CN103639888B - Retainer ring and rubbing head - Google Patents
Retainer ring and rubbing head Download PDFInfo
- Publication number
- CN103639888B CN103639888B CN201310630265.5A CN201310630265A CN103639888B CN 103639888 B CN103639888 B CN 103639888B CN 201310630265 A CN201310630265 A CN 201310630265A CN 103639888 B CN103639888 B CN 103639888B
- Authority
- CN
- China
- Prior art keywords
- retainer ring
- conducting wire
- rubbing head
- annular matrix
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 claims abstract description 53
- 239000011159 matrix material Substances 0.000 claims abstract description 45
- 235000012431 wafers Nutrition 0.000 claims abstract description 44
- 239000000126 substance Substances 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 238000009826 distribution Methods 0.000 claims description 24
- 230000007704 transition Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 5
- 230000001737 promoting effect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a kind of retainer ring, for in chemical mechanical polishing apparatus, chemical mechanical polishing apparatus includes polishing disk and rubbing head, rubbing head includes chip carrier and retainer ring, and chip carrier is used for clamping semiconductor wafer, polishing disk and contact wafers and rotates in a reverse direction respectively with rubbing head to polish wafer, retainer ring includes: annular matrix, it is located at below chip carrier, around wafer side face, for fixed wafer；At least one breakable conducting wire, is fixed on annular matrix surface, and annularly the circumferential direction of matrix extends and rounds；On off operating mode detecting device, it is connected with each breakable conducting wire respectively, and sends alarm signal when arbitrary breakable conducting wire ruptures；Signal processing apparatus, is connected with on off operating mode detecting device outfan, alarm signal is converted into polish stop stop signal, is used for indicating rubbing head and polishing disk to stop the rotation。It can effectively reduce because retainer ring is broken the loss brought to technique, is conducive to promoting wafer preparation technology efficiency。
Description
Technical field
The present invention relates to semiconductor processing and manufacturing technical field, more particularly, it relates to a kind of for the retainer ring in chemical mechanical polishing apparatus and rubbing head。
Background technology
Development along with semiconductor fabrication, while the critical size of integrated circuit is increasingly less, the size of wafer is increasing, and the value of single-wafer is also more and more higher, once there is fragmentation in the course of processing of wafer, the economic loss that factory is brought is also increasing。
Chemically mechanical polishing is for making wafer surface planing and a kind of method removing solid layer making metal interconnection patterns apparent and carrying out。Generally, it adopts the rotating polishing pad accommodating chemical reactivity slurry to polish the surface of wafer。Wafer is arranged at above polishing pad with chip carrier, is clamped in place by retainer ring。Retainer ring and chip carrier are fixed on rubbing head, apply a pressure by rubbing head to wafer, wafer presses to polishing pad and is in direct contact with it；Producing relative movement between a polishing pad and a wafer, make the material of wafer surface be removed under the effect of chemistry and machinery, in prior art, a kind of chemically mechanical polishing retainer ring is as shown in Figure 1。
In CMP process, retainer ring on rubbing head is broken in polishing process and is caused the fragmentation of wafer and be not belonging to rare cases, and once the operation of buffing machine can not be found in time and stop, not only can cause wafer fragmentation, possibly even cause the badly damaged of the miscellaneous part such as rubbing head and polishing pad, so that production efficiency declines, production cost rises。
Therefore, needing in the industry a kind of retainer ring structure, it can carry out self-inspection accurately and in time and send alarm when breaking, the loss brought to technique to prevent retainer ring from breaking。
Summary of the invention
It is an object of the invention to provide a kind of for the retainer ring in chemical mechanical polishing apparatus。
For achieving the above object, the present invention one technical scheme is as follows:
A kind of retainer ring, for in chemical mechanical polishing apparatus, chemical mechanical polishing apparatus includes polishing disk and rubbing head, and rubbing head includes chip carrier and retainer ring, and chip carrier is used for clamping semiconductor wafer, polishing disk and contact wafers also rotate with rubbing head to polish wafer respectively in a reverse direction, retainer ring includes: annular matrix, is located at below chip carrier, around wafer side face, for fixed wafer, described annular matrix surface is provided with groove；At least one breakable conducting wire, is fixed on annular matrix surface, and annularly the circumferential direction of matrix extends and rounds, and described breakable conducting wire carries out transition by described groove in the inside and outside both sides of described annular matrix；On off operating mode detecting device, it is connected with each breakable conducting wire respectively, and sends alarm signal when arbitrary breakable conducting wire ruptures；Signal processing apparatus, is connected with on off operating mode detecting device outfan, alarm signal is converted into polish stop stop signal, is used for indicating rubbing head and polishing disk to stop the rotation。
