CN103608146A - Method for cutting glass sheet - Google Patents
Method for cutting glass sheet Download PDFInfo
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- CN103608146A CN103608146A CN201280029808.1A CN201280029808A CN103608146A CN 103608146 A CN103608146 A CN 103608146A CN 201280029808 A CN201280029808 A CN 201280029808A CN 103608146 A CN103608146 A CN 103608146A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/04—Annealing glass products in a continuous way
- C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
- C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
To minimize as early as possible a condition in which deformation such as warping occurs in a glass sheet, a method for cutting glass is provided. A glass sheet cutting apparatus (1) for fusion-separating a glass base plate using an intended cutting line as a boundary by supplying, from above the glass base plate, assist gas and a laser beam along the intended cutting line of the glass base plate, is provided with a first laser irradiator (2) for radiating a laser for fusion cutting, and a second laser irradiator (3) for radiating a laser for annealing, and is configured such that the second laser irradiator (3) radiates an annealing laser diagonally from above on the fusion-cutting edge surface of an annealing object through the fusion-cutting gap between fusion-cutting edge surfaces formed by fusion cutting.
Description
Technical field
The present invention relates to the improvement of the cut-out technology of glass plate fusing.
Background technology
, as the method that glass plate is cut off, used after the surface of glass plate forms line in the past, and made bending stress act on this line and the method (based on cutting off of bending stress) of cutting off; Or form initial be full of cracks on glass plate after, utilize the irradiation heat of laser to make this initial laser that chaps development and cut off cut off (based on cutting off of thermal stress).
Yet based in the cutting off of bending stress, existence cannot be avoided the generation of small glass dust, and is also not easy to remove such problem in this small glass dust cleaning after cut-out.This problem especially becomes problem in the glass substrate of display applications etc. of spatter property that requires height.And based in the cutting off of bending stress, the cut-out end of glass plate is the shape that has corner angle, easily produces the defects such as breach, therefore need to implement chamfer machining to the cut-out end of glass plate after cut-out.
On the other hand, in laser cuts off, although almost glass plate is cut off zero defect, when glass plate after cutting off is separated, the contact each other of the extremely difficult cut-out end face of avoiding glass plate.Therefore,, when separation, due to the cut-out end face of glass plate friction each other etc., may form tiny flaw cutting off on end face.And, in laser cuts off, with above-mentioned same based on cutting off of bending stress, because the cut-out end of glass plate is the shape that has corner angle, therefore also need to after cut-out, implement chamfer machining.
As the cutting-off method of this problem of reply, laser blown attracts attention.
Laser blown is to utilize the hot limit of irradiation of laser that a part of melting of glass substrate is removed, the method that limit cuts off glass plate.Therefore,, in laser blown, can prevent the generation of glass dust.And, by not needing the melting of glass to remove, between fusing end face (cut-out end face), form the gap of stipulating, can avoid reliably the fusing end face of glass plate when separation to come in contact each other such state of affairs.And, because fusing end face becomes the level and smooth forging plane that melting forms, even if therefore do not implement separately chamfer machining, be also difficult for damaging.
But, with regard to this laser blown, also have problems in actual applications.
That is, when utilizing laser that glass plate is fused, exist with temperature sharply rise excessive thermal stress together act on this laser irradiation area near such problem or near the end face that fuses, produce the such problem of hot residual deformation.And in the situation that the impact of the problems referred to above is large, glass plate is sometimes because warpage etc. deforms or damaged.
Therefore, a kind of technology is for example disclosed in patent documentation 1: the laser defocusing in utilization utilizes the laser that is concentrated on tiny dots that glass plate is fused, then after glass substrate is prepared to heating, again utilize the laser defocusing to anneal, reduce thus thermal deformation.
It should be noted that, in the document, the laser of annealing use and the laser of the use that fuses similarly from directly over to glass plate is vertical, irradiate.
In addition, in the document, in the cut-out preset lines of glass substrate, be arranged with respectively the output of laser of preparation heating use, the output (laser irradiation device) of the laser of the output of the laser of fusing use and annealing use, the spaced interval of irradiation area of each laser and become independently state.
Technical literature formerly
Patent documentation
Patent documentation 1: Japanese kokai publication sho 60-251138 communique
Summary of the invention
The problem that invention will solve
< the first problem >
Yet, the in the situation that of patent documentation 1, due to the laser of annealing use from directly over glass plate to the upper surface vertical incidence of glass plate, so the heat affecting that produces of laser must be partial to the upper surface side of glass plate.Consequently, fail to carry out fully the annealing of the fusing end face integral body of glass plate, in the fusing of glass plate or after fusing, be subject to the impact of hot residual deformation and glass plate still can produce the distortion such as warpage.
In addition, also considered to replace and above-mentionedly in fusing, annealed concurrently with fusing like that midway, and after fusing completes to separation the fusing end face of glass plate individually implement the method for annealing (anneal), but can produce following problem in this case.; in recent years; actual conditions are with headed by the glass substrate of display applications and constantly advance the thin plate of glass plate; once the words in distortion such as fusing glass plate generation midway warpages; after processing time may cause breakage, or difference according to circumstances and glass plate may occur damaged in the moment that produce distortion.Therefore,, if consider the requirement of the thin plate of glass plate, it is vital in fusing, annealing concurrently with fusing midway.
The present invention is in view of above actual conditions, and its first problem is glass plate to be fused and during with the parallel annealing of fusing, making reliably the fusing end face annealing of glass plate, reducing glass plate as far as possible and produce the such states of affairs of distortion such as warpage.
< the second problem >
And, in patent documentation 1, the spaced interval of irradiation area separately of three laser irradiation devices arranging at the superjacent air space of glass plate and independence, the heat energy of therefore supplying with between each irradiation area can produce loss.Between the irradiation area that is preparing heating and the irradiation area that fuses, the temperature that need to make glass plate is high temperature more, if so between these two regions, lose heat energy, prepare heating effect and can decline and produce waste.And when preparation heating effect declines, it is large that the temperature ascensional range of glass plate during fusing becomes, and therefore also breakage may occur in thermal shock lower glass plate.In addition,, if the irradiation area fusing is separated with the irradiation area of annealing, between these two regions, also can lose heat energy.Therefore, between these two regions, the glass plate having fused is sharply cooling, in thermal shock lower glass plate, also breakage may occur.
The present invention is in view of above actual conditions, and its second problem is when reducing the preparation heating before and after fusing and the hot loss of energy given during annealing as far as possible, and suppresses reliably the generation of the damaged or hot residual deformation of glass plate.
Solution
< the first invention >
The first invention proposing in order to solve above-mentioned the first problem relates to a kind of glass plate cutting-off method, cut-out preset lines along glass plate is irradiated laser from top, the described cut-out preset lines of take is separated by described glass plate fusing as having a common boundary, it is characterized in that, the fusing that described laser comprises the fusing of carrying out described glass plate is with laser and carry out the annealing laser of annealing of the fusing end face of described glass plate, described annealing with laser via the gap between the described fusing end face forming by described fusing, described fusing end slope from top to described annealing object irradiates.
