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CN103700397B - SRAM memory cell, SRAM memory cell write operation method and SRAM memory - Google Patents

SRAM memory cell, SRAM memory cell write operation method and SRAM memory Download PDF

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CN103700397B
CN103700397B CN201310674701.9A CN201310674701A CN103700397B CN 103700397 B CN103700397 B CN 103700397B CN 201310674701 A CN201310674701 A CN 201310674701A CN 103700397 B CN103700397 B CN 103700397B
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storage unit
sram
power supply
data latch
sram storage
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CN103700397A (en
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赵立新
董小英
俞大立
乔劲轩
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Galaxycore Shanghai Ltd Corp
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Abstract

The invention discloses a kind of SRAM memory cell, SRAM memory cell write operation method and SRAM memory.The SRAM memory cell includes:Data latches, selection control, the first transfer tube and the second transfer tube, the selection control are connected with the power supply of the data latches, and the power supply for controlling the data latches is connected with supply voltage or is connected with ground level.The write operation method includes:Before write operation is carried out to the SRAM memory cell, the SRAM memory cell is reset, the first memory node and the second memory node is discharged to ground level.The present invention can improve the reliability of SRAM memory cell write operation, reduce instantaneous power consumption during write operation.

Description

SRAM存储单元、SRAM存储单元写操作方法及SRAM存储器SRAM storage unit, SRAM storage unit write operation method and SRAM memory

技术领域technical field

本发明涉及半导体技术领域,尤其涉及一种SRAM存储单元、一种SRAM存储单元写操作方法以及一种SRAM存储器。The invention relates to the technical field of semiconductors, in particular to an SRAM storage unit, an SRAM storage unit writing operation method and an SRAM memory.

背景技术Background technique

半导体存储器根据存储数据的方式不同,可分为随机存取存储器(RAM)和只读存储器(ROM)两大类。随机存取存储器(RAM)又可分为静态随机存取存储器(SRAM)和动态随机存取存储器(DRAM)。与DRAM相比,SRAM具有更快的读写速度。而且SRAM不需要周期性刷新存储的信息,其设计和制造相对简单。According to the different ways of storing data, semiconductor memory can be divided into two categories: random access memory (RAM) and read-only memory (ROM). Random access memory (RAM) can be divided into static random access memory (SRAM) and dynamic random access memory (DRAM). Compared with DRAM, SRAM has faster read and write speeds. Moreover, SRAM does not need to periodically refresh the stored information, and its design and manufacture are relatively simple.

存储单元是SRAM存储器中最基本、最重要的组成部分,占据了整个SRAM存储器面积的大部分。存储单元的稳定性决定了存储器的数据可靠性。The storage unit is the most basic and important component of the SRAM memory, occupying most of the entire SRAM memory area. The stability of the storage unit determines the data reliability of the memory.

主流的SRAM存储单元为六晶体管单元(6T)。如图1所示,所述6T存储单元具有对称性,由6个MOS管组成。其中MOS管M1~M4构成两个交叉耦合的反相器,用来锁存存储节点的信号。MOS管M5、M6是传输管,它们在对SRAM存储器进行读/写操作时起到将所述存储单元与位线连接或断开的作用。The mainstream SRAM memory cell is a six-transistor cell (6T). As shown in FIG. 1 , the 6T memory cell is symmetrical and consists of six MOS transistors. Among them, MOS transistors M1~M4 constitute two cross-coupled inverters, which are used to latch storage nodes signal of. The MOS transistors M5 and M6 are transmission transistors, and they play a role of connecting or disconnecting the storage unit with the bit line when performing read/write operations on the SRAM memory.

所述SRAM存储单元一共有3个状态,分别为:读、写和数据保持。The SRAM storage unit has three states in total, namely: read, write and data hold.