Alternatively, breakable conducting wire is one, and it includes first, second and connecting portion, first annularly extends distribution inside matrix, second annularly extends distribution outside matrix, and first is connected by connecting portion with second, and connecting portion is arranged in the groove on annular matrix surface。
Preferably, first, second serpentine-like or waveform distribution。
Preferably, on off operating mode detecting device includes a current source and an ammeter, concatenates with breakable conducting wire respectively, and current source for maintaining an electric current on breakable conducting wire, and the current value on breakable conducting wire measured by ammeter, and sends alarm signal when current value is zero。
Alternatively, breakable conducting wire includes four, respectively first, second, third and fourth wire, distribution is extended inside first wire annularly matrix, distribution is extended outside second wire annularly matrix, privates annularly body upper surface extends distribution, and privates annularly matrix lower surface extends distribution。
Preferably, serpentine-like or waveform distribution distinguished by first, second, third and fourth wire。
Preferably, first, second, third and fourth wire is in parallel mutually。
Preferably, on off operating mode detecting device includes a current source, four ammeters and one and door, current source maintains an electric current respectively on four breakable conducting wire, four ammeters concatenate with each breakable conducting wire respectively, make logic and operation with door according to the measured value of four ammeters, and send alarm signal when at least one breakable conducting wire ruptures。
The present invention also provides for a kind of rubbing head, for in chemical mechanical polishing apparatus, chemical mechanical polishing apparatus includes polishing disk and rubbing head, rubbing head includes the chip carrier for holding chip and retainer ring as above, polishing disk and contact wafers and rotates in a reverse direction respectively with rubbing head to polish wafer。
Retainer ring provided by the invention, can carry out self-inspection accurately and in time and send alarm when breaking, and then stops the rotation of rubbing head and polishing disk, can effectively reduce because retainer ring is broken the loss brought to technique。It is conducive to promoting wafer preparation technology efficiency, reduces production cost, is adapted in semicon industry popularization and application。
Accompanying drawing explanation
Fig. 1 illustrates chemically mechanical polishing retainer ring schematic diagram in prior art；
Fig. 2 A-2B illustrates the chemically mechanical polishing retainer ring and attachment circuits schematic diagram thereof that first embodiment of the invention provides；
Fig. 3 A-3B illustrates the chemically mechanical polishing retainer ring and attachment circuits schematic diagram thereof that second embodiment of the invention provides。
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail。
It should be noted that, chemical mechanical polishing apparatus includes polishing disk and rubbing head, wherein, rubbing head includes again chip carrier and retainer ring, chip carrier is used for clamping semiconductor wafer, polishing disk and contact wafers also generally rotate respectively in a reverse direction with rubbing head, carry out chemical reaction and machining in this process, wafer is polished technique。
As shown in Figure 2 A and 2 B, the chemically mechanical polishing retainer ring that first embodiment of the invention provides, for in chemical mechanical polishing apparatus, this retainer ring includes: annular matrix 10, when being polished, it is located at chip carrier (accompanying drawing is not shown) lower section, around wafer side face, for fixed wafer；One breakable conducting wire 20, it is fixed on annular matrix 10 surface, and annularly the circumferential direction of matrix 10 extends and rounds；On off operating mode detecting device, it is connected with breakable conducting wire 20, and sends alarm signal when breakable conducting wire 20 ruptures；Signal processing apparatus 50, is connected with on off operating mode detecting device outfan, alarm signal is converted into polish stop stop signal, is used for indicating rubbing head and polishing disk to stop the rotation。
Wherein, breakable conducting wire 20 includes first 201, second 202 and connecting portion 203, annularly extend distribution inside matrix 10 for first 201, annularly extend distribution outside matrix 10 for second 202, being connected by connecting portion 203 with second 202 for first 201, connecting portion 203 is arranged in a groove on annular matrix 10 surface。First 201 and second 202 can be attached directly to the interior outside of annular matrix 10 respectively, it is also possible to be respectively arranged in the groove of interior outer surface。
Further, first 201, second 202 serpentine-like or waveform distributions, thus increasing the contact area of breakable conducting wire 20 and annular matrix 10。