According to this method, the gap between the fusing end face that annealing forms by fusing with laser utilization, irradiates becoming the fusing end slope of annealing object.Therefore, can not be partial to terrifically as the impact of the irradiation heat of laser by the laser situation of vertically irradiating to glass plate of annealing use the upper surface of glass plate.Subsidiary, due to part or all the direct irradiation annealing laser to fusing end face, therefore irradiate thermal capacitance easily to the whole conduction of fusing end face.Therefore, can fuse the reliably annealing of end face integral body.
In above-mentioned method, preferably, in described annealing, with in the irradiation area of laser, form the intensity distribution that the fusing enforcement division of heat energy intensity described cut-out preset lines changes to the portion of fusing.Especially more preferably form heat energy intensity and towards fusing, complete the intensity distribution (thermograde) that subordinate falls from fusing enforcement division.At this, fusing enforcement division refers to by the fusing current part fusing of laser, and the portion of fusing refers to the part that fuses and to complete with the fusing that laser carries out.
Like this, can make annealing to the portion of fusing, be with and change from the fusing enforcement division of cutting off preset lines with the impact of the irradiation heat of laser, can suitably adjust annealing conditions according to fusing situation etc.Especially forming from fusing enforcement division when fusing completes the intensity distribution of portion's heat energy decline, from cutting off fusing enforcement division preset lines, towards fusing, complete portion and anneal and weaken with the impact of the irradiation heat of laser, the mild thermograde that formation temperature declines gradually.Consequently, the Temperature Distribution of the fusing end face of annealing object during annealing is good.
In above-mentioned method, preferably, described annealing does not complete portion's side direction with laser with the fusing along with described cut-out preset lines and has fused portion's side and approached described glass plate or along with the fusing described cut-out preset lines completes that portion's side direction has fused portion's side and the mode that approaches described glass plate tilts.
Like this, project to annealing on glass plate and with the irradiation area of laser, from the fusing of the fusing end face of glass plate, do not complete portion's side to the portion's side that fuse and form rectangularly, so can fully anneal to glass plate.And, now, adopting collimated light beam by the Energy distribution of laser Shi， view field, apart from center, to be point symmetry as annealing.And, when by gathered light bundle defocus irradiation, can make heat energy intensity reduce gradually towards the fusing portion of completing from fusing enforcement division, or heat energy intensity is increased towards fusing enforcement division gradually from the portion of having fused.Therefore, as the former during by gathered light bundle defocus irradiation, the thermograde that formation temperature declines towards the fusing portion of completing gradually from the fusing enforcement division of cutting off preset lines simply.
At this, additional disclosure is by the situation of the gathered light bundle defocus irradiation tilting, as shown in Figure 1, Energy distribution on the beam cross section of the upside of focal point FP and the horizontal direction of downside all presents the form that energy reduces towards the opposing party from a side of rectangular irradiation area, and in upper lateral section (cross section 1) and lower lateral section (cross section 2), the gradient of distribution become on the contrary towards.Specifically, in upper lateral section, present the form that energy reduces towards horizontal direction rear gradually from horizontal direction the place ahead, in lower lateral section, present the form that energy reduces towards horizontal direction the place ahead gradually from horizontal direction rear.
In above-mentioned method, preferably, described annealing is elliptical shape with beam shape laser and section light shaft positive cross.
Like this, can be at the annealing of the internal radiation on a large scale laser of glass plate, the annealing of the end face that therefore can fuse expeditiously.And, above-mentioned, make like that annealing tilts with laser in the situation that, even if do not increase the inclined degree of annealing use laser, also can extend the total length of irradiation area and make the intensity gradient of heat energy intensity mild.
In above-mentioned method, can be, described annealing with the irradiation area of laser with across overlapping and form with the mode of the front and back of the irradiation area of laser and the irradiation area fusing with laser to described fusing.State in this what is called " overlapping " refers in annealing to have each other under the state of lap with the irradiation area of laser with the irradiation area of laser and fusing, and annealing is exposed with the front and back (front and back on fusing travel direction) of the irradiation area of laser to fusing with the irradiation area of laser.That is,, on the width with fusing travel direction quadrature, fusing can be exposed with the irradiation area of laser from annealing by a part for the irradiation area of laser, also can not expose.
Like this, can before fusing is with laser, utilize annealing, with the part of the irradiation area of laser, glass plate is prepared to heating.Therefore, the situation that in the time of can preventing from utilizing fusing to carry out the fusing of glass plate with laser, the temperature of glass plate sharply rises, can reduce the generation of hot residual deformation.
In above-mentioned method, can be, described fusing with laser and described annealing with laser by the laser branch penetrating from same light source is formed.
Like this, light source can be concentrated is one, therefore can realize save space.In this case, preferably fusing is adjusted to optimum value with laser and annealing with laser output separately.As the method for adjustment of output, can enumerate to for fusing by laser and the method adjusted by the transmissivity (reflectivity) of the separated semi-transparent semi-reflecting lens of laser etc. of annealing, in light path, configure the method for the optics that the dim lights such as ND filter use.
In above-mentioned method, can be that described fusing is penetrated and formed from different light sources with laser with laser and described annealing.
Like this, fusing is independent of one another with the light source of laser with annealing with the light source of laser, therefore has advantages of that the output of the laser that a side laser is not impacted and can adjust simply the opposing party is such.
The first invention proposing in order to solve above-mentioned the first problem relates to a kind of glass plate shearing device, cut-out preset lines along glass plate is irradiated laser from top, the described cut-out preset lines of take is separated by described glass plate fusing as having a common boundary, it is characterized in that, possess the fusing of irradiating the fusing carry out described glass plate with the first laser irradiation device of laser and irradiate second laser irradiation device of annealing use laser of the annealing of the fusing end face that carries out described glass plate, described the second laser irradiation device is via the gap between the described fusing end face forming by described fusing, from top to the described fusing end slope of described annealing object irradiate annealing laser.
According to this structure, can enjoy with above-mentioned corresponding method and invent same action effect.It should be noted that, the first laser irradiation device and the second laser irradiation device be consubstantiality not, and the first laser irradiation device also can be also used as the second laser irradiation device.
