conductive metal foil, it is possible to use copper (Cu).Certainly do not limit
In copper (Cu), as long as usually used as the conduction of the conductive layer forming flexible printed wiring board
The material that property metal forming is used, it is possible to use any material.
Below, with reference to Fig. 2 C, by wiring circuit formation process E, shape on conductive layer 12
Become a plurality of wiring circuit 12a.
More specifically, by etching, the regulation region of conductive layer 12 (is formed without wired electric
The region on road) remove and form wiring circuit 12a.
Additionally, the width L of the wiring circuit 12a shown in Figure 1B is preferably set to 5 μm to 150
About μm.It addition, the interval S between adjacent wiring circuit 12a is preferably set to 5 μm
To 150 μm.Preferred mode is the width L of wiring circuit 12a and adjacent joining
Interval S between line circuit 12a at least any one is set to little more than or equal to 5 μm
In or equal to 20 μm.By forming said structure, it is possible to produce and can realize wiring circuit
The granular of 12a and the flexible printed wiring board of high density distribution.
It addition, the height M of wiring circuit 12a is preferably set to about 5 μm to 35 μm.
Additionally, in the present embodiment, although do not carry out detailed view, but by width L
With interval S is set to same length.
Below, with reference to Fig. 2 D, processed by the resin bed formation of insulating barrier formation process F
F1, makes photoresist be coated on and is formed on the surface of substrate layer 11 and wiring circuit 12a
Resin bed 13a.
More specifically, in the present embodiment, by by aqueous photosensitive polyimide
It is coated in and forms resin bed 13a on the surface of substrate layer 11 and wiring circuit 12a.
Additionally, as aqueous photoresist, be not limited to photosensitive polyimide,
Photonasty epoxylite, photonasty acrylic resin etc. can be used.
Below, by the not shown dried of insulating barrier formation process F, resin bed is made
The solvent evaporation of 13a.
Then, with reference to Fig. 3 A, by exposure-processed F2 of insulating barrier formation process F, use
Exposing unit 30 makes resin bed 13a expose via pattern mask 20.
More specifically, as shown in Figure 4 A, on flexible printed wiring board 10, apparatus is made
Insulating barrier cladding region Q1 (being represented by single dotted broken line) and not having and be coated with by insulating barrier 13
The insulating barrier non-cladding region Q2 being coated with by insulating barrier 13 (mainly makes wiring circuit 12a expose
And form the region of wiring circuit exposed area R) pattern mask 20 of corresponding pattern,
Resin bed 13a is made to expose.
Additionally, in the present embodiment, as shown in Figure 4 A, by the pattern of pattern mask 20
It is shaped so as to insulating barrier cladding region Q1 and the boundary line K1 of insulating barrier non-cladding region Q2
For corrugated pattern form.
More specifically, as shown in Figure 4 B, as in order to insulating barrier cladding region Q1's
The measure that the boundary member K2 of cladding region Q2 non-with insulating barrier does not produces slight crack and takes,
Constitute in the following manner.That is, it is configured to, uses the pattern mask with wave pattern
20 are exposed, and this wave pattern makes hanging down from the surface H with flexible printed wiring board
When straight direction is observed, insulating barrier cladding region Q1 and the limit of insulating barrier non-cladding region Q2
Boundary line K1 (the line T1 of the end face 13-1 of the insulating barrier 13 that expression is subsequently formed) and table
Show the side 12a-1's of the wiring circuit 12a both sides being coated with by insulating barrier cladding region Q1
The intersecting angle A1 that line T2 intersects and formed is formed as acute angle to intersection angle A 4.
Refer to additionally, so-called " boundary member K2 " at this, " from flexible printing distribution
When the direction vertical for surface H of plate is observed, it is coated with district with representing by insulating barrier from boundary line K1
Territory Q1 cladding wiring circuit 12a side 12a-1 line T2 between intersection point start to
Outside the width of wiring circuit 12a about 5 μm in the range of region ".