When annular matrix 10 breaks or be damaged, breakable conducting wire 20 will rupture simultaneously。
Wherein, breakable conducting wire can be made up of the enamel-covered wire of diameter 0.1-0.5mm。
Specifically, on off operating mode detecting device includes current source 400 and an ammeter 410, concatenates with breakable conducting wire 20 respectively, and current source 400 for maintaining an electric current on breakable conducting wire 20, the current value on breakable conducting wire 20 measured by ammeter 410, and sends alarm signal when current value is zero。
Signal processing apparatus 50 is connected with on off operating mode detecting device outfan, alarm signal is converted into polish stop stop signal, and exports control signal to rubbing head and polishing disk, and instruction rubbing head and polishing disk stop the rotation so that glossing stops。
According to above-mentioned first embodiment, when retainer ring is broken or is damaged, the breakable conducting wire 20 bound together with it will rupture, thus on off operating mode detecting device will send alarm signal to signal processing apparatus 50, signal processing apparatus 50 indicates rubbing head and polishing disk to stop the rotation again, terminates glossing in time。This retainer ring has self-checking circuit, can effectively reduce because retainer ring is broken the loss brought to technique。It is conducive to promoting wafer preparation technology efficiency, reduces production cost。
As shown in Figure 3 A and Figure 3 B, the chemically mechanical polishing retainer ring that second embodiment of the invention provides, for in chemical mechanical polishing apparatus, this retainer ring includes: annular matrix 10, when being polished, it is located at chip carrier (accompanying drawing is not shown) lower section, around wafer side face, for fixed wafer；Article four, breakable conducting wire, respectively first, second, third and fourth wire 301,302,303,304, these four breakable conducting wire are fixed on annular matrix 10 surface and do not exist together, and annularly the circumferential direction of matrix extends and rounds；On off operating mode detecting device, it is connected with each breakable conducting wire 301,302,303,304 respectively, and sends alarm signal when arbitrary breakable conducting wire ruptures；Signal processing apparatus 50, is connected with on off operating mode detecting device outfan, alarm signal is converted into polish stop stop signal, is used for indicating rubbing head and polishing disk to stop the rotation。
Specifically, first wire 301 annularly matrix 10 inner surface extends distribution, second wire 302 annularly matrix 10 outer surface extends distribution, and privates 303 annularly matrix 10 upper surface extends distribution, and privates 304 annularly matrix 10 lower surface extends distribution。Each breakable conducting wire can be attached directly to annular matrix 10 surface, it is possible to is arranged in the groove on annular matrix 10 surface。
Under preferable case, serpentine-like or waveform distribution distinguished by first, second, third and fourth wire 301,302,303,304, to increase the contact area with annular matrix 10。
Similarly, each breakable conducting wire can be made up of the enamel-covered wire of diameter 0.1-0.5mm。
In this second embodiment, first, second, third and fourth wire 301,302,303,304 is in parallel mutually。
On off operating mode detecting device includes 411,412,413,414 and one, 400, four ammeters of a current source and door 420, current source 400 maintains an electric current respectively on four breakable conducting wire 301,302,303,304, four ammeters 411,412,413,414 concatenate with each breakable conducting wire 301,302,303,304 respectively, make logic and operation with door 420 according to the measured value of four ammeters 411,412,413,414, and send alarm signal when at least one breakable conducting wire ruptures。Signal processing apparatus 50, is connected with door 420 outfan, and alarm signal is converted into polish stop stop signal, and instruction rubbing head and polishing disk stop the rotation。
Further improvement according to above-mentioned second embodiment, first, second, third and fourth wire 301,302,303,304 is not in parallel from each other, and they affiliated circuit are each independent；On off operating mode detecting device includes 4 detection unit, detect the on off operating mode of first, second, third and fourth wire 301,302,303,304 place circuit respectively, and send alarm signal when at least one breakable conducting wire ruptures, alarm signal sends signal processing apparatus 50 to, to stop glossing。
According to above-mentioned second embodiment, when retainer ring is broken or is damaged, in four breakable conducting wire 301,302,303,304 bound together with it one or more can rupture, thus on off operating mode detecting device produces alarm signal, signal processing apparatus 50 generates control signal for terminating glossing in time further according to alarm signal, thus can effectively reduce because retainer ring is broken the loss brought to technique, it is conducive to promoting wafer preparation technology efficiency, reducing production cost。Can in industry be applicable。