读数据时,位线首先被充电至高电平,然后把字线WL充到高电平,使传输管M5/M6导通,存储节点bit/bit_向位线放电,使一根位线电压下降ΔV而另一个位线保持高电平不变,灵敏放大器放大这个电压差ΔV使数据被读出。When reading data, the bit line Firstly, it is charged to a high level, and then the word line WL is charged to a high level, so that the transmission tube M5/M6 is turned on, and the storage node bit/bit_ is directed to the bit line Discharge causes the voltage of one bit line to drop by ΔV while the other bit line remains high, and the sense amplifier amplifies the voltage difference ΔV to read the data.

写数据时,先根据要写的数据将某一根位线预充至高电平,同时另一根位线放电到地电平。然后使字线WL充电至高电平,导通传输管M5/M6,位线向存储节点bit/bit_充放电。这时要保证充/放电电流要大于下/上拉路径电流,使存储节点bit/bit_的电压足以使反相器反转的程度,否则就是一次失败的写入(fail write)。When writing data, first precharge a certain bit line to a high level according to the data to be written, and at the same time discharge the other bit line to a ground level. Then charge the word line WL to a high level, turn on the transfer transistor M5/M6, and charge and discharge the bit line to the storage node bit/bit_. At this time, it is necessary to ensure that the charge/discharge current is greater than the current of the pull-down/pull-up path, so that the voltage of the storage node bit/bit_ is sufficient to reverse the inverter, otherwise it is a failed write (fail write).

现有技术中通过各MOS管的尺寸设计,使各MOS管存在一定的强弱关系以确保数据的成功写入。而一旦各MOS管充放电能力强弱发生改变,则数据仍可能写入错误。In the prior art, through the size design of each MOS transistor, a certain strength relationship exists between each MOS transistor to ensure successful writing of data. Once the charging and discharging capability of each MOS tube changes, the data may still be wrongly written.

发明内容Contents of the invention

本发明所要解决的技术问题是如何提高SRAM存储单元写操作的可靠性。The technical problem to be solved by the invention is how to improve the reliability of the write operation of the SRAM storage unit.

为了解决上述问题,本发明提供了一种SRAM存储单元,包括:In order to solve the above problems, the invention provides a kind of SRAM storage unit, comprising:

数据锁存器,所述数据锁存器包括第一存储节点和第二存储节点;a data latch comprising a first storage node and a second storage node;

选择控制器,所述选择控制器与所述数据锁存器的电源相连,用于控制所述数据锁存器的电源与电源电压相连或者与地电平相连;a selection controller, the selection controller is connected to the power supply of the data latch, and is used to control the power supply of the data latch to be connected to a power supply voltage or to a ground level;

第一传输管,所述第一传输管位于第一位线与所述第一存储节点之间;a first transmission pipe, the first transmission pipe is located between the first bit line and the first storage node;

第二传输管,所述第二传输管位于第二位线与所述第二存储节点之间;a second transmission pipe, the second transmission pipe is located between the second bit line and the second storage node;

所述第一传输管的栅极和所述第二传输管的栅极均与字线相连。Both the gate of the first transfer transistor and the gate of the second transfer transistor are connected to a word line.

可选地,所述选择控制器受控于所述SRAM存储单元的写控制信号,使所述数据锁存器的电源在所述写控制信号有效前与地电平相连,在写控制信号有效时与电源电压相连。Optionally, the selection controller is controlled by the write control signal of the SRAM storage unit, so that the power supply of the data latch is connected to the ground level before the write control signal is valid, and when the write control signal is valid connected to the supply voltage.

可选地,所述选择控制器受控于复位控制信号;所述复位控制信号有效,所述选择控制器使所述数据锁存器的电源与地电平相连,所述复位控制信号无效,所述选择控制器使所述数据锁存器的电源与电源电压相连。Optionally, the selection controller is controlled by a reset control signal; the reset control signal is valid, the selection controller connects the power supply of the data latch to the ground level, and the reset control signal is invalid, The selection controller connects the power supply of the data latch to a supply voltage.