< the second invention >
The second invention proposing in order to solve above-mentioned the second problem relates to a kind of glass plate cutting-off method, cut-out preset lines along glass plate is irradiated laser and annealing laser for fusing, the described cut-out preset lines of take is separated by described glass plate fusing as having a common boundary, it is characterized in that, on the fusing travel direction along described cut-out preset lines, described annealing is larger by the size of the irradiation area of laser than described fusing by the size of the irradiation area of laser, and, with described annealing with the irradiation area of laser across making described annealing overlapping with the irradiation area of laser and the irradiation area of described fusing use laser to described fusing by the mode of the front and back on the described fusing travel direction of the irradiation area of laser.It should be noted that, state in this what is called " overlapping " refers in annealing to have each other under the state of lap with the irradiation area of laser with the irradiation area of laser and fusing, and annealing is exposed with the front and back on the fusing travel direction of the irradiation area of laser to fusing with the irradiation area of laser.That is,, on the width with fusing travel direction quadrature, fusing can be exposed with the irradiation area of laser from annealing by a part for the irradiation area of laser, also can not expose.The former in the situation that, for example,, when glass plate fusing is separated into He Fei product department of product department's (certified products) (non-certified products), if fusing is exposed by laser Xiang Fei product department side, and annealing is irradiated to product department's side with laser, can enjoy effect of the present invention in fact.In the latter case, whole irradiation areas of annealing with laser that are contained in of the irradiation area of laser for fusing.
According to this method, by annealing, use the irradiation area of laser, in fusing, with the front and back on the fusing travel direction of the irradiation area of laser, glass plate is heated with the set point of temperature below fusing-off temperature.That is, in annealing, with in the irradiation area of laser, in fusing, with the region of the fusing travel direction rear side of the irradiation area of laser, anneal, in fusing, with the region of the fusing travel direction front side of the irradiation area of laser, prepare heating.Therefore,, in the front and back of fusing, can reduce by temperature sharply as far as possible and rise or the decline breakage that caused breakage caused by thermal shock or produce the such state of affairs of hot residual deformation of temperature sharply.And, owing to being responsible for annealing of task of this preparation heating and annealing overlapping with the irradiation area of laser with fusing with the irradiation area of laser, therefore on fusing travel direction, simple and reliable ground is continuously in each region of preparation heating fusing annealing.Therefore, can carry out continuously above-mentioned a series of heat treatment to glass plate, thereby can suppress the hot loss of energy of supply, expeditiously except reducing phlegm and internal heat residual deformation.It should be noted that, preparation heating can be fused and with the relative position of the irradiation area of laser, easily be adjusted with respect to annealing with the irradiation area of laser by change with the balance of annealing.
In above-mentioned method, preferably, described glass plate is separated into He Fei product department of product department by fusing, and described annealing is more partial to this side of described product department with the irradiation area of laser compared with this side of described non-product department and is formed.
Like this, when glass plate fusing is separated into He Fei product department of product department, can preferentially implement to prepare heat treated or annealing in process to this side of product department in glass plate, therefore can reduce more reliably the hot residual deformation of product department.
In above-mentioned method, preferably, described fusing is leaned on the position of the front side on described fusing travel direction with the irradiation area of laser in the described annealing than on described fusing travel direction with the center of the irradiation area of laser, overlapping with the irradiation area of laser with described annealing.
Like this, annealing is with in the irradiation area of laser, carries out the region of annealing of glass plate than region length on fusing travel direction of carrying out the preparation heating of glass plate.Hot residual deformation because of after fusing by cooling generation rapidly, the mode that therefore increases as described above the region of annealing becomes except reducing phlegm and internal heat the preferred mode of residual deformation this respect.
In above-mentioned method, can be that described annealing forms elongated shape long on described fusing travel direction with the irradiation area of laser.
Hot residual deformation concentrate to produce near the fusing portion of glass plate, if therefore annealing is formed to elongated shape long on fusing travel direction (such as elliptical shape etc.) with the irradiation area of laser, can irradiate laser to fusing end emphasis.Therefore, can reduce the waste of the heat energy of supply as far as possible.
In above-mentioned method, preferably, described annealing is irradiated the surface of described glass substrate from the direction tilting with laser.
Like this, in the time of on projecting to the surface of glass substrate, annealing is elongated with the irradiation area of laser, therefore can simply annealing be shaped to elongated shape with the irradiation area of laser.
In above-mentioned method, preferably, described fusing is different with swashing light wavelength with swashing light wavelength and described annealing.
Laser is owing to being coherent light, so interference capability is high.In the present invention, if form interference fringe with annealing with the lap of the irradiation area of laser with the irradiation area of laser in fusing, it is complicated that the Energy distribution that glass plate is subject to becomes.Consequently, be difficult to control fully each operation of fusing annealing.Therefore,, in above-mentioned method, by making fusing different with swashing light wavelength with swashing light wavelength and annealing, can be suppressed at thus in the overlapping region of two laser stable interference fringe in formation time.Therefore, if consider the time average in above-mentioned overlapping region, can reduce the impact that interference fringe produces, easily control fully the Energy distribution that glass plate is subject to.
In above-mentioned method, preferably, described fusing is the light beam that is vibrated and by mutually different oscillator with laser beam and described annealing laser beam.
Like this, can make fusing easy and stably different with the wavelength of laser beam from annealing with the wavelength of laser beam.; if use different oscillators; the oscillator of the laser medium of homogeneity even for example vibrate; also can easily vibrate the light beam of different wave length, therefore can be suppressed at laser beam and the situation of annealing by interference fringe stable in the overlapping region formation time of laser beam for fusing.
It should be noted that, in above-mentioned method, as laser beam and described annealing laser beam for described fusing, even use by same oscillator and vibrate the light beam light splitting that and the light beam that obtains, as long as that considers two light beams can adjust described fusing laser beam and the described annealing path difference of laser beam by interference distance, just can suppress the formation of interference fringe.
Invention effect
According to above the first such invention, can to the fusing end face integral body of glass plate, anneal reliably, therefore can reduce as far as possible and at glass plate, produce the such states of affairs of distortion such as warpage.
In addition, according to above the second such invention, owing to preparing, the irradiation area that heating fuses anneals is continuous respectively, the hot loss of energy that therefore can reduce as far as possible when the preparation heating of the front and back of fusing and give during annealing, produces the ratio of hot residual deformation thereby can reduce reliably glass plate because of thermal shock breakage or glass plate.
Accompanying drawing explanation
Fig. 1 is for the figure of effect of the glass plate cutting-off method of the first invention is described.
Fig. 2 A means the cutaway view of the glass plate shearing device of the first working of an invention mode.
Fig. 2 B means the top view of irradiation area of laser of glass plate shearing device of the working of an invention mode of Fig. 1.
Fig. 3 A means the top view of variation in Ear Mucosa Treated by He Ne Laser Irradiation region of the glass plate shearing device of the first working of an invention mode.
Fig. 3 B means the top view of variation in Ear Mucosa Treated by He Ne Laser Irradiation region of the glass plate shearing device of the first working of an invention mode.
Fig. 4 means the annealing of the glass plate shearing device of the first working of an invention mode stereogram of the irradiating state of laser.
Fig. 5 means the annealing of the glass plate shearing device of the first working of an invention mode stereogram of the irradiating state of laser.