It addition, so-called " the surface H of flexible printed wiring board " refers to, as Figure 1A, Figure 1B,
Shown in Fig. 5, " face being configured with wiring circuit 12a on flexible printed wiring board 10 ".
As long as it addition, the angle of intersecting angle A1 extremely intersection angle A 4 is formed as acute angle, then
Intersecting angle A1 to intersect angle A 4 can be with the width L of wiring circuit 12a, adjacent
Interval S-phase between wiring circuit 12a the most suitably changes.But it is preferably set to be more than
Or equal to 15 degree less than 90 degree, be more preferably set to be less than more than or equal to 30 degree or etc.
In 60 degree.It addition, be formed at the intersecting angle A1 of the width both sides of wiring circuit 12a
Can be equal angular with intersecting angle A2 (intersecting angle A3 and intersecting angle A4), also
Can be different angles.
It addition, the light exposure of exposure-processed F2, time of exposure can suitably change.But preferably
Light exposure is set to 200mJ/cm2To 1500mJ/cm2Left and right, time of exposure is set to 20 seconds extremely
About 90 seconds.
It addition, pattern mask 20 can be to use eurymeric, any one structure of minus.
It addition, the amplitude of the shape of wave, more specifically wave, cycle etc. can be with
The interval S between the width L of wiring circuit 12a, adjacent wiring circuit 12a fits
Work as change.Additionally, in the present embodiment, it is configured to as shown in Fig. 4 B simplifies, shakes
Width is formed as laterally zygomorphic sine wave, and, at 1 wiring circuit 12a (1 distribution
The width L of circuit 12a) 1 crest of upper configuration, (phase between adjacent wiring circuit 12a
The adjacent interval S between wiring circuit 12a) 1 trough of place's configuration.
Below, in the not shown development treatment of insulating barrier formation process F, will be by exposing
Resin bed 13a development after optical processing F2 exposure.
More specifically, by developer solution by the cladding region non-with insulating barrier of resin bed 13a
Region soluble corresponding for Q2 is removed.
By this process, as shown in Figure 4 B, insulating barrier cladding region Q1 and insulating barrier are formed
Non-cladding region Q2.
Additionally, as developer solution, as long as organic solvent, alkaline aqueous solution etc. are generally used for
The material of the photoresist development of the insulating barrier of flexible printed wiring board will be formed, it is possible to use
Any material.But organic solvent is preferably used, preferably developing time is set to 5 minutes to 15
About minute.
Below, with reference to Fig. 3 B, Fig. 3 C, by the cure process of insulating barrier formation process F
F3, makes the hardening of the resin bed 13a after being developed by development treatment form insulating barrier 13.
More specifically, make not dissolve removal in developing procedure by thermmohardening unit 40
For formed insulating barrier cladding region Q1 resin bed 13a thermmohardening.
Additionally, the condition of thermmohardening can suitably change.But preferably on 150 DEG C to 350 DEG C left sides
In right temperature atmosphere, carry out the heat treated of 30 minutes to about 10 hours.
Additionally, the thickness of insulating barrier 13 is preferably set to about 3 μm to 25 μm.
By via above operation, formed involved by the embodiments of the present invention shown in Fig. 3 C
And flexible printed wiring board 10.More specifically, as it is shown in figure 5, printing from flexibility
When the direction vertical for surface H of brush distributing board 10 is observed, insulating barrier cladding region Q1 is with exhausted
The boundary line K1 of edge layer non-cladding region Q2 and expression are by insulating barrier cladding region Q1 bag
The intersecting angle that the line T2 of the side 12a-1 of the wiring circuit 12a covered intersects and formed
A1 is formed as acute angle to intersection angle A 4.Further, formation has the flexibility of insulating barrier 13
Printing distributing board 10, this insulating barrier 13 has corrugated end face 13-1.
It is various that the flexible printed wiring board 10 formed in the manner described above is arranged in mobile phone etc.
The inside of electronic equipment.
Flexible printing distribution involved by the embodiments of the present invention being made up of said structure
The manufacture method of plate 10 and this flexible printed wiring board 10 realizes following effect.