可选地,所述SRAM存储单元为标准6T存储单元;Optionally, the SRAM storage unit is a standard 6T storage unit;

所述数据锁存器包括:第一反相器和第二反相器,所述第一反相器和所述第二反相器交叉耦接;The data latch includes: a first inverter and a second inverter, the first inverter and the second inverter are cross-coupled;

所述第一反相器包括:第一PMOS晶体管和第一NMOS晶体管;The first inverter includes: a first PMOS transistor and a first NMOS transistor;

所述第二反相器包括:第二PMOS晶体管和第二NMOS晶体管;The second inverter includes: a second PMOS transistor and a second NMOS transistor;

所述数据锁存器的电源包括:所述第一PMOS晶体管的源极和所述第二PMOS晶体管的源极。The power supply of the data latch includes: the source of the first PMOS transistor and the source of the second PMOS transistor.

本发明还提供了一种SRAM存储单元写操作方法,适用于上述SRAM存储单元,包括:The present invention also provides a method for writing an SRAM storage unit, which is suitable for the above-mentioned SRAM storage unit, including:

在对所述SRAM存储单元进行写操作之前,对所述SRAM存储单元清零,使所述第一存储节点和所述第二存储节点放电至地电平。Before performing a write operation on the SRAM storage unit, the SRAM storage unit is cleared to discharge the first storage node and the second storage node to ground level.

可选地,所述对所述SRAM存储单元清零包括:Optionally, the clearing the SRAM storage unit includes:

将所述第一位线和所述第二位线与地电平相连;connecting the first bit line and the second bit line to a ground level;

将所述数据锁存器的电源与地电平相连;connecting the power supply of the data latch to the ground level;

将所述字线与电源电压相连。The word line is connected to a supply voltage.

可选地,所述对所述SRAM存储单元进行写操作包括:Optionally, the writing operation to the SRAM storage unit includes:

将所述数据锁存器的电源与电源电压相连;connecting the power supply of the data latch to a supply voltage;

将所述第一位线和所述第二位线载入待写数据。Loading the first bit line and the second bit line with data to be written.

可选地,所述清零至少持续3ns。Optionally, the clearing lasts at least 3 ns.

本发明还提供了一种SRAM存储器,包括:上述SRAM存储单元。The present invention also provides an SRAM memory, including: the above-mentioned SRAM storage unit.

与现有技术相比,本发明的技术方案具有以下优点:Compared with the prior art, the technical solution of the present invention has the following advantages:

本发明在写SRAM存储单元前,先清除原存数据,将SRAM存储单元两个存储节点的电压均降到地电平,使写操作时位线送入的数据不会与原存储节点的数据存在充放电冲突,进而降低写操作时的瞬时功耗,提高SRAM存储器整体的良率。Before writing the SRAM storage unit, the present invention first clears the original stored data, and lowers the voltages of the two storage nodes of the SRAM storage unit to the ground level, so that the data sent by the bit line during the write operation will not be different from the data of the original storage nodes. There is a charge-discharge conflict, thereby reducing the instantaneous power consumption during the write operation and improving the overall yield of the SRAM memory.

附图说明Description of drawings

图1是一种现有技术的SRAM存储单元的结构示意图;Fig. 1 is a structural representation of a prior art SRAM storage unit;

图2是本发明的SRAM存储单元一实施例的结构示意图;Fig. 2 is the structural representation of an embodiment of the SRAM storage unit of the present invention;

图3是本发明的SRAM存储单元写操作方法一实施例的流程示意图;Fig. 3 is the schematic flow chart of an embodiment of the SRAM storage unit write operation method of the present invention;

图4是本发明的SRAM存储单元写操作方法一实施例的时序图。FIG. 4 is a timing diagram of an embodiment of a method for writing an SRAM storage unit according to the present invention.

具体实施方式detailed description

在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本发明内涵的情况下做类似推广,因此本发明不受下面公开的具体实施的限制。In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

其次,本发明利用示意图进行详细描述,在详述本发明实施例时,为便于说明,所述示意图只是实例,其在此不应限制本发明保护的范围。Secondly, the present invention is described in detail by means of schematic diagrams. When describing the embodiments of the present invention in detail, for convenience of explanation, the schematic diagrams are only examples, which should not limit the protection scope of the present invention.

