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CN103595357A - 0.1-1.2GHz CMOS (complementary metal oxide semiconductor) ultra-wideband radiofrequency power amplifier - Google Patents

0.1-1.2GHz CMOS (complementary metal oxide semiconductor) ultra-wideband radiofrequency power amplifier Download PDF

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CN103595357A
CN103595357A CN201310486290.0A CN201310486290A CN103595357A CN 103595357 A CN103595357 A CN 103595357A CN 201310486290 A CN201310486290 A CN 201310486290A CN 103595357 A CN103595357 A CN 103595357A
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nmos transistor
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马建国
王立果
邬海峰
周鹏
王建利
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Tianjin University
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Abstract

本发明公开了一种0.1~1.2GHz的CMOS超宽带射频功率放大器,包括多级放大电路,多级放大电路包括驱动级放大电路用于实现整个放大器的增益,并保证整个电路的输入匹配(S11参数)达到要求;中间级放大电路用于保证整个电路的增益、效率和级间匹配;功率输出级放大电路用于保证整个电路的良好的输出匹配(S22参数)和功率输出。还包括驱动级有源偏置和匹配电路、中间级有源偏置和匹配电路和输出级有源偏置和匹配电路。本发明采用的是一个三级的单端A类电路结构,由此可以产生较好的线性度。本发明采用CMOS Si工艺,使用单端结构可以使整个电路省去输入输出巴伦,由此可以节省芯片面积并提升整个电路的性能。

Figure 201310486290

The invention discloses a 0.1-1.2GHz CMOS ultra-broadband radio frequency power amplifier, which includes a multi-stage amplifier circuit, and the multi-stage amplifier circuit includes a drive stage amplifier circuit for realizing the gain of the entire amplifier and ensuring the input matching of the entire circuit (S11 parameters) to meet the requirements; the intermediate stage amplifier circuit is used to ensure the gain, efficiency and inter-stage matching of the entire circuit; the power output stage amplifier circuit is used to ensure good output matching (S22 parameters) and power output of the entire circuit. Also included are driver stage active biasing and matching circuits, intermediate stage active biasing and matching circuits, and output stage active biasing and matching circuits. The present invention adopts a three-stage single-end Class A circuit structure, which can produce better linearity. The invention adopts the CMOS Si technology, and the single-end structure can save the input and output baluns of the whole circuit, thereby saving the chip area and improving the performance of the whole circuit.

Figure 201310486290

Description

一种0.1~1.2GHz的CMOS超宽带射频功率放大器A 0.1-1.2GHz CMOS ultra-wideband RF power amplifier

技术领域technical field

本发明涉及互补型金属氧化物半导体(CMOS)射频功率放大器和集成电领域,特别是面向行业专网应用的一种CMOS超宽带射频功率放大器。The invention relates to the field of complementary metal oxide semiconductor (CMOS) radio frequency power amplifiers and integrated circuits, in particular to a CMOS ultra-wideband radio frequency power amplifier for industry private network applications.

背景技术Background technique

随着现代无线通信技术的快速发展,不断推动射频前端收发器向高集成、低功耗、结构紧凑、价格低廉的方向发展。功率放大器(简称功放)是无线发射器中必不可少的组成部分,也是整个发射机中耗能最多的部件,输出功率一般比较大。目前,人们对功率放大器设计的要求也越来越高,特别是功率放大器的功率、效率、带宽和线性度等方面的考虑。所以在现在无线电系统中,宽带功率放大器有着举足轻重的地位,其性能的优劣将直接影响整个无线电系统的工作情况。With the rapid development of modern wireless communication technology, the RF front-end transceivers are continuously promoted to the direction of high integration, low power consumption, compact structure and low price. The power amplifier (referred to as the power amplifier) is an essential part of the wireless transmitter, and it is also the part that consumes the most energy in the entire transmitter, and the output power is generally relatively large. At present, people have higher and higher requirements on the design of power amplifiers, especially the power, efficiency, bandwidth and linearity of power amplifiers. Therefore, in the current radio system, the broadband power amplifier plays a decisive role, and its performance will directly affect the working conditions of the entire radio system.

