CN103616801A - Making method of special high-uniformity light source for PCB surface exposure, and apparatus of light source - Google Patents
Making method of special high-uniformity light source for PCB surface exposure, and apparatus of light source Download PDFInfo
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- CN103616801A CN103616801A CN201310516897.9A CN201310516897A CN103616801A CN 103616801 A CN103616801 A CN 103616801A CN 201310516897 A CN201310516897 A CN 201310516897A CN 103616801 A CN103616801 A CN 103616801A
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- 230000009021 linear effect Effects 0.000 claims description 15
- 238000002360 preparation method Methods 0.000 claims description 13
- MFYFNUKUXIRYFV-JSGCOSHPSA-N Polygonone Natural products O=CC=1C(=O)C[C@H]2C(C)(C)CCC[C@@]2(C)C=1 MFYFNUKUXIRYFV-JSGCOSHPSA-N 0.000 claims description 3
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Abstract
The invention discloses a making method of a special high-uniformity light source for PCB surface exposure. The making method comprises the following steps: 1, arranging a plurality of UV optical modules, wherein each of the UV optical modules comprises an UVLED chip and a condensing device; 2, arranging an area array, wherein the plurality of UV optical modules are arrayed in a parallel or offset manner to form a rectangular or approximate rectangular shape in the area of the area array in order to form an area array light source; 3, arranging a light source control system used for the brightness control or the fault monitoring of the area array light source; and 4, turning on a power supply to make the light source control system run, wherein the plurality of UV optical modules respectively emit square light spots, and superfluous illumination overlap areas and light leakage areas between adjacent UV optical modules are reduced or eliminated to maintain the high uniformity of the brightness of lights emitted by the light source in a whole irradiation range. The invention also discloses an apparatus of the special high-uniformity light source for the PCB surface exposure.
Description
Technical field
The present invention relates to the high uniformity light sources technical field of ultraviolet curing technology, optical technology, light source control technology, particularly a kind of PCB surface ink preparation method and equipment of special-purpose high evenness light source that exposes.
Background technology
In recent years along with the fast development of electronic technology, the traditional mercury lamp exposure method solidifying for PCB industry surface ink faces the challenge, although current whole PCB in China industry surface ink exposure almost all adopts traditional mercury lamp to be cured, but due to very power consumption of mercury lamp itself, the pollution problem such as high temperature and release sulphuric dioxide simultaneously, is badly in need of industrial upgrading.
Adopting at present UVLED to replace traditional mercury lamp brings into schedule, its efficiently energy-conservation and 50 times of serviceable lifes to mercury lamp are its maximum advantages, but for now, adopt UVLED to exist technical immature, first be exactly uniform luminance problem, although because traditional mercury lamp has shortcomings, the luminous principle of mercury lamp determines that its uniformity coefficient is high, meet the requirement that PCB produces completely.And to adopt the area array light source that many UVLED form to replace mercury lamp, and homogeneity is great challenge, if do not solve the uniformity coefficient problem of light source, UVLED just can not obtain large-area popularization at the exposure machine of PCB industry.
Although China at present in Shenzhen, the Some Enterprises on the ground such as Wenzhou, Shanghai starts development and replaces traditional mercury lamp exposure machine for the UVLED exposure machine of PCB industry, saves energy can reach 80% left and right, but all can not realize spread at present, the uniformity coefficient that reason and difficult point are all embodied in light source can not reach the effect of traditional mercury lamp.These enterprises all adopt UVLED to produce circular hot spot in conjunction with optical lens, as accompanying drawing 1, shown in accompanying drawing 2, because LED transmitting is circular light spot, nearly all optical lens is all also circular, therefore the hot spot designing is also circular naturally, and the large area exposure light source that a plurality of sphere shape lights combine is because hot spot is overlapping serious, uniformity coefficient is far below 85% requirement, can only be for the welding resistance exposure requirement of least significant end, wiring board exposure for middle and high end, because the brightness uniformity of light source is low, may there is overexposure or leak exposure phenomenon, make the PCB circuit indentation producing, there is short circuit or the hidden danger that opens circuit, can not use completely.
