CN103660128B - LED integrated forming technique - Google Patents
LED integrated forming technique Download PDFInfo
- Publication number
- CN103660128B CN103660128B CN201210332016.3A CN201210332016A CN103660128B CN 103660128 B CN103660128 B CN 103660128B CN 201210332016 A CN201210332016 A CN 201210332016A CN 103660128 B CN103660128 B CN 103660128B
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- circuit board
- led lamp
- drive circuit
- lamp panel
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000004033 plastic Substances 0.000 claims abstract description 14
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229960001866 silicon dioxide Drugs 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- -1 organic siliconresin Polymers 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C45/14196—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being positioned around an edge of the injected part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a kind of LED integrated forming technique, comprise the technical steps that: metal connecting piece and drive circuit board are welded into driving assembly, drive circuit board is reserved with slot, LED lamp panel is reserved with room；By lens and LED lamp panel with snapping connection or linking together with hot weld, the position, hole that aforementioned driving assembly inserts LED lamp panel reserved by reserved slot is carried out tight fit；By lens, LED lamp panel and drive circuit board pre-assembled molectron；As inserts, aforementioned combinatorial part is put into matched moulds after mould, and the pressure being applied on inserts at matched moulds, more than injection mo(u)lding under conditions of injection pressure, makes Helf heat-conducting plastic be coated with drive circuit board and lamp plate completely, and forming temperature is 150-160 DEG C.The present invention is applicable to the encapsulation of independent electric drive so that the modularity of electric drive adds the feasibility of configuration aspects.
Description
Technical field
The invention belongs to circuit board package technical field, be specifically related to a kind of LED integrated forming technique.
Background information
How at present LED Market competition, use emerging technique, reach low cost, the production efficiency of high production, thus reduces cost, occupy market be each manufacturer must faced by problem.
At present the structure of the LED of Gu10/Mr16 basic as it is shown in figure 1, main member be lens 1., LED lamp panel 2., drive circuit board 3., radiator 4. with metal connecting piece 5. these 5 major parts compositions.Join individually completing these 5 laggard luggages of critical piece, can make during assembling to stick with glue or buckle, the assembly technologies such as screw, the 20% of whole cost is accounted for including logistics cost and each proving ring festival-gathering, in addition to improve its heat-sinking capability, major part manufacturer can radiator 4. and drive circuit board 5. between fill heat-conducting silicone grease, like this can increase again production cost, the quality standard of product is also to increase major step and determines factor.
As shown in Figure 2, during whole assembling, pin (metal connector) 11 needs to weld with drive circuit board 13, and it is subjected to certain impact power, drive circuit board 13 and LED lamp panel 16 are welded by connecting line 18, lED lamp plate 16 is connected by screw 19 and lamp holder 12, thus fixing heat radiator body 15.Lens 17 and radiator body 15 stick with glue or snap connection.Whole assembly technology teacher is completed by several little assemblings, and wherein arbitrary load is not up to examination requirements, will affect whole characteristic of a navigation light amount.And mainly heat energy parts and radiator body 15 have certain hollow 14, are the biggest adverse effect to heat dispersion.
Summary of the invention
For the above-mentioned deficiency of prior art, the technical problem to be solved is based on Helf heat-conducting plastic distinctive processing technique data demand, we have developed and has processing technique revolutionary LED integrated forming technique.
According to embodiment, the LED integrated forming technique that the present invention provides, comprise the technical steps that:
Metal connecting piece and drive circuit board are welded into driving assembly, drive circuit board is reserved with slot, LED lamp panel is reserved with room；
By lens and LED lamp panel with snapping connection or linking together with hot weld, the position, hole that aforementioned driving assembly inserts LED lamp panel reserved by reserved slot is carried out tight fit；
By lens, LED lamp panel and drive circuit board pre-assembled molectron；
As inserts, aforementioned combinatorial part is put into matched moulds after mould, and the pressure being applied on inserts at matched moulds, more than injection mo(u)lding under conditions of injection pressure, makes Helf heat-conducting plastic be coated with drive circuit board and lamp plate completely, and forming temperature is 150-160 DEG C.