相对于其它无线收发组件,大功率、高线性、高效率是功率放大器的基本设计要求。CMOS工艺的进步除了提高功放的工作频率带宽之外,对输出功率、线性度、PAE等指标的改善难度加大,实现起来更困难。从频域来看,超宽带有别于传统的窄带和宽带,它的频带更宽。目前,频率在100MHz-1.2GHz范围内的宽带无线接入设备主要用于行业专网,但是行业专网的频点和带宽种类繁多,标准不统一。我国对于宽带功率放大器的研制起步较晚,尤其是CMOS宽带功率放大器。并且,目前行业专网所用的射频前端芯片多数被国外公司所垄断。行业专网核心器件应用国外芯片还存在诸多问题。因此,我们十分迫切地需要研发具有自主知识产权的射频前端芯片。Compared with other wireless transceiver components, high power, high linearity and high efficiency are the basic design requirements of power amplifiers. In addition to improving the operating frequency bandwidth of the power amplifier, the progress of CMOS technology makes it more difficult to improve the output power, linearity, PAE and other indicators, and it is even more difficult to realize. From the perspective of frequency domain, UWB is different from traditional narrowband and broadband, and its frequency band is wider. At present, broadband wireless access devices with a frequency in the range of 100MHz-1.2GHz are mainly used in industrial private networks, but the frequency points and bandwidths of industrial private networks are various, and the standards are not uniform. The research and development of broadband power amplifiers in our country started relatively late, especially CMOS broadband power amplifiers. Moreover, most of the RF front-end chips used in the industry private network are monopolized by foreign companies. There are still many problems in the application of foreign chips to the core components of the industry private network. Therefore, we urgently need to develop RF front-end chips with independent intellectual property rights.

发明内容Contents of the invention

针对上述现有技术,本发明提供一种0.1~1.2GHz的CMOS超宽带射频功率放大器,用于面向行业专网应用的0.1~1.2GHz的超宽带射频功率放大器电路芯片的设计,其具有足够的增益、带宽和输出功率,并具有良好的线性度。In view of the above prior art, the present invention provides a 0.1-1.2GHz CMOS ultra-wideband radio frequency power amplifier, which is used for the design of a 0.1-1.2GHz ultra-wideband radio frequency power amplifier circuit chip for industry private network applications, which has sufficient gain, bandwidth and output power with good linearity.