发明人对写入失败的情况进行了分析研究,发现:之所以写入失败,是因为写入过程中可能发生各管的充放电冲突。The inventor has analyzed and studied the failure of writing, and found that the reason for the failure of writing is that the charging and discharging conflicts of each tube may occur during the writing process.

由于写操作时,两根位线总是一高一低。而前一次的写操作使得SRAM存储单元中两个存储节点的电压也保持一高一低。高电平的位线向低电平的存储节点放电时,传输管和数据锁存器中的NMOS管构成一条通路,位线电压被拉低,低电平存储节点电压升高但不足以使另一NMOS管开启。低电平位线被高电平存储节点充电时,PMOS管和传输管形成一条通路,高电平存储节点电压下降至使另一PMOS管导通时,锁存器存储状态切换,写入完成。在这个过程中,有一段时间PMOS、NMOS管同时导通,存在静态电流。而且对6个管子能力强弱要求严格,才能使各管按正确的电流走向依次导通,否则就会写入错误。Due to the write operation, the two bit lines are always one high and one low. The previous write operation keeps the voltages of the two storage nodes in the SRAM storage unit high and low. When the high-level bit line discharges to the low-level storage node, the transmission tube and the NMOS tube in the data latch form a path, the bit line voltage is pulled down, and the low-level storage node voltage rises but not enough to make Another NMOS tube is turned on. When the low-level bit line is charged by the high-level storage node, the PMOS transistor and the transmission tube form a path, and when the voltage of the high-level storage node drops to turn on the other PMOS transistor, the storage state of the latch switches, and the writing is completed. . In this process, for a period of time, the PMOS and NMOS transistors are turned on at the same time, and there is a quiescent current. Moreover, there are strict requirements on the strength of the six tubes, so that each tube can be turned on in sequence according to the correct current direction, otherwise errors will be written.

因此,发明人提供了一种新的写入方法,能有效避免写入过程中的充放电冲突,提高写入可靠性。Therefore, the inventor provides a new writing method, which can effectively avoid the charge-discharge conflict during the writing process and improve the writing reliability.

为了解决背景技术中的技术问题,本发明提供了一种SRAM存储单元。图2是本发明的SRAM存储单元一实施例的结构示意图。如图2所示,本实施例是一个标准6T存储单元,包括:由第一PMOS管M3、第一NMOS管M1、第二PMOS管M4和第二NMOS管M2交叉耦接构成的数据锁存器;第一传输管M5;第二传输管M6及选择控制器S。In order to solve the technical problems in the background technology, the present invention provides an SRAM storage unit. FIG. 2 is a schematic structural diagram of an embodiment of the SRAM storage unit of the present invention. As shown in Figure 2, this embodiment is a standard 6T storage unit, including: a data latch composed of a first PMOS transistor M3, a first NMOS transistor M1, a second PMOS transistor M4, and a second NMOS transistor M2 cross-coupled device; the first transmission pipe M5; the second transmission pipe M6 and the selection controller S.

所述第一PMOS管M3和所述第一NMOS管M1构成第一反相器。所述第二PMOS管M4和所述第二NMOS管M2构成第二反相器。The first PMOS transistor M3 and the first NMOS transistor M1 form a first inverter. The second PMOS transistor M4 and the second NMOS transistor M2 form a second inverter.

第一存储节点bit位于所述第一PMOS管M3的漏极和所述第一NMOS管M1的漏极之间,同时耦接至所述第二PMOS管M4的栅极和所述第二NMOS管M2的栅极之间。The first storage node bit is located between the drain of the first PMOS transistor M3 and the drain of the first NMOS transistor M1, and is coupled to the gate of the second PMOS transistor M4 and the second NMOS between the gates of tube M2.

第二存储节点bit_位于所述第二PMOS管M4的漏极和所述第二NMOS管M2的漏极之间,同时耦接至所述第一PMOS管M3的栅极和所述第一NMOS管M1的栅极之间。The second storage node bit_ is located between the drain of the second PMOS transistor M4 and the drain of the second NMOS transistor M2, and is simultaneously coupled to the gate of the first PMOS transistor M3 and the first NMOS transistor M3. between the gates of tube M1.