The pattern mask 20 used in exposure-processed F2 is formed as having corrugated limit
The pattern mask in boundary line K1, this corrugated boundary line K1 makes joining from flexible printing
When the direction vertical for surface H of line plate 10 is observed, insulating barrier cladding region Q1 and insulating barrier
Boundary line K1 (the end face 13 of the insulating barrier 13 that expression is subsequently formed of non-cladding region Q2
The line T1 of-1) and represent by the wiring circuit 12a two of insulating barrier cladding region Q1 cladding
The intersecting angle A1 that the line T2 of the side 12a-1 of side intersects and formed is to intersecting angle
A4 is formed as acute angle.Thereby, it is possible to be effectively prevented in development treatment (not shown) and hard
Change processes in F3, due to the insulating barrier shown in Fig. 4 B, Fig. 4 C be coated with region Q1 with
The boundary member K2 of insulating barrier non-cladding region Q2 produces slight crack (crackle) etc. and wraps
Cover bad.
That is, in development treatment and cure process F3, in resin bed 13a, it may occur that companion
The expansion caused with absorbing developer solution, and the contraction caused with being dried subsequently.For upper
State phenomenon, by intersecting angle A1 is designed as acute angle to intersection angle A 4 such that it is able to
It is effectively prevented particularly at the boundary member of resin bed 13a of insulating barrier cladding region Q1
The contraction that K2 causes with being dried occurs in a plurality of directions, it is possible to prevent at resin bed 13a
Boundary member K2 occur stress concentrate.Thereby, it is possible to be effectively prevented in development treatment,
Slight crack (crackle) is produced at the boundary member K2 of the resin bed 13a of insulating barrier cladding region Q1
Bad Deng cladding.
Further, in cure process F3, for resin bed 13a, body before heating acid imide
Body and there is volume contraction during imidizate.For above-mentioned phenomenon, by by intersecting angle A1
It is designed as acute angle such that it is able to be effectively prevented particularly at insulating barrier bag to intersection angle A 4
Cover the boundary member K2 heat tracing of the resin bed 13a of region Q1 and being contracted in of causing is many
Occur on individual direction, it is possible to prevent from occurring stress to concentrate at the boundary member K2 of resin bed 13a.
Thereby, it is possible to be effectively prevented in cure process F3, insulating barrier cladding region Q1's
The boundary member K2 of resin bed 13a occurs the claddings such as slight crack (crackle) bad.
Therefore, it is possible to realize the system of following flexible printed wiring board and flexible printed wiring board
Make method, i.e. can be effectively prevented in the fabrication stage insulating barrier cladding region Q1's
Resin bed 13a occurs the claddings such as slight crack bad, manufacture efficiency height, yield rate height.
It addition, as it has been described above, be formed as following structure, i.e. consider wiring circuit 12a's
Circuit direction (the laying direction of wiring circuit 12a) and in development treatment and cure process F3
In the action of resin bed 13a and carry out the design (insulating barrier 13 of pattern mask 20
The design of end surface shape).Thus, formation resin bed 13a (insulating barrier 13) is not changed
The material of photoresist itself, only changes design, can prevent from being coated with district at insulating barrier
The boundary member K2 of the resin bed 13a of territory Q1 occurs cladding bad.Thereby, it is possible to low
Cost realizes manufacturing flexible printed wiring board and the flexible printing distribution that efficiency is high, yield rate is high
The manufacture method of plate.
It addition, as shown in Figure 4 A, the pattern form of pattern mask 20 is formed as insulating barrier
The boundary line K1 of cladding region Q1 and insulating barrier non-cladding region Q2 is corrugated pattern
Shape.Thus, in time observing with vertical for the surface H direction of flexible printed wiring board 10,
Easily boundary line K1 can be coated with, by insulating barrier, the wired electric that region Q1 is coated with representing
The intersecting angle A1 best friend that the line T2 of the side 12a-1 of 12a both sides, road intersects and formed
Fork angle A 4 is formed as acute angle.Thereby, it is possible to realize manufacturing the flexibility that efficiency improves further
Printing distributing board and the manufacture method of flexible printed wiring board.