It is appreciated that, thought according to the present invention, the detection of each breakable conducting wire on off operating mode can be realized by off operating mode detecting device by the combination of current source and ammeter, it is possible to is realized by other devices provided in prior art, for instance the combination of voltage source and display lamp, the sensor of such as testing circuit on off operating mode again, such as digital ohm meter again, as long as can detect that whether each breakable conducting wire ruptures, all can realize the thought of the present invention, therefore, should be regarded as falling into the simple deformation design of the present invention。
Third embodiment of the invention provides a kind of rubbing head, for in chemical mechanical polishing apparatus, chemical mechanical polishing apparatus includes polishing disk and rubbing head, rubbing head includes the chip carrier for holding chip and the retainer ring as above provided in first embodiment or the second embodiment, and polishing disk and contact wafers also rotate with rubbing head to polish wafer respectively in a reverse direction。
Utilize this rubbing head to perform CMP process, be conducive to promoting wafer preparation technology efficiency, reducing production cost。
Above-described it is only the preferred embodiments of the present invention; described embodiment is also not used to limit the scope of patent protection of the present invention; therefore the equivalent structure change that the description of every utilization present invention and accompanying drawing content are made, in like manner should be included in protection scope of the present invention。
Claims (10)
1. a retainer ring, for in chemical mechanical polishing apparatus, described chemical mechanical polishing apparatus includes polishing disk and rubbing head, described rubbing head includes chip carrier and described retainer ring, described chip carrier is used for clamping semiconductor wafer, described polishing disk and described contact wafers also rotate with described rubbing head to polish described wafer respectively in a reverse direction, it is characterised in that described retainer ring includes:
Annular matrix, is located at below described chip carrier, around described wafer side face, is used for fixing described wafer, and described annular matrix surface is provided with groove；
At least one breakable conducting wire, is fixed on described annular matrix surface, and the circumferential direction along described annular matrix extends and rounds, and described breakable conducting wire carries out transition by described groove in the inside and outside both sides of described annular matrix；
On off operating mode detecting device, it is connected with each described breakable conducting wire respectively, and sends alarm signal when arbitrary described breakable conducting wire ruptures；
Signal processing apparatus, is connected with described on off operating mode detecting device outfan, described alarm signal is converted into polish stop stop signal, is used for indicating described rubbing head and polishing disk to stop the rotation。
2. retainer ring as claimed in claim 1, it is characterized in that, described breakable conducting wire is one, it includes first, second and connecting portion, described first extends distribution inside described annular matrix, described second extends distribution outside described annular matrix, and described first is connected by described connecting portion with second, and described connecting portion is arranged in the described groove on described annular matrix surface。
3. retainer ring as claimed in claim 2, it is characterised in that described first, second serpentine-like or waveform distribution。
4. retainer ring as claimed in claim 2, it is characterized in that, described on off operating mode detecting device includes a current source and an ammeter, concatenate with described breakable conducting wire respectively, described current source for maintaining an electric current on described breakable conducting wire, the current value on described breakable conducting wire measured by described ammeter, and sends described alarm signal when described current value is zero。
5. retainer ring as claimed in claim 1, it is characterized in that, described breakable conducting wire includes four, respectively first, second, third and fourth wire, described first wire extends distribution inside described annular matrix, described second wire extends distribution outside described annular matrix, and described privates extends distribution along described annular matrix upper surface, and described privates extend distribution along described annular matrix lower surface。
6. retainer ring as claimed in claim 5, it is characterised in that serpentine-like or waveform distribution distinguished by described first, second, third and fourth wire。
7. retainer ring as claimed in claim 5, it is characterised in that described first, second, third and fourth wire is in parallel mutually。
8. retainer ring as claimed in claim 7, it is characterized in that, described on off operating mode detecting device includes a current source, four ammeters and one and door, described current source maintains an electric current respectively on described four breakable conducting wire, described four ammeters concatenate with each described breakable conducting wire respectively, described make logic and operation with door according to the measured value of described four ammeters, and send described alarm signal when at least one described breakable conducting wire ruptures。
9. retainer ring as according to any one of claim 1 to 8, it is characterised in that described breakable conducting wire is the enamel-covered wire of diameter 0.1-0.5mm。
10. a rubbing head, for in chemical mechanical polishing apparatus, described chemical mechanical polishing apparatus includes polishing disk and described rubbing head, described rubbing head includes the chip carrier for holding chip and the retainer ring as according to any one of claim 1 to 8, described polishing disk and described contact wafers and rotates in a reverse direction respectively with described rubbing head to polish described wafer。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630265.5A CN103639888B (en) | 2013-11-29 | 2013-11-29 | Retainer ring and rubbing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310630265.5A CN103639888B (en) | 2013-11-29 | 2013-11-29 | Retainer ring and rubbing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103639888A CN103639888A (en) | 2014-03-19 |
| CN103639888B true CN103639888B (en) | 2016-06-22 |
Family
ID=50245245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310630265.5A Active CN103639888B (en) | 2013-11-29 | 2013-11-29 | Retainer ring and rubbing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103639888B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105364696A (en) * | 2015-10-14 | 2016-03-02 | 上海华力微电子有限公司 | Fixing ring capable of automatically giving alarm when damaged |
| CN105397618B (en) * | 2015-10-20 | 2018-03-06 | 上海华力微电子有限公司 | Retainer ring for work-table of chemicomechanical grinding mill |
| CN110181355B (en) * | 2019-06-27 | 2021-08-17 | 西安奕斯伟硅片技术有限公司 | A grinding device, grinding method and wafer |
| CN111644977A (en) * | 2020-07-17 | 2020-09-11 | 中国科学院微电子研究所 | Polishing retainer ring and polishing head |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236184A (en) * | 1998-04-10 | 1999-11-24 | 日本电气株式会社 | Polishing device |
| US6634924B1 (en) * | 1999-09-28 | 2003-10-21 | Ebara Corporation | Polishing apparatus |
| CN1684800A (en) * | 2002-09-27 | 2005-10-19 | 小松电子金属股份有限公司 | Polishing apparatus, polishing head, and polishing method |
| CN1694782A (en) * | 2002-10-02 | 2005-11-09 | 恩辛格合成材料技术Gbr公司 | Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| CN101331003A (en) * | 2005-05-24 | 2008-12-24 | 安格斯公司 | Cmp retaining ring |
| CN201788163U (en) * | 2010-08-13 | 2011-04-06 | 北汽福田汽车股份有限公司 | Part assembly |
-
2013
- 2013-11-29 CN CN201310630265.5A patent/CN103639888B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236184A (en) * | 1998-04-10 | 1999-11-24 | 日本电气株式会社 | Polishing device |
| US6634924B1 (en) * | 1999-09-28 | 2003-10-21 | Ebara Corporation | Polishing apparatus |
| CN1684800A (en) * | 2002-09-27 | 2005-10-19 | 小松电子金属股份有限公司 | Polishing apparatus, polishing head, and polishing method |
| CN1694782A (en) * | 2002-10-02 | 2005-11-09 | 恩辛格合成材料技术Gbr公司 | Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| CN101331003A (en) * | 2005-05-24 | 2008-12-24 | 安格斯公司 | Cmp retaining ring |
| CN201788163U (en) * | 2010-08-13 | 2011-04-06 | 北汽福田汽车股份有限公司 | Part assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103639888A (en) | 2014-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103639888B (en) | Retainer ring and rubbing head | |
| TWI663023B (en) | Method and apparatus of chemical mechanical polishing retaining ring or carrier head with integrated sensor | |
| CN103969569A (en) | Preparation method and analytical method for back optical failure positioning sample of integrated circuit | |
| CN102956521A (en) | Apparatus and methods for real-time error detection in cmp processing | |
| JP2011091262A (en) | Prober and probe inspecting method | |
| JP2009085720A (en) | Probe card and semiconductor wafer inspection apparatus using the same | |
| CN104931543A (en) | Probe-card probe cleaning method and probe cleaning system | |
| CN102928761B (en) | Wafer sort system and crystal round test approach | |
| CN102172888B (en) | a polishing head | |
| CN101004428A (en) | Probe measuring device and system | |
| CN104251922B (en) | Limiting frame, chip testing device and chip testing method | |
| CN210255734U (en) | Chemical mechanical polishing machine | |
| TW202438229A (en) | Printed circuit board fixing chuck for printed circuit board polishing machine | |
| US10239182B2 (en) | Polishing pad and polishing method | |
| CN110174128A (en) | Encoder and standby current abnormality judgment method | |
| JP2014039001A (en) | System and method for temperature control of semiconductor wafer | |
| CN207724097U (en) | Protection structure on chemical-mechanical grinding device | |
| CN105364696A (en) | Fixing ring capable of automatically giving alarm when damaged | |
| CN105397618B (en) | Retainer ring for work-table of chemicomechanical grinding mill | |
| JP2017208513A (en) | Wafer holding mechanism and method for turntable and wafer rotation retainer | |
| CN104913855A (en) | Tire temperature online detection experiment device | |
| CN103394996B (en) | Retainer ring | |
| CN112179915A (en) | Layer removing method for positioning damage points in bare chip | |
| CN218099323U (en) | Probe card and semiconductor test apparatus | |
| CN220454477U (en) | Dimension gauge for chemical mechanical polishing retaining ring |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |