CN103687449B - Electronic equipment and data center - Google Patents

Abstract

The invention discloses electronic equipment and a data center. The electronic equipment includes a cabinet, a first backplane placed in the cabinet, at least two first single boards, and a first heat dissipation device, wherein the cabinet includes two opposite sides. wall and the back that connects the two side walls; the first back plate is approximately perpendicular to the back and approximately parallel to the side walls; at least two first veneers are plugged on the first surface of the first back plate, and There is a gap between two adjacent first single boards; and, the air inlet or air outlet of the first heat dissipation device faces the gap between two adjacent first single boards. In this way, since the first heat dissipation device can blow air to the first single board along the air duct parallel to the board plane of the first back board, there is basically no air duct resistance at the back board, and the electronic equipment and Data centers can effectively improve the cooling capacity of electronic equipment under forced air cooling.

Description

Electronics and Data Centers

technical field

The invention relates to the field of electronic technology, in particular to an electronic device and a data center that use forced air cooling to dissipate heat.

Background technique

Under the trend of ICT (Information Communication Technology, information communication technology) integration, the bandwidth and speed of electronic equipment continue to increase, and the heat density of electronic equipment is also increasing. This makes it preferable for the electronic equipment adopting the plug-in structure to have a straight air passage, so as to realize forced air cooling. Wherein, the so-called plug-in architecture refers to that a single board in an electronic device is plugged into a backplane.

Generally, in order to realize forced air cooling, as shown in Fig. 1a and Fig. 1b, in the outer frame 1040 of the electronic device: a plurality of veneers 1010 parallel to the horizontal plane are stacked along a direction perpendicular to the horizontal plane; 1020 is located behind the plurality of single boards 1010; the fan 1030 is placed at the front of the single board 1010 or at the rear of the backplane 1020, and as shown in FIG. The hole 1050 forms a straight air passage for blowing air directly to the veneer.

However, as the integration level of the system continues to increase, more and more lines are placed on the backplane 1020 , which inevitably limits the aperture ratio of the backplane 1020 . The limited opening ratio will increase the air duct resistance at the back plate 1020 , thereby reducing the heat dissipation performance of the entire electronic device.

Contents of the invention

In view of this, the technical problem to be solved by the present invention is how to improve the heat dissipation capability of the electronic equipment in the forced air cooling mode as much as possible.

In order to solve the above technical problems, according to the first aspect of the present invention, an electronic device is provided, including a cabinet (140, 240, 340), a first backplane (120, 220, 320, 421), at least two first Single boards (110, 210, 311, 411) and first heat dissipation devices (130, 230, 331, 431), wherein: the first backplane (120, 220, 320, 421), the at least two second A single board (110, 210, 311, 411) and the first heat dissipation device (130, 230, 331, 431) are both arranged in the cabinet; the cabinet includes two opposite side walls (141, 142, 241, 242, 341, 342, 441, 442) and the back (143, 243, 343, 443) connecting the two side walls; the first back plate (120, 220, 320, 421) is approximately perpendicular to the back (143, 243, 343, 443) and approximately parallel to the side walls (141, 142, 241, 242, 341, 342, 441, 442); the at least two first veneers (110, 210, 311, 411) are plugged onto the first surface of the first backplane (120, 220, 320, 421), and two adjacent first single boards (110, 210, 311, 411) with a gap; and the air inlet or outlet of the first heat sink (130, 230, 331, 431) faces the adjacent two first single boards (110, 210, 311, 411) between the gaps.

For the above-mentioned electronic equipment, in a possible implementation manner, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the first heat dissipation device (130, 230, 331, 431) is roughly the same as that of the back (143 , 243, 343, 443) vertically.

For the above-mentioned electronic equipment, in a possible implementation manner, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the first heat dissipation device (130, 230, 331, 431) is roughly the same as the side wall ( 141, 142, 241, 242, 341, 342, 441, 442) in parallel.

For the above electronic device, in a possible implementation manner, the first heat dissipation device (130, 230, 331, 431) includes a plurality of fans.