Fig. 6 is used collimated light beam as the annealing of the glass plate shearing device of the first working of an invention mode, to use the concept map of the irradiating state in the situation of laser for illustrating.
Fig. 7 be for illustrate use to assemble light beam as the annealing of the glass plate shearing device of the first working of an invention mode with laser and make this gathering light beam carry out the concept map of the irradiating state in the situation of defocus irradiation.
Fig. 8 means the stereogram of variation of the illumination mode of the laser in the glass plate shearing device of the first working of an invention mode.
Fig. 9 means the stereogram of variation of the illumination mode of the laser in the glass plate shearing device of the first working of an invention mode.
Figure 10 means the cutaway view of variation of glass substrate of the cut-out object of the glass plate shearing device that becomes the first working of an invention mode.
Figure 11 means the top view of irradiation area of laser of the glass plate shearing device of the second working of an invention mode.
Figure 12 A is for laser and the figure of annealing with the position relationship of laser irradiation area separately for fusing of the glass plate shearing device of the second working of an invention mode are described.
Figure 12 B is for laser and the figure of annealing by the preferable range of the position relationship of laser irradiation area separately for fusing of the glass plate shearing device of the second working of an invention mode are described.
The specific embodiment
Below, with reference to accompanying drawing, the first invention and the second invention embodiment are separately described.It should be noted that, below, glass plate is the glass substrate that the flat-panel monitor below thickness 500 μ m is used, but is not certainly defined in this.For example, go for used for solar batteries, organic EL illuminating are used etc. the glass substrate that utilizes in various fields, itself and organic resin with, digital signage duplexer etc. with, contact panel.It should be noted that, the thickness of glass plate is preferably below 300 μ m, is particularly preferably below 200 μ m.
< the first working of an invention mode >
As shown in Fig. 2 A, Fig. 2 B, the glass plate shearing device 1 of the first working of an invention mode be take the glass substrate G that keeps flat attitude to cut off preset lines CL and be separated into the Gb of GaHe Fei product department of product department as having a common boundary to fuse, and possesses the first laser irradiation device 2, the second laser irradiation device 3 and gas injection nozzle 4.
The first laser irradiation device 2 roughly irradiates fusing laser LB1 directly over the cut-out preset lines CL of glass substrate G vertical.By this fusing, use laser LB1, in the part of the cut-out preset lines CL of glass substrate G, form the first irradiation area SP1 as the enforcement division that fuses.In the present embodiment, by not shown carrying mechanism (for example, glass substrate G is adsorbed to the conveyer belt keeping) make glass substrate G mobile along carrying direction (arrow A in figure), make thus the first irradiation area SP1 scan along cutting off preset lines CL, by the glass substrate G separation that fuses continuously.That is, the arrow B in the figure contrary with arrow A becomes fusing travel direction.Now between the fusing end face Gb1 of this side of the fusing end face Ga1Yu Fei Gb of product department of this side of the Ga of ， product department, form fusing gap S.It should be noted that, be not limited to the situation that only makes glass substrate G move like this, as long as exist and relatively move comprising between the machining cell of the first laser irradiation device 2, the second laser irradiation device 3 and gas injection nozzle 4 and glass substrate G, just can carry out the fusing of glass substrate G.For example, can make, under the state that glass substrate G is static, machining cell to be moved.
The second laser irradiation device 3 irradiates annealing (anneal) via the top of fusing gap this side of the S ，Cong Fei Gb of product department between fusing end face Ga1, the Gb1 of the glass substrate G that uses laser LB1 to form by fusing obliquely to the fusing end face Ga1 of this side of the Ga of product department uses laser LB2.By this annealing, use laser LB2, in the part of the cut-out preset lines CL of glass substrate G, form the second irradiation area SP2 as the enforcement division of annealing.The second irradiation area SP2 is along the region that cuts off the long elongated shape (illustrated example is elliptical shape) of preset lines CL, is formed on the fusing of cutting off on preset lines CL completes the R1 of portion with the first irradiation area SP1 devices spaced apart.In the present embodiment, by glass substrate G is moved as described above, and the fusing end face Ga1 that makes the second irradiation area SP2 scan this side of the Ga of ，Dui product department along cut-out preset lines CL anneals continuously.
It should be noted that, as shown in Figure 3A, the second irradiation area SP2 also can contact with the first irradiation area SP1.And as shown in Figure 3 B, the second irradiation area SP2 also can be overlapping and form with the mode before and after carrying direction across to the first irradiation area SP1 and the first irradiation area SP1.In the latter case, the fusing that a part of the second irradiation area SP2 is formed on glass substrate G does not complete the R2 of portion above, is therefore being about to, before fusing, glass substrate G is being prepared to heating.
As assist gas AG, such as the gases such as oxygen (or air), steam, carbon dioxide, nitrogen, argon are used with state independent or that mix.And assist gas AG also can spray with the form of hot blast.
It should be noted that, the allocation position of the gas injection nozzle 4 in the superjacent air space of glass substrate G is not particularly limited, for example, can be configured in cut off preset lines CL directly over, together with laser LB1, with respect to glass substrate G, generally perpendicularly spray assist gas AG with fusing.And, also gas injection nozzle 4 can be configured in to the lower side space of glass substrate G, from the below of glass substrate G, melting impurity is blown and flown.These assist gas AG is used for fusing expeditiously, but also can suitably omit.
In the present embodiment, as shown in Figure 4, the second laser irradiation device 3 is configured in the top position that fusing does not complete non-this side of the Gb of product department of the R2 of portion.The annealing of penetrating from this second laser irradiation device 3 is tilted to approach the mode of glass substrate G along with having fused the R1 of portion side from the portion's R2 side direction that fused with laser LB2.It should be noted that, annealing also can be tilted to approach the mode of glass substrate G along with having fused the R2 of portion side from the portion's R1 side direction that fused with laser LB2.
That is, annealing has the azimuth angle theta shown in figure and polar angle φ with laser LB2.Therefore, as shown in Figure 5, be projected in the second irradiation area SP2 on glass substrate G and from the first irradiation area SP1 as fusing enforcement division to the R1 of portion that fused, form rectangularly, and become elliptical shape.The major axis of this elliptical shape towards being illustrated as in Fig. 2 B with to cut off preset lines CL parallel, but can change according to the size of azimuth angle theta, there is in this case the component of fusing travel direction.In addition, also can be made as θ=pi/2, with major axis towards the mode along cutting off preset lines CL, the annealing that the cross section with light shaft positive cross is shaped as in advance to elliptical shape is irradiated with the fusing end face Ga1 of this side of the laser LB2Xiang Ga of product department.As the cross section that is orthogonal to optical axis of laser being shaped as in advance to the method for elliptical shape, can list the shadow mask of opticses such as using cylindrical lens or slit-shaped etc.