Therefore, research and develop light source a kind of UVLED of employing, high evenness, just become very urgent.
Summary of the invention
For the above-mentioned deficiency of prior art, the invention provides the expose preparation method of special-purpose high evenness light source of a kind of PCB surface ink, it has solved the homogeneity question of light source well;
The present invention also provides and implements PCB surface ink prepared by the said method special-purpose high evenness light source that exposes, and this light source can be directly installed on production line and carry out rapid curing, can replace mercury lamp pipe comprehensively, reaches energy-efficient technique effect.
For achieving the above object, the technical solution used in the present invention is as follows:
The expose preparation method of special-purpose high evenness light source of PCB surface ink, is characterized in that, it comprises the steps:
1). many group UV optical modules are set, and every group of UV optical module forms by UVLED chip and beam condensing unit;
2). a face array area territory is set, in this face array area territory, described many groups UV optical module is parallel or Heterogeneous Permutation is orthogonal or approximate rectangular, form area array light source;
3). a set of light-source control system is set, and this system is carried out brilliance control or failure monitoring to described area array light source;
4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot respectively, controls respectively to organize between adjacent UV optical module to reduce or eliminate unnecessary illumination overlapping region and light leak region, makes light source in whole range of exposures, keep the high uniformity of brightness.
Described step 4) specifically comprise the following steps: described UV optical module is placed under the irradiation distance of setting, and described beam condensing unit converges the light beam of UVLED chip transmitting into square focus spot, is radiated at PCB surface; The edge contour of this square focus spot is by near linear or gradual change rectilinear(-al), make the adjacent UV optical module of respectively organizing carry out permutation and combination with near linear border or the gradual change border of square focus spot, reduce or eliminate unnecessary illumination overlapping region and light leak region, forming the large area exposure light source that illumination is continuous, uniformity coefficient is high.
Described step 4) square focus spot in, it is shaped as square, rectangle or polygon one of square, making its irradiation area edge contour is a comparatively fuzzy gradual change profile, and by part, the circular arc by near linear forms the composition on its border, forms the boundary characteristic with near linear effect.
Described step 1), in, specifically described each beam condensing unit includes one or two above optically focused pieces; While adopting plural optically focused piece, the center line of the center line of optically focused piece and UVLED chip overlaps, and described optically focused piece is that two bottom surfaces, front and back are the square or polygon lens that cambered surface, peripheric surface are plane;
Described step 4), in, the light beam that described UVLED chip sends, after beam condensing unit, converges as square focus spot light beam.
A kind of PCB surface ink of implementing above-mentioned preparation method special-purpose high evenness light source that exposes, it comprises many group UV optical modules, the rectangular arrangement of this many group UV optical module, be arranged on a circuit board, form area array light source, this UV optical module comprises UVLED chip and beam condensing unit, and described UVLED chip is arranged on beam condensing unit below, and each UVLED chip is corresponding one by one with each beam condensing unit; The high evenness special light source of described PCB surface ink exposure also comprises a set of light-source control system, and this system is carried out brilliance control and failure monitoring to described area array light source.
The described PCB surface ink special-purpose high evenness light source that exposes also comprises power supply, and this power supply connects described light-source control system and UVLED chip.
Described beam condensing unit includes one or two above optically focused pieces; While adopting plural optically focused piece, the center line of the center line of optically focused piece and UVLED chip overlaps, and described optically focused piece is that two bottom surfaces, front and back are the square or polygon lens that cambered surface, peripheric surface are plane.
The invention has the advantages that: the present invention is for the circular arc border of traditional circular light spot, near linear border or the gradual change border of the square focus spot producing by the square lens of bilayer, can effectively reduce or eliminate unnecessary illumination overlapping region and light leak region, thereby be combined into the high large area of brightness uniformity light area; This light source adopts UVLED chip, and it is energy-conservation, efficient.
It is orthogonal or approximate rectangular that the present invention organizes UV optical module by parallel or Heterogeneous Permutation more, guarantee that adjacent respectively group reduces or eliminates unnecessary illumination overlapping region and light leak region between UV optical module, efficiently solve light source in the brightness uniformity problem of whole range of exposures, uniformity coefficient can reach more than 95%, is specially adapted to high-precision PCB solidifying circuit board.