According to an embodiment, in the present invention aforementioned LED integrated forming technique, when carrying out tight fit by driving assembly by the position, hole that reserved slot insertion LED lamp panel is reserved, between slot and position, hole, increase silicagel pad be used for increasing sealing.
Heat-conduction electric insulation composite material component disclosed in the present invention aforementioned Helf heat-conducting plastic and Chinese patent CN101787178A is identical, its manufacture method also with Chinese patent CN101787178A disclosed in manufacture method identical.
Relative to prior art, the present invention reprints books in a reduce format this two major features in the excessive outward appearance that will not produce of the scope of 150-160 DEG C and material thickness change according to the peculiar processing characteristics of Helf heat-conducting plastic, i.e. its forming temperature so that it is be suitable for circuit board package.Helf heat-conducting plastic can avoid the damage of electronic devices and components when machining at low temperature, thus reach drive circuit board and LED lamp panel are encapsulated purpose in its material, additionally Helf heat-conducting plastic will cause product appearance bad because wall thickness is different when molding so that moulding process of the present invention can not have the influence factor of outward appearance in product structure molding.The novel forming technology of the LED of the Gu10&Mr16 that the present invention provides is applicable to the encapsulation of independent electric drive so that the modularity of electric drive adds the feasibility of configuration aspects.Main advantages of the present invention are as follows:
(1) owing to the temperature of integral forming process of the present invention is less than 150-160 DEG C, so the components and parts scolding tin of drive circuit board will not be produced impact, this is that common thermoplastic's raw material cannot complete.
(2) can avoid, because structure material is thick to appearance effects, apparent flaws such as reprinting books in a reduce format will not being produced due to Helf heat-conducting plastic.
(3) the fully wrapped around drive circuit board of Helf heat-conducting plastic so that the heat radiation of drive circuit board need not be by heat-conducting silicone grease, and the ability dispelled the heat also has the biggest lifting.
(4) because being integrated molding, the structural strength of product is more firm than former subpackage.
(5) the fitted position tolerance tightened up because of assembling of miscellaneous part is reduced so that the machining accuracy of miscellaneous part is greatly lowered.
Accompanying drawing explanation
Fig. 1 is the basic structure schematic diagram of LED.
Fig. 2 is the assembling schematic diagram of LED.
Fig. 3 is the pre-assembled schematic diagram of the lens of LED of the present invention, LED lamp panel and drive circuit board.
Fig. 4 is the assembling schematic diagram of LED of the present invention.
Wherein: 1 is metal connecting piece；2 is radiator；3 is drive circuit board；4 is LED lamp panel；5 is lens.
Detailed description of the invention
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is expanded on further.These embodiments are interpreted as being merely to illustrate the present invention rather than limiting the scope of the invention.After having read the content that the present invention records, the present invention can be made various changes or modifications by those skilled in the art, and these equivalence changes and modification fall into the scope of the claims in the present invention equally.
First, by pin (metal connector) 1 with drive circuit board 3 by being welded and fixed into driving assembly, drive circuit board 3 is reserved with slot, reserved porose position in LED lamp panel 4.
Secondly, by lens 5 and LED lamp panel 4 with snapping connection, if using thermal weld more preferably, ensure the sealing between lens 5 and LED lamp panel 4 as far as possible, then the position, hole driving assembly to insert LED lamp panel reserved by reserved slot is carried out tight fit, as space allows, silicagel pad can be increased between slot and position, hole and be used for improving sealing.
Again, by lens 5, LED lamp panel 4 and drive circuit board 3 pre-assembled molectron, as shown in Figure 3.
Finally, aforementioned combinatorial part is put into matched moulds after mould as inserts, it is ensured that the pressure that matched moulds is applied on inserts, more than injection mo(u)lding under conditions of injection pressure, makes Helf heat-conducting plastic be coated with drive circuit board and lamp plate completely, and forming temperature is 150-160 DEG C.In injection molding process, upper and lower mould is needed to be given to the pressure that molectron is certain during matched moulds, to ensure the sealing between lens 5 and Led lamp plate 4, penetrate in Led lamp plate 4 with prevention raw material impact that is stressed in injection moulding process, affect whole lamp effect, so necessarily noting when mode transfer, matched moulds is applied to the pressure of inserts will be greater than injection pressure.