Further, by being configured to, width L and interval S is set to same length, and by ripple
Wave is shaped so as to the laterally zygomorphic sine wave of amplitude, and, at 1 wiring circuit 12a (1
The width L of individual wiring circuit 12a) 1 crest of upper configuration, at adjacent wiring circuit 12a
Between (the adjacent interval S between wiring circuit 12a) place configuration 1 trough, it is thus possible to
Enough angle A 4 of extremely being intersected by intersecting angle A1 are formed as equal angular.Thereby, it is possible to make to
The stress that multiple boundary member K2 of the resin bed 13a of insulating barrier cladding region Q1 apply is equal
Even.Thus, in the case of implementing high density distribution, it is also possible to be effectively prevented at resin bed
Multiple boundary member K2 of 13a occur the claddings such as slight crack (crackle) bad.Therefore, it is possible to
Obtain yield rate height and realize flexible printed wiring board and the flexible printing distribution of high density distribution
The manufacture method of plate.It also is able to become easy it addition, the pattern of pattern mask 20 is formed, energy
Enough realize manufacturing flexible printed wiring board that efficiency improves further and flexible printed wiring board
Manufacture method.
On the other hand, in existing flexible printed wiring board and the manufacture of flexible printed wiring board
In method, the most do not consider the circuit direction (the laying direction of wiring circuit) of wiring circuit
With the action of the resin bed in development treatment and cure process, and carry out pattern mask
Design (design of the end surface shape of insulating barrier).
Such as, there is following flexible printed wiring board 100, as shown in Figure 6A, from scratch
Property printing distributing board 100 vertical for surface H direction when observing, make insulating barrier be coated with region
The boundary line K1 of Q1 and insulating barrier non-cladding region Q2 (represents the end face 130 of insulating barrier 130
The line T1 of-1) form the rectilinear form of inclination.
In said structure, as shown in Figure 6A, although can be by intersecting angle B 1 and intersection
Angle B 3 is formed as acute angle, but intersecting angle B2 and intersecting angle B4 is formed as obtuse angle.
Thus, in development treatment and cure process, with intersecting angle B2 and intersecting angle
The boundary member K2 of resin bed 130a corresponding for B4, cause with being dried is contracted in
Occur in multiple directions.Thus, corresponding with intersecting angle B2 and intersecting angle B4
The boundary member K2 of resin bed 130a occurs stress to concentrate.Therefore, as shown in Figure 6B, tool
Have in development treatment, at the resin bed corresponding with intersecting angle B2 and intersecting angle B4
There is the problem that the claddings such as slight crack (crackle) are bad in the boundary member K2 of 130a.
Further, in cure process, corresponding with intersecting angle B2 and intersecting angle B4
The boundary member K2 of resin bed 130a, cause be contracted in multiple side with imidizate
Upwards occur.Thus, at the resin bed corresponding with intersecting angle B2 and intersecting angle B4
The boundary member K2 of 130a occurs stress to concentrate.Therefore, as shown in Figure 6B, have firmly
During change processes, the resin bed 130a's corresponding with intersecting angle B2 and intersecting angle B4
There is the problem that the claddings such as slight crack (crackle) are bad in boundary member K2.
Additionally, in existing flexible printed wiring board 100, for printing with already described flexibility
Parts that brush distributing board 10 is identical, realize the part of same function, mark the numbering of first 2
And the label that letter is identical, and detailed.
Thus, by using the flexible printed wiring board 10 involved by embodiments of the present invention
And the structure of the manufacture method of flexible printed wiring board 10 such that it is able to it is effectively prevented aobvious
Shadow processes and in cure process F3, on the limit of the resin bed 13a of insulating barrier cladding region Q1
Boundary's part K2 occurs the claddings such as slight crack (crackle) bad.
