CN103600875B - Take off and cover lid arrangement - Google Patents
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- CN103600875B CN103600875B CN201310571927.6A CN201310571927A CN103600875B CN 103600875 B CN103600875 B CN 103600875B CN 201310571927 A CN201310571927 A CN 201310571927A CN 103600875 B CN103600875 B CN 103600875B
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Abstract
本发明涉及集成电路芯片处理技术领域,公开了一种揭盖合盖装置,用于对芯片盒的盖子进行合盖和揭盖动作,芯片盒包括底座、底座上设置的芯片容置腔以及底座两侧上端设置的卡扣,卡扣的内侧设有卡扣头,卡扣的外侧设有弧形凹面;盖子包括两侧设置的卡槽,卡槽用于与卡扣头相配合,揭盖合盖装置还包括气缸以及固定设置在气缸下端的压块槽,在压块槽的两侧分别设置两个J字形钩爪,两个钩爪之间分别与芯片盒上两个卡扣的弧形凹面配合实现卡扣的开合,在压块槽内设置压块,在压块的下端设置吸盘,吸盘由一个真空气路控制,当气缸下压直至吸盘至盖子上表面时,钩爪位于将卡扣打开的位置。本发明通过机械钩爪和气缸实现全机械化操作。
The invention relates to the technical field of integrated circuit chip processing, and discloses an uncovering and closing device, which is used for closing and uncovering the lid of a chip box. The chip box includes a base, a chip accommodating cavity set on the base, and the base The upper ends of the buckles on both sides are provided with a buckle head on the inner side of the buckle, and an arc-shaped concave surface is arranged on the outside of the buckle; the cover includes a slot on both sides, and the slot is used to cooperate with the buckle head. The lid closing device also includes a cylinder and a briquetting groove fixedly arranged at the lower end of the cylinder. Two J-shaped claws are respectively arranged on both sides of the briquetting groove. The opening and closing of the buckle is realized by matching the concave surface of the shape. A pressure block is set in the pressure block groove, and a suction cup is set at the lower end of the pressure block. The suction cup is controlled by a vacuum air circuit. When the cylinder is pressed down until the suction cup reaches the upper surface of the cover, the claw is located The position where the clasp is opened. The present invention realizes fully mechanized operation through mechanical claws and air cylinders.
Description
技术领域 technical field
本发明涉及集成电路芯片处理技术领域,特别是一种揭盖合盖装置。 The invention relates to the technical field of integrated circuit chip processing, in particular to an uncovering and closing device.
背景技术 Background technique
芯片在检测前要放置于芯片盒中进行送检移动,在这个过程中,要对芯片盒进行封盖,芯片盒的盖子与芯片盒相匹配,由于将盖子盖在芯片盒上以及从芯片盒上取下盖子都是一个较为复杂的动作,现有的这个过程都是在人工干预下进行的,而在生产线上,人工干预不仅降低了生产效率,而且引起诸多不利因素。 Before testing, the chip should be placed in the chip box for inspection and movement. During this process, the chip box should be sealed. The cover of the chip box matches the chip box. Lifting and removing the cover is a relatively complicated action. The existing process is all carried out under manual intervention. On the production line, manual intervention not only reduces production efficiency, but also causes many unfavorable factors.
发明内容 Contents of the invention
本发明的目的是为了解决上述技术问题,提供一种揭盖合盖装置,通过钩爪与气缸的配合实现芯片盒的揭盖合盖动作。 The object of the present invention is to solve the above-mentioned technical problems, and to provide a cover-uncovering and closing device, which realizes the cover-uncovering and closing action of the chip box through the cooperation of the claw and the cylinder.
本发明采取的技术方案是: The technical scheme that the present invention takes is:
一种揭盖合盖装置,用于对芯片盒的盖子进行合盖和揭盖动作,其特征是,所述芯片盒包括底座、底座上设置的芯片容置腔以及所述底座两侧上端设置的卡扣,所述卡扣的内侧设有卡扣头,所述卡扣的外侧设有弧形凹面;所述盖子与所述芯片盒配合,所述盖子包括两侧设置的卡槽,所述卡槽用于与所述卡扣头相配合,所述揭盖合盖装置还包括气缸以及固定设置在所述气缸下端的压块槽,在所述压块槽的两侧分别设置两个J字形钩爪,所述两个钩爪之间分别与所述芯片盒上两个卡扣的弧形凹面配合实现所述卡扣的开合,在所述压块槽内设置压块,在所述压块的下端设置吸盘,所述吸盘由一个真空气路控制,当所述气缸下压直至所述吸盘至所述盖子上表面时,所述钩爪位于将所述卡扣打开的位置。 An uncovering and closing device, used for closing and uncovering the lid of a chip box, characterized in that the chip box includes a base, a chip accommodating cavity set on the base, and the upper ends of both sides of the base set buckle, the inner side of the buckle is provided with a buckle head, and the outer side of the buckle is provided with an arc-shaped concave surface; the cover is matched with the chip box, and the cover includes a slot provided on both sides, so The card slot is used to cooperate with the buckle head, and the cover uncovering and closing device also includes a cylinder and a briquetting groove fixedly arranged at the lower end of the cylinder, and two J-shaped hook claws, the two hook claws cooperate with the arc-shaped concave surfaces of the two buckles on the chip box respectively to realize the opening and closing of the buckles, and a briquetting block is arranged in the briquetting block groove. The lower end of the pressure block is provided with a suction cup, and the suction cup is controlled by a vacuum circuit. When the cylinder is pressed down until the suction cup reaches the upper surface of the cover, the hook is in the position to open the buckle .
进一步,所述压块可滑动设置在所述压块槽内,所述压块与所述压块槽的上底面之间设有一个压缩弹簧。 Further, the pressing block is slidably arranged in the pressing block groove, and a compression spring is provided between the pressing block and the upper bottom surface of the pressing block groove.
进一步,所述压块槽包括上底板和槽体,所述上底板与所述气缸固定连接,所述槽体与所述上底板固定连接,在所述上底板的下表面设有密封圈,当进行揭盖动作时,所述盖子上表面、吸盘、压块、上底板的下表面以及密封圈形成真空。 Further, the briquetting tank includes an upper base plate and a tank body, the upper base plate is fixedly connected to the cylinder, the tank body is fixedly connected to the upper base plate, and a sealing ring is provided on the lower surface of the upper base plate, When the cover is uncovered, the upper surface of the cover, the suction cup, the pressure block, the lower surface of the upper bottom plate and the sealing ring form a vacuum.
进一步,在所述盖子的下表面设置定位销,在所述芯片盒上设有定位孔,当所述盖子在所述芯片盒上合盖时,所述定位销配合至所述定位孔内。 Further, a positioning pin is provided on the lower surface of the cover, and a positioning hole is provided on the chip box, and when the cover is closed on the chip box, the positioning pin fits into the positioning hole.
进一步,在所述盖子的下表面设有多个吹气孔,所述吹气孔由一个吹气气路控制,当所述盖子刚被揭开时,所述吹气孔进行吹气。 Further, a plurality of air blowing holes are provided on the lower surface of the cover, and the air blowing holes are controlled by an air blowing circuit, and when the cover is just opened, the air blowing holes are used for blowing air.
进一步,所述吹气孔从所述盖子的侧边引出。 Further, the blowing holes are led out from the side of the cover.
进一步,所述盖子上表面设有压头,所述压头与所述芯片容置腔相对应。 Further, an indenter is provided on the upper surface of the cover, and the indenter corresponds to the chip accommodating cavity.
本发明的有益效果是: The beneficial effects of the present invention are:
(1)通过机械钩爪和气缸实现全机械化操作; (1) Fully mechanized operation is realized through mechanical claws and cylinders;
(2)通过吹气气路,可以防止芯片粘着在盖子上; (2) By blowing the air path, the chip can be prevented from sticking to the cover;
(3)压块内的压缩弹簧在揭盖和合盖时提供机械缓冲。 (3) The compression spring in the pressing block provides mechanical buffer when the cover is opened and closed.
附图说明 Description of drawings
附图1为本发明的结构爆炸示意图; Accompanying drawing 1 is the structural explosion schematic diagram of the present invention;
附图2为本发明的装配结构示意图; Accompanying drawing 2 is the assembly structure schematic diagram of the present invention;
附图3为压块槽的上底板内密封圈的位置示意图; Accompanying drawing 3 is the schematic diagram of the position of the sealing ring in the upper bottom plate of the briquetting groove;
附图4为芯片盒及盖子的位置结构剖视图; Accompanying drawing 4 is the sectional view of the position structure of chip box and cover;
附图5为盖有盖子的芯片盒的立体结构示意图。 Accompanying drawing 5 is the three-dimensional structure diagram of the chip box covered with the cover.
附图中的标记分别为: The marks in the accompanying drawings are:
1.气缸; 2.压块槽; 1. Cylinder; 2. Briquetting groove;
3.上底板; 4.槽体; 3. Upper floor; 4. Tank body;
5.密封圈; 6.钩爪; 5. Sealing ring; 6. Hook;
7.压块; 8.压缩弹簧; 7. Briquetting; 8. compressed spring;
9.吸盘; 10.芯片盒; 9. sucker; 10. chip box;
11.底座; 12.芯片容置腔; 11. Base; 12. Chip holding chamber;
13.卡扣; 14.盖子; 13. buckle; 14. cover;
15.卡槽; 16.侧边孔; 15. card slot; 16. side hole;
17.压头。 17. pressure head.
具体实施方式 Detailed ways
下面结合附图对本发明揭盖合盖装置的具体实施方式作详细说明。 The specific implementation of the uncovering and closing device of the present invention will be described in detail below in conjunction with the accompanying drawings.
参见附图1、2,揭盖合盖装置用于对芯片盒的盖子进行合盖和揭盖动作,包括气缸1以及固定设置在气缸1下端的压块槽2,压块槽2的上底板3通过紧固件与气缸1固定连接,压块槽2的槽体4也通过紧固件与上底板3固定连接,在上底板3的下表面设有密封圈5(参见附图3)。在压块槽2的槽体4的两侧分别设置两个J字形钩爪6,两个钩爪6的上端开有长槽,通过紧固螺钉固定在槽体4的两侧,长槽的设计可以对钩爪6的上下位置进行调节。两个钩爪6的钩头向槽体4的内侧相对设置。在压块槽2内设置压块7,压块7可以在槽体4内滑动,在上底板3和压块7之间安装一个压缩弹簧8,在压块7的下端设置吸盘9,由一个真空气路控制实现压盘内的真空度。当压块7压紧于上底板3上的密封圈5时,吸盘、压块、上底板的下表面以及密封圈围成一个密闭空间。 Referring to accompanying drawings 1 and 2, the cover-opening and closing device is used for closing and uncovering the lid of the chip box, including the cylinder 1 and the briquetting groove 2 fixedly arranged at the lower end of the cylinder 1, and the upper bottom plate of the briquetting groove 2 3 is fixedly connected with the cylinder 1 through fasteners, and the tank body 4 of the press block groove 2 is also fixedly connected with the upper bottom plate 3 through fasteners, and a sealing ring 5 is provided on the lower surface of the upper bottom plate 3 (see Figure 3). Two J-shaped hook claws 6 are respectively arranged on both sides of the groove body 4 of the briquetting groove 2, and the upper ends of the two hook claws 6 are provided with long grooves, which are fixed on both sides of the groove body 4 by fastening screws. The design can adjust the up and down position of the claw 6. The hook heads of the two claws 6 are arranged oppositely to the inboard of the groove body 4 . A briquetting block 7 is set in the briquetting block groove 2, and the briquetting block 7 can slide in the groove body 4. A compression spring 8 is installed between the upper base plate 3 and the briquetting block 7, and a suction cup 9 is set at the lower end of the briquetting block 7. Vacuum air circuit control realizes the vacuum degree in the platen. When the briquetting block 7 is pressed tightly on the sealing ring 5 on the upper base plate 3, the suction cup, the briquetting block, the lower surface of the upper base plate and the sealing ring form a closed space.