It addition, in injection molding process, the exposed face of product must be protected in die cavity, to ensure that not having raw material in production and processing has spilling at exposed face.
In shaped article, Helf heat-conducting plastic is coated with drive circuit board and LED lamp panel completely so that LED produced heat in use was distributed by Helf heat-conducting plastic (constituting the agent structure of radiator 2 in as shown in Figure 4 after injection mo(u)lding) conduction in the very first time.Additionally, due to being seamless link, it also avoid the generation of creepage phenomenon so that LED is safer.
Claims (2)
1. a LED integrated forming technique, is characterized in that, comprises the technical steps that:
Metal connecting piece and drive circuit board are welded into driving assembly, drive circuit board is reserved with slot, reserved porose position in LED lamp panel；
By lens and LED lamp panel with snapping connection or linking together with hot weld, the position, hole that aforementioned driving assembly inserts LED lamp panel reserved by reserved slot is carried out tight fit；
By lens, LED lamp panel and drive circuit board pre-assembled molectron；
As inserts, aforementioned combinatorial part is put into matched moulds after mould, and the pressure being applied on inserts at matched moulds, more than injection mo(u)lding under conditions of injection pressure, makes heat-conducting plastic be coated with drive circuit board and lamp plate completely, and forming temperature is 150-160 DEG C；
Described heat-conducting plastic, its characteristic component is:
1) the highly crystalline type spherical metal oxide powder of at least two size, heat conductivity is more than or equal to 10 watts/meter degree Celsius, and has electrical insulation capability；Described metal oxide powder includes aluminium oxide, zirconium oxide, magnesium oxide, zinc oxide；
2) at least one lamellar heat conduction powder, heat conductivity is more than or equal to 30 watts/meter degree Celsius；Described lamellar heat conduction powder includes flaky graphite powder, boron nitride powder；
3) thermosetting resin, including the mixture of one or more in epoxy resin, organic siliconresin, phenolic resin.
LED integrated forming technique the most according to claim 1, is characterized in that, when carrying out tight fit by driving assembly by the position, hole that reserved slot insertion LED lamp panel is reserved, increases silicagel pad between slot and position, hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210332016.3A CN103660128B (en) | 2012-09-10 | 2012-09-10 | LED integrated forming technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210332016.3A CN103660128B (en) | 2012-09-10 | 2012-09-10 | LED integrated forming technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103660128A CN103660128A (en) | 2014-03-26 |
| CN103660128B true CN103660128B (en) | 2016-08-03 |
Family
ID=50299500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210332016.3A Active CN103660128B (en) | 2012-09-10 | 2012-09-10 | LED integrated forming technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103660128B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104595757A (en) * | 2014-12-26 | 2015-05-06 | 深圳市众明半导体照明有限公司 | Led lamp |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248633A (en) * | 2011-05-10 | 2011-11-23 | 惠州速乐科技有限公司 | Molding and packaging technology of LED lamp bead and special die thereof |
| CN102473827A (en) * | 2010-01-29 | 2012-05-23 | 株式会社东芝 | Led package and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129077A (en) * | 1995-11-06 | 1997-05-16 | Japan Aviation Electron Ind Ltd | Illuminated key top and manufacturing method thereof |
| JP4643050B2 (en) * | 2000-03-31 | 2011-03-02 | 日本特殊陶業株式会社 | Sensor waterproof structure and sensor including the same |
| TWI361502B (en) * | 2010-02-03 | 2012-04-01 | Liang Meng Plastic Share Co Ltd | A method of packaging led is disclosed |
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2012
- 2012-09-10 CN CN201210332016.3A patent/CN103660128B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102473827A (en) * | 2010-01-29 | 2012-05-23 | 株式会社东芝 | Led package and manufacturing method thereof |
| CN102248633A (en) * | 2011-05-10 | 2011-11-23 | 惠州速乐科技有限公司 | Molding and packaging technology of LED lamp bead and special die thereof |
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| Publication number | Publication date |
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| CN103660128A (en) | 2014-03-26 |
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