CN103730394B - A kind of tool preventing dissipating cover adhesive glue from solidifying shift - Google Patents
A kind of tool preventing dissipating cover adhesive glue from solidifying shift Download PDFInfo
- Publication number
- CN103730394B CN103730394B CN201410015392.9A CN201410015392A CN103730394B CN 103730394 B CN103730394 B CN 103730394B CN 201410015392 A CN201410015392 A CN 201410015392A CN 103730394 B CN103730394 B CN 103730394B
- Authority
- CN
- China
- Prior art keywords
- gland
- base
- dissipating cover
- fixing slide
- cross chute
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 title claims abstract description 24
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 210000004907 gland Anatomy 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 12
- 238000007711 solidification Methods 0.000 description 13
- 230000008023 solidification Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of tool preventing dissipating cover adhesive glue from solidifying shift, including: base, gland and four fixing slide blocks; Being formed with cross chute in the surface of base, the cross section of cross chute is the rectangle installing port installing fixing slide block, and the groove part of the part except rectangle installing port of cross chute is recessed to the sidepiece of base; Base is formed multiple gland installing hole; Gland includes forming the multiple long pin corresponding with gland installing hole at gland body floor; Gland includes the raised platform forming the middle body at gland body floor; Gland includes forming the slide block capacity groove corresponding with cross chute on gland body floor; Four fixing slide blocks are separately mounted in a branch of middle cross chute, and each fixing slide block includes columnar body and is arranged in the fixed block of columnar body both sides. The encapsulation chip being coated with dissipating cover on substrate is disposed on base and is between four fixing slide blocks, and is glanded and covers.
Description
Technical field
The present invention relates to integrated antenna package field, it is more particularly related to a kind of tool preventing dissipating cover adhesive glue from solidifying shift.
Background technology
Development along with semiconductor packaging, electronic product tends to miniaturization, microminiaturization, lightweight, slimming, and I/O terminal number gradually and is continuously increased, traditional encapsulation technology can not meet highdensity demand for development, and flip-chip interconnection technique is high-density packages brings hope.
High-performance package chip, power is high, needs the operating temperature of strict control chip, it usually needs install dissipating cover additional in running, in order to provide mechanical protection for chip, it is to avoid chip sustains damage; Dissipating cover provides approach for chip cooling simultaneously, reduces the operating temperature of high power dissipating chip, improves operation stability.
Fig. 1 schematically shows chip package overall structure. Silicon chip is arranged on substrate, is filled with underfill between silicon chip and substrate, and fin is arranged on silicon chip, is wherein filled with thermal grease conduction between fin and silicon chip, and the end of fin is engaged to substrate by adhesive glue. As it is shown in figure 1, dissipating cover realizes the bonding with substrate by the glue that bonds. Specifically, dissipating cover bonding process mainly includes four big steps: thermal grease conduction distribution, adhesive glue distribution, attachment dissipating cover, cure under pressure. Need to be transferred to solidification case heat-pressure curing after dissipating cover attachment, dissipating cover easily displacement in transfer with solidification process, cause dissipating cover imperfect bonding, not only affect the outward appearance of product, and affect the reliability of product. Therefore, in whole bonding, solidification process, special fixture need to be adopted to ensure, and bonding is good.
When producing in enormous quantities, dissipating cover adhesive glue solidifies the tool product design according to specific dimensions, is only capable of specific dimensions product is used.When chip size changes, solidifying tool cannot reuse. It is to say, existing dissipating cover bonding tool need to be designed according to specific product size, tool throws the increased periods processed production cycle, and tool cannot be general between different size product, cause tool utilization rate relatively low, particularly be pilot, relatively costly.
Summary of the invention
The technical problem to be solved is for there is drawbacks described above in prior art, a kind of dissipating cover bonding General purpose jig is provided, it is applicable to various sizes of dissipating cover bonding process, and can ensure that dissipating cover does not produce skew in transfer and solidification process, it is ensured that dissipating cover bonding is good.
According to the present invention, it is provided that a kind of tool preventing dissipating cover adhesive glue from solidifying shift, it is characterised in that including: base, gland and four fixing slide blocks; Wherein, being formed with cross chute in a surface of base, the cross section of this cross chute is the rectangle installing port for installing fixing slide block, and the groove part of the part except rectangle installing port of cross chute is recessed to the sidepiece of base; Further, base is formed with multiple gland installing hole; Wherein, gland includes forming the multiple long pin corresponding with gland installing hole at gland body floor; Gland includes the raised platform forming the middle body at gland body floor; And, gland includes forming the slide block capacity groove corresponding with cross chute on gland body floor; And wherein, four fixing slide blocks are separately mounted in a branch of middle cross chute, and each fixing slide block includes columnar body and is arranged in the fixed block of columnar body both sides. The encapsulation chip being coated with dissipating cover on substrate is disposed on base and is between four fixing slide blocks, and is glanded and covers.
Preferably, four angles of base are respectively formed with gland installing hole.
Preferably, base has cubic shaped.
Preferably, prevent the tool that dissipating cover adhesive glue solidifies shift from also including being placed on the counterweight at gland top described in.
Fixing slide block is arranged in the sidepiece and being glanded of encapsulation chip and pushes down fixing by the present invention, it is thus possible to carry out size adjustment by fixing slide block, to adapt to the fixing requirement of different size substrate and dissipating cover, and prevent from producing between substrate and dissipating cover the skew of horizontal direction. And, by contacting of the long pin between gland with base, and by the effect of gland upper process platform, it is ensured that do not produce the inclination of vertical direction between dissipating cover and encapsulated core plate base.
Accompanying drawing explanation
In conjunction with accompanying drawing, and by with reference to detailed description below, it will more easily the present invention is had more complete understanding and its adjoint advantage and feature is more easily understood, wherein:
Fig. 1 schematically shows chip package overall structure.
Fig. 2 schematically shows thermal grease conduction and adhesive glue distribution condition.
Fig. 3 schematically shows the top view of the base of the tool preventing dissipating cover adhesive glue solidification shift according to the preferred embodiment of the invention.
Fig. 4 schematically shows the sectional view of the base of the tool preventing dissipating cover adhesive glue solidification shift according to the preferred embodiment of the invention.
Fig. 5 schematically shows the top view of the gland of the tool preventing dissipating cover adhesive glue solidification shift according to the preferred embodiment of the invention.
Fig. 6 schematically shows the sectional view of the gland of the tool preventing dissipating cover adhesive glue solidification shift according to the preferred embodiment of the invention.
Fig. 7 schematically shows the top view of the fixing slide block of the tool preventing dissipating cover adhesive glue solidification shift according to the preferred embodiment of the invention.
Fig. 8 schematically shows the sectional view of the fixing slide block of the tool preventing dissipating cover adhesive glue solidification shift according to the preferred embodiment of the invention.
Fig. 9 schematically shows and fixes the structure chart under the state encapsulating chip by fixing slide block on the base of the tool preventing dissipating cover adhesive glue from solidifying shift according to the preferred embodiment of the invention.
It should be noted that accompanying drawing is used for illustrating the present invention, and the unrestricted present invention. Note, represent that the accompanying drawing of structure is likely to be not necessarily drawn to scale. Further, in accompanying drawing, same or like element indicates same or like label.
Detailed description of the invention
In order to make present disclosure clearly with understandable, below in conjunction with specific embodiments and the drawings, present disclosure is described in detail.
The present invention is by designing dissipating cover bonding General purpose jig, to meet the dissipating cover bonding process of different size chip, it is ensured that dissipating cover solidification process is without skew, and by the control of gland, solidification process is applied certain pressure, it is ensured that dissipating cover bonding is good.
Specifically, prevent the tool that dissipating cover adhesive glue solidifies shift from including according to the preferred embodiment of the invention: base 100, gland 200 and four fixing slide blocks 300.
Wherein, as shown in Figure 3 and Figure 4, one surface of base 100 is formed with cross chute 101, the cross section of this cross chute 101 is the rectangle installing port 104 for installing fixing slide block, and the groove part of the part except rectangle installing port 104 of cross chute 101 is to the sidepiece of base 100 recessed (as shown in reference number 103).
Such as, base 100 has cubic shaped, thus the surface being formed with cross chute 101 of base 100 is square surface.
Further, four angles of base 100 are formed with gland installing hole 102. Though it is shown that the example of four gland installing holes 102, but the number of gland installing hole 102 is not limited to four.
As shown in Figure 5 and Figure 6, gland 200 includes forming multiple (such as, four) the long pin 201 corresponding with gland installing hole 102 at gland body floor. Four long pins 201 can insert gland installing hole 102 respectively so that gland 200 and base 100 can assemble and fixed position.
Gland 200 includes the raised platform 202 forming the middle body at gland body floor; So can pass through raised platform 202 and prop up encapsulation chip, such that it is able to guarantee that dissipating cover does not produce the inclination of vertical direction with encapsulation chip.
And, gland 200 includes forming the slide block capacity groove 203 corresponding with cross chute 101 on gland body floor, so that fixing slide block 300 can be received.
Four fixing slide blocks 300 are separately mounted in a branch of middle cross chute 101, and wherein as shown in Figure 7 and Figure 8, each fixing slide block 300 includes columnar body 301 and is arranged in the fixed block 302 of columnar body 301 both sides.
Wherein, fixed block 302 can be accommodated in the sidepiece shown in reference number 103 recessed in (fixed block 302 of fixing slide block 300 can pass through rectangle installing port 104, and to enter sidepiece recessed. ), so that fixing slide block 300 can fit together with base, and encapsulation chip can be fixed further; From the prominent column-like body part of cross chute 101 then by capacity slide block capacity groove 203, thus base 100, gland 200 and four fixing slide blocks 300 can effectively assemble.