At this, the azimuth angle theta of annealing use laser LB2 and polar angle φ are preferably in following scope.That is, the preferred scope in 0 < θ < pi/2 and pi/2 < θ < π of azimuth angle theta.If in this scope, have along the component that cuts off the direction of preset lines CL, therefore the annealing in the second irradiation area SP2 has mild variation by the heat energy intensity of laser LB2 from the first irradiation area SP1 side to the portion's R1 side that fused.Therefore, form the intensity gradient that heat energy intensity gently changes to the portion's R1 side that fused from the first irradiation area SP1 cutting off preset lines CL.It should be noted that, as shown in Figure 6, while adopting collimated light beam to use laser LB2 as annealing, azimuth angle theta is which scope in 0 < θ < pi/2 and pi/2 < θ < π no matter, the effect of irradiating is all identical, but as shown in Figure 7,, when adopting gathering light beam and irradiating in the mode defocusing, there is the proper range of azimuth angle theta.; in the situation that than focal point position defocus irradiation on the lower to glass substrate G (with reference to the cross section 2 of Fig. 1); 0 < θ < pi/2 is proper range; otherwise in the situation that than the top side's of focal point position defocus irradiation to glass substrate G (with reference to the cross section 1 of Fig. 1), pi/2 < θ < π is proper range.
On the other hand, as shown in Figure 6, when adopting collimated light beam to use laser LB2 as annealing, if annealing is w with the beam diameter of laser LB2
2, glass substrate G thickness be that the adjustment amount of t, irradiation position is d, polar angle φ preferably meets 0 < φ < cos
-1[(t+w
2)/{ 2 (s+t+d) }] scope.And, as shown in Figure 7, adopt to assemble light beam as annealing with laser LB2 and while making its defocus irradiation, if the beam diameter at the contact point place under the state that the Gb of Yu Fei product department annealing with laser LB2 joins is w
2, condensing angle is that the thickness of α, glass substrate G is that the adjustment amount of t, irradiation position is d, polar angle φ preferably meets 0 < φ < cos
-1((tcos α+w
2)/{ 2 (s+t+d) }) scope.In other words, the fusing end face Ga1 of the fusing end face Gb1Yu Ga of product department of the angular range ，Fei Gb of product department not interfering the fusing end face Gb1 of the polar angle φ preferred settings Gb of Cheng Yufei product department near approaches opposed.Near the position of the tensile stress that annealing preferably produces the fusing end face Ga1 of the Ga of product department of basis before annealing with the irradiation position of laser LB2 is adjusted, and its adjustment amount d for example adjusts in the scope of-0.5t≤d≤2.5t.
It should be noted that, if annealing is shaped to the cross section of light shaft positive cross and becomes elliptical shape with laser LB2, even if do not increase inclination angle (polar angle φ), also can form that total length is grown and the second mild irradiation area SP2 of gradient of Energy distribution.
The action of the glass severing device 1 of the present embodiment that next, simple declaration forms above like that.
First, as shown in Fig. 2 A, Fig. 2 B, limit moving glass substrate G, fusing laser LB1 is irradiated from 2 couples of glass substrate G of the first laser irradiation device in limit.Thus, glass substrate G is fused.Now, from 4 pairs of fusing of gas injection nozzle, with the first irradiation area SP1 of laser LB1, spray assist gas AG, melting impurity is blown and flown from the first irradiation area SP1.
Meanwhile, from the second laser irradiation device 3, will anneal and irradiate to glass substrate G with laser LB2.Fusing gap S between fusing end face Ga1, Gb1 that this annealing forms via the irradiation of using laser LB1 by fusing with laser LB2, the fusing end face Ga1 from top to this side of the Ga of product department irradiates obliquely.Thus, fusing end face Ga1 is annealed.
Like this, the upper surface that can not anneal as the situation that annealing is vertically irradiated to the upper surface of glass substrate G with laser LB2 and be partial to terrifically glass substrate G with the impact of the irradiation heat of laser LB2.Subsidiary, due to part or all the direct irradiation annealing laser LB2 to fusing end face Ga1, therefore irradiate thermal capacitance easily to the whole conduction of fusing end face Ga.Therefore, even if glass substrate is the thin plate below 500 μ m, also residual deformation can be removed expeditiously, the such unfavorable conditions of distortion such as warpage can be avoided producing.
At this, utilize fusing by the upper surface side of glass substrate G, to start melting with laser LB1, and the cut-out groove forming by this melting is connected downwards, complete thus the fusing of glass substrate G.Therefore, what can consider is that fusing end face Ga1 more approaches upper surface, and the impact of the irradiation heat of supplying with while being subject to fusing is stronger, and the hot residual deformation of fusing end face Ga1 also becomes large relatively in upper surface side.Therefore,, for the residual deformation of fusing end face Ga1 is removed, preferably to the upper surface side of fusing end face Ga1, supply with more heat and carry out annealing in process.Therefore, as shown in FIG. 6 and 7, annealing preferably shines directly into the upper portion (for example, the region of the first half) of fusing end face Ga1 with laser LB2.
It should be noted that, the first invention is not defined as above-mentioned embodiment, can carry out various distortion.
In the above-described embodiment, directly over the cut-out preset lines CL having illustrated at glass substrate G, configure the first laser irradiation device 2, and above the non-Gb of product department of glass substrate G, configure the situation of the second laser irradiation device 3, but the configuration of the first laser irradiation device 2, the second laser irradiation device 3 is not defined in this.Example as shown in Figure 8, also can be configured in the first laser irradiation device 2 and the second laser irradiation device 3 top position of the Ga of product department, by opticses such as speculums 5,6 to fusing with laser LB1 and anneal and guide with laser LB2.
In addition, in the above-described embodiment, the first laser irradiation device 2 and the second laser irradiation device 3 consist of different light sources, but also can be as shown in Figure 9, and the first laser irradiation device 2 is also used as the second laser irradiation device 3.That is, can pass through semi-transparent semi-reflecting lens 7 opticses such as grade, make the laser LB penetrating from the first laser irradiation device 2 be branched off into laser LB1 and annealing laser LB2 for fusing.In this case, annealing can adjusted the transmissivity (reflectivity) of semi-transparent semi-reflecting lens etc. or in its light path, by ND filter etc., carry out dim light and after suitably having adjusted energy, to glass substrate G, irradiate with laser LB2.And, also can consider fusing with laser beam LB1 and annealing with laser beam LB2 can interference distance, by adjusting the path difference of two light beams, suppress the formation of interference fringe.
In addition, when utilizing overflow downdraw etc. to be shaped glass substrate G, as shown in figure 10, the relative thickening of thickness of the width central portion of the Thickness Ratio glass substrate G at the width both ends of glass substrate G.And width central portion is the Ga of product department, the Gb of width both ends Wei Fei product department (being called ear).The ear that the cutting-off method of the first invention and shearing device go for this glass substrate G removes.