For the above electronic equipment, in a possible implementation manner, the first heat dissipation device (130, 230, 331, 431) is closer to or closer to the first single board (110, 210, 311, 411) away from the back (143, 243, 343, 443). For example, the first heat dissipation device (130, 230, 331, 431) may be disposed between the first single board (110, 210, 311, 411) and the back (143, 243, 343, 443) . Alternatively, the first heat dissipation device (130, 230, 331, 431) may be disposed on the back (143, 243, 343, 443).

For the above-mentioned electronic equipment, in a possible implementation manner, it further includes a second heat sink (332) and at least two second single boards (312), wherein: the at least two second single boards (312) are plugged into connected to the second surface of the first backplane (320) opposite to the first surface, and there is a gap between two adjacent second single boards (312); the second heat dissipation The air outlet or air inlet of the device (332) faces the gap between two adjacent second veneers (312).

For the above electronic device, in a possible implementation manner, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the second heat sink (332) is approximately perpendicular to the back (343).

For the above electronic device, in a possible implementation manner, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the second heat sink (332) is approximately parallel to the side walls (341, 342).

For the foregoing electronic device, in a possible implementation manner, the second heat dissipation device (332) includes a plurality of fans.

For the above electronic device, in a possible implementation manner, the second heat dissipation device (332) is closer to or farther from the back (343) than the second single board (312). For example, the second heat dissipation device (332) is arranged between the second single board (312) and the back (343). Alternatively, the second heat dissipation device (332) is disposed on the back (343).

For the above-mentioned electronic equipment, in a possible implementation manner, it further includes a partition (451), a second backplane (422), at least two third single boards (412) and a third heat dissipation device (432), wherein : the second backboard (422) is roughly perpendicular to the back (443), and roughly parallel to the side walls (441, 442); the partition (451) is fixed to the first backplane ( 421) and the second backplane (422), and are approximately perpendicular to the back (443) and the sidewalls (441, 442); the at least two third veneers (412) are inserted connected to the first surface of the second backplane (422), and there is a gap between two adjacent third single boards (412); and the air inlet of the third heat sink (432) Or the air outlet faces the gap between two adjacent third veneers (412).

For the above electronic device, in a possible implementation manner, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the third heat dissipation device (432) is approximately perpendicular to the back (443).

For the above electronic device, in a possible implementation manner, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the third heat dissipation device (432) is approximately parallel to the side walls (441, 442).

For the foregoing electronic device, in a possible implementation manner, the third heat dissipation device (432) includes a plurality of fans.

For the above electronic device, in a possible implementation manner, the third heat dissipation device (432) is closer to or farther from the back (443) than the third single board (412). For example, the third heat dissipation device (432) can be arranged between the third single board (412) and the back (443). Alternatively, the third heat dissipation device (432) may be disposed on the back (443).

For the above electronic device, in a possible implementation manner, the partitions (451, 452) are integrally formed with the back (443) and the side walls (441, 442).

For the above electronic device, in a possible implementation manner, the fan is an exhaust fan or an exhaust fan.

In order to solve the above technical problems, according to the second aspect of the present invention, a data center is provided, which includes at least two electronic devices as described above arranged in a determinant, and between two adjacent rows of the electronic devices There is an aisle between.

In the electronic equipment and the data center according to the embodiment of the present invention, because the backplane is parallel to the straight air duct formed between the single board and the heat sink, there is basically no air duct resistance at the backplane, so that the electronic equipment can be effectively improved. The heat dissipation capability of the device under forced air cooling.

Other features and aspects of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the invention and together with the description, serve to explain the principles of the invention.

Figure 1a shows a schematic diagram of an electronic device in the prior art before assembly;

FIG. 1b shows a perspective view of an electronic device in the prior art;

Figure 1c shows a schematic diagram of a backplane in an electronic device of the prior art;

Figure 2a shows a schematic diagram of an electronic device before assembly according to Embodiment 1 of the present invention;

Fig. 2b shows a schematic perspective view of an electronic device according to Embodiment 1 of the present invention;

Fig. 2c shows a top view of an electronic device according to Embodiment 1 of the present invention;

Figure 2d shows a front view of the electronic device according to Embodiment 1 of the present invention;

Figure 3a shows a schematic diagram of an electronic device before assembly according to Embodiment 2 of the present invention;

Fig. 3b shows a schematic perspective view of an electronic device according to Embodiment 2 of the present invention;