为了解决上述技术问题,本发明一种0.1~1.2GHz的CMOS超宽带射频功率放大器,包括多级放大电路,多级放大电路用于实现整个放大器的增益,并保证整个电路的输入匹配(S11参数)达到要求,所述多级放大电路包括输入隔直电容C1、驱动级偏置及输入匹配电路、驱动级放大电路、级间隔直电容C2、中间级偏置及级间匹配电路、中间级放大电路、级间隔直电容C3、功率级偏置及级间匹配电路、功率级放大电路、输出隔直电容C4和芯片电源,所述芯片电源采用电压节点VDD;所述中间级放大电路用于保证整个电路的增益、效率和级间匹配;功率输出级放大电路用于保证整个电路的良好的输出匹配(S22参数)和功率输出。所述驱动级放大电路包括两个共栅共源结构的NMOS管M1和NMOS管M2,一个片外电感L0,其电感值至少为100nH;所述中间级放大电路包括两个共栅共源结构的NMOS管M4和NMOS管M5,一个片外电感L1,其电感值至少为100nH;所述功率级放大电路包括一共源结构的NMOS管M7和一个片外电感L2,其电感值至少为100nH,所述NMOS管M7的漏级和栅级之间设有反馈电阻Rf,所述反馈电阻Rf用于改善输出匹配,带宽增益平坦度和稳定性。所述驱动级偏置及输入匹配电路、中间级偏置及级间匹配电路和功率级偏置及级间匹配电路结构相同,均分别包括有一个NMOS管、第一电阻和第二电阻;所述驱动级放大电路中,所述NMOS管M2的源极接地,所述NMOS管M2的栅极通过驱动所述驱动级偏置及输入匹配电路和输入隔直电容C1后连接至放大器的输入端Vin,所述NMOS管M2的漏极与所述NMOS管M1的源极相连,所述NMOS管M1的栅极偏置接至电压节点VDD,所述NMOS管M1的漏极与所述片外电感L0连接,所述片外电感L0的另一端接电压节点VDD;所述中间级放大电路中采用与驱动级放大电路相同的偏置结构和放大结构,即所述中间级放大电路中,所述NMOS管M5的源极接地,所述NMOS管M5的栅极通过中间级偏置及级间匹配电路和级间隔直电容C2后连接至所述NMOS管M1的漏极,所述NMOS管M5的漏极与所述NMOS管M4的源极相连,所述NMOS管M4的栅极偏置为芯片电源,即节点VDD,所述NMOS管M4的漏极与所述片外电感L1连接,所述片外电感L1的另一端接电压节点VDD;所述功率级放大电路采用与前两级相同的偏置结构,所述功率级放大电路中,所述NMOS管M7的源极接地,所述NMOS管M7的栅极通过功率级偏置及级间匹配电路和级间隔直电容C3后连接至所述NMOS管M4的漏极,所述NMOS管M7的漏极与所述片外电感L2连接,所述NMOS管M7的漏极与所述输出隔直电容C4并接后连接至放大器的输出端口Vout,所述片外电感L2的另一端接电压节点VDD。In order to solve the above-mentioned technical problems, a 0.1-1.2GHz CMOS ultra-wideband radio frequency power amplifier of the present invention includes a multi-stage amplifier circuit, which is used to realize the gain of the entire amplifier and ensure the input matching of the entire circuit (S11 parameter ) to meet the requirements, the multi-stage amplifier circuit includes an input DC blocking capacitor C1, a driver stage bias and input matching circuit, a driver stage amplifier circuit, a stage interval direct capacitor C2, an intermediate stage bias and an interstage matching circuit, and an intermediate stage amplifier Circuit, stage interval straight capacitor C3, power stage bias and interstage matching circuit, power stage amplifying circuit, output direct blocking capacitor C4 and chip power supply, the chip power supply adopts voltage node VDD; the intermediate stage amplifying circuit is used to ensure The gain, efficiency and inter-stage matching of the whole circuit; the power output stage amplifier circuit is used to ensure good output matching (S22 parameter) and power output of the whole circuit. The driving stage amplifying circuit includes two NMOS transistors M1 and NMOS transistors M2 with a cascode structure, and an off-chip inductor L0 with an inductance value of at least 100nH; the intermediate stage amplifying circuit includes two cascode structures NMOS transistor M4 and NMOS transistor M5, an off-chip inductance L1, the inductance value of which is at least 100nH; the power stage amplifier circuit includes a common source NMOS transistor M7 and an off-chip inductance L2, the inductance value of which is at least 100nH, A feedback resistor Rf is provided between the drain and the gate of the NMOS transistor M7, and the feedback resistor Rf is used to improve output matching, bandwidth gain flatness and stability. The drive stage bias and input matching circuit, the intermediate stage bias and interstage matching circuit and the power stage bias and interstage matching circuit have the same structure, and all include an NMOS transistor, a first resistor and a second resistor respectively; In the driver stage amplifier circuit, the source of the NMOS transistor M2 is grounded, and the gate of the NMOS transistor M2 is connected to the input terminal of the amplifier after driving the driver stage bias and input matching circuit and the input DC blocking capacitor C1 Vin, the drain of the NMOS transistor M2 is connected to the source of the NMOS transistor M1, the gate bias of the NMOS transistor M1 is connected to the voltage node VDD, and the drain of the NMOS transistor M1 is connected to the off-chip The inductor L0 is connected, and the other end of the off-chip inductor L0 is connected to the voltage node VDD; the intermediate stage amplifier circuit adopts the same bias structure and amplification structure as the driver stage amplifier circuit, that is, in the intermediate stage amplifier circuit, the The source of the NMOS transistor M5 is grounded, and the gate of the NMOS transistor M5 is connected to the drain of the NMOS transistor M1 through an intermediate stage bias, an interstage matching circuit and a straight capacitor C2 between stages, and the NMOS transistor M5 The drain of the NMOS transistor M4 is connected to the source of the NMOS transistor M4, the gate of the NMOS transistor M4 is biased as the chip power supply, that is, the node VDD, and the drain of the NMOS transistor M4 is connected to the off-chip inductor L1, so The other end of the off-chip inductance L1 is connected to the voltage node VDD; the power stage amplifier circuit adopts the same bias structure as the previous two stages, in the power stage amplifier circuit, the source of the NMOS transistor M7 is grounded, and the The gate of the NMOS transistor M7 is connected to the drain of the NMOS transistor M4 through the power stage bias, the interstage matching circuit and the straight capacitor C3 between stages, and the drain of the NMOS transistor M7 is connected to the off-chip inductor L2 , the drain of the NMOS transistor M7 is connected in parallel with the output DC blocking capacitor C4 and then connected to the output port Vout of the amplifier, and the other end of the off-chip inductor L2 is connected to the voltage node VDD.

与现有技术相比,本发明的有益效果是:Compared with prior art, the beneficial effect of the present invention is:

本发明为了为实现CMOS工艺下的宽带功率输出和较高的增益,采用一个三级的单端A类电路结构,由此可以产生较好的线性度。本发明放大器中的第一级为驱动级,用来实现整个放大器的增益和电路的输入匹配;第二级为电路的中间过渡级,用于实现整个电路增益和级间匹配的调整;第三级为功率输出级,用于保证电路最终良好的输出匹配和最大功率输出。本发明采用CMOS Si工艺,使用单端结构可以使整个电路省去输入输出巴伦,由此可以节省芯片面积并提升整个电路的性能。In order to realize broadband power output and higher gain under CMOS technology, the present invention adopts a three-stage single-end Class A circuit structure, thereby producing better linearity. The first stage in the amplifier of the present invention is a driving stage, which is used to realize the gain of the whole amplifier and the input matching of the circuit; the second stage is an intermediate transition stage of the circuit, which is used to realize the adjustment of the gain of the whole circuit and the matching between stages; the third stage The stage is the power output stage, which is used to ensure the final good output matching and maximum power output of the circuit. The present invention adopts the CMOS Si process, and the single-ended structure can save the input and output baluns of the whole circuit, thereby saving the chip area and improving the performance of the whole circuit.