In addition, in the above-described embodiment, illustrated glass substrate G fusing has been separated into the situation of the Gb of GaHe Fei product department of product department, but also gone for the separated both sides of fusing to utilize the situation as product department.
As the first inventive embodiment, prepare the test portion of alkali-free glass and the test portion of soda-lime glass, by the fusing of each test portion, each test portion after damaged confirmation, (3) fusing of having or not under damage test that has carried out confirmation that (1) fusing end face has or not residual deformation, (2) fusing end face has or not the confirmation of warpage.It should be noted that, as laser and annealing laser for fusing, used near the CO of wavelength 10.6 μ m
2laser.And fusing becomes the form shown in Fig. 2 B with irradiation area (SP1) and the annealing of laser with the irradiation area (SP2) of laser.Each test of above-mentioned (1)～(3) is described in Details as Follows.
(1) residual deformation
Having or not by being used as Sai Nameng (Senarmont) method or the sensitive color method of optical distortion instrumentation method to observe to confirm to the fusing end face of each test portion of the residual deformation of fusing end face.
(2) damage test
The damage test of fusing end face, by utilizing after the sand paper of #1000 applies damage to the fusing end face of each test portion, is placed 1000 hours, according to whether there is autoclasia, confirms.
(3) warpage
Each test portion after fusing is placed on platform, confirms having or not of warpage.At this, with regard to warpage, to confirming respectively by the ventricumbent situation of the table of each test portion with by the ventricumbent situation of the back of the body, in each situation when circumference at test portion exist from platform float 0.3mm float part time, be evaluated as " existence ".
The result of such contrast test is as shown in table 1 above.It should be noted that, in table, θ, φ be take Fig. 4 as foundation, w
2, to take Fig. 6 and Fig. 7 be foundation for s, d.And the energy intensity of the laser in table [W] is actually the value at glass baseplate surface place.
[table 1]
According to above table 1, make annealing in the comparative example 1 and 2 with respect to glass substrate vertical incidence, about residual deformation damage test warpage, all confirm respectively the generation of unfavorable condition with laser.With respect to this, make annealing, in the embodiment 1～6 with respect to glass substrate oblique incidence, about residual deformation damage test warpage, can recognize and obtain good result with laser.
< the second working of an invention mode >
The glass plate shearing device of the glass plate shearing device of the second working of an invention mode and the first working of an invention mode similarly, possesses laser irradiation device for fusing, annealing laser irradiation device and gas injection nozzle (with reference to Fig. 2 A).About above-mentioned each structure, due to identical with the glass plate shearing device of the first working of an invention mode, therefore omit detailed explanation.Below, centered by the distinctive points about cutting-off method, describe.
As shown in figure 11, when the glass plate shearing device that utilizes the second working of an invention mode cuts off glass plate, with annealing, use formed the second irradiation area SP2 of laser across to the mode of fusing with the front and back on the fusing travel direction (the arrow B direction in figure) of formed the first irradiation area SP1 of laser, the second irradiation area SP2 and the first irradiation area SP1 is overlapping.That is, at the first irradiation area SP1 and the second irradiation area SP2, have each other under the state of lap, the second irradiation area SP2 exposes to the front and back on the fusing travel direction of the first irradiation area SP1.Therefore, when utilizing the second irradiation area SP2 to heat glass substrate G, in continuous region, front and back on the fusing travel direction with the first irradiation area SP1, glass substrate G is heated to form the low temperature (for example 100～1000 ℃) for example, than fusing-off temperature (1300～3000 ℃) lower.; in the second irradiation area SP2; region SP2a by the front side of the fusing travel direction of the first irradiation area SP1 prepares heating to glass substrate G, by the region SP2b of the rear side of the fusing travel direction of the first irradiation area SP1, glass substrate G is annealed.And, by making glass substrate G mobile along carrying direction (the arrow A direction in figure), and the second irradiation area SP2 is scanned along cutting off preset lines CL, thereby glass substrate G is implemented to preparation heating and annealing continuously in the front and back of fusing.
Thus, in the front and back of fusing, can reduce by temperature sharply as far as possible and rise or the decline breakage that caused breakage caused by thermal shock or produce the such state of affairs of hot residual deformation of temperature sharply.Especially in the situation that the glass substrate below 500 μ m, if each region SP2a, SP1, the SP2b of preparation heating fusing annealing are separated, temperature rises or temperature declines and becomes sharply.And, because responsible the second irradiation area SP2 and first irradiation area SP1 that this prepares heating and annealing of task are overlapping, therefore prepare each region SP2a, SP1, SP2b that heating fuses anneals simple and reliablely continuous on fusing travel direction.Therefore, can carry out continuously this series of heat treatment to glass substrate G, the state of affairs that can avoid heat energy to lose undeservedly between each thermal treatment zone SP2a, SP1, SP2b.In other words, Yi Bian can utilize the heat energy of supplying with to glass substrate G to carry out expeditiously preparation to heat and fuse hot residual deformation is removed.
At this, as shown in Figure 12 A, by the center in the second irradiation area SP2 and direction fusing travel direction quadrature and the line extending along fusing travel direction, be made as X-axis, at the line of the center position quadrature of the fusing travel direction of the second irradiation area SP2, be made as Y-axis with this X-axis, the X-direction size of the second irradiation area SP2 is made as 2a
2, the Y direction size of the second irradiation area SP2 is made as 2b
2, the X-direction size of the first irradiation area SP1 is made as 2a
1, the Y direction size of the first irradiation area SP1 is made as 2b
1, when the centre coordinate of the first irradiation area SP1 is made as (x, y), the preferred relation between the first irradiation area SP1 and the second irradiation area SP2 as follows.
That is, the pass between the first irradiation area SP1 and the some footpath of the second irradiation area SP2 is a
1< a
2, b
1< b
2, be preferably:
50a
1≤a
2
30b
1≤b
2…(1)
And the centre coordinate of the first irradiation area SP1 (x, y) preferably meets following relation (region shown in the A1 of Figure 12 B):
-a
2/4≤x＜a
2-a
1
-b
2-b
1＜y≤b
2/2…(2)
More preferably meet following relation (region shown in the A2 of Figure 12 B):
a
2/4≤x≤3a
2/4
-b
2/2≤y≤0…(3)
If meet above-mentioned formula (1) or formula (2), magnitude relationship and the position relationship of the first irradiation area SP1 and the second irradiation area SP2 become the best, can reduce reliably the generation of the hot residual deformation in the Ga of product department of glass substrate G.And, if meet formula (3), the second irradiation area SP2 is more partial to the Ga of product department side compared with the non-Gb of product department side and forms, and position the first irradiation area SP1 and the second irradiation area SP2 of side is overlapping on the front in the center than on the fusing travel direction of the second irradiation area SP2 (position of Y-axis).Like this, can preferentially implement to prepare heat treated or annealing in process to this side of the Ga of product department in glass substrate G, therefore can reduce more reliably the hot residual deformation of the Ga of product department.And in this case, in irradiation area SP2, the size on the fusing travel direction of the region SP2b annealing is longer than the size of preparing on the fusing travel direction of region SP2a of heating.Hot residual deformation because of after fusing by cooling generation rapidly, therefore increasing as described above the region of annealing the mode that reduces cooling velocity becomes except reducing phlegm and internal heat the preferred mode of residual deformation this respect.