Fig. 3c shows a top view of an electronic device according to Embodiment 2 of the present invention;

Figure 3d shows a front view of an electronic device according to Embodiment 2 of the present invention;

Figure 4a shows a schematic diagram of an electronic device before assembly according to Embodiment 3 of the present invention;

Fig. 4b shows a schematic perspective view of an electronic device according to Embodiment 3 of the present invention;

Fig. 4c shows a top view of an electronic device according to Embodiment 3 of the present invention;

Figure 4d shows a front view of an electronic device according to Embodiment 3 of the present invention;

Fig. 5a shows a schematic perspective view of an electronic device according to Embodiment 4 of the present invention;

Figure 5b shows a front view of an electronic device according to Embodiment 4 of the present invention;

Fig. 5c shows a top view of an electronic device according to Embodiment 4 of the present invention.

detailed description

Various exemplary embodiments, features, and aspects of the invention will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

In addition, in order to better illustrate the present invention, numerous specific details are given in the specific embodiments below. It will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, means, components and circuits are not described in detail so as to highlight the gist of the present invention.

As described in the Background and Summary of the Invention, for the plug-in architecture where the single board is plugged into the backplane, a straight air channel for forced air cooling of the single board is formed by opening holes at the backplane. The air duct resistance at the plate is large, which becomes the main bottleneck of efficient heat dissipation. In view of this, the inventor of the present invention proposes to form a straight air passage parallel to the plane of the backplane between the single board and the heat sink, so that there is basically no air passage resistance at the backplane, so that the electronic equipment can be effectively improved. Heat dissipation capacity under forced air cooling.

For example, an electronic device according to an embodiment of the present invention includes a cabinet, a backplane disposed in the cabinet, at least two first single boards, and a first heat dissipation device, wherein: the cabinet includes oppositely arranged Two side walls and the back connecting the two side walls; the back plate is perpendicular to the back and parallel to the side walls; the at least two first veneers are plugged into the back plate on the first surface, and there is a gap between two adjacent first veneers; and the air inlet or air outlet of the first heat dissipation device faces the void.

Taking the case where the backplane is located on the left side, the right side and the middle part of the cabinet respectively in a manner perpendicular to the horizontal plane as an example, the specific implementation of the above inventive concept of the present invention is described in detail as follows.

Fig. 2a shows a schematic diagram of an electronic device according to Embodiment 1 of the present invention before assembly. Fig. 2b shows a schematic perspective view of an electronic device according to Embodiment 1 of the present invention. Fig. 2c shows a top view of an electronic device according to Embodiment 1 of the present invention. Fig. 2d shows a front view of an electronic device according to Embodiment 1 of the present invention.

As shown in FIGS. 2 a to 2 d , the electronic device 100 mainly includes a cabinet 140 , a first backplane 120 , at least two first single boards 110 and a first heat dissipation device 130 .

Wherein, as shown in FIGS. 2c and 2d , the cabinet 140 includes two side walls 141 , 142 disposed opposite to each other and a back 143 connecting the two side walls 141 , 142 . In a possible implementation manner, the cabinet 140 may be a frame structure or a frame-cabinet integrated structure.

As shown in FIGS. 2 a to 2 d , the first backplane 120 is located on the right side of the cabinet 140 in such a way that the plane of the board is perpendicular to the horizontal plane. Moreover, as shown by the arrow in FIG. 2 a , the first backplane 120 can be disposed in the cabinet 140 by moving backward. Wherein, the left-hand side when the user faces the front of the cabinet 140 is called the left side, and the right-hand side when the user faces the front of the cabinet 140 is called the right side.

As shown in FIGS. 2 a to 2 d , the first single board 110 is plugged onto the first surface, eg, the left side surface, of the first backplane 120 in such a manner that the plane of the board is parallel to the horizontal plane. In a possible implementation manner, the first veneers 110 can be stacked parallel to each other as shown in FIG. 2a, FIG. 2b and FIG. Helps dissipate heat. Wherein, the side farther away from the back 143 of the first veneer 110 of the cabinet 140 is called the front side of the first veneer 110, and the side nearer the first veneer 110 and the back 143 of the cabinet 140 is called the front side of the first veneer 110. is the rear side of the first veneer 110 .

Moreover, as shown by the arrows in FIG. 2a, each first veneer 110 can be connected to the first backplane 120 by moving backward and to the right, that is, the first veneer 110 can pass through a two-dimensional straight line in the horizontal plane. The movement completes the plugging and unplugging of the first backplane 120 . It should be noted that the plugging and unplugging of the first single board 110 to the first backplane 120 may be but not limited to a two-dimensional linear motion, and the two dimensions may be but not limited to two mutually perpendicular directions.

As shown in FIGS. 2 a to 2 c , the first heat dissipation device 130 is located on the rear side of the first single board 110 . In a possible implementation manner, the first heat dissipation device 130 may be disposed on the back 143 of the cabinet 140 , for example, embedded in a through space opened on the back 143 . Moreover, the air inlet or air outlet of the first heat dissipation device 130 faces the gap between two adjacent first single boards 110 . In other words, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the first heat sink 130 is approximately perpendicular to the back 143 and approximately parallel to the side walls 141, 142, so that as shown by the arrows in FIG. 130 can blow air toward the first single board 110 along the air duct parallel to the plane of the first backplane 120 .

In another possible implementation manner, the heat dissipation device 130 may be located on the front side of the first single board 110 . In addition, the first cooling device 130 may be a fan such as an exhaust fan, an exhaust fan, or other devices capable of generating forced air pressure. In fact, the present invention does not further limit the location of the cooling device 130 and the form of blowing, as long as the cooling device 130 can blow air to the first single board 110 along the air duct parallel to the board plane of the first backplane 120 .

In a possible specific implementation manner, a plurality of cooling devices 130 can be arranged in a specific manner in a matrix as shown in FIG. .

In this way, in the forced air cooling mode, since a straight air passage can be formed between the first single board 110 and the first heat sink 130, and the board plane of the first backplane 120 is parallel to the air passage, the first backplane 120 Basically, there will be no resistance to the straight air passage, so that the heat dissipation capability of the electronic device 100 can be effectively improved. Experimental data show that, compared with the prior art, the heat dissipation capability of the electronic device 100 according to the above-mentioned embodiments of the present invention is increased by more than 30%.

Fig. 3a shows a schematic diagram of an electronic device before assembly according to Embodiment 2 of the present invention. Fig. 3b shows a schematic perspective view of an electronic device according to Embodiment 2 of the present invention. Fig. 3c shows a top view of an electronic device according to Embodiment 2 of the present invention. Fig. 3d shows a front view of an electronic device according to Embodiment 2 of the present invention. Wherein, components with similar numbers in FIGS. 3a-3d and those in FIGS. 2a-2d have the same functions and will not be repeated here.

As shown in FIGS. 3a to 3d , the main difference between the electronic device 200 and the electronic device 100 shown in FIGS. 2a to 2d is that the first backplane 220 is located on the left side of the the right side of the backboard 220 .

Similar to the electronic device 100 shown in FIGS. 2a to 2d, since the board plane of the first backplane 220 is parallel to the straight air duct formed between the first single board 210 and the first heat sink 230, the electronic device 200 Compared with the prior art, the heat dissipation capability is also greatly improved.

Fig. 4a shows a schematic diagram of an electronic device before assembly according to Embodiment 3 of the present invention. Fig. 4b shows a schematic perspective view of an electronic device according to Embodiment 3 of the present invention. Fig. 4c shows a top view of an electronic device according to Embodiment 3 of the present invention. Fig. 4d shows a front view of an electronic device according to Embodiment 3 of the present invention. Components with similar numbers in FIGS. 4a-4d and those in FIGS. 2a-2d and 3a-3d have the same functions and will not be repeated here.

As shown in Figures 4a to 4d, the main difference between the electronic equipment 300 and the electronic equipment shown in Figures 2a to 2d and Figures 3a to 3d is that the first backplane 320 in the electronic equipment 300 is located And the electronic device 300 further includes a second heat sink 332 and at least two second single boards 312 .

On the one hand, the first single board 311 is plugged into the first surface of the first backplane 320 , for example, the left side surface, that is, the first single board 311 is located on the left side of the first backplane 320 . There is a gap between two adjacent first veneers 311 . In a possible implementation manner, as shown in FIGS. 4 a to 4 c , the first heat dissipation device 331 is located on the rear side of the first single board 311 . Moreover, the air outlet or the air inlet of the first heat dissipation device 331 faces the gap between two adjacent first single boards 311 . In other words, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the first heat sink 331 is approximately perpendicular to the back 343 and approximately parallel to the side walls 341, 342, so that as shown by the arrows in FIG. 331 can blow air toward the first single board 311 along the air duct parallel to the board plane of the first back board 320 .

On the other hand, the second single board 312 is plugged into the second surface of the first backplane 320 , for example, the right side surface, that is, the second single board 312 is located on the right side of the first backplane 320 . Wherein, the second surface of the first backplane 320 is another plane opposite to the first surface of the first backplane 320 . There is a gap between two adjacent second veneers 312 . In a possible implementation manner, as shown in FIGS. 4 a to 4 c , the second heat sink 332 is located on the rear side of the second single board 312 . In addition, the air outlet or air inlet of the second heat sink 332 faces the gap between two adjacent second single boards 312 . In other words, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the second heat sink 332 is approximately perpendicular to the back 343 and approximately parallel to the side walls 341, 342, so that as shown by the arrows in FIG. 332 can blow air toward the second single board 312 along the air duct parallel to the board plane of the first back board 320 .

In this way, as shown in FIG. 4b, the air ducts used in the electronic device 300 to realize forced air cooling include: a first air duct located on the left side of the first backplane 320, and a second air duct located on the right side of the first backplane 320. road. Wherein, both the first air duct and the second air duct are parallel to the plate plane of the first back plate 320 .

It should be noted that the wind directions of the first air duct and the second air duct may be the same or different. The first heat dissipation device 331 and the second heat dissipation device 332 can be located on the same side or different sides of the first veneer 311 and the second veneer 312 respectively, as long as they are respectively along the first air duct and the second air duct toward the first unit. The board 311 and the second single board 312 only need to be blown. In a possible implementation manner, the first heat dissipation device 331 and the second heat dissipation device 332 may be integrated. In a possible specific implementation manner, the first heat dissipation device 331 and/or the second heat dissipation device 332 may be a fan wall.

Similar to the electronic device 100 shown in FIGS. 2a-2d and the electronic device 200 shown in FIGS. The straight air passages between the second single board 312 and the second heat dissipation device 332 are parallel, so that the heat dissipation capability of the electronic device 300 is greatly improved compared with the prior art.

Fig. 5a shows a schematic perspective view of an electronic device according to Embodiment 4 of the present invention. Fig. 5b shows a front view of an electronic device according to Embodiment 4 of the present invention. Fig. 5c shows a top view of an electronic device according to Embodiment 4 of the present invention. Components with similar numbers in FIGS. 5a to 5c as those in FIGS. 2a to 2d, 3a to 3d, and 4a to 4d have the same functions.

As shown in FIGS. 5a to 5c, the main difference between the electronic device 400 and the electronic devices shown in FIGS. , so that the entire cabinet can be divided into multiple structures as shown in FIGS. 2a to 2d, 3a to 3d, and 4a to 4d.

Specifically, as shown in FIGS. 5 a to 5 c , the partition 451 is fixed between the first backplane 421 and the second backplane 422 , and is substantially perpendicular to the back 443 of the cabinet and the side walls 441 and 442 of the cabinet. In this way, on the top of the partition 451, the following structure can be formed: the first backplane 421 is roughly perpendicular to the back 443 of the cabinet, and is roughly parallel to the side walls 441, 442 of the cabinet; at least two first single boards 411 are plugged On the right side surface of the first backplane 421, there is a gap between two adjacent first single boards 411; and, as shown in FIG. The gap between the two first veneers 411. In other words, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the first heat sink 431 is approximately perpendicular to the back 443 and approximately parallel to the side walls 441, 442, so that as shown by the arrows in FIG. 431 can blow air toward the first single board 411 along the air duct parallel to the board plane of the first back board 421 .