Therefore, it is possible to realize manufacturing efficiency is high, yield rate is high flexible printed wiring board and scratch
The manufacture method of property printing distributing board.
Additionally, in the present embodiment, flexible printed wiring board 10 is configured to only at base
The one side of sheet material layers 11 has a so-called one side flexible printed wiring board of wiring circuit 12a, but also
Not necessarily it is defined to said structure, it is also possible to be configured to, the two-sided of substrate layer 11, there is distribution
The so-called double-faced flexible printing wiring board of circuit 12a.
It addition, in the present embodiment, it is configured to be formed resin by aqueous photoresist
Layer 13a, but said structure might not be defined to, it is also possible to it is configured to membranaceous photonasty
Resin is attached on substrate layer 11 and wiring circuit 12a.
It addition, in the present embodiment, insulating barrier is coated with region Q1 and the non-cladding of insulating barrier
The boundary line K1 of region Q2 is configured to waveform.But, above-mentioned knot might not be defined to
Structure, as long as in time observing with vertical for the surface H direction of flexible printed wiring board 100,
Boundary line K1 and the wiring circuit 12a both sides represented by insulating barrier cladding region Q1 cladding
The intersecting angle that the line T2 of side 12a-1 intersects and formed can be formed as acute angle, then
It is configured to any shape.
It addition, in the present embodiment, it is configured to by substrate layer 11, conductive layer 12 and insulation
Layer 13 forms flexible printed wiring board 10, but might not be defined to said structure, it is also possible to
It is configured to increase the metallic plates such as stainless-steel sheet and constitute the flexible printed wiring board of flexible portion.
It addition, in the present embodiment, it is configured to the width L of wiring circuit 12a and phase
The adjacent interval S between wiring circuit 12a is set to same length, but might not be defined to
State structure, it is also possible to be configured to width L and interval S is set to different length.
It addition, the shape of flexible printed wiring board 10, the quantity of wiring circuit 12a, distribution
The forming position etc. of circuit exposed area R is also not limited to present embodiment, it is possible to fit
Work as change.
Embodiment
Hereinafter, by embodiment, the present invention will be described in more detail, but the present invention is not
It is defined in the present embodiment.
Make the value of the width L of wiring circuit 12a respectively, between adjacent wiring circuit 12a
The value of interval S, and from the side vertical with the surface H of flexible printed wiring board 10
In time observing, insulating barrier cladding region Q1 and the boundary line of insulating barrier non-cladding region Q2
K1 and expression are by the side 12a of the wiring circuit 12a of insulating barrier cladding region Q1 cladding
The value of the intersecting angle A1 that the line T2 of-1 intersects and formed changes and forms flexible printing
Distributing board, to the boundary member K2 of the resin bed 13a at insulating barrier cladding region Q1 whether
Produce slight crack (crackle) to be observed.Its result illustrates in Table 1.
[table 1]
As can be known from the results of Table 1, by intersecting angle A1 is formed as acute angle (more than or
Equal to 30 degree less than or equal to 60 degree), it is possible to it is effectively prevented and is coated with district at insulating barrier
The boundary member K2 of the resin bed 13a of territory Q1 produces slight crack (crackle).Understand particularly
By the interval S-shaped between the width L and adjacent wiring circuit 12a of wiring circuit 12a
Become trickle in the case of (more than or equal to 18 μm less than or equal to 20 μm), energy
Enough it is effectively prevented and produces at the boundary member K2 of the resin bed 13a of insulating barrier cladding region Q1
Raw slight crack (crackle).
Industrial applicibility
According to the present invention, owing to can be effectively prevented in insulating barrier formation process, formed
The region of the insulating barrier being made up of photoresist occur the claddings such as slight crack bad, therefore,
Industry in the field of the flexible printed wiring board with the insulating barrier being made up of photoresist
Practicality is high.