In addition, as laser and annealing laser for fusing, preferably use the laser that vibrates and by different oscillators, can make thus both wavelength different.Like this, can be by laser and stable interference fringe in laser formation time for annealing, the Energy distribution that easily fully control is given to glass plate for fusing.
It should be noted that, the second invention is not defined as above-mentioned embodiment, and can carry out various distortion.
For example, in the above-described embodiment, illustrated glass substrate G fusing has been separated into the situation of the Gb of GaHe Fei product department of product department, but also gone for the separated both sides of fusing to utilize the situation as product department.
In addition, also can similarly be suitable for the variation of explanation in the first above-mentioned invention.
As the second inventive embodiment, will fuse with near laser (CO wavelength 10.6 μ m
2laser.In table shown below, being expressed as output 1) residual deformation while scanning to fuse with relative moving speed 10mm/s with respect to glass substrate is made as at 10 o'clock, and this residual deformation is improved to this situation with which kind of degree and check.Residual deformation is 10 o'clock, and glass substrate may produce the distortion such as warpage or when processing or in manufacturing procedure, occur damaged.Residual deformation is preferably below 3.And with together with the inspection of above-mentioned residual deformation, during also to fusing, whether glass substrate checks because damaged this situation occurs in thermal shock.Think that the breakage meeting being caused by thermal shock produces the in the situation that glass substrate sharply being heated when fusing.
Specifically, make respectively by different oscillators laser and near laser (CO wavelength 10.6 μ m for annealing for the fusing that vibrate
2laser.In table shown below, being expressed as output 2) relative position of irradiation area separately changes, or make the size variation of the irradiation area of laser for annealing, thus above-mentioned residual deformation and the caused breakage of thermal shock with which kind of degree are improved and evaluated.Its result is as shown in table 2～4.It should be noted that a in table shown below
1, b
1, a
2, b
2, x, y symbol take Figure 12 B as foundation.And, the output 1 in table shown below and export the energy of each laser at 2 expression glass baseplate surface places.
[table 2]
| ? | No.1 | No.2 | No.3 | No.4 | No.5 | No.6 | No.7 | No.8 | No.9 |
| Output 1[W] | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Output 2[W] | - | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| a 1[mm] | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 |
| b 1[mm] | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 |
| a 2[mm] | - | 2.0 | 0.6 | 0.8 | 1.0 | 1.3 | 1.5 | 1.7 | 1.5 |
| b 2[mm] | - | 1.5 | 0.6 | 0.8 | 1.0 | 1.0 | 1.0 | 1.0 | 1.5 |
| x | - | 1.0 | 0.3 | 0.4 | 0.5 | 0.7 | 0.8 | 0.9 | 0.8 |
| y | - | -0.4 | -0.2 | -0.2 | -0.3 | -0.3 | -0.3 | -0.3 | -0.4 |
| a 2/a 1 | - | 67 | 20 | 27 | 33 | 43 | 50 | 57 | 50 |
| b 2/b 1 | - | 50 | 20 | 27 | 33 | 33 | 33 | 33 | 50 |
| Residual deformation | 10 | 1 | 6 | 5 | 3 | 2 | 1 | 1 | 1 |
| Thermal shock is broken | Have | Nothing | Roughly without | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing |
[table 3]
| ? | No.10 | No.11 | No.12 | No.13 | No.14 | No.15 | No.16 | No.17 | No.18 | No.19 | No.20 |
| Output 1[W] | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Output 2[W] | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| a 1[mm] | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 |
| b 1[mm] | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 |
| a 2[mm] | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 |
| b 2[mm] | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
| x | -2.0 | -1.0 | -0.4 | 0.0 | 0.4 | 0.6 | 1.0 | 1.5 | 1.6 | 1.8 | 2.0 |
| y | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 | -0.4 |
| Residual deformation | 10 | 6 | 3 | 3 | 2 | 1 | 1 | 1 | 1 | 1 | 1 |
| Thermal shock is broken | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Roughly without | Roughly without | Have |
[table 4]
| ? | No.21 | No.22 | No.23 | No.24 | No.25 | No.26 | No.27 | No.28 | No.29 | No.30 | No.31 |
| Output 1[W] | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Output 2[W] | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| a 1[mm] | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 |
| b 1[mm] | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 |
| a 2[mm] | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 |
| b 2[mm] | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
| x | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 |
| y | -1.8 | -1.5 | -1.4 | -0.8 | -0.6 | 0.0 | 0.2 | 0.6 | 0.8 | 1.4 | 1.8 |
| Residual deformation | 10 | 3 | 3 | 2 | 1 | 1 | 2 | 3 | 4 | 7 | 10 |
| Thermal shock is broken | Have | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing | Have |
According to above table 2, in test portion No.1 as a comparative example, for sheet glass, both also enforcement annealing of enforcement preparation heating, so residual deformation is 10, and has produced breaking of being caused by thermal shock.With respect to this, in test portion No.2～9 as embodiment, because the second irradiation area (irradiation area of laser for annealing) is overlapping with mode and first irradiation area of the front and back across to the first irradiation area (irradiation area of laser for fusing), therefore sheet glass is implemented to preparation heating and annealing in the front and back of fusing, thereby residual deformation is all improved, and breaking of being caused by thermal shock do not occur yet.Especially as test portion No.2,7～9, at a
2/ a
1>=50 and b
2/ b
1in>=30 scope, having obtained residual deformation is 1 so extremely good result.
According to above table 3, in test portion No.10 as a comparative example, the state of the second irradiation area in only exposing to the fusing travel direction front side of the first irradiation area therefore do not implemented annealing for sheet glass after fusing, do not observe the improvement of residual deformation.And in test portion No.20 as a comparative example, the state of the second irradiation area in only exposing to the fusing travel direction rear side of the first irradiation area therefore do not implemented preparation heating for sheet glass before fusing, what occurred to be caused by thermal shock breaks.With respect to this, in test portion No.11～19 as embodiment, the second irradiation area exposes to the front and back on the fusing travel direction of the first irradiation area under the state with the part overlapping with the first irradiation area, therefore sheet glass is implemented to preparation heating and annealing in the front and back of fusing, thereby obtain the such result that is also improved of breaking that residual deformation is all improved and is caused by thermal shock.