所述第一传输管M5位于所述第一存储节点bit与第一位线BL之间。The first transfer transistor M5 is located between the first storage node bit and the first bit line BL.

所述第二传输管M6位于所述第二存储节点bit_与第二位线之间。The second transfer transistor M6 is located between the second storage node bit_ and the second bit line between.

所述第一传输管M5的栅极和所述第二传输管的栅极M6均与字线WL相连。Both the gate of the first transfer transistor M5 and the gate M6 of the second transfer transistor are connected to the word line WL.

所述数据锁存器的电源latch(即所述第一PMOS管M3的源极和所述第二PMOS管M4的源极)连接所述选择控制器S。The power supply latch of the data latch (that is, the source of the first PMOS transistor M3 and the source of the second PMOS transistor M4 ) is connected to the selection controller S.

所述选择控制器S控制所述数据锁存器的电源latch接入电源电压VDD或者接入地电平。The selection controller S controls the power supply latch of the data latch to be connected to the power supply voltage VDD or connected to the ground level.

本实施例中,所述选择控制器S受控于复位控制信号RST。所述复位控制信号RST有效时,开始清零原存数据。具体地,所述第一位线BL和所述第二位线被送入地电平,所述选择控制器S将所述数据锁存器的电源latch与地电平相连,所述字线WL被送入电源电压VDD。所述复位控制信号RST无效时,所述选择控制器S将所述数据锁存器的电源latch与电源电压VDD相连,使新的数据可以写入。本领域技术人员可以理解,本实施例的SRAM存储单元在写入操作前,增加了清零原存数据的步骤,所以,在其他实施例中,所述选择控制器S还可受控于所述SRAM存储单元的写控制信号(图未示),使所述数据锁存器的电源latch在所述写控制信号有效前与地电平相连,在写控制信号有效时与电源电压VDD相连。In this embodiment, the selection controller S is controlled by a reset control signal RST. When the reset control signal RST is valid, the original stored data starts to be cleared. Specifically, the first bit line BL and the second bit line is sent to the ground level, the selection controller S connects the power supply latch of the data latch to the ground level, and the word line WL is sent to the power supply voltage VDD. When the reset control signal RST is invalid, the selection controller S connects the power supply latch of the data latch to the power supply voltage VDD, so that new data can be written. Those skilled in the art can understand that the SRAM storage unit of this embodiment adds a step of clearing the original stored data before the write operation, so in other embodiments, the selection controller S can also be controlled by the The write control signal of the SRAM storage unit (not shown in the figure) connects the power supply latch of the data latch to the ground level before the write control signal is valid, and connects to the power supply voltage VDD when the write control signal is valid.

本实施例的SRAM存储单元能在写操作前,清零原存数据,进而有效避免写入过程中各管间的充放电冲突。The SRAM storage unit of this embodiment can clear the original stored data before the write operation, thereby effectively avoiding the charge-discharge conflict between the tubes during the write process.

需要说明的是,本领域技术人员可以理解,虽然本实施例的SRAM存储单元是标准6T单元,但不应理解为对SRAM存储单元的限定。在其他实施例中,其他类型的SRAM存储单元,比如:4T、8T等,皆适用本发明。It should be noted that those skilled in the art can understand that although the SRAM storage unit in this embodiment is a standard 6T unit, it should not be construed as a limitation on the SRAM storage unit. In other embodiments, other types of SRAM memory cells, such as 4T, 8T, etc., are applicable to the present invention.

相应地,本发明还提供了一种SRAM存储单元写操作方法。图3是本发明的SRAM存储单元写操作方法一实施例的流程示意图。如图3所示,本实施例包括以下步骤:Correspondingly, the present invention also provides a method for writing an SRAM storage unit. FIG. 3 is a schematic flowchart of an embodiment of a method for writing an SRAM storage unit according to the present invention. As shown in Figure 3, this embodiment includes the following steps:

执行步骤101,对SRAM存储单元清零,使第一存储节点和所述第二存储节点放电至地电平。Step 101 is executed to clear the SRAM storage unit, so that the first storage node and the second storage node are discharged to ground level.