Claims (2)
1. a flexible printed wiring board, it is made up of following part: substrate layer；Wired electric
Road, it is formed on this substrate layer；And insulating barrier, it is made up of photoresist, is coated with
Described substrate layer and described wiring circuit,
This flexible printed wiring board is characterised by,
In described flexible printed wiring board, there is the insulating barrier bag being coated with by described insulating barrier
Cover region and the insulating barrier non-cladding region not being coated with by described insulating barrier, described wiring circuit by
A plurality of composition, and, in the interval between width and the adjacent wiring circuit of wiring circuit
At least some is less than or equal to 20 μm, and described photoresist is at 150 DEG C extremely
The temperature atmosphere of 350 DEG C carries out the photosensitive polyimide of heat treated, is printing from flexibility
When vertical direction, the surface of brush distributing board is observed, described insulating barrier cladding region and described insulation
The boundary line in the non-cladding region of layer is joined described in the cladding of described insulating barrier cladding region with representing
The intersecting angle that the line of the side of line circuit intersects and formed is formed as acute angle, and this intersection
Angle is for being less than 60 degree more than or equal to 30 degree, and described insulating barrier cladding region and institute
The boundary line stating insulating barrier non-cladding region is waveform.
2. a manufacture method for flexible printed wiring board, it is scratching described in claim 1
The manufacture method of property printing distributing board,
The manufacture method of this flexible printed wiring board is characterised by, at least has a following operation:
Substrate layer formation process, in this operation, forms substrate layer；
Wiring circuit formation process, in this operation, forms wired electric on described substrate layer
Road；And
Insulating barrier formation process, in this operation, is being coated on described base material by photoresist
After on layer and described wiring circuit, through exposure-processed, development treatment, cure process, formed
The insulating barrier cladding region being coated with by insulating barrier and the insulating barrier non-cladding district not being coated with by insulating barrier
Territory,
Further, in described wiring circuit formation process, with the width of wiring circuit and adjacent
Wiring circuit between interval at least some less than or equal to the mode shape of 20 μm
Become a plurality of wiring circuit, as in order to be coated with the non-with described insulating barrier of region at described insulating barrier
The measure that the boundary member in cladding region does not produces slight crack and takes, forms work at described insulating barrier
In sequence, when observing from the direction vertical with the surface of flexible printed wiring board, with described insulation
Layer cladding region and the boundary line in described insulating barrier non-cladding region and expression are by described insulating barrier
The intersecting angle that the line of the side of the described wiring circuit of cladding region cladding intersects and formed is
Acute angle, and this intersecting angle is for being less than 60 degree more than or equal to 30 degree, and described absolutely
The boundary line in edge layer cladding region and described insulating barrier non-cladding region becomes corrugated mode,
Photosensitive polyimide is carried out in the temperature atmosphere of 150 DEG C to 350 DEG C heat treated and shape
Become insulating barrier.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-181133 | 2011-08-23 | ||
| JP2011181133A JP5703525B2 (en) | 2011-08-23 | 2011-08-23 | Flexible printed wiring board and method for manufacturing the flexible printed wiring board |
| PCT/JP2012/069307 WO2013027542A1 (en) | 2011-08-23 | 2012-07-30 | Flexible printed circuit board and method for producing flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103748975A CN103748975A (en) | 2014-04-23 |
| CN103748975B true CN103748975B (en) | 2016-08-24 |
Family