参见附图4、5,芯片盒10包括底座11、底座11上设置的芯片容置腔12以及底座11两侧上端设置的卡扣13,卡扣13的内侧设有卡扣头,卡扣13的外侧设有弧形凹面;盖子14与芯片盒10配合,用于将芯片盒10上的容置腔12内的芯片封闭,盖子14包括两侧设置的卡槽15,卡槽15与卡扣头相配合,卡扣13向内翻动时,卡扣头与卡槽15配合,实现盖子14与芯片盒10的合盖,卡扣13向外翻动时,卡扣头与卡槽14脱离,盖子14与芯片盒10松开,可以拿出盖子14。盖子14的下表面设置定位销,在芯片盒10上设有定位孔,当盖子14在芯片盒10上合盖时,定位销配合至定位孔内,实现精确合盖。在盖子14的下表面设有多个吹气孔,吹气孔由一个吹气气路控制,吹气孔从盖子14的侧边孔16中引出至吹气气路。盖子14上设有与芯片容置腔12相对应的压头17,实现对芯片容置腔12内芯片的封压。 Referring to accompanying drawings 4 and 5, the chip box 10 includes a base 11, a chip accommodating cavity 12 provided on the base 11, and buckles 13 provided on both sides of the base 11. The inside of the buckle 13 is provided with a buckle head, and the buckle 13 The outer side is provided with an arc-shaped concave surface; the cover 14 cooperates with the chip box 10, and is used to close the chip in the accommodating cavity 12 on the chip box 10, and the cover 14 includes a slot 15 provided on both sides, and the slot 15 is connected with the buckle When the buckle 13 is turned inward, the buckle head cooperates with the slot 15 to close the cover 14 and the chip box 10. When the buckle 13 is turned outward, the buckle head is separated from the slot 14, and the lid 14 is unclamped with chip box 10, and cover 14 can be taken out. Positioning pins are arranged on the lower surface of the cover 14, and positioning holes are provided on the chip box 10. When the cover 14 is closed on the chip box 10, the positioning pins fit into the positioning holes to realize accurate closing. The lower surface of the cover 14 is provided with a plurality of blowing holes, the blowing holes are controlled by a blowing air path, and the blowing holes are drawn from the side hole 16 of the cover 14 to the blowing air path. A pressure head 17 corresponding to the chip accommodating cavity 12 is provided on the cover 14 to realize sealing and pressing of the chip in the chip accommodating cavity 12 .
两个钩爪6之间的距离与两个卡扣13之间的距离相匹配,当钩爪6从卡扣13的上方向下移动时,钩爪6的J字形钩头挤压卡扣13的弧形凹面,使卡扣13向外翻转,松开芯片盒10上的盖子14。当钩爪6从卡扣13的下方向上移动时,钩爪6的J字形钩头提拉卡扣13的弧形凹面,使卡扣13向内翻转,卡扣13扣入卡槽15内,实现盖子14在芯片盒10上的合盖。 The distance between the two claws 6 matches the distance between the two buckles 13. When the claws 6 move downward from the top of the buckles 13, the J-shaped head of the claws 6 squeezes the buckles 13 The arc-shaped concave surface of the chip box 10 is turned outward so that the buckle 13 is turned outward, and the cover 14 on the chip box 10 is released. When the claw 6 moves upward from the bottom of the buckle 13, the J-shaped hook head of the claw 6 pulls the arc-shaped concave surface of the buckle 13, so that the buckle 13 is turned inward, and the buckle 13 is buckled in the slot 15. The closing of the cover 14 on the chip box 10 is realized.
本装置的揭盖的工作过程是,首先将盖有盖子的芯片盒移动本装置工作预定位置后,驱动气缸下压,吸盘接触压合盖子后,气缸继续作用下压,这时压缩弹簧受到压块的压力而压缩,两个钩爪与卡后配合开始打开卡扣,而压块继续压缩弹簧直至压块与压块槽的上底板上的密封圈配合,将密封圈压缩至弹性变形从而实现密封,这时,盖子上表面、吸盘、压块、上底板的下表面以及密封圈形成密闭空间。此时,钩爪将卡扣全部打开。这时开启真空气路,所述密闭空间内形成真空负压,吸盘将盖子紧紧吸合,由于真空压力的作用使得密封圈弹性变形,使得盖子不再压合芯片盒的容置空间内的芯片,其与底座反而留出一定微量的间隙,在底座上设置的真空压力开关检测到此信号后开启吹气气路工作,将一些可能粘连在盖子压头上的芯片吹离,保证芯片不会带出且移位。然后气缸抬起,气缸抬起时,钩爪将卡扣复位,移走芯片盒至下一工序。 The working process of uncovering the cover of this device is, firstly, after moving the chip box covered with the cover to the predetermined working position of the device, the cylinder is driven to press down, and after the suction cup touches and presses the cover, the cylinder continues to press down, and at this time the compression spring is pressed Compressed by the pressure of the block, the two claws cooperate with the card and start to open the buckle, and the pressure block continues to compress the spring until the pressure block cooperates with the sealing ring on the upper bottom plate of the pressure block groove, compressing the sealing ring to elastic deformation to achieve Sealing, at this time, the upper surface of the cover, the suction cup, the pressing block, the lower surface of the upper bottom plate and the sealing ring form a closed space. At this time, the claws will fully open the buckle. At this time, the vacuum air circuit is opened, and a vacuum negative pressure is formed in the closed space, and the suction cup tightly sucks the cover, and the sealing ring is elastically deformed due to the vacuum pressure, so that the cover is no longer pressed against the cavity in the accommodating space of the chip box. There is a slight gap between the chip and the base. The vacuum pressure switch set on the base detects this signal and starts the air blowing circuit to blow off some chips that may be stuck on the cover pressure head to ensure that the chips are not damaged. will be brought out and shifted. Then the cylinder is lifted, and when the cylinder is lifted, the claw will reset the buckle, and remove the chip box to the next process.
本装置合盖的工作过程是,将芯片在芯片盒中装料完成后移动至本装置下方的预定位置,气缸通过真空压力吸附盖子。气缸带着盖子下压,钩爪先接触卡扣将卡扣打开,然后继续下降使得盖子的压头接触芯片,并在气缸作用下进一步下降后,盖子与底座完全贴合到位。关闭真空气路,压块由于没有负压的支持,其在弹簧的作用下,对盖子施压。驱动气缸上抬,由于弹簧的弹性变形,当钩爪离开卡扣过程中,盖子与底座始终完全贴合,当钩爪完全离开后,卡扣被钩爪提拉到锁紧位置抱死盖子,气缸进一步抬离,整个装置脱离芯片合,完成合盖动作,然后移动芯片盒至下一工序如测试位置进行测试。 The working process of closing the cover of this device is to move the chip to the predetermined position under the device after loading the chip box, and the cylinder absorbs the cover by vacuum pressure. The cylinder presses down with the cover, the claw first touches the buckle to open the buckle, and then continues to descend so that the pressure head of the cover touches the chip, and after further descending under the action of the cylinder, the cover and the base are completely fitted in place. Close the vacuum air circuit, and the pressure block exerts pressure on the cover under the action of the spring because there is no negative pressure support. Drive the cylinder to lift up. Due to the elastic deformation of the spring, when the hook leaves the buckle, the cover and the base are always completely attached. When the hook leaves completely, the buckle is pulled to the locked position by the hook to lock the cover. The cylinder is further lifted away, the whole device is separated from the chip and the lid is closed, and then the chip box is moved to the next process such as the test position for testing.
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。 The above is only a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be considered Be the protection scope of the present invention.
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CN106678143A (en) * | 2016-12-06 | 2017-05-17 | 苏州博众精工科技有限公司 | Pressure maintaining mechanism |
CN107140244B (en) * | 2017-06-21 | 2022-07-05 | 苏州宏瑞达新能源装备有限公司 | Product packaging capping manipulator and capping method |
CN110642020A (en) * | 2019-09-27 | 2020-01-03 | 天津市金星空气压缩机制造股份有限公司 | Car light short-distance beam plectrum pan feeding equipment |
CN114572472B (en) * | 2020-12-02 | 2022-11-08 | 中国科学院沈阳自动化研究所 | A fully automatic opening and closing mechanism of a packing box |
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ITTO20060706A1 (en) * | 2006-10-02 | 2008-04-03 | Arol Spa | "HEAD OF SCREWING AND ROLLING FOR THE APPLICATION OF PRE-THREADED CAPS" |
CN101769974B (en) * | 2010-01-14 | 2012-05-23 | 嘉兴景焱智能装备技术有限公司 | Chip testing processor |
JP5427123B2 (en) * | 2010-06-24 | 2014-02-26 | Hoya Candeo Optronics株式会社 | Photo-curing device and adhesive component holding jig |
JP2012204645A (en) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | Lid opening/closing device |
CN102798809B (en) * | 2011-05-27 | 2015-04-22 | 嘉兴景焱智能装备技术有限公司 | Multi-station chip tester |
CN102856412B (en) * | 2012-09-25 | 2015-01-21 | 衡水英利新能源有限公司 | Box cover withholding tool for junction box of solar battery assembly |
CN203568012U (en) * | 2013-11-15 | 2014-04-30 | 嘉兴景焱智能装备技术有限公司 | Cover opening and closing device |
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2013
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Denomination of invention: Uncovering and closing device Effective date of registration: 20230526 Granted publication date: 20150819 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
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Denomination of invention: Uncovering and closing device Granted publication date: 20150819 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2024980018023 |
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Denomination of invention: Opening and closing device Granted publication date: 20150819 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2025980004308 |
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