附图说明Description of drawings

图1是本发明CMOS超宽带射频功率放大器的原理方框图;Fig. 1 is the principle block diagram of CMOS ultra-wideband radio frequency power amplifier of the present invention;

图2是本发明CMOS超宽带射频功率放大器实施例的电路原理图。Fig. 2 is a schematic circuit diagram of an embodiment of a CMOS ultra-wideband radio frequency power amplifier of the present invention.

图3是本发明放大器的稳定性Kf值曲线图;Fig. 3 is the stability Kf value curve figure of amplifier of the present invention;

图4是本发明放大器的S参数曲线图;Fig. 4 is the S parameter graph of amplifier of the present invention;

图5是本发明放大器的输出功率曲线图;Fig. 5 is the output power curve figure of amplifier of the present invention;

图6是本发明放大器的功率附加效率曲线图。Fig. 6 is a graph of the power added efficiency of the amplifier of the present invention.

具体实施方式Detailed ways

下面结合附图和具体实施例对本发明电路作进一步详细地描述。The circuit of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

如图1所示,本发明一种0.1~1.2GHz的CMOS超宽带射频功率放大器,采用的是三级单端放大结构,统一采用3.3V供电,包括第一级为驱动级放大电路用来实现电路的高增益,第二级为中间级放大电路用于保证整个电路的增益、效率和级间匹配;第三级为功率输出放大级电路用于保证整个电路良好的输出匹配和最终较大的功率输出。所述电路还包括驱动级有源偏置和匹配电路、中间级有源偏置和匹配电路和输出级有源偏置和匹配电路。As shown in Figure 1, a 0.1-1.2GHz CMOS ultra-wideband radio frequency power amplifier of the present invention adopts a three-stage single-ended amplification structure, uniformly adopts 3.3V power supply, and includes the first stage as a driver stage amplifier circuit to realize The high gain of the circuit, the second stage is an intermediate stage amplifier circuit to ensure the gain, efficiency and inter-stage matching of the entire circuit; the third stage is a power output amplifier stage circuit to ensure good output matching of the entire circuit and the final larger power output. The circuit also includes a driver stage active biasing and matching circuit, an intermediate stage active biasing and matching circuit, and an output stage active biasing and matching circuit.

如图2所示,所述驱动级放大电路包括两个共源共栅结构的NMOS管M1和NMOS管M2,一个片外电感L0,电感值大于100nH;所述中间级放大电路包括两个共源共栅结构的NMOS管M4和NMOS管M5,一个片外电感L1,电感值大于100nH;所述功率输出级放大电路包括一个共源结构的NMOS管M7和一个片外电感L2,电感值大于100nH,所述NMOS管M7的漏级和栅级之间设有反馈电阻Rf;所述驱动级有源偏置和匹配电路、中间级有源偏置和匹配电路和输出级有源偏置和匹配电路结构相同,均分别包括有一个NMOS管、第一电阻、第二电阻。As shown in Figure 2, the driver stage amplifier circuit includes two cascode NMOS transistors M1 and NMOS transistor M2, an off-chip inductor L0, the inductance value is greater than 100nH; the intermediate stage amplifier circuit includes two common The NMOS tube M4 and the NMOS tube M5 of the source common gate structure, an off-chip inductance L1, the inductance value is greater than 100nH; The described power output stage amplifier circuit includes a common source structure NMOS tube M7 and an off-chip inductance L2, the inductance value is greater than 100nH, a feedback resistor Rf is provided between the drain and the gate of the NMOS transistor M7; the active bias and matching circuit of the driver stage, the active bias and matching circuit of the intermediate stage and the active bias and matching circuit of the output stage The matching circuits have the same structure, and each includes an NMOS transistor, a first resistor, and a second resistor.

所述驱动级放大电路中,所述NMOS管M2的源极接地,所述NMOS管M2的栅极通过驱动级有源偏置及输入匹配电路和片外隔直电容C1后连接至放大器的输入端Vin,所述NMOS管M2的漏极与所述NMOS管M1的源极相连,所述NMOS管M1的栅极偏置接电压节点VDD,所述NMOS管M1的漏极与所述片外电感L0连接,所述片外电感L0的另一端接电压节点VDD;所述驱动级有源偏置和匹配电路中,NMOS管M0的漏极串联第一电阻R0并接于电压节点VDD,所述NMOS管M0的栅极与漏极相连,并接第二电阻R1后给所述NMOS管M1的栅极加偏置。In the amplifier circuit of the driver stage, the source of the NMOS transistor M2 is grounded, and the gate of the NMOS transistor M2 is connected to the input of the amplifier after being actively biased by the driver stage, an input matching circuit and an off-chip DC blocking capacitor C1 Terminal Vin, the drain of the NMOS transistor M2 is connected to the source of the NMOS transistor M1, the gate of the NMOS transistor M1 is biased to the voltage node VDD, the drain of the NMOS transistor M1 is connected to the off-chip The inductor L0 is connected, and the other end of the off-chip inductor L0 is connected to the voltage node VDD; in the active bias and matching circuit of the driver stage, the drain of the NMOS transistor M0 is connected in series with the first resistor R0 and connected to the voltage node VDD, so The gate of the NMOS transistor M0 is connected to the drain, and connected to the second resistor R1 to bias the gate of the NMOS transistor M1.

所述中间级放大电路中,所述NMOS管M5的源极接地,所述NMOS管M5的栅极通过中间级有源偏置及级间匹配电路和片内隔直电容C2后连接至所述NMOS管M1的漏极,所述NMOS管M5的漏极与所述NMOS管M4的源极相连,所述NMOS管M4的栅极偏置接电压节点VDD,所述NMOS管M4的漏极与所述片外电感L1连接,所述片外电感L1的另一端接电压节点VDD;所述中间级有源偏置和匹配电路中,NMOS管M3的漏极串联第一电阻R2并接于电压节点VDD,所述NMOS管M3的栅极与漏极相连,并接第二电阻R3后给所述NMOS管M5的栅极加偏置。In the intermediate stage amplifying circuit, the source of the NMOS transistor M5 is grounded, and the gate of the NMOS transistor M5 is connected to the The drain of the NMOS transistor M1, the drain of the NMOS transistor M5 is connected to the source of the NMOS transistor M4, the gate of the NMOS transistor M4 is biased to the voltage node VDD, and the drain of the NMOS transistor M4 is connected to the source of the NMOS transistor M4. The off-chip inductance L1 is connected, and the other end of the off-chip inductance L1 is connected to the voltage node VDD; in the intermediate stage active bias and matching circuit, the drain of the NMOS transistor M3 is connected in series with the first resistor R2 and connected to the voltage node Node VDD, the gate of the NMOS transistor M3 is connected to the drain, and connected to the second resistor R3 to bias the gate of the NMOS transistor M5.

所述功率输出级放大电路中,所述NMOS管M7的源极接地,所述NMOS管M7的栅极通过功率输出级有源偏置及级间匹配电路中的片内隔直电容C3后连接至所述NMOS管M4的漏极,所述NMOS管M7的漏极与所述片外电感L2连接,所述NMOS管M7的漏极并接一个片外隔直电容C4后连接至放大器的输出端口Vout,所述片外隔直电容C4用于防止额外的直流功耗,所述片外电感L2的另一端接电压节点VDD。所述功率级有源偏置和匹配电路中,NMOS管M6的漏极串联第一电阻R4并接于电压节点VDD,所述NMOS管M6的栅极与漏极相连,并接第二电阻R5后给所述NMOS管M7的栅极加偏置。本发明中的功率输出级放大电路采用共源极放大结构是为得到更大的电压输出摆幅,从而保证整个电路得到最大的输出功率。而且,共源结构可以比共源共栅结构节省一部分芯片的面积,同样可以达到所要求的功率输出指标。In the power output stage amplifying circuit, the source of the NMOS transistor M7 is grounded, and the grid of the NMOS transistor M7 is connected through the active bias of the power output stage and the on-chip DC blocking capacitor C3 in the interstage matching circuit. To the drain of the NMOS transistor M4, the drain of the NMOS transistor M7 is connected to the off-chip inductor L2, and the drain of the NMOS transistor M7 is connected to the output of the amplifier after being connected to an off-chip DC blocking capacitor C4 port Vout, the off-chip DC blocking capacitor C4 is used to prevent additional DC power consumption, and the other end of the off-chip inductor L2 is connected to the voltage node VDD. In the power stage active bias and matching circuit, the drain of the NMOS transistor M6 is connected in series with the first resistor R4 and connected to the voltage node VDD, and the gate of the NMOS transistor M6 is connected to the drain and connected to the second resistor R5 Then bias the gate of the NMOS transistor M7. The power output stage amplifying circuit in the present invention adopts a common source amplifying structure to obtain a larger voltage output swing, thereby ensuring that the entire circuit obtains the maximum output power. Moreover, the common source structure can save a part of chip area compared with the cascode structure, and can also achieve the required power output index.

本发明CMOS超宽带射频功率放大器的工作过程如下:The working process of the CMOS ultra-broadband radio frequency power amplifier of the present invention is as follows:

如图2所示,首先,射频信号从放大器的输入端Vin流经片外电容C1进入放大电路的第一级即驱动级放大电路,NMOS管M0在电源VDD的作用下产生电压偏置经第二电阻R1加在该放大电路的栅极,在偏置电压的作用下,两个共源共栅结构的NMOS管M1和NMOS管M2开始工作。信号经共源管流入共栅管并最终从其漏端输出。由于漏端片外电感L0的作用,信号不会从NMOS管M2的漏端流出到VDD端。最终,信号经过第一级的驱动放大电路放大之后经过级间的片内电容C2流入第二级的中间级放大电路中。As shown in Figure 2, first, the RF signal flows from the input terminal Vin of the amplifier through the off-chip capacitor C1 into the first stage of the amplifier circuit, that is, the driver stage amplifier circuit, and the NMOS transistor M0 generates a voltage bias under the action of the power supply VDD and passes through the first stage The two resistors R1 are added to the gate of the amplifying circuit, and under the action of the bias voltage, the two NMOS transistors M1 and M2 of cascode structure start to work. The signal flows into the common gate tube through the common source tube and finally outputs from its drain terminal. Due to the effect of the off-chip inductance L0 at the drain end, the signal will not flow out from the drain end of the NMOS transistor M2 to the VDD end. Finally, after the signal is amplified by the driver amplifier circuit of the first stage, it flows into the intermediate stage amplifier circuit of the second stage through the on-chip capacitor C2 between the stages.

在与第一级的驱动级放大电路相同的偏置电路作用下,第二级的中间级放大电路共源共栅电路也开始对信号进行放大,并经漏端输出。片外电感L1与级间片内电容C3作用与第一级相同。Under the action of the same bias circuit as that of the driver stage amplifier circuit of the first stage, the cascode circuit of the intermediate stage amplifier circuit of the second stage also starts to amplify the signal and outputs it through the drain terminal. The role of off-chip inductance L1 and inter-stage on-chip capacitor C3 is the same as that of the first stage.

信号从第二级电路流出后,经过片内级间电容C3流入第三级的功率输出级放大电路。同样,在偏置电路作用下,第三级共源放大电路开始工作,对信号进一步放大。NMOS管M7采用共源结构产生更大的输出摆幅,同时可以节省芯片面积。NMOS管M7漏栅之间的反馈电阻Rf与NMOS管M7构成反馈回路,可以改善电路的宽带输出匹配。由此,功率输出级片外电感L2和片外电容C4与反馈电阻Rf共同作用,使整个放大器电路得到最佳的输出匹配,从而实现最大功率输出。After the signal flows out from the second stage circuit, it flows into the power output stage amplifier circuit of the third stage through the on-chip interstage capacitor C3. Similarly, under the action of the bias circuit, the third-stage common-source amplifier circuit starts to work to further amplify the signal. The NMOS transistor M7 adopts a common source structure to generate a larger output swing, and can save chip area at the same time. The feedback resistor Rf between the drain and gate of the NMOS transistor M7 forms a feedback loop with the NMOS transistor M7, which can improve the broadband output matching of the circuit. Therefore, the off-chip inductance L2 and off-chip capacitor C4 of the power output stage work together with the feedback resistor Rf to make the entire amplifier circuit get the best output matching, thereby realizing the maximum power output.

在整个宽带放大电路设计过程中,各个晶体管以及电阻电容的尺寸大小是综合考虑的整个电路的带宽、增益、输出功率和效率等各项指标后决定的。并且通过后期的版图设计与合理布局优化,能够最大程度地实现要求的各项输出指标,实现在0.1~1.2GHz的超宽带下的高增益、高线性度、较大的输出功率和效率,并且占用较小的芯片面积。In the design process of the entire broadband amplifier circuit, the size of each transistor, resistor and capacitor is determined after comprehensively considering the bandwidth, gain, output power and efficiency of the entire circuit. And through the layout design and rational layout optimization in the later stage, the required output indicators can be realized to the greatest extent, and high gain, high linearity, large output power and efficiency can be realized under the ultra-wideband of 0.1-1.2GHz, and Occupies a smaller chip area.