Method and apparatus provided by the invention, reliable, cost is low, stability is high, is adapted at directly installing and using on production line, efficient, energy-conservation, automaticity is high.
Below in conjunction with drawings and Examples, the invention will be further described.
Accompanying drawing explanation
Fig. 1 is that traditional circular light spot combines overlapping schematic diagram;
Fig. 2 is traditional circular light spot combination light leak schematic diagram.
Fig. 3 is embodiment of the present invention monnolithic case structural representation;
Fig. 4 is the light path principle figure that square focus spot of the present invention forms;
Fig. 5 is a square focus spot actual effect figure of the present invention;
Fig. 6 is a plurality of square focus spot actual effect figure of the present invention.
1. circuit board 2.UVLED chip 3. beam condensing units
32. times optically focused pieces of optically focused piece, 4. square focus spot 5. circular light spots on 31..
Embodiment
Referring to Fig. 3～Fig. 6, the expose preparation method of special-purpose high evenness light source of PCB surface ink provided by the invention, it comprises the steps:
1). many group UV optical modules are set, and every group of UV optical module forms by UVLED chip 2 and beam condensing unit 3; Described in each, beam condensing unit 3 includes one or two above optically focused pieces; While adopting plural optically focused piece, the center line of the center line of optically focused piece and UVLED chip 2 overlaps, and described optically focused piece is that two bottom surfaces, front and back are the square or polygon lens that cambered surface, peripheric surface are plane; While adopting two optically focused pieces, comprise on one optically focused piece 31 and optically focused piece 32 once, wherein descend optically focused piece 32 to be arranged on the side near UVLED chip 2, upper optically focused piece 31 is arranged on the outside of lower optically focused piece 32, and upper optically focused piece 31 overlaps with the center line of lower optically focused piece 32 and the center line of UVLED chip 2;
2). a face array area territory is set, in this face array area territory, described many groups UV optical module is parallel or Heterogeneous Permutation is orthogonal or approximate rectangular, form area array light source;
3). a set of light-source control system is set, and this system is carried out brilliance control or failure monitoring to described area array light source;
4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot 4 respectively, control is respectively organized between adjacent UV optical module and is reduced or eliminated unnecessary illumination overlapping region and light leak region, makes light source in whole range of exposures, keep the high uniformity of brightness; Wherein, the light beam that described UVLED chip 2 sends, after the refraction of lower optically focused piece 32, then passes through the refraction of optically focused piece 31, completes pointolite to the conversion of area source, and the light beam sending is converged as square focus spot 4.
Described step 4) in, specifically described UV optical module is placed under the irradiation distance of setting, described beam condensing unit 3 converges the light beam of UVLED chip transmitting into square focus spot 4, is radiated at PCB surface; The edge contour of this square focus spot 4 is by near linear or gradual change rectilinear(-al), make the adjacent UV optical module of respectively organizing carry out permutation and combination with near linear border or the gradual change border of square focus spot 4, reduce or eliminate unnecessary illumination overlapping region and light leak region, forming the large area exposure light source that illumination is continuous, uniformity coefficient is high.
Described step 4) square focus spot 4 in, it is shaped as square, rectangle or polygon one of square, making its irradiation area edge contour is a comparatively fuzzy gradual change profile, and by part, the circular arc by near linear forms the composition on its border, forms the boundary characteristic with near linear effect.
A kind of PCB surface ink of implementing above-mentioned preparation method special-purpose high evenness light source that exposes, it comprises many group UV optical modules, the rectangular arrangement of this many group UV optical module, be arranged on a circuit board 1, form area array light source, this UV optical module comprises UVLED chip 2 and beam condensing unit 3, and described UVLED chip 2 is arranged on beam condensing unit 3 belows, and each UVLED chip 2 is corresponding one by one with each beam condensing unit 3; The high evenness special light source of described PCB surface ink exposure also comprises a set of light-source control system, and this system is carried out brilliance control and failure monitoring to described area array light source.The described PCB surface ink special-purpose high evenness light source that exposes also comprises power supply, and this power supply connects described light-source control system and UVLED chip 2.