In use, the encapsulation chip that substrate is coated with dissipating cover is disposed on base and is between four fixing slide blocks, and is glanded and covers.
Fig. 9 schematically shows the structure chart under the state preventing the tool that dissipating cover adhesive glue solidifies shift from fixing encapsulation chip according to the preferred embodiment of the invention. As shown in Figure 8, the encapsulation chip (such as, BGA chip bga) of the dissipating cover that bondd is placed in centre in the base, by the fixing chip bga of fixing slide block, can meet the fixing requirement of different size chip. At base upper cover upper press cover, cylindrical pin circular hole of correspondence position on base in gland corner is combined, make the pin of appropriate length, can ensure that when gland and base contacts, coplanarity is better, contacted with dissipating cover by the raised platform in the middle of bottom gland, it can be ensured that do not produce during dissipating cover pressurized. Therefore by the effect with gland of fixing slide block, it is ensured that gland does not offset, do not tilt. The counterweight of constant weight can be placed in gland top, desirable pressure during to regulate solidification, it is ensured that dissipating cover and substrate bonding are good.
Thus, fixing slide block is arranged in the sidepiece and being glanded of encapsulation chip and pushes down fixing by the present invention, it is thus possible to carry out size adjustment by fixing slide block, to adapt to the fixing requirement of different size substrate and dissipating cover, and prevent from producing between substrate and dissipating cover the skew of horizontal direction. And, by contacting of the long pin between gland with base, and by the effect of gland upper process platform, it is ensured that do not produce the inclination of vertical direction between dissipating cover and encapsulated core plate base.
Although it is understood that the present invention discloses as above with preferred embodiment, but above-described embodiment is not limited to the present invention. For any those of ordinary skill in the art, without departing under technical solution of the present invention ambit, all may utilize the technology contents of the disclosure above and technical solution of the present invention is made many possible variations and modification, or be revised as the Equivalent embodiments of equivalent variations. Therefore, every content without departing from technical solution of the present invention, the technical spirit of the foundation present invention, to any simple modification made for any of the above embodiments, equivalent variations and modification, all still falls within the scope of technical solution of the present invention protection.
Claims (4)
1. prevent dissipating cover adhesive glue from solidifying a tool for shift, comprising: base, gland, it is characterised in that also include four fixing slide blocks;
Wherein, being formed with cross chute in a surface of base, the cross section of this cross chute is the rectangle installing port for installing fixing slide block, and the groove part of the part except rectangle installing port of cross chute is recessed to the sidepiece of base; Further, base is formed with multiple gland installing hole;
Wherein, gland includes forming the multiple long pin corresponding with gland installing hole at gland body floor; Gland includes the raised platform forming the middle body at gland body floor; And, gland includes forming the slide block capacity groove corresponding with cross chute on gland body floor;
And wherein, four fixing slide blocks are separately mounted in a branch of cross chute, and each fixing slide block includes columnar body and is arranged in the fixed block of columnar body both sides;
Further, the encapsulation chip that substrate is coated with dissipating cover is disposed on base and is between four fixing slide blocks, and is glanded and covers.
2. the tool preventing dissipating cover adhesive glue from solidifying shift according to claim 1, it is characterised in that be respectively formed with gland installing hole on four angles of base.
3. the tool preventing dissipating cover adhesive glue from solidifying shift according to claim 1 and 2, it is characterised in that base has cubic shaped.
4. the tool preventing dissipating cover adhesive glue from solidifying shift according to claim 1 and 2, it is characterised in that also include the counterweight being placed on gland top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410015392.9A CN103730394B (en) | 2014-01-14 | 2014-01-14 | A kind of tool preventing dissipating cover adhesive glue from solidifying shift |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410015392.9A CN103730394B (en) | 2014-01-14 | 2014-01-14 | A kind of tool preventing dissipating cover adhesive glue from solidifying shift |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103730394A CN103730394A (en) | 2014-04-16 |
| CN103730394B true CN103730394B (en) | 2016-06-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410015392.9A Active CN103730394B (en) | 2014-01-14 | 2014-01-14 | A kind of tool preventing dissipating cover adhesive glue from solidifying shift |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103730394B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2482222Y (en) * | 2001-06-05 | 2002-03-13 | 深圳市中兴通讯股份有限公司上海第二研究所 | Clamp for radiator aluminium base plate |
| CN103367214A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Automatic positioning method for mounting and packaging radiating cover |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040032021A1 (en) * | 2002-08-16 | 2004-02-19 | Wen-Lo Shieh | Structure of a heat dissipation fin |
-
2014
- 2014-01-14 CN CN201410015392.9A patent/CN103730394B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2482222Y (en) * | 2001-06-05 | 2002-03-13 | 深圳市中兴通讯股份有限公司上海第二研究所 | Clamp for radiator aluminium base plate |
| CN103367214A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Automatic positioning method for mounting and packaging radiating cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103730394A (en) | 2014-04-16 |
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| C14 | Grant of patent or utility model | ||
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