On the other hand, between the partition board 451 and the partition board 452, the following structure can be formed: the second backplane 422 is roughly perpendicular to the back 443 of the cabinet, and is roughly parallel to the side walls 441, 442 of the cabinet; The two single boards 412 are inserted on the right side surface of the second backplane 422, and there is a gap between two adjacent second single boards 412; and, as shown in FIG. 5a, the air inlet of the second heat sink 432 Or the air outlet faces the gap between two adjacent second veneers 412 . In other words, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the second heat sink 432 is approximately perpendicular to the back 443 and approximately parallel to the side walls 441, 442, so that as shown by the arrows in FIG. 432 can blow air toward the second single board 412 along the air duct parallel to the board plane of the second back board 422 .

On the other hand, in the lower part of the partition 452, the following structure can be formed: the third backplane 423 is roughly perpendicular to the back 443 of the cabinet, and is roughly parallel to the side walls 441, 442 of the cabinet; at least two third single boards 413 Inserted on the right side surface of the third backplane 423, and there is a gap between two adjacent third single boards 413; and, as shown in Figure 5a, the air inlet or air outlet of the third heat sink 433 faces The gap between two adjacent third veneers 413 . In other words, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the third heat sink 433 is approximately perpendicular to the back 443 and approximately parallel to the side walls 441, 442, so that as shown by the arrows in FIG. 433 can blow air toward the third single board 413 along the air duct parallel to the board plane of the third back board 423 .

It should be noted that, although the space divided by the partition board is explained above by using the structure of the backplane on the left side and the single board on the right side as shown in Figure 3a to Figure 3d as an example, those skilled in the art should be able to understand that, In the case of using partitions, the space divided by the partitions in the cabinet can choose any structure explained according to the above-mentioned embodiments of the present invention, as long as the structure adopted can form a connection between the single board and the heat sink. The plane of the plate is parallel to the straight air duct, so that there is basically no air duct resistance at the back plate.

In addition, although the above is explained by taking two partitions as an example, those skilled in the art should understand that the present invention is not limited thereto. In fact, it is completely possible to flexibly choose whether to use partitions and use several partitions to reasonably divide the space in the cabinet according to the application scenario and the actual backplane and single-board wiring requirements.

In a possible implementation manner, the partitions 451 and 452 are integrally formed with the back 443 of the cabinet and the side walls 441 and 442 of the cabinet.

It should be noted that the first heat sink 431, the second heat sink 432, and the third heat sink 433 can be located on the same side or different sides of the first single board 411, the second single board 412, and the third single board 413, as long as It is sufficient to blow air to the first veneer 411 , the second veneer 412 , and the third veneer 413 along air ducts respectively parallel to the planes of the back panels 421 , 422 , and 423 . In a possible implementation manner, any two or more of the first heat dissipation device 431 , the second heat dissipation device 432 and the third heat dissipation device 433 may be integrated. In a possible specific implementation manner, any one or more of the first heat dissipation device 431 , the second heat dissipation device 432 and the third heat dissipation device 433 may be a fan wall.

According to another aspect of the present invention, there is also provided a data center including at least two of any one of the above-mentioned electronic devices. In a possible implementation manner, the electronic equipment in the data center is arranged in rows and rows, and there is an aisle with a predetermined width between two adjacent rows of electronic equipment, so as to ensure sufficient cooling space.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (22)

1. An electronic device, comprising a cabinet (140, 240, 340), a first backplane (120, 220, 320, 421) and at least two first single boards (110, 210, 311, 411), the The first backplane (120, 220, 320, 421) and the at least two first single boards (110, 210, 311, 411) are arranged in the cabinet, characterized in that, The electronic equipment also includes a first heat dissipation device (130, 230, 331, 431), The cabinet includes two opposite side walls (141, 142, 241, 242, 341, 342, 441, 442) and a back (143, 243, 343, 443) connecting the two side walls, the The back (143, 243, 343, 443) has a through space; The first back panel (120, 220, 320, 421) is approximately perpendicular to the back (143, 243, 343, 443) and approximately perpendicular to the side walls (141, 142, 241, 242, 341, 342 , 441, 442) parallel; The at least two first single boards (110, 210, 311, 411) are plugged on the first surface of the first backplane (120, 220, 320, 421), and the adjacent two gaps between the first veneers (110, 210, 311, 411); and The air inlet or outlet of the first heat dissipation device (130, 230, 331, 431) faces the gap between two adjacent first single boards (110, 210, 311, 411), Wherein, the air inlet direction of the air inlet or the air outlet direction of the first heat dissipation device (130, 230, 331, 431) is approximately perpendicular to the back (143, 243, 343, 443); The air inlet direction of the air inlet or the air outlet direction of the first heat dissipation device (130, 230, 331, 431) is roughly the same as the side wall (141, 142, 241, 242, 341, 342, 441, 442) parallel; Formed between the first single board (110, 210, 311, 411) and the first heat sink (130, 230, 331, 431) Straight air ducts parallel to the plate plane. 2. The electronic device according to claim 1, characterized in that, the first heat dissipation device (130, 230, 331, 431) comprises a plurality of fans. 3. The electronic device according to claim 1 or 2, characterized in that, compared with the first single board (110, 210, 311, 411), the first heat dissipation device (130, 230, 331, 431) closer to or further from the back (143, 243, 343, 443). 4. The electronic device according to claim 3, characterized in that, the first heat dissipation device (130, 230, 331, 431) is arranged on the first single board (110, 210, 311, 411) and the between the backs (143, 243, 343, 443). 5. The electronic device according to claim 3, characterized in that, the first heat dissipation device (130, 230, 331, 431) is arranged in the open space of the back (143, 243, 343, 443) superior. 6. The electronic device according to claim 1, characterized in that, The electronic equipment also includes a second heat dissipation device (332) and at least two second single boards (312), The at least two second single boards (312) are inserted on the second surface of the first backplane (320) opposite to the first surface, and the two adjacent second single boards (312) have gaps between them; The air outlet or air inlet of the second heat sink (332) faces the gap between two adjacent second single boards (312). 7. The electronic device according to claim 6, characterized in that, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the second heat sink (332) is substantially perpendicular to the back (343). 8. The electronic device according to claim 6, characterized in that, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the second heat dissipation device (332) is roughly the same as that of the side walls (341, 342) parallel. 9. The electronic device according to claim 6, characterized in that, the second heat dissipation device (332) comprises a plurality of fans. 10. The electronic device according to any one of claims 6 to 9, characterized in that, the second heat sink (332) is closer to or farther from the back than the second single board (312) (343). 11. The electronic device according to Claim 10, characterized in that, the second heat dissipation device (332) is disposed between the second single board (312) and the back (343). 12. The electronic device according to Claim 10, characterized in that, the second heat dissipation device (332) is disposed on the back (343). 13. The electronic device according to claim 1, further comprising a partition (451), a second backplane (422), at least two third single boards (412) and a third heat sink (432) ,in: The second back plate (422) is substantially perpendicular to the back (443) and substantially parallel to the side walls (441, 442); The partition (451) is fixed between the first backboard (421) and the second backboard (422), and is connected to the back (443) and the side walls (441, 442). roughly vertical; The at least two third veneers (412) are inserted on the first surface of the second backplane (422), and there is a gap between two adjacent third veneers (412); as well as The air inlet or outlet of the third heat dissipation device (432) faces the gap between two adjacent third single boards (412). 14. The electronic device according to claim 13, characterized in that, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the third heat dissipation device (432) is substantially perpendicular to the back (443). 15. The electronic device according to claim 13, characterized in that, the air inlet direction of the air inlet or the air outlet direction of the air outlet of the third heat dissipation device (432) is roughly the same as that of the side walls (441, 442) parallel. 16. The electronic device according to claim 13, characterized in that, the third heat dissipation device (432) comprises a plurality of fans. 17. The electronic device according to any one of claims 13 to 16, characterized in that, the third heat dissipation device (432) is closer to or farther from the back than the third single board (412) (443). 18. The electronic device according to Claim 17, characterized in that, the third heat dissipation device (432) is disposed between the third single board (412) and the back (443). 19. The electronic device according to Claim 17, characterized in that, the third heat dissipation device (432) is disposed on the back (443). 20. The electronic device according to any one of claims 13 to 16, characterized in that, the partition (451, 452) is integrated with the back (443) and the side wall (441, 442) shaped. 21. The electronic device according to any one of claims 2, 9 and 16, wherein the fan is an exhaust fan or an exhaust fan. 22. A data center, characterized by comprising at least two electronic devices according to any one of claims 1 to 8 arranged in a determinant, and between two adjacent rows of the electronic devices are aisle.