Described beam condensing unit 3 comprises optically focused piece 31 and lower optically focused piece 32, the light beam that described UVLED chip 2 sends is after the refraction of lower optically focused piece 32, pass through again the refraction of optically focused piece 31, be formed with pointolite to the conversion of area source, and light beam converges as square focus spot 4.
The lens that the face that described lower optically focused piece 32 is sphere, surrounding for two bottom surfaces, front and back is plane; Described upper optically focused piece 31 is that rear bottom surface is the face of sphere, surrounding and the lens that front bottom surface is plane.
In the present embodiment, referring to accompanying drawing 3, the collector lens in figure also can be other versions and array configuration, can produce the hot spot of square focus spot 4 or squarish.UVLED chip 2 is high-power UVLED chip.
The inhomogeneity large area light source of the high brightness schematic diagram that square focus spot 4 assembled arrangement that accompanying drawing 6 is the transmitting of many group UV optical modules form, the near linear boundary edge profile of square focus spot 4 of take combines as overlapping region.
In accompanying drawing 1, after traditional circular light spot 5 combinations, in order to realize illumination, cover whole region, circular light spot 5 must be overlapping and just can avoid light leak, cause like this light-source brightness of overlapping region apparently higher than Non-overlapping Domain, cannot effectively guarantee that light source is at the brightness uniformity of whole rectangular area.
In accompanying drawing 2, after traditional circular light spot 5 combinations, there is not overlapping circular light spot 5 in rectangular area, but obviously has light leakage phenomena, and uniformity coefficient is low.
The present invention is for the circular arc border of traditional circular light spot 5, the near linear border of formed square focus spot 4 or gradual change border, effectively reduce or eliminate unnecessary illumination overlapping region and light leak region, thereby be combined into the high light source of brightness uniformity.Method and apparatus provided by the invention, reliable, cost is low, stability is high, be applicable to installing and using online.
The present invention organizes UV optical module by parallel or Heterogeneous Permutation more, guarantee that adjacent respectively group reduces or eliminates unnecessary illumination overlapping region and light leak region between UV optical module, effectively solve light source in the brightness uniformity problem of whole range of exposures, be specially adapted to high-precision PCB solidifying circuit board.
The present invention is not limited to above-mentioned embodiment; adopt step and the structure identical or approximate with the above embodiment of the present invention; and obtain other for PCB surface ink expose preparation method and the equipment of special-purpose high evenness light source, all within protection scope of the present invention.
Claims (7)
1. the PCB surface ink preparation method for special-purpose high evenness light source that exposes, is characterized in that, it comprises the steps:
1). many group UV optical modules are set, and every group of UV optical module forms by UVLED chip and beam condensing unit;
2). a face array area territory is set, in this face array area territory, described many groups UV optical module is parallel or Heterogeneous Permutation is orthogonal or approximate rectangular, form area array light source;
3). a set of light-source control system is set, and this system is carried out brilliance control or failure monitoring to described area array light source;
4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot respectively, controls respectively to organize between adjacent UV optical module to reduce or eliminate unnecessary illumination overlapping region and light leak region, makes light source in whole range of exposures, keep the high uniformity of brightness.
2. the expose preparation method of special-purpose high evenness light source of PCB surface ink according to claim 1, is characterized in that described step 4) specifically comprise the following steps:
Described UV optical module is placed under the irradiation distance of setting, and described beam condensing unit converges the light beam of UVLED chip transmitting into square focus spot, is radiated at PCB surface; The edge contour of this square focus spot is by near linear or gradual change rectilinear(-al), make the adjacent UV optical module of respectively organizing carry out permutation and combination with near linear border or the gradual change border of square focus spot, reduce or eliminate unnecessary illumination overlapping region and light leak region, forming the large area exposure light source that illumination is continuous, uniformity coefficient is high.
3. the PCB surface ink according to claim 1 preparation method of special-purpose high evenness light source that exposes, is characterized in that, it is further comprising the steps of:
Described step 4) square focus spot in, it is shaped as square, rectangle or polygon one of square, making its irradiation area edge contour is a comparatively fuzzy gradual change profile, and by part, the circular arc by near linear forms the composition on its border, forms the boundary characteristic with near linear effect.