ID=47746293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280040897.XA Active CN103748975B (en) | 2011-08-23 | 2012-07-30 | Flexible printed wiring board and the manufacture method of this flexible printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5703525B2 (en) |
| CN (1) | CN103748975B (en) |
| WO (1) | WO2013027542A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106536384B (en) * | 2014-07-04 | 2019-12-20 | 盖茨优霓塔亚洲有限公司 | Multifunctional belt |
| CN106918938B (en) * | 2017-04-28 | 2020-06-16 | 上海中航光电子有限公司 | Display substrate, manufacturing method thereof and display device |
| JP6959066B2 (en) * | 2017-08-14 | 2021-11-02 | 住友電気工業株式会社 | Flexible printed wiring board |
| CN113474853B (en) * | 2019-02-27 | 2023-04-04 | 住友电工印刷电路株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| JP7569626B2 (en) * | 2020-04-06 | 2024-10-18 | メクテック株式会社 | Flexible printed wiring board with crimp terminals |
| WO2022259425A1 (en) * | 2021-06-09 | 2022-12-15 | 三菱電機株式会社 | Flexible printed board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1427662A (en) * | 2001-12-10 | 2003-07-02 | 日本碍子株式会社 | Flexible distributing board |
| CN1744799A (en) * | 2004-09-01 | 2006-03-08 | 日东电工株式会社 | Wire-laying circuit substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230595A (en) * | 1990-02-05 | 1991-10-14 | Nitto Denko Corp | Flexible printed circuit board |
| JPH04121777U (en) * | 1991-04-19 | 1992-10-30 | 信越ポリマー株式会社 | flexible printed circuit board |
| JP2005268593A (en) | 2004-03-19 | 2005-09-29 | Fujikura Ltd | Printed-wiring board and manufacturing method thereof |
| JP2007279489A (en) | 2006-04-10 | 2007-10-25 | Hitachi Chem Co Ltd | Photosensitive resin composition, method for producing resist pattern, flexible substrate and electronic component |
| EP2091307B1 (en) * | 2006-11-15 | 2011-10-19 | Panasonic Corporation | Circuit board connection structure and circuit board |
-
2011
- 2011-08-23 JP JP2011181133A patent/JP5703525B2/en active Active
-
2012
- 2012-07-30 CN CN201280040897.XA patent/CN103748975B/en active Active
- 2012-07-30 WO PCT/JP2012/069307 patent/WO2013027542A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1427662A (en) * | 2001-12-10 | 2003-07-02 | 日本碍子株式会社 | Flexible distributing board |
| CN1744799A (en) * | 2004-09-01 | 2006-03-08 | 日东电工株式会社 | Wire-laying circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103748975A (en) | 2014-04-23 |
| WO2013027542A1 (en) | 2013-02-28 |
| JP2013045818A (en) | 2013-03-04 |
| JP5703525B2 (en) | 2015-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103748975B (en) | Flexible printed wiring board and the manufacture method of this flexible printed wiring board | |
| KR20170040944A (en) | Flexible Substrate | |
| CN104619122B (en) | A kind of production method of printed circuit board | |
| CN102480846A (en) | Preparation method of flexible substrate and flexible substrate | |
| JP6376637B2 (en) | Manufacturing method of three-dimensional wiring board | |
| CN102196668A (en) | Method for manufacturing circuit board | |
| CN107148157A (en) | A kind of preparation method of PCB | |
| CN101616542A (en) | Soft and hard composite circuit board with strippable protective layer and manufacturing method thereof | |
| CN102156602A (en) | Production process of conductive circuit of capacitive touch screen | |
| CN207435578U (en) | A kind of micropore copper plating device of HDI wiring boards | |
| TWI463927B (en) | Transparent printed circuit board | |
| CN204206610U (en) | aluminum foil circuit board | |
| TWI359631B (en) | ||
| CN203313518U (en) | Flexible circuit board | |
| US9603261B2 (en) | Method for improving coating | |
| CN107835564A (en) | A kind of flexible circuit board and its manufacturing method, electronic equipment | |
| RU2496286C1 (en) | Manufacturing method of flexible relief printed-circuit boards for electronic and electrotechnical equipment | |
| TWM461284U (en) | The jumper for printed wiring board and printed wiring board | |
| JP6511740B2 (en) | Chip-on substrate and method of manufacturing electronic device using the same | |
| CN103079338A (en) | A kind of PCB and electronic device | |
| JP6027819B2 (en) | Printed circuit board | |
| JP6806526B2 (en) | Printed wiring board | |
| CN105704905A (en) | Printed circuit board, electronic equipment and method for manufacturing printed circuit board | |
| CN206775819U (en) | A kind of printed circuit board (PCB) | |
| KR20140005520A (en) | Method for manufacturing printable flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |