CN103596729B - Structural member for polishing - Google Patents

Abstract

A structural member for polishing including a supporting member, a polishing material, and an adhesive agent layer bonding these together. The adhesive agent layer includes a polymer of monomers including from 58 to 85 wt% of a first monomer, from 2 to 7 wt% of a second monomer, and from 10 to 40 wt% of a third monomer. The first monomer is an alkyl (meth)acrylate having an alkyl group with carbon counts from 8 to 18 carbon atoms and provides a homopolymer with a glass transition temperature of 0 DEG C or less. The second monomer is a polar monomer that provides a homopolymer with a glass transition temperature of 50 DEG C or greater. The third monomer is an alkyl (meth)acrylate having an alkyl group with carbon counts from 4 to 18 carbon atoms or an aralkyl group having carbon counts from 7 to 18 carbon atoms and provides a homopolymer with a glass transition temperature of 10 DEG C or greater.

Description

Structural components for polishing

technical field

The invention relates to a structural component for polishing.

Background technique

Due to miniaturization of electronic components and increase in precision of optical devices in recent years, there has been a demand for planarization of various substrates used therein (for example, silicon wafers, sapphire wafers, glass substrates used in hard disks, etc.). In addition, planarization of these types of substrates is usually performed with a polishing device with a polishing material adhered to the substrate (platen). At this time, in order to facilitate the machining planarization process, a machining fluid that may include a surfactant or the like is often used.

Adhesion of the polishing pad to the substrate is typically performed by use of double sided adhesive tape. As such a double-sided tape, for example, "Double-sided tape for fixing a polishing material, which is provided with a removable adhesive on one side of a base material and disclosed in Japanese Unexamined Patent Publication No. 2008-111008 A strong adhesive layer is provided on the other side of the base material, wherein the strong adhesive layer is formed of an adhesive comprising a styrene-isoprene-styrene copolymer resin elastic Body as the base elastomer, and including at least petrochemical resin and terpene phenolic resin as tackifying resin, and "Double-sided adhesive tape for fixing polishing material, wherein the base A heat-activated acrylic adhesive layer is provided on one side of the material and a removable adhesive layer is provided on the other surface of the base material". The Japanese version of published PCT patent application 2002-503559 discloses " A polishing article for polishing glass comprising a plurality of integrally formed polishing composites on a base material". The Japanese version of published PCT patent application 2002-542057 discloses "a polishing article comprising at least A three-dimensional finish coating bonded to the surface of the front material and rear material".

In the above-mentioned polishing method, preferably, the polishing material is replaced after the polishing surface is reduced by abrasion to make polishing difficult. The spent polishing material is removed from the polishing device and replaced.

Avoiding as much as possible a situation in which the polishing material needs to be replaced before the surface of the polishing material is used up, it is desired to prevent (a) reduction of stickiness due to penetration of the cutting working fluid into the interface between the polishing material and the double-sided tape holding the polishing material. (b) Peeling occurs due to the load on the adhesive layer of the double-sided tape that fixes the polishing material, etc. during the frictional movement when it is in contact with the object to be polished, etc. for polishing. Note that this peeling is also considered to be due to swelling of the adhesive layer of the double-sided tape holding the polishing material by the working fluid.

An object of the present invention is to provide a structural member for polishing a substrate, which can be used stably for a long period of time, has the ability to maintain sufficient adhesive strength even when soaked in a processing fluid, and sufficiently controls defects caused by the processing fluid. Swollen adhesive layer.

Contents of the invention

One aspect of the present invention relates to a structural member for polishing having a support member, a polishing material, and an adhesive layer bonding the support member and the polishing material; wherein the adhesive layer comprises a monomeric polymer, The monomers include 58% to 85% of the first monomer, 2% to 7% of the second monomer and 10% to 40% of the third monomer; the first monomer is (meth)acrylic acid Alkyl ester, which has an alkyl group having a carbon number of 8 to 18 carbon atoms and provides a homopolymer having a glass transition temperature of 0° C. or lower; the second monomer is a polar monomer, which A homopolymer having a glass transition temperature of 50°C or higher is provided; the third monomer is an alkyl (meth)acrylate having an alkyl group or carbon having a carbon number of 4 to 18 carbon atoms Aralkyl groups numbering from 7 to 18 carbon atoms and providing homopolymers with a glass transition temperature of 10°C or higher.

The adhesive layer in the structural member for polishing includes the above-mentioned polymer, and thus maintains sufficient adhesive strength even when soaked in a working fluid and can sufficiently control swelling due to the working fluid. Because of this, the above-mentioned structural member for polishing makes it possible to prevent delamination of the polishing material and the adhesive layer due to a decrease in adhesive strength, and to prevent delamination of the adhesive layer due to swelling of the adhesive layer. The stripping allows the polishing operation to be performed stably for a long time.

In another aspect, the glass transition temperature of the polymer may be between -25°C and 10°C, between -20°C and 10°C, or even between -15°C and 10°C. An adhesive layer including this type of polymer can sufficiently prevent the adhesive from being squeezed out of the side of the structural member or the like due to the pressure applied at the time of polishing. In addition, the above-mentioned structural member for polishing may have a plurality of polishing materials bonded to the adhesive layer, and at this time gaps may be generated between the polishing materials. The adhesive layer comprising the polymer described above can then sufficiently prevent the adhesive from being extruded into the gaps between the polishing materials.

Also, in another aspect, the polishing material can have a base material and a polishing layer. The polishing layer may comprise a plurality of solid elements arranged in an orderly manner on a base material. The solid element may include a plurality of abrasive particles and their binder.

Also, in another aspect, the thickness of the adhesive layer can be between 50 μm and 500 μm.

In yet another aspect, the structural member for polishing may further have a removable adhesive layer provided on another surface of the support member. This type of structural member for polishing can be easily attached to and removed from the base of the polishing device by means of the removable adhesive layer.

The present invention provides a structural member for polishing that can be used stably for a long time. The structural member has an adhesive layer in which, if soaked with a working fluid, the adhesive strength will be sufficiently maintained and swelling by the working fluid will be sufficiently controlled.

All percentages mentioned herein are by weight unless otherwise indicated.

Description of drawings

Fig. 1(a) is a perspective view, and (b) is a schematic cross-sectional view showing a section on a cross-section line I-I of a structural member for polishing according to a first form of an embodiment.

Fig. 2(a) is a perspective view, and (b) is a schematic cross-sectional view showing a section of a structural member for polishing according to a second form of the embodiment on a cross-section line II-II.

Fig. 3(a) is a perspective view, and (b) is a schematic cross-sectional view showing a section of a structural member for polishing according to a third form of the embodiment on the cross-section line III-III.

Fig. 4 is a schematic cross-sectional view showing a polishing method using the structural member for polishing as described in the second form of the embodiment.

detailed description

Although the embodiments according to the present invention are described in detail below with reference to the drawings, the structural member for polishing according to the present invention is not limited to the following embodiments. Note that in the following description, the same or similar parts are given the same reference numerals, and repeated descriptions are omitted.

Unless otherwise indicated, all numbers expressing characteristic dimensions, quantities and physical properties used in the specification and claims are to be understood in all instances as being modified by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the foregoing specification and attached claims are approximations that can be calculated based on the desired properties sought to be obtained by those skilled in the art utilizing the teachings disclosed herein. Variety. The recitations of numerical ranges by endpoints include all numbers within that range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) and any range within that range.

Fig. 1(a) is a perspective view, and (b) is a schematic cross-sectional view showing a section on a cross-section line I-I of a structural member for polishing 100 according to a first form of an embodiment. The structural member 100 for polishing according to the first form of the embodiment has a supporting member 10, an adhesive layer 12 provided on one face of the supporting member 10, a polishing member bonded to the supporting member 10 through the adhesive layer 12. Material 14 and a layer of removable adhesive 16 disposed on the other face of the support member 10 .

Although there is no particular limitation on the support member 10, the support member 10 can use plastics made of polyester, polyamide, polyurethane, polyethylene, polypropylene, vinyl acetate-ethylene copolymer, polyvinyl chloride, polycarbonate, etc. films; multilayer films in which these plastic films are laminated; foams using polyethylene, polyurethane, synthetic rubber, etc. as main raw materials; woven fabrics, nonwoven fabrics; and the like.

Although there is no particular limitation on the thickness of the support member 10, the thickness of the support member 10 may be between 25 μm and 5,000 μm, or may also be between 50 μm and 2,000 μm.

Adhesive layer 12 includes a polymer of monomers (which may hereinafter be referred to as "monomer component") comprising 58% to 85% of a first monomer (which may hereinafter be referred to as "component ( a)"), 2% to 7% of the second monomer (hereinafter may be referred to as "component (b)"), and 10% to 40% of the third component (hereinafter may be referred to as "component (b)") c)"). Component (a) is an alkyl (meth)acrylate having an alkyl group having a carbon number of 8 to 18 carbon atoms and providing a homopolymer having a glass transition temperature of 0° C. or lower; the component (b) is a polar monomer that provides a homopolymer having a glass transition temperature of 50°C or higher; component (c) is an alkyl (meth)acrylate having a carbon number of 4 to 18 An alkyl group of carbon atoms or an aralkyl group of 7 to 18 carbon atoms and provides a homopolymer having a glass transition temperature of 10° C. or higher. Components (a) to (c) will be described in detail below.

Here, the "glass transition temperature (also written "Tg")" of a homopolymer refers to the temperature at which a hot melt polymer becomes glassy when cooled under a specified set of conditions to pass through a subcooled liquid to a glassy state. In particular, the glass transition temperature of the homopolymer is a value measured based on JIS K7121.

Component (a) is an alkyl (meth)acrylate having an alkyl group with a carbon number between 8 and 18 carbon atoms, which provides a homopolymer having a glass transition temperature not exceeding 0°C monomer. Mixtures of one or more monomers meeting this criterion can be used as component (a).

Component (a) provides sufficient softness and sufficient wettability to adhesive layer 12 relative to support member 10 and polishing material 14 . In addition, component (a) provides hydrophobicity to the adhesive layer 12 to thereby sufficiently prevent the adhesive layer 12 from being swollen by the cutting working fluid.

Component (a) can be 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, (meth) Lauryl acrylate, isomyristyl (meth)acrylate, isohexadecyl (meth)acrylate, 2-octadecyl (meth)acrylate, isostearyl acrylate, and the like. Among them, 2-ethylhexyl acrylate and isooctyl acrylate are preferable from the viewpoint of greatly improving the adhesiveness of the adhesive layer 12 .

Component (a) is included in the monomer component in an amount of between 58% and 85% by weight, preferably between 65% and 80% by weight, based on the total amount of the monomer component. If component (a) is included in an amount of less than 58% by weight, the adhesive layer 12 will not be imparted with sufficient hydrophobicity to sufficiently protect the adhesive layer 12 from being swollen by the processing fluid. In addition, if the component (a) is included in an amount exceeding 85% by weight, the adhesive strength of the adhesive layer 12 will be insufficient in some cases.

Component (b) is a polar monomer which provides a homopolymer in which the glass transition temperature is 50°C or higher. Mixtures of one or more monomers meeting this criterion can be used as component (b).

The cohesive strength of the adhesive layer 12 is increased by the component (b) to provide excellent adhesive properties of bonding the support member 10 and the polishing material 14 to the adhesive layer 12 . Note that in a conventional adhesive layer, even if strong adhesion is obtained to an adherend with a rough surface (for example, polyurethane foam) by the anchoring effect, in some cases, for an adherend with a smooth surface Attachments, if processing fluid (eg, water, etc.) enters the interface with the adherend, detachment will easily occur. However, the adhesive layer 12 exhibits excellent adhesive properties due to the component (b), even for an adherend having a smooth surface. As such, adhesive layer 12 can bond support member 10 and polishing material 14 for extended periods of time, even in the presence of processing fluids.

Component (b) may be, for example: ethylenically unsaturated monomers with functional groups such as sulfo groups; vinyl esters; vinyl amides; N-vinyllactams; (meth)acrylamides; substituted acrylamides such as N-alkyl(meth)acrylamide, N,N-dialkyl(meth)acrylamide, etc.; etc.

Additionally, component (b) may be: acrylic acid, methacrylic acid, itaconic acid, maleic acid, styrenesulfonic acid, acryloxyethyl phthalate, acryloxypropyl phthalate , maleic acid, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-tert-butyl(meth)acrylamide, N,N-iso Propyl (meth)acrylamide, N-tert-alkyl (meth)acrylamide, N,N-dimethylaminoethyl (meth)acrylamide, N-N-dimethylaminopropyl (methyl) Acrylamide, diacetone acrylamide, (meth)acrylonitrile or N-vinylpyrrolidone; or N-vinylcaprolactam, etc. Among them, due to the particularly excellent adhesive strength and cohesive strength of the adhesive layer 12, it is preferable to include at least one kind of acid-functional monomer, and among them, (meth)acrylic acid and phthalic acid (meth)acrylic acid are particularly preferable. ) Acryloyloxyethyl ester.

Component (b) is included in the monomer component in an amount between 2% and 7% by weight, preferably between 3% and 6% by weight, based on the total weight of the monomer component. If the amount of component (b) is less than 2% by weight, it will be impossible to obtain sufficient adhesive strength in the adhesive layer 12 in some cases, in particular, it will be impossible to obtain sufficient adhesion to smooth surfaces. combined strength. Also, if the purpose is solely to increase the adhesive strength, it would be beneficial to increase the amount of component (b), but one of the purposes of the present invention is to control the swelling by the processing fluid as described above. Including component (b) in an amount within the above range will make it possible to obtain both excellent adhesive strength and control of swelling caused by the working fluid.

Component (c) is an alkyl (meth)acrylate having an alkyl group with a carbon number between 4 carbon atoms and 18 carbon atoms or a carbon number between 7 carbon atoms and 18 carbon atoms Aralkyl groups between atoms and are monomers that give homopolymers with a glass transition temperature of 10°C or higher. Mixtures of one or more monomers meeting these criteria may be used as component (c).

Component (c) is capable of controlling the glass transition temperature of the polymer while maintaining hydrophobicity. Because of this, the component (c) allows the adhesive layer 12 to obtain both sufficient hydrophobicity and sufficient adhesive strength.

Component (c) can be tert-butyl (meth)acrylate, n-butyl methacrylate, isobutyl methacrylate or other linear or branched alkyl (meth)acrylates; alicyclic alkyl ( Meth)acrylates such as cyclohexyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acrylate or isobornyl (meth)acrylate; and the like.

Component (c) is included in the monomer component in an amount between 10% and 40% by weight, preferably between 20% and 40% by weight, based on the total weight of the aforementioned monomer components. If the component (c) is included in an amount of less than 10% by weight, the glass transition temperature of the polymer will not be sufficiently increased, and sufficient adhesive strength cannot be obtained. Also, if it is higher than 40% by weight, the glass transition temperature of the polymer will be too high, which may make adhesion difficult.

The monomer component may contain monomers other than components (a) to (c). For example, the monomer component can include a crosslinking monomer.

The crosslinking monomer is a monomer having a plurality of functional groups in which radical polymerization can occur, such as (meth)acryloyl functional groups and the like. The crosslinking monomer forms a crosslinking structure in the polymer to further increase the cohesion of the adhesive layer 12 .

The crosslinking monomer can be a multifunctional (meth)acrylate monomer such as 1,2-ethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6 -Hexanediol di(meth)acrylate and the like.

The amount of the crosslinking monomer included in the above-mentioned monomer component is preferably between 0.01% by weight and 2% by weight, more preferably between 0.02% by weight and 1% by weight, based on the total weight of the monomer component .

In addition to those listed above (except for component (a), component (b), component (c) and cross-linking monomers). The other monomers are preferably included in an amount not exceeding 15% by weight based on the total weight of the monomer component.

The other monomers may be, for example: acrylic monomers such as benzyl acrylate, pentamethylpiperidinyl methacrylate, N,N-dimethylaminoethyl acrylate, 3-ethacryloyloxypropyl Dimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxy Propyltriethoxysilane and 3-acryloxypropyltrimethoxysilane; vinyl monomers such as vinyl acetate, vinyl propionate, branched chain alkane carboxylate vinyl ester, styrene, vinylpyridine, Vinylimidazole; etc.

The polymer included in the adhesive layer 12 may be formed by polymerizing the monomer components in the presence of a polymerization initiator. Although the polymerization method of the monomer component is not particularly limited, it can be a standard free radical polymerization method, such as solvent polymerization, emulsion polymerization, suspension polymerization or bulk polymerization.

The polymerization of the foregoing monomer components can be carried out by a thermal polymerization method using a thermal polymerization initiator. The thermal polymerization initiator may be, for example, an organic peroxide such as benzoyl peroxide; tert-butyl perbenzoate, cumene hydroperoxide, diisopropyl peroxydicarbonate; di-n-propyl peroxydicarbonate, Bis(2-ethoxyethyl) peroxydicarbonate; tert-butyl peroxyneodecanoate, tert-butyl peroxypivalate, (3,5,5-trimethylhexanoyl peroxide), Dipropionyl peroxide or diacetyl peroxide; azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 1,1'- Azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethyl-4 -methoxyvaleronitrile), dimethyl 2,2'-azobis(2-methylpropionate), 4,4'-azobis(4-cyanovaleric acid), 2,2' - azobis(2-hydroxymethylpropionitrile) or 2,2'-azobis[2-(2-imidazolin-2-yl)propane; and the like.

The aforementioned polymerization of the monomer components can also be performed by photopolymerization using a photopolymerization initiator. In particular, the polymer can be obtained by polymerizing a monomer compound which has been mixed together and which comprises a photopolymerization initiator, by irradiating said mixture with activating radiation, such as ultraviolet (UV) radiation.

The photopolymerization initiator can be, for example: acetophenone, diethoxyacetophenone, 2-[4-(methylthio)-methyl-phenyl]-2-morpholinoacetone, benzoin, benzoin ethyl ether, Benzylmethylketal, benzophenone, 2-ethylanthraquinone, thioxanthone, diethylthioxanthone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide (such as "Lucirin ^TM TPO" manufactured by BASF), 2,4,6-trimethylbenzoyldiethoxyphosphine oxide (such as "Lucirin ^TM TPO-L"" manufactured by BASF ), bis(2,4,6-trimethylbenzoyl)phenylphosphine (such as "IRGACURE ^TM 819", manufactured by Chiba, Japan), 2-hydroxy-methyl-1-benzene Propan-1-one (such as "DAROCURE ^TM 1173", produced by Ciba, Japan), 4-(2-hydroxyethoxy) phenyl (2-hydroxy-propyl) ketone (such as " IRGACURE ^TM 2959", produced by Ciba Corporation (Chiba, Japan), 4-(2-acryloyloxyethoxy)phenyl-(2-hydroxy-propyl)ketone, 1-hydroxycyclohexyl (such as "IRGACURE ^TM 184", produced by Ciba, Japan), 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 1-(4-deca Dialkylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-methyl-2-morpholinyl-(4-thiomethylphenylpropan-1-one (such as "IRGACURE ^TM 907", produced by Chiba, Japan), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone (such as "IRGACURE ^TM 369", (manufactured by Chiba, Japan), N,N'-bisoctylene acridine (such as "ADEKAOptomer ^TM N1717"), acryloyl benzophenone (such as "DaicelUCBEbercryl ^TM P36"), etc.

The polymer included in the adhesive layer 12 may be crosslinked by a crosslinking agent. The crosslinking agent is preferably a compound capable of forming a crosslinked structure with, for example, a functional group in a polymer. This compound may be, for example, polyfunctional isocyanate, epoxy compound, aziridine compound, or the like. The crosslinking agent is preferably added in an amount between 0.01 and 3 parts by weight, preferably in an amount between 0.1 and 2 parts by weight, relative to 100 parts by weight of the monomer.

Adhesive layer 12 may include non-polymeric components such as tackifiers, oxidation inhibitors, UV absorbers, fillers, and the like.

The amount of polymer included in the adhesive layer 12 is preferably between 70% and 100% by weight, more preferably between 90% and 100% by weight, based on the total weight of the adhesive layer 12 .

The thickness of the adhesive layer 12 is not particularly limited as long as the thickness is those in which planarity is not a problem, and may be, for example, between 0.025 mm and 1 mm. If the adhesive layer 12 is too thick, even if there is a strong adhesive strength between the support member 10 and the polishing material 14, the amount of deformation of the adhesive layer 12 will become large when polishing the polishing surface of the substrate, which may Make the adhesive layer protrude. On the other hand, if the adhesive layer 12 is too thin, if there is roughness on the surface of the polishing material 14 that the adhesive layer 12 contacts, it may not be possible to obtain a smooth surface between the adhesive layer 12 and the polishing material 14. Full conformability and adhesion.

The polishing material 14 is bonded to the support member 10 by the adhesive layer 12 to polish a polishing object using a surface (polishing surface) opposite to the surface in contact with the adhesive layer 12 .

The polishing material 14 can be appropriately selected according to the object to be polished. For example, polishing material 14 may be structured from known polishing materials made of hard or soft materials. The polishing material made of a hard material may be, for example, a hard polyurethane foam sheet (eg, MH ^™ C-14A(W) or Supreme ^™ RN-H, manufactured by Nitta Haas Inc.). The polishing material made of soft material may be, for example, a polishing pad (SUBA ^™ 400 or MH ^™ S15A) manufactured by Nitta Haas Inc., artificial leather suede, velvet, and the like.

The polishing material 14 may be made to have only a polishing layer that will polish the object being polished, or may have multiple layers including, for example, a base material and a polishing layer having a structured polishing surface disposed on the base material.

The base material supports the polishing layer on one surface thereof and contacts the adhesive layer 12 on the other surface thereof. Materials for the base material are not particularly limited, but may be polymer films, paper, metal films, vulcanized cardboard, nonwoven base materials, combinations of the above, treated products of the above, and the like. From the viewpoint of being conformable to the object to be polished, the base material is preferably made of a flexible material.

The polishing layer can be made of, for example, abrasive grains and a binder.

The binder is a matrix in which abrasive grains are dispersed, including, for example, phenolic resins, amino resins, polyurethane resins, epoxy resins, acrylate resins, acrylate-modified isocyanurate resins, urea-formaldehyde resins, isocyanurate resins , acrylate-modified polyurethane resin, acrylate-modified epoxy resin, combinations of the above, and the like.

The size of the abrasive grains can vary depending on the type of abrasive grain and the polishing application. For example, in finish polishing, the size is preferably between 0.01 μm and 1 μm, more preferably between 0.01 μm and 0.5 μm, even more preferably between 0.01 μm and 0.1 μm. In rough polishing or rough grinding, in order to form eg a curved surface, the size is preferably between 0.5 μm and 20 μm, more preferably between 0.5 μm and 10 μm.

Examples of abrasive grains include diamond, cubic boron nitride, ceria, fused alumina, heat-treated alumina, alumina sol-gel, silicon carbide, chromia, silica, zirconia, alumina-zirconia , iron oxide and garnet. Among them, diamond, cubic boron nitride, aluminum oxide, and silicon carbide are preferable for rough polishing, and silicon dioxide and aluminum oxide are preferable for fine polishing.

A removable adhesive layer 16 is provided on one side of the support member 10, which is the side opposite to the adhesive layer 12 provided thereon, and the adhesive layer 16 is used for bonding The layer of the polished structural member 100 to a platen or the like of a polishing apparatus.

When the polishing material 14 is worn by polishing to make polishing difficult, the structural member for polishing 100 is removed from the platen of the polishing apparatus and replaced with a new structural member for polishing. Here, in order to allow removal from the platen of the polishing device, the bonding between the structural member 100 for polishing and the platen of the polishing device is achieved by a removable adhesive layer 16, which has properties allowing removal. As such, the removable adhesive layer 16 is preferably peelable from the platen of the polishing apparatus without leaving residue when replacing the structural member 100 for polishing.

Although the adhesive constituting the removable adhesive layer 16 is not particularly limited, natural rubber, synthetic rubber, acrylic resin, or the like can be used. For example, mixtures having copolymers of (meth)acrylates and monomers having carboxyl groups and/or hydroxyl groups such as (meth)acrylates or 2-hydroxyethyl methacrylate can be used as Its main component, in which a tackifying resin is mixed, and also contains a crosslinking agent such as isocyanate, is adjusted to have a low adhesive strength.

The removable adhesive layer 16 does not necessarily come into contact with the processing fluid, and does not easily contact the object to be polished even if it is swollen by the processing fluid. Because of this, the effect of suppressing swelling due to the processing fluid as in the adhesive layer 12 is unnecessary in the removable adhesive layer 16 .

The thickness of the removable adhesive layer 16 is not particularly limited, but may be between 10 μm and 100 μm. Also, in another aspect, the thickness can be between 20 μm and 50 μm.

In the structural member for polishing 100 according to the first form of the embodiment, the adhesive layer 12 includes the polymer having the above-mentioned characteristics, and thus maintains sufficient adhesive strength even when soaked with a working fluid, and due to working The swelling caused by the liquid is fully suppressed. Because of this, the structural member 100 for polishing can prevent delamination of the polishing material 14 from the adhesive layer 12 due to a decrease in adhesive strength and can prevent sticking due to swelling of the adhesive layer 12. The mixture layer 12 is peeled off, so that the polishing operation can be performed stably for a long time.

Next, a description will be given of a second form of embodiment in which the polishing material has a base material and a polishing layer. The polishing layer includes a plurality of solid elements arranged in order on a base material. The solid element may include a plurality of abrasive particles and their binder.

Fig. 2(a) is a perspective view, and (b) is a schematic cross-sectional view showing a cross-section of a structural member 110 for polishing according to a second form of the embodiment on the cross-section line II-II. The structural member 110 for polishing according to the second form of the embodiment has a supporting member 20, an adhesive layer 22 provided on one face of the supporting member 20, a polishing member bonded to the supporting member 20 through the adhesive layer 22. Material 24 and a layer of removable adhesive 26 disposed on the other face of support member 20 .

In the structural member 110 for polishing, the support member 20, the adhesive layer 22 and the removable adhesive layer 26 can be schematically shown as the corresponding support member 10, adhesive in the structural member 100 for polishing described above. Layer 12 and removable adhesive layer 16 are identical.

In the structural member 110 for polishing, a polishing material 24 has a base material 24b and a polishing layer 24a, and a plurality of solid elements 28 are sequentially formed on the polishing layer 24a. Here, the base material 24b and the polishing layer 24a can be illustrated to be the same as the base material and the polishing layer described above. The shape and the like of the solid member 28 are not particularly limited, but preferred examples are described below.

Adjacent solid elements 28 are preferably separated from one another by planar regions 29 . Separating the solid elements 28 in this manner will allow the machining fluid to flow freely through the channels formed between the solid elements 28 over the entire surface of the structural member 110 for polishing. Allowing the fluid to flow freely will result in better metal removal rates and improved surface finish.

The number of solid elements 28 may fall within the range of 0.3 to about 100 per 1 cm ² . One preferred shape for the solid element 28 is a frustum as shown in FIG. 2 . The height of the solid element 28 (the distance from the surface formed by the planar region 29 to the upper surface of the solid element 28 ) may be, for example, about 10 to 15,000 μm. The area of the upper surface of the frustum formed by the solid element 28 may be from 0.0001 to 400 mm ² .

The base material 24b is bonded to the adhesive layer 22 and functions to support the polishing layer. In view of improving conformability with the object to be polished, the base material 24b is preferably a base material with flexibility. From the standpoint of improving the durability of the structural member 110 for polishing, the base material 24b is preferably strong and durable.

Materials for the matrix material 24b may be selected from, for example, polymer films, paper, vulcanized cardboard, non-woven matrix materials, cloth matrix materials, and the like. The matrix material 24b is preferably a polymer film. Examples of polymer films include polyester films, polyimide films, polyamide films, polypropylene films, polycarbonate films, polyurethane films, and the like; among them, polyester films are preferable. Polyester films have properties that are excellent in strength, smoothness, heat resistance, water resistance, and oil resistance. To improve adhesion to the polishing layer 24a, the base material 24b may be treated to facilitate adhesion by an undercoat of ethylene-acrylate copolymer or the like.

In the structural member 110 for polishing according to the second form of the embodiment, the adhesive layer 22 includes the polymer having the above-mentioned characteristics, and thus maintains sufficient adhesive strength even when soaked with a working fluid, and due to working The swelling caused by the liquid is fully suppressed. Because of this, the structural member 110 for polishing can prevent delamination of the polishing material 24 from the adhesive layer 22 due to a decrease in adhesive strength, and can prevent delamination of the adhesive layer 22 due to swelling. The adhesive layer 22 is peeled off, thereby making it possible to stably perform the polishing operation for a long time.

Fig. 3(a) is a perspective view, and (b) is a schematic cross-sectional view showing a section of a structural member 120 for polishing according to a third form of the embodiment on the cross-section line III-III. The structural member 120 for polishing according to the third form of the embodiment has a supporting member 30, an adhesive layer 32 provided on one face of the supporting member 30, a polishing member bonded to the supporting member 30 through the adhesive layer 32. Material 34 and a layer of removable adhesive 36 disposed on the other face of support member 30 .

In the structural member 120 for polishing, the support member 30, the adhesive layer 32 and the removable adhesive layer 36 can be schematically shown as the corresponding support member 10, adhesive in the structural member 100 for polishing described above. Layer 12 and removable adhesive layer 16 are identical.

In the structural member for polishing 120 , various polishing materials 34 are provided and arranged on the adhesive layer 32 . Each polishing material 34 has a base material 34b and a polishing layer 34a in which a plurality of solid elements are sequentially formed. Here, the base material 34b and the polishing layer 34a can be illustrated to be the same as the base material and the polishing layer described above.

In the structural member 120 for polishing, a polishing material 34 is provided together with a groove 38 as shown in FIG. 3( b ). When such grooves 38 exist, there is a risk that pressure or the like will cause the adhesive layer 32 to flow into the grooves 38 at the time of polishing. Here, the glass transition temperature of the polymer included in the adhesive layer 32 is made to be between -15°C and 10°C, or more preferably between -10°C and 10°C, even more preferably between Between -5°C and 5°C will make it possible to sufficiently prevent the adhesive layer 32 from flowing into the groove 38 .

In the structural member 120 for polishing according to the third form of the embodiment, the adhesive layer 32 includes the polymer having the above-mentioned characteristics, and thus maintains sufficient adhesive strength even when soaked with a working fluid, and due to working The swelling caused by the liquid is fully suppressed. Therefore, due to the improvement in the adhesive layer 32, the structural member 120 for polishing can prevent delamination of the polishing material 34 from the adhesive layer 32 due to a decrease in adhesive strength, and can prevent sticking. The peeling of the adhesive layer 32 due to the swelling of the mixture layer 32 makes it possible to stably perform the polishing operation for a long time.

In addition, in addition to the above-mentioned effects, in the structural member 120 for polishing as described in the third form of the embodiment, the glass transition temperature of the polymer included in the adhesive layer 32 will be reduced within the specified range. This makes it possible to prevent the adhesive layer 32 from flowing into the grooves 38 created between the polishing materials 34 .

Fig. 4 is a schematic cross-sectional view showing a polishing method using the structural member for polishing as described in the second form of the embodiment. In FIG. 4, a structural member for polishing having a support member 20, an adhesive layer 22, a polishing material 24, and a removable adhesive layer 26 is bonded to the surface of the polishing device through the removable adhesive layer 26. Platen 40.

The object 50 to be polished is placed so as to be in contact with the polishing surface (polishing layer 24 a ) of the polishing material 24 of the structural member for polishing 110 to be polished by the polishing surface (polishing layer 24 a ).

At the time of polishing, it is preferable that the machining liquid exists at the surface where there is contact between the object to be polished 50 and the polishing layer 24a. The machining fluid reduces polishing friction, removes heat generated by polishing and provides cooling, and prevents polishing debris from adhering to the polished surface of the polished object 50 .

As the working fluid, conventionally known ones can be used. A processing fluid is generally a solution having water as its main component and additives are added to the solution. Additives may include surfactants, lubricants, etc., and in particular, may include chelating compounds, alkyl phosphates, alkyl carboxyphosphates, alkyl phosphates, alkylaryl sulfonates, alkylaryl carboxylic acids Esters, Alkylaryl Phosphates, Alkyl Compounds, Polyolefins, Polyalkylene Alkyl Compounds, Polyalkylene Glycol Alkylaryl Ethers, Polyalkylene Glycol Alkyl Compounds, Alkyl Amines, polyalkyleneamines, alkanolamines, tetraalkylammonium salts and tetraalkylammonium betaines.

The surfactant can be anionic, nonionic or cationic and can be highly hydrophilic. Anionic surfactants or cationic surfactants having strong hydrophilic groups in the molecule are preferred, and HLB is preferably 8 or more, particularly preferably HLB is 10 or more (using Davis HLB). Among nonionic surfactants, a strong HLB of 8 to 20 or especially an HLB between 10 and 20 (Griffin HLB) is preferred. Here, for anionic surfactants, the HLB value is obtained based on the Davis method, and for nonionic surfactants, the HLB value is obtained based on the Griffin method.

HLB is a well-known calculated value that expresses the degree of affinity of a surfactant for water and oil. For Griffin HLB, reference may be made to Journal of the Society of Cosmetic Chemists 1 (1949): 311 or Journal of the Society of Cosmetic Chemists 5 (1954): 259. For Davies HLB, reference is made to "Air/Liquid and Liquid/Liquid Interfaces", Proceedings of the International Congress of Surface Activity (1957): 426-438.

Note that in the case where the object 50 to be polished is a semiconductor wafer or nonionic alkaline glass, in particular, it is preferable that the processing liquid does not include alkali metal ions or halogen compound ions. As such, it is preferred in this case that the surfactant is a nonionic surfactant or an anionic alkanolamine salt surfactant.

The amount of additives included in the processing fluid is preferably between 0.001% and 50% by weight, more preferably between 0.5% and 30% by weight, even more preferably between 1.0% and 10% by weight. If the surfactant is included in an amount of less than 0.5% by weight, the adhesion preventing effect may be insufficient, depending on the type. Also, if it is more than 20% by weight, the working fluid will become viscous, and there is a risk of polishing irregularities.

In the structural member 110 for polishing, the adhesive layer 22 includes a polymer having the above-mentioned characteristics, and thus maintains sufficient adhesive strength even when soaked with a working fluid, and swelling due to the working fluid is sufficiently suppressed . Because of this, when using the structural member 110 for polishing, even if the polishing is performed in the presence of a working fluid, delamination of the polishing material 24 from the adhesive layer 22 due to a decrease in adhesive strength and the adhesive Peeling of the adhesive layer 22 due to swelling of the layer 22 can be sufficiently prevented so that the polishing operation can be performed stably for a long time.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, although in FIGS. 1-3 , the structural member for polishing is illustrated as a disc shape, the shape of the structural member for polishing in the present invention is not limited thereto. For example, the structural members used for polishing may be cylindrical or may be polygonal prisms.

example

The present invention is explained in more detail below based on examples, but the present invention is not limited to the following examples.

The method for measuring the storage modulus of elasticity and the glass transition temperature Tg (dynamic adhesive properties) of the adhesive sheet, the method for measuring the acid value, the method for measuring the adhesive strength, and the method for measuring the adhesive strength are first explained below. Methods for conducting saturation tests and methods used to measure process fluid absorption.

Measurement of storage elastic modulus and glass transition temperature (Tg) (dynamic adhesive properties)

Sample preparation: Using the adhesive sheet obtained in Preparation Examples 1 to 11 below, a 7.9 mm diameter sample (from which the release film was removed) from a 16-layer sheet (approximately 3 mm thick) was punched by using a punching knife A disk-shaped sample is obtained.

Measurements: Dynamic Adhesion Properties used the Advanced Rheological Expansion System (ARES) manufactured by Rheometric Scientific. A 7.9 mm diameter parallel plate was used as a tool for fixing the sample, wherein the disk-shaped sample prepared using the method described above was placed between the plates, and the tension was adjusted. The dynamic adhesion measurements were carried out in the atmosphere and the measurements were carried out in shear mode with a frequency of 1.0 Hz and a temperature ramp between -50°C and 200°C at a rate of 5°C/min. The temperature corresponding to the peak tan δ was defined as the glass transition temperature. Tanδ is the ratio of the loss elastic modulus G" (Pa) to the storage elastic modulus G' (Pa).

Measurement of Adhesive Strength

The adhesive strength between the polycarbonate film and the polishing pad was measured by a peel test. Structural members for polishing as obtained in the following Examples and Comparative Examples were cut with a cutter to 25 mm×150 mm. The polycarbonate film and the polishing pad were pulled at a peel rate of 5 mm/min using a tensile tester (Ag-IS, manufactured by Shimadzu), and the maximum strength was recorded as the peel strength of the adhesive sheet.

Adhesive strength measurement after immersion

The structural members for polishing obtained in the following examples and comparative examples were soaked in an aqueous solution of SABRELUBE9016 in a processing fluid (10% by weight), (produced by Chemettal Oakite, Romulus, Missouri, U.S.A.) at 50° C. for 7 days and 14 day, then rinse with pure water. Adhesive strength was measured 30 minutes after rinsing. Adhesive strength measurements were performed using the method described above. Note that a minimum of 20N/25mm is required both initially and after 14 days of immersion for adequate bond strength.

Process Fluid Absorption Measurements

The adhesive layer obtained as described below was cut into a size of 25 mm×70 mm and a thickness of 250 μm with a cutter, and its weight was measured after removing one of the release liners. Soak in a 10% aqueous solution of SABRELUBE 9016 at 23°C for 10 days. The sample was taken out from the solution, and the weight was measured 30 minutes after rinsing with pure water and blowing off the moisture with compressed air. The percent absorption is then calculated from the initial and final weights as follows: (final weight - initial weight)/(initial weight) x 100. In order to minimize swelling of the adhesive layer, it is preferred that the processing fluid absorb no more than 10%, more preferably less than 5%. From the results shown in Table 2, it can be seen that the processing fluid absorption varies with the amount of acrylate and the amount of crosslinking monomer in the adhesive.

Preparation of Adhesive Layer 1 with Release Liner

In a glass container, 70 parts by weight of 2-ethylhexyl acrylate (Nippon Shokubai Co., Ltd.; Chiyoda Ward, Tokyo)), 25 parts by weight of isobornyl acrylate (Osaka Organic Chemical Industry, Ltd.; Osaka, Osaka )), 5 parts by weight of acrylic acid (Toagosei Co., Ltd.; Minato Ward, Tokyo)) and 0.04 parts by weight of Irgacure ^TM 651 (2,2-dimethoxy-2-phenylphenethyl Ketone, (BASF Japan, Ltd.; Minato Ward, Tokyo)), the dissolved oxygen was replaced with nitrogen, and the mixture was irradiated with ultraviolet light for several minutes using a low-pressure Hg lamp (SylvaniaTMF20T12B: (Osram Sylvania Inc., Massachusetts, US)) to induce partial polymerization and obtain a viscous liquid with a viscosity of approximately 2,500 cP. 0.06 parts by mass of HDDA (1,6-hexanediol diacrylate, light acrylate TM1.6HX-A: (Kyoeisha Chemical Co., Ltd.)) as a crosslinking agent and 0.15 parts by mass of an additional polymerization initiator ( Irgacure ^™ 651: (BASF Japan, Ltd.; Minato Ward, Tokyo)) and stir the mixture well. The mixture was applied to the surface of a release liner which was a 50 μm thick release-treated polyester film (Serapeel MIB(T): (Toray Advanced Film Co., Ltd.: Minato Ward) to form a 250 μm thick coating. ,Tokyo)). A second release liner of the same polyester film was placed on the top surface of the coating. This release liner-coated layer was irradiated on both sides at 2,000 mJ/cm ² using a low-pressure Hg lamp, resulting in an adhesive layer 1 with a release liner.

Preparation of Adhesive Layer 2-11 with Release Liner

Adhesive layer 2-11 was prepared in the same manner as adhesive layer 1 except that the composition ratio (weight ratio) of each monomer was changed as shown in Table 1.

In Table 1, "2EHA" refers to 2-ethylhexyl acrylate (AEH: (Nippon Shokubai Co., Ltd.; MinatoWard, Tokyo)), "IOA" refers to isooctyl acrylate (3M; Minnesota, US), "AA" means acrylic acid, "CHA" means cyclohexyl acrylate (Osaka Organic Chemical Industry, Ltd.; Osaka, Osaka), "IBXA" means isobornyl acrylate (Osaka Organic Chemical Industry, Ltd.; Osaka, Osaka), "BZA" refers to benzyl acrylate (Osaka Organic Chemical Industry, Ltd.; Osaka, Osaka), "BA" refers to butyl acrylate (Mitsubishi Chemical Corporation; Minato Ward, Tokyo), "HDDA" refers to 1,6-hexanediol diol Acrylate (Light Acrylate TM1.6HX-A: (Kyoeisha Chemical Co., Ltd.; Osaka, Osaka)), "IRG651" refers to Irgacure ^TM 651 (2,2-dimethoxy-2-phenylacetophenone , (BASF Japan, Ltd.; Minato Ward, Tokyo)).

Table 1

Example 1

The adhesive layer 1 with release liner was cut into 1,200×120 mm with a cutter, one release liner was removed, and the sheet was attached to a polycarbonate film (GE: Connecticut, US). The release liner left on the transparent adhesive layer 1 was peeled off, and the adhesive layer was attached to a roll (Trizact ^™ tile DT4MAA1HD, 250 mm × 50 mm thick roll: (Sumiyoshi 3M; Setagaya Ward, Tokyo)) using a rubber roller. On a polishing pad with a length of 1,200 mm. Then lamination was performed at 80° C. and 0.5 MPa using a laminator (ARCTIC EAGLE1600: (Japan GBC; Nakano Ward, Tokyo) to obtain Structural Member Example 1 for polishing.

Example 2-7

Structural member examples 2 to 7 for polishing were obtained in the same manner as in example 1, except that adhesive layers 2 to 7 were used instead of adhesive layer 1, respectively.

Comparative Examples 8-11

Structural members for polishing were obtained in the same manner as in Example 1 except that adhesive layers 8 to 11 were used instead of adhesive layer 1, respectively.

The glass transition temperature Tg, adhesive strength, adhesive strength after immersion, and processing fluid absorption of Examples 1 to 7 and Comparative Examples 8 to 11 were measured using the methods described above. The results are shown in Table 2.

Table 2

Claims (8)

1. A structural member for polishing, said structural member comprising a support member, a polishing material, and an adhesive layer bonding said support member and said polishing material; wherein said adhesive layer comprises monomeric A polymer, the monomer comprising 58% to 85% by weight of the first monomer, 2% to 7% by weight of the second monomer, and 10% to 40% by weight of the third monomer; wherein the The first monomer is an alkyl (meth)acrylate having an alkyl group with a carbon number of 8 to 18 carbon atoms, and provides a homopolymer having a glass transition temperature of 0° C. or lower; the The second monomer is a polar monomer providing a homopolymer having a glass transition temperature of 50° C. or higher; and the third monomer is an alkyl group having a carbon number of 4 to 18 carbon atoms or Alkyl (meth)acrylates of aralkyl groups having a carbon number of 7 to 18 carbon atoms and providing homopolymers having a glass transition temperature of 10°C or higher. 2. A structural member for polishing according to claim 1, wherein the polymer has a glass transition temperature between -25 and 10°C. 3. A structural member for polishing according to claim 2, wherein the polymer has a glass transition temperature between -15 and 10°C. 4. The structural member for polishing according to claim 1, wherein the polishing material comprises a base material and a polishing layer. 5. A structural member for polishing according to claim 4, wherein the polishing layer comprises a plurality of solid elements. 6. The structural member for polishing according to claim 5, wherein said plurality of solid elements comprises a plurality of abrasive grains and their binder. 7. A structural member for polishing according to any one of claims 1 , 3 or 6, wherein the thickness of the adhesive layer is between 50 and 500 μm. 8. The structural member for polishing according to claim 1, further comprising a removable adhesive layer disposed on the other surface of the support member.