CN103607848A - Method for improving solder resist alignment accuracy of printed-circuit board - Google Patents
Method for improving solder resist alignment accuracy of printed-circuit board Download PDFInfo
- Publication number
- CN103607848A CN103607848A CN201310607715.9A CN201310607715A CN103607848A CN 103607848 A CN103607848 A CN 103607848A CN 201310607715 A CN201310607715 A CN 201310607715A CN 103607848 A CN103607848 A CN 103607848A
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- CN
- China
- Prior art keywords
- circuit board
- welding resistance
- periphery
- printed circuit
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 title abstract 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 68
- 238000011161 development Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 abstract 2
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a method for improving solder resist alignment accuracy of a printed-circuit board. The method includes the following steps that firstly, when circuitous patterns for manufacturing the printed-circuit board transfer, solder resist alignment points are correspondingly manufactured in the periphery of the printed-circuit board and the periphery of a circuit film in a one-to-one mode; secondly, the solder resist alignment points in the periphery of the circuit film are used for manufacturing solder resist alignment points in the periphery of a solder resist film, and before solder resist manufacturing, an automatic punching machine is used for punching positioning holes in the periphery of the printed-circuit board with the solder resist alignment points as centers of circles. Meanwhile, corresponding solder resist positioning holes are punched in the periphery of the solder resist film with the solder resist alignment points as centers of circles. The aperture of the positioning holes in the periphery of the printed-circuit board is equal to the aperture of the positioning holes in the periphery of the solder resist film. The method for improving the solder resist alignment accuracy of the printed-circuit board is reasonable in design and highest in alignment precision of the circuit film and the printed-circuit board. Screws are used for assisting positioning of the circuit film and the printed-circuit board, so that the circuit film and the printed-circuit board can be aligned more accurately and rapidly.
Description
Technical field
The present invention relates to the contraposition exposure of circuit in a kind of printed circuit board manufacturing process and welding resistance operation, specifically relate to a kind of for improving the method for printed circuit board welding resistance aligning accuracy.
Background technology
During existing printed circuit board exposure, first at circuit film periphery, get location hole, according to the location hole on the luxuriant and rich with fragrance road of circuit, at printed circuit board periphery and welding resistance film periphery, get location hole again, because printed circuit board is through exposure, development, plating and etching work procedure, cause printed circuit board to expand with heat and contract with cold, and all can have deviation when digital control hole drilling, and cause the relative welding resistance film of the position of positioning hole periphery location hole of printed circuit board periphery to change, locate just inaccurate.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of, printed circuit board and welding resistance film aligning accurate method that precision high fast to bit rate.
The object of the present invention is achieved like this.
A kind of for improving the method for printed circuit board welding resistance aligning accuracy, when A, printed circuit board are made circuitous pattern transfer, printed circuit board by exposure, development, plating and etching work procedure after, the periphery of printed circuit board periphery and the circuit film one by one respective production go out welding resistance loci; B, by the welding resistance loci of circuit film periphery, at welding resistance film periphery, make welding resistance loci again, make before welding resistance, printed circuit board periphery be take welding resistance loci and with automatic punch machine, is gone out location hole as the center of circle, simultaneously welding resistance film periphery also be take welding resistance loci and as the center of circle, is gone out corresponding welding resistance location hole, and the aperture of printed circuit board periphery location hole is consistent with welding resistance film periphery location hole aperture; When C, welding resistance contraposition, in the location hole of welding resistance film periphery, be pressed into screw, then the welding resistance film is fitted in to printed circuit board surface, screw one end penetrates in the location hole that printed circuit board is corresponding, complete after printed circuit board and the laminating of welding resistance film aligning, be placed in exposure machine and expose, then throw off the welding resistance film after exposure, welding resistance contraposition exposure process completes.
The inventive method is reasonable in design, the welding resistance loci of first finding out according to circuit film periphery, at printed circuit board periphery and welding resistance film periphery, make one by one welding resistance loci respectively again, due to every printed circuit board tow sides each can printed circuit, therefore, printed circuit board tow sides are respectively established four welding resistance loci, double-edged welding resistance is to putting the setting of staggering, film plate periphery is made four anchor points, after circuit board carry circuit to be printed is made, according to welding resistance loci position, the location hole of printed circuit board and welding resistance film periphery is made again before welding resistance, both contrapositions are accurately the highest like this.Because the present invention is first in printed circuit board and welding resistance film periphery loci processed, circuit board to be printed is covered all process steps before welding resistance contraposition, by loci, rush location hole again, reduce the possibility that printed circuit board periphery position of positioning hole changes, make the change in location of it and welding resistance film periphery location hole very little, make their contrapositions more accurately and quick.
Embodiment
Below by embodiment, the invention will be further described again.
Embodiment, a kind of for improving the method for printed circuit board welding resistance aligning accuracy, it is characterized in that:
When A, printed circuit board make circuitous pattern and shift, printed circuit board by exposure, development, plating and etching work procedure after, the periphery of printed circuit board periphery and the circuit film one by one respective production go out welding resistance loci; B, by the welding resistance loci of circuit film periphery, at welding resistance film periphery, make welding resistance loci again, make before welding resistance, printed circuit board periphery be take welding resistance loci and with automatic punch machine, is gone out location hole as the center of circle, simultaneously welding resistance film periphery also be take welding resistance loci and as the center of circle, is gone out corresponding welding resistance location hole, and the aperture of printed circuit board periphery location hole is consistent with welding resistance film periphery location hole aperture; When C, welding resistance contraposition, in the location hole of welding resistance film periphery, be pressed into screw, then the welding resistance film is fitted in to printed circuit board surface, screw one end penetrates in the location hole that printed circuit board is corresponding, complete after printed circuit board and the laminating of welding resistance film aligning, be placed in exposure machine and expose, then throw off the welding resistance film after exposure, welding resistance contraposition exposure process completes.
Claims (1)
1. one kind for improving the method for printed circuit board welding resistance aligning accuracy, it is characterized in that: when A, printed circuit board are made circuitous pattern transfer, printed circuit board by exposure, development, plating and etching work procedure after, the periphery of printed circuit board periphery and the circuit film one by one respective production go out welding resistance loci; B, by the welding resistance loci of circuit film periphery, at welding resistance film periphery, make welding resistance loci again, make before welding resistance, printed circuit board periphery be take welding resistance loci and with automatic punch machine, is gone out location hole as the center of circle, simultaneously welding resistance film periphery also be take welding resistance loci and as the center of circle, is gone out corresponding welding resistance location hole, and the aperture of printed circuit board periphery location hole is consistent with welding resistance film periphery location hole aperture; When C, welding resistance contraposition, in the location hole of welding resistance film periphery, be pressed into screw, then the welding resistance film is fitted in to printed circuit board surface, screw one end penetrates in the location hole that printed circuit board is corresponding, complete after printed circuit board and the laminating of welding resistance film aligning, be placed in exposure machine and expose, then throw off the welding resistance film after exposure, welding resistance contraposition exposure process completes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310607715.9A CN103607848A (en) | 2013-11-27 | 2013-11-27 | Method for improving solder resist alignment accuracy of printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310607715.9A CN103607848A (en) | 2013-11-27 | 2013-11-27 | Method for improving solder resist alignment accuracy of printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103607848A true CN103607848A (en) | 2014-02-26 |
Family
ID=50126032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310607715.9A Pending CN103607848A (en) | 2013-11-27 | 2013-11-27 | Method for improving solder resist alignment accuracy of printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103607848A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN104526758A (en) * | 2014-11-06 | 2015-04-22 | 深圳崇达多层线路板有限公司 | Method for controlling positioning precision of PCB drill holes |
| CN106061108A (en) * | 2016-08-12 | 2016-10-26 | 广德新三联电子有限公司 | Printed circuit board welding prevention counterpoint structure |
| CN110324971A (en) * | 2019-04-29 | 2019-10-11 | 惠州中京电子科技有限公司 | A kind of production method that LED board overall dimensions precision improves |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090205854A1 (en) * | 2008-02-15 | 2009-08-20 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board for a package and manufacturing method thereof |
| CN102802363A (en) * | 2012-08-27 | 2012-11-28 | 长沙牧泰莱电路技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
-
2013
- 2013-11-27 CN CN201310607715.9A patent/CN103607848A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090205854A1 (en) * | 2008-02-15 | 2009-08-20 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board for a package and manufacturing method thereof |
| CN102802363A (en) * | 2012-08-27 | 2012-11-28 | 长沙牧泰莱电路技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN104526758A (en) * | 2014-11-06 | 2015-04-22 | 深圳崇达多层线路板有限公司 | Method for controlling positioning precision of PCB drill holes |
| CN106061108A (en) * | 2016-08-12 | 2016-10-26 | 广德新三联电子有限公司 | Printed circuit board welding prevention counterpoint structure |
| CN106061108B (en) * | 2016-08-12 | 2018-12-28 | 广德新三联电子有限公司 | A kind of anti-welding aligning structure of printed circuit board |
| CN110324971A (en) * | 2019-04-29 | 2019-10-11 | 惠州中京电子科技有限公司 | A kind of production method that LED board overall dimensions precision improves |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140226 |