具体地,可以先将所述第一位线BL和所述第二位线与地电平相连。再将所述数据锁存器的电源latch与地电平相连,使所述第一存储节点的电压和所述第二存储节点的电压持续下降。最后将所述字线WL与电源电压VDD相连,以导通所述第一传输管M5和所述第二传输管M6。导通后,所述第一位线BL的地电平和所述第二位线的地电平将分别写入所述第一存储节点和所述第二存储节点。Specifically, the first bit line BL and the second bit line can be connected Connect to ground level. Then connect the power supply latch of the data latch to the ground level, so that the voltage of the first storage node and the voltage of the second storage node continue to drop. Finally, the word line WL is connected to the power supply voltage VDD to turn on the first transfer transistor M5 and the second transfer transistor M6. After conduction, the ground level of the first bit line BL and the second bit line The ground levels of will be respectively written into the first storage node and the second storage node.

具体地,所述清零至少持续3ns,以确保所述第一存储节点的电压和所述第二存储节点的电压已降至地电平,原存数据被清零。Specifically, the clearing lasts at least 3 ns to ensure that the voltages of the first storage node and the second storage node have dropped to ground level, and the original stored data is cleared.

之后执行步骤102,对SRAM存储单元进行写操作。Afterwards, step 102 is performed to perform a write operation on the SRAM storage unit.

具体地,可以将所述数据锁存器的电源latch与电源电压VDD相连。接着,将所述第一位线BL和所述第二位线载入待写数据,开始写操作。Specifically, the power supply latch of the data latch may be connected to the power supply voltage VDD. Next, the first bit line BL and the second bit line are loaded with data to be written, and a write operation is started.

本实施例在写操作之前先将原存数据清零,在清零后的写操作过程中不会出现充放电冲突,降低了写入时的瞬时功耗,提高了写入SRAM存储单元的可靠性,进而提高了SRAM存储器整体的良率。In this embodiment, the original stored data is cleared before the write operation, and there will be no charging and discharging conflicts during the write operation after the clearing, which reduces the instantaneous power consumption when writing, and improves the reliability of writing into the SRAM storage unit. performance, thereby improving the overall yield of the SRAM memory.

图4是本发明的SRAM存储单元写操作方法一实施例的时序图。下面结合图4说明图2所示实施例的工作过程。FIG. 4 is a timing diagram of an embodiment of a method for writing an SRAM storage unit according to the present invention. The working process of the embodiment shown in FIG. 2 will be described below in conjunction with FIG. 4 .

对图2所示的SRAM存储单元进行写操作之前,先对所述SRAM存储单元清零。Before performing a write operation on the SRAM storage unit shown in FIG. 2 , the SRAM storage unit is first cleared.

图4虚线a处于SRAM存储单元的清零阶段,所述清零包括:将所述第一位线BL和所述第二位线与地电平相连(图未示)。将数据锁存器的电源latch接地电平(即V(latch)波形)。将字线WL接高电平(即V(WL)波形)。The dotted line a in Fig. 4 is in the clearing stage of the SRAM storage unit, and the clearing includes: connecting the first bit line BL and the second bit line Connect to ground level (not shown). Ground the power supply latch of the data latch to the ground level (that is, the V (latch) waveform). Connect the word line WL to a high level (that is, V (WL) waveform).

图中可见,第一存储节点bit和第二存储节点bit_的电压被迅速降至地电平(即V(bit)波形和V(bit_)波形),原存数据被清零。It can be seen from the figure that the voltages of the first storage node bit and the second storage node bit_ are rapidly dropped to the ground level (that is, V(bit) waveform and V(bit_) waveform), and the original stored data is cleared.