4. the PCB surface ink according to claim 3 preparation method of special-purpose high evenness light source that exposes, is characterized in that described step 1) in, described each beam condensing unit includes one or two above optically focused pieces; While adopting plural optically focused piece, the center line of the center line of optically focused piece and UVLED chip overlaps, and described optically focused piece is that two bottom surfaces, front and back are the square or polygon lens that cambered surface, peripheric surface are plane;
Described step 4), in, the light beam that described UVLED chip sends, after beam condensing unit, converges as square focus spot light beam.
5. a PCB surface ink that implements the claims one of 1～4 described preparation method special-purpose high evenness light source that exposes, it is characterized in that, it comprises many group UV optical modules, the rectangular arrangement of this many group UV optical module, be arranged on a circuit board, form area array light source, this UV optical module comprises UVLED chip and beam condensing unit, described UVLED chip is arranged on beam condensing unit below, and each UVLED chip is corresponding one by one with each beam condensing unit; The high evenness special light source of described PCB surface ink exposure also comprises a set of light-source control system, and this system is carried out brilliance control and failure monitoring to described area array light source.
6. the PCB surface ink special-purpose high evenness light source that exposes according to claim 5, is characterized in that, it also comprises power supply, and this power supply connects described light-source control system and UVLED chip.
7. the PCB surface ink special-purpose high evenness light source that exposes according to claim 5, is characterized in that, described beam condensing unit includes one or two above optically focused pieces; The center line of the center line of described optically focused piece and UVLED chip overlaps, and described optically focused piece is that two bottom surfaces, front and back are the square or polygon lens that cambered surface, peripheric surface are plane.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108286682A (en) * | 2018-02-12 | 2018-07-17 | 丁强 | Enhance the integrated module and strip-shaped light source of UVLED radiation peak intensity |
| CN112130426A (en) * | 2020-10-15 | 2020-12-25 | 深圳优卫乐得科技有限公司 | A UV LED light source for solder mask exposure |
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| JP2000098619A (en) * | 1998-09-22 | 2000-04-07 | Sanee Giken Kk | Light source device |
| CN101477311A (en) * | 2007-12-31 | 2009-07-08 | 乐金显示有限公司 | Exposure method and exposure apparatus for photosensitive film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100431883B1 (en) * | 2001-11-05 | 2004-05-17 | 삼성전자주식회사 | Projection Method and projection system |
| CN100559277C (en) * | 2006-11-03 | 2009-11-11 | 上海微电子装备有限公司 | A lighting system for lithography |
| JP2010251232A (en) * | 2009-04-20 | 2010-11-04 | Ushio Inc | Integrator and light irradiation device |
| JP2011009611A (en) * | 2009-06-29 | 2011-01-13 | Ushio Inc | Integrator and light irradiation device using the same integrator |
| CN102360122B (en) * | 2011-09-30 | 2013-11-13 | 中国科学院光电技术研究所 | Fly-eye lens |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000098619A (en) * | 1998-09-22 | 2000-04-07 | Sanee Giken Kk | Light source device |
| CN101477311A (en) * | 2007-12-31 | 2009-07-08 | 乐金显示有限公司 | Exposure method and exposure apparatus for photosensitive film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108286682A (en) * | 2018-02-12 | 2018-07-17 | 丁强 | Enhance the integrated module and strip-shaped light source of UVLED radiation peak intensity |
| CN112130426A (en) * | 2020-10-15 | 2020-12-25 | 深圳优卫乐得科技有限公司 | A UV LED light source for solder mask exposure |
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Address after: No. 333, Zhushan Zhenxing Road, Dongcheng District, Dongguan City, Guangdong Province Patentee after: Guangdong Keshi Optical Technology Co.,Ltd. Address before: 523000 Room 601, building a, Lianchuang building, Jiaowei Industrial Zone, Shaxiang, Luosha community, Guancheng, Dongguan City, Guangdong Province Patentee before: CST AUTOMATION TECHNOLOGY Co.,Ltd. |