下面以一个设计实例具体说明。在实际设计中,取前两级所有NMOS管M0~M5栅宽/栅长比均为200um/0.35um,,第三级NMOS管M6和M7尺寸均为400um/0.35um;电阻R0为167ohm,R1为30ohm,R2为317ohm,R3为220ohm,R4为500ohm,R5为230ohm,反馈电阻Rf为840ohm;片外隔直电容C1、C4均为1uF,C2、C3为20pF;电感L0、L1、L2均取200nH。The following is a specific design example. In the actual design, the gate width/gate length ratio of all NMOS transistors M0~M5 in the first two stages is 200um/0.35um, and the size of the third stage NMOS transistors M6 and M7 are both 400um/0.35um; the resistance R0 is 167ohm, R1 is 30ohm, R2 is 317ohm, R3 is 220ohm, R4 is 500ohm, R5 is 230ohm, feedback resistor Rf is 840ohm; off-chip DC blocking capacitors C1 and C4 are 1uF, C2 and C3 are 20pF; inductors L0, L1, L2 Both take 200nH.

如图3所示为本发明的功率放大器的稳定性Kf值仿真结果,当Kf值大于1时放大器稳定。从图中可以看出,在整个0.1~1.2GHz频段内Kf值均大于4.8e5,所以该电路是稳定的。As shown in FIG. 3 , the simulation result of the stability Kf value of the power amplifier of the present invention is shown. When the Kf value is greater than 1, the amplifier is stable. It can be seen from the figure that the Kf value is greater than 4.8e5 in the entire 0.1-1.2GHz frequency band, so the circuit is stable.

如图4所示为本功率放大器的S参数曲线仿真结果。从图中可以看出,在整个频段范围内,增益曲线S21均在28dB以上;输入输出回波损耗S11和S22均在-10dB以下,大多在-20dB左右;隔离度S12小于-150dB。As shown in Fig. 4, it is the simulation result of the S parameter curve of this power amplifier. It can be seen from the figure that in the entire frequency range, the gain curve S21 is above 28dB; the input and output return loss S11 and S22 are both below -10dB, mostly around -20dB; the isolation S12 is less than -150dB.

如图5所示为本发明功率放大器的输出功率曲线图。从图中可以看出,功率放大器的饱和输出功率为21.6dBm。FIG. 5 is a graph showing the output power of the power amplifier of the present invention. It can be seen from the figure that the saturated output power of the power amplifier is 21.6dBm.

如图6所示为本发明功率放大器的功率附加效率曲线图。从图中可以看出,在输出功率饱和的条件下,该放大器的效率为35%左右。FIG. 6 is a graph showing the power added efficiency of the power amplifier of the present invention. It can be seen from the figure that under the condition of output power saturation, the efficiency of the amplifier is about 35%.

综合图3、图4、图5和图6的仿真结果可知,本发明的功率放大器在0.1~1.2GHz频段内具有良好的性能指标,可以满足设计的要求。Based on the simulation results of Fig. 3, Fig. 4, Fig. 5 and Fig. 6, it can be known that the power amplifier of the present invention has good performance indicators in the 0.1-1.2 GHz frequency band and can meet the design requirements.

尽管上面结合图对本发明进行了描述,但是本发明并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本发明的启示下,在不脱离本发明宗旨的情况下,还可以作出很多变形,这些均属于本发明的保护之内。Although the present invention has been described above in conjunction with the drawings, the present invention is not limited to the above-mentioned specific embodiments, and the above-mentioned specific embodiments are only illustrative, rather than restrictive. Under the inspiration, many modifications can be made without departing from the gist of the present invention, and these all belong to the protection of the present invention.

Claims (2)