之后,第一存储节点bit和第二存储节点bit_的电压为地电平的状态保持了一端时间后,进入SRAM存档单元的写入阶段。将数据锁存器的电源latch接入高电平,将字线WL接入高电平,第一位线BL和第二位线根据写入的数据分别输入一高一低两个电压(图未示)。最终,要写入的数据在第一存储节点bit和第二存储节点bit_以一高一低的电压形式被存储起来。图4虚线b处示出了写入完成后,第一存储节点bit和第二存储节点bit_的电压。如图所示,第一存储节点bit的电压为低,第二存储节点bit_的电压为高。After that, the voltages of the first storage node bit and the second storage node bit_ are maintained at the ground level for a certain period of time, and then enter the writing phase of the SRAM archive unit. Connect the power latch of the data latch to a high level, connect the word line WL to a high level, and connect the first bit line BL and the second bit line Input two voltages, one high and one low, respectively according to the written data (not shown in the figure). Finally, the data to be written is stored in the form of one high and one low voltage at the first storage node bit and the second storage node bit_. The dotted line b in FIG. 4 shows the voltages of the first storage node bit and the second storage node bit_ after writing is completed. As shown in the figure, the voltage of the first storage node bit_ is low, and the voltage of the second storage node bit_ is high.

本发明还提供了一种SRAM存储器(图未示),包括:上述SRAM存储单元。The present invention also provides an SRAM memory (not shown in the figure), including: the above-mentioned SRAM storage unit.

需要说明的是,本发明可用于众多通用或专用的计算系统环境或配置中。例如:个人计算机、服务器计算机、手持设备或便携式设备、平板型设备、多处理器系统、基于微处理器的系统、置顶盒、可编程的消费电子设备、网络PC、小型计算机、大型计算机、包括以上任何系统或设备的分布式计算环境等。It should be noted that the present invention can be used in many general-purpose or special-purpose computing system environments or configurations. Examples: personal computers, server computers, handheld or portable devices, tablet-type devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, including Distributed computing environment of any of the above systems or devices, etc.

本发明虽然已以较佳实施例公开如上,但其并不是用来限定本发明,任何本领域技术人员在不脱离本发明的精神和范围内,都可以利用上述揭示的方法和技术内容对本发明技术方案做出可能的变动和修改,因此,凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化及修饰,均属于本发明技术方案的保护范围。Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can use the methods disclosed above and technical content to analyze the present invention without departing from the spirit and scope of the present invention. Possible changes and modifications are made in the technical solution. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention, which do not depart from the content of the technical solution of the present invention, all belong to the technical solution of the present invention. protected range.

Claims (9)