According to above table 4, in test portion No.21 as a comparative example, the second irradiation area is not overlapping with the first irradiation area, and this side of product department of deflection sheet glass, therefore the heat energy that the second irradiation area produces does not act on the first irradiation area, the result of breaking and all not improving that has obtained residual deformation and caused by thermal shock.And, in test portion No.31 as a comparative example, the second irradiation area is not overlapping with the first irradiation area, and this side of non-product department of deflection sheet glass, therefore the heat energy that the second irradiation area produces does not act on the first irradiation area, the result of breaking and all not improving that has obtained equally residual deformation and caused by thermal shock.With respect to this, in test portion No.22～30 as embodiment, under the state that expose the front and back of the second irradiation area on the fusing travel direction to the first irradiation area, on the width with fusing travel direction quadrature, there is lap, therefore the effect of preparation heating and annealing acts on the fusing portion of sheet glass, has obtained the also nonevent result of breaking that residual deformation is all improved and is caused by thermal shock.
Especially according to table 3 and table 4, as test portion No.12～19 and test portion No.22～30 ,-a
2/ 4≤x < a
2-a
1and-b
2-b
1< y≤b
2in/2 scope, can confirm that breaking of being caused by thermal shock is improved and residual deformation is result good like this below 3.Wherein, as test portion No.15～17 and test portion No.25～26, at 1/4≤x/a
2≤ 3/4 and-1/2≤y/b
2in≤0 scope, generation and residual deformation are not so extremely good result below 1 completely can to confirm breaking of being caused by thermal shock.
Symbol description
1 glass plate shearing device
2 first laser irradiation devices
3 second laser irradiation devices
4 gas injection nozzles
AG assist gas
CL cuts off preset lines
G glass substrate
Ga product department
The Ga1 end face that fuses
GbFei product department
LB1 fusing laser
LB2 annealing laser
SP1 the first irradiation area
SP2 the second irradiation area
SP2a prepares heating region
SP2b annealing region
The S gap that fuses
The R1 portion that fused
The R2 portion that fused
The azimuth of laser is used in θ annealing
The polar angle of laser for φ annealing
Claims (14)
1. a glass plate cutting-off method, irradiates laser along the cut-out preset lines of glass plate from top, and the described cut-out preset lines of take is separated by described glass plate fusing as having a common boundary, it is characterized in that,
The fusing that described laser comprises the fusing of carrying out described glass plate is with laser and carry out the annealing laser of annealing of the fusing end face of described glass plate,
Described annealing is with laser via the gap between the described fusing end face forming by described fusing, and the described fusing end slope from top to described annealing object irradiates.
2. glass plate cutting-off method according to claim 1, is characterized in that,
In described annealing, with in the irradiation area of laser, form the intensity distribution that the fusing enforcement division of heat energy intensity described cut-out preset lines changes to the portion of fusing.
3. glass plate cutting-off method according to claim 1 and 2, is characterized in that,
Described annealing does not complete portion's side direction with laser with the fusing along with described cut-out preset lines and has fused portion's side and approached described glass plate or along with the fusing described cut-out preset lines completes that portion's side direction has fused portion's side and the mode that approaches described glass plate tilts.
4. according to the glass plate cutting-off method described in any one in claim 1～3, it is characterized in that,
Described annealing is elliptical shape with beam shape laser and section light shaft positive cross.
5. according to the glass plate cutting-off method described in any one in claim 1～4, it is characterized in that,
Described annealing with the irradiation area of laser with across overlapping and form with the irradiation area of laser with the mode of the front and back of the irradiation area of laser and described fusing to described fusing.
6. according to the glass plate cutting-off method described in any one in claim 1～5, it is characterized in that,
Described fusing with laser and described annealing with laser by the laser branch penetrating from same light source is formed.
7. according to the glass plate cutting-off method described in any one in claim 1～5, it is characterized in that,
Described fusing is penetrated and is formed from different light sources with laser with laser and described annealing.
8. a glass plate cutting-off method, irradiates laser and annealing laser for fusing along the cut-out preset lines of glass plate, and the described cut-out preset lines of take is separated by described glass plate fusing as having a common boundary, it is characterized in that,
On the fusing travel direction along described cut-out preset lines, described annealing is larger by the size of the irradiation area of laser than described fusing by the size of the irradiation area of laser, and,
With described annealing with the irradiation area of laser across making described annealing overlapping with the irradiation area of laser and the irradiation area of described fusing use laser to described fusing by the mode of the front and back on the described fusing travel direction of the irradiation area of laser.
9. glass plate cutting-off method according to claim 8, is characterized in that,
Described glass plate is separated into He Fei product department of product department by fusing, and described annealing is more partial to this side of described product department with the irradiation area of laser compared with this side of described non-product department and is formed.
10. glass plate cutting-off method according to claim 8 or claim 9, is characterized in that,
Described fusing is leaned on the position of the front side on described fusing travel direction with the irradiation area of laser in the described annealing than on described fusing travel direction with the center of the irradiation area of laser, overlapping with the irradiation area of laser with described annealing.
Glass plate cutting-off method in 11. according to Claim 8～10 described in any one, is characterized in that,
Described annealing forms elongated shape long on described fusing travel direction with the irradiation area of laser.
12. glass plate cutting-off methods according to claim 11, is characterized in that,
Described annealing is irradiated the surface of described glass substrate from the direction tilting with laser.
Glass plate cutting-off method in 13. according to Claim 8～12 described in any one, is characterized in that,
Described fusing is different with swashing light wavelength with swashing light wavelength and described annealing.
14. glass plate cutting-off methods according to claim 13, is characterized in that,
Described fusing is the light beam that is vibrated and by mutually different oscillator with laser beam and described annealing laser beam.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011202143 | 2011-09-15 | ||
| JP2011202144 | 2011-09-15 | ||
| JP2011-202144 | 2011-09-15 | ||
| JP2011-202143 | 2011-09-15 | ||
| JP2011203300A JP5825551B2 (en) | 2011-09-15 | 2011-09-16 | Glass plate cutting method and glass plate cutting device |
| JP2011-203300 | 2011-09-16 | ||
| PCT/JP2012/073718 WO2013039230A1 (en) | 2011-09-15 | 2012-09-14 | Method for cutting glass sheet |
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| CN103608146A true CN103608146A (en) | 2014-02-26 |
| CN103608146B CN103608146B (en) | 2016-01-13 |
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| KR (1) | KR20140062427A (en) |
| CN (1) | CN103608146B (en) |
| TW (1) | TWI587955B (en) |
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| CN109455916A (en) * | 2017-09-06 | 2019-03-12 | 三星钻石工业股份有限公司 | The residual stress of glass substrate, which reduces method and residual stress, reduces device |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20140062427A (en) | 2014-05-23 |
| TW201328808A (en) | 2013-07-16 |
| CN103608146B (en) | 2016-01-13 |
| TWI587955B (en) | 2017-06-21 |
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