1.一种0.1~1.2GHz的CMOS超宽带射频功率放大器,包括多级放大电路,其特征在于,多级放大电路包括输入隔直电容C1、驱动级偏置及输入匹配电路、驱动级放大电路、级间隔直电容C2、中间级偏置及级间匹配电路、中间级放大电路、级间隔直电容C3、功率级偏置及级间匹配电路、功率级放大电路、输出隔直电容C4和芯片电源,所述芯片电源采用电压节点VDD;1. A CMOS ultra-broadband radio frequency power amplifier of 0.1~1.2GHz comprises a multistage amplifying circuit, wherein the multistage amplifying circuit comprises an input DC blocking capacitor C1, a driving stage bias and an input matching circuit, and a driving stage amplifying circuit , stage interval straight capacitor C2, intermediate stage bias and interstage matching circuit, intermediate stage amplifying circuit, stage interval direct capacitor C3, power stage bias and interstage matching circuit, power stage amplifying circuit, output DC blocking capacitor C4 and chip A power supply, the chip power supply adopts a voltage node VDD; 所述驱动级放大电路包括两个共栅共源结构的NMOS管M1和NMOS管M2,一个片外电感L0,其电感值至少为100nH;The driver stage amplifier circuit includes two NMOS transistors M1 and NMOS transistors M2 with a common-gate common-source structure, and an off-chip inductor L0 whose inductance value is at least 100nH; 所述中间级放大电路包括两个共栅共源结构的NMOS管M4和NMOS管M5,一个片外电感L1,其电感值至少为100nH;The intermediate stage amplifier circuit includes two NMOS transistors M4 and NMOS transistors M5 with a common-gate common-source structure, and an off-chip inductor L1 whose inductance value is at least 100nH; 所述功率级放大电路包括一共源结构的NMOS管M7和一个片外电感L2,其电感值至少为100nH,所述NMOS管M7的漏级和栅级之间设有一反馈电阻Rf;The power stage amplifying circuit includes an NMOS transistor M7 with a common source structure and an off-chip inductor L2, the inductance value of which is at least 100nH, and a feedback resistor Rf is provided between the drain and the gate of the NMOS transistor M7; 所述驱动级偏置及输入匹配电路、中间级偏置及级间匹配电路和功率级偏置及级间匹配电路结构相同,均分别包括有一个NMOS管、第一电阻和第二电阻;The drive stage bias and input matching circuit, the intermediate stage bias and interstage matching circuit and the power stage bias and interstage matching circuit have the same structure, each including an NMOS transistor, a first resistor and a second resistor; 所述驱动级放大电路中,所述NMOS管M2的源极接地,所述NMOS管M2的栅极通过驱动所述驱动级偏置及输入匹配电路和输入隔直电容C1后连接至放大器的输入端Vin,所述NMOS管M2的漏极与所述NMOS管M1的源极相连,所述NMOS管M1的栅极偏置接至电压节点VDD,所述NMOS管M1的漏极与所述片外电感L0连接,所述片外电感L0的另一端接电压节点VDD;In the driver stage amplifier circuit, the source of the NMOS transistor M2 is grounded, and the gate of the NMOS transistor M2 is connected to the input of the amplifier after driving the driver stage bias and input matching circuit and the input DC blocking capacitor C1 Terminal Vin, the drain of the NMOS transistor M2 is connected to the source of the NMOS transistor M1, the gate bias of the NMOS transistor M1 is connected to the voltage node VDD, the drain of the NMOS transistor M1 is connected to the chip The external inductance L0 is connected, and the other end of the off-chip inductance L0 is connected to the voltage node VDD; 所述中间级放大电路中,所述NMOS管M5的源极接地,所述NMOS管M5的栅极通过中间级偏置及级间匹配电路和级间隔直电容C2后连接至所述NMOS管M1的漏极,所述NMOS管M5的漏极与所述NMOS管M4的源极相连,所述NMOS管M4的栅极偏置接至所述电压节点VDD,所述NMOS管M4的漏极与所述片外电感L1连接,所述片外电感L1的另一端接电压节点VDD;In the intermediate-stage amplifying circuit, the source of the NMOS transistor M5 is grounded, and the gate of the NMOS transistor M5 is connected to the NMOS transistor M1 after passing through the intermediate-stage bias and inter-stage matching circuit and the straight capacitor C2 between stages. The drain of the NMOS transistor M5 is connected to the source of the NMOS transistor M4, the gate bias of the NMOS transistor M4 is connected to the voltage node VDD, and the drain of the NMOS transistor M4 is connected to the source of the NMOS transistor M4. The off-chip inductor L1 is connected, and the other end of the off-chip inductor L1 is connected to the voltage node VDD; 所述功率级放大电路中,所述NMOS管M7的源极接地,所述NMOS管M7的栅极通过功率级偏置及级间匹配电路和级间隔直电容C3后连接至所述NMOS管M4的漏极,所述NMOS管M7的漏极与所述片外电感L2连接,所述NMOS管M7的漏极与所述输出隔直电容C4并接后连接至放大器的输出端口Vout,所述片外电感L2的另一端接电压节点VDD。In the power stage amplifying circuit, the source of the NMOS transistor M7 is grounded, and the gate of the NMOS transistor M7 is connected to the NMOS transistor M4 after passing through a power stage bias, an inter-stage matching circuit and a straight capacitor C3 between stages. The drain of the NMOS transistor M7 is connected to the off-chip inductor L2, the drain of the NMOS transistor M7 is connected to the output DC blocking capacitor C4 in parallel, and then connected to the output port Vout of the amplifier. The other end of the off-chip inductor L2 is connected to the voltage node VDD. 2.根据权利要求1所述0.1~1.2GHz的CMOS超宽带射频功率放大器,其中,所述驱动级偏置及输入匹配电路中的NMOS管M0的漏极串联第一电阻R0连接至电压节点VDD,所述NMOS管M0的栅极与漏极相连、并与第二电阻R1串联后给所述NMOS管M1的栅极加偏置。2. The 0.1-1