1.一种SRAM存储单元,其特征在于,包括:1. A kind of SRAM storage unit, is characterized in that, comprises: 数据锁存器,所述数据锁存器包括存储数据反向的第一存储节点和第二存储节点;a data latch including a first storage node and a second storage node storing data inversion; 选择控制器,所述选择控制器与所述数据锁存器的电源相连,用于控制所述数据锁存器的电源与电源电压相连或者与地电平相连,其中与地电平相连用于在所述第一存储节点和第二存储节点写入数据之前,对两存储节点清零;A selection controller, the selection controller is connected to the power supply of the data latch, and is used to control the power supply of the data latch to be connected to the power supply voltage or to the ground level, wherein the connection to the ground level is used for Before the first storage node and the second storage node write data, clear the two storage nodes; 第一传输管,所述第一传输管位于第一位线与所述第一存储节点之间;a first transmission pipe, the first transmission pipe is located between the first bit line and the first storage node; 第二传输管,所述第二传输管位于第二位线与所述第二存储节点之间;a second transmission pipe, the second transmission pipe is located between the second bit line and the second storage node; 所述第一传输管的栅极和所述第二传输管的栅极均与字线相连。Both the gate of the first transfer transistor and the gate of the second transfer transistor are connected to a word line. 2.根据权利要求1所述的SRAM存储单元,其特征在于,所述选择控制器受控于所述SRAM存储单元的写控制信号,使所述数据锁存器的电源在所述写控制信号有效前与地电平相连,在写控制信号有效时与电源电压相连。2. The SRAM storage unit according to claim 1, wherein the selection controller is controlled by the write control signal of the SRAM storage unit, so that the power supply of the data latch is controlled by the write control signal It is connected to the ground level before it is valid, and is connected to the power supply voltage when the write control signal is valid. 3.根据权利要求1所述的SRAM存储单元,其特征在于,所述选择控制器受控于复位控制信号;所述复位控制信号有效,所述选择控制器使所述数据锁存器的电源与地电平相连,所述复位控制信号无效,所述选择控制器使所述数据锁存器的电源与电源电压相连。3. The SRAM storage unit according to claim 1, wherein the selection controller is controlled by a reset control signal; the reset control signal is effective, and the selection controller makes the power supply of the data latch connected to the ground level, the reset control signal is invalid, and the selection controller connects the power supply of the data latch to the power supply voltage. 4.根据权利要求1所述的SRAM存储单元,其特征在于,所述SRAM存储单元为标准6T存储单元;4. The SRAM storage unit according to claim 1, wherein the SRAM storage unit is a standard 6T storage unit; 所述数据锁存器包括:第一反相器和第二反相器,所述第一反相器和所述第二反相器交叉耦接;The data latch includes: a first inverter and a second inverter, the first inverter and the second inverter are cross-coupled; 所述第一反相器包括:第一PMOS晶体管和第一NMOS晶体管;The first inverter includes: a first PMOS transistor and a first NMOS transistor; 所述第二反相器包括:第二PMOS晶体管和第二NMOS晶体管;The second inverter includes: a second PMOS transistor and a second NMOS transistor; 所述数据锁存器的电源包括:所述第一PMOS晶体管的源极和所述第二PMOS晶体管的源极。The power supply of the data latch includes: the source of the first PMOS transistor and the source of the second PMOS transistor. 5.一种SRAM存储单元写操作方法,适用于权利要求1~4中任一权利要求所述的SRAM存储单元,其特征在于,包括:5. A method for writing an SRAM storage unit, applicable to the SRAM storage unit according to any one of claims 1 to 4, characterized in that it comprises: 在对所述SRAM存储单元进行写操作之前,对所述SRAM存储单元清零,使所述第一存储节点和所述第二存储节点放电至地电平。Before performing a write operation on the SRAM storage unit, the SRAM storage unit is cleared to discharge the first storage node and the second storage node to ground level. 6.根据权利要求5所述的SRAM存储单元写操作方法,其特征在于,所述对所述SRAM存储单元清零包括:6. The SRAM storage unit write operation method according to claim 5, wherein said clearing said SRAM storage unit comprises: 将所述第一位线和所述第二位线与地电平相连;connecting the first bit line and the second bit line to a ground level; 将所述数据锁存器的电源与地电平相连;connecting the power supply of the data latch to the ground level; 将所述字线与电源电压相连。The word line is connected to a supply voltage. 7.根据权利要求5所述的SRAM存储单元写操作方法,其特征在于,所述对所述SRAM存储单元进行写操作包括:7. The SRAM storage unit write operation method according to claim 5, wherein said writing operation to said SRAM storage unit comprises: 将所述数据锁存器的电源与电源电压相连;connecting the power supply of the data latch to a supply voltage; 将所述第一位线和所述第二位线载入待写数据。Loading the first bit line and the second bit line with data to be written. 8.根据权利要求5所述的SRAM存储单元写操作方法,其特征在于,所述清零至少持续3ns。8. The method for writing an SRAM storage unit according to claim 5, wherein the clearing lasts at least 3 ns. 9.一种SRAM存储器,其特征在于,包括:权利要求1~4中任一权利要求所述的SRAM存储单元。9. An SRAM memory, characterized by comprising: the SRAM storage unit according to any one of claims 1-4.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101615424A (en) * 2008-06-26 2009-12-30 台湾积体电路制造股份有限公司 8 t low leakage sram cell
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Family Cites Families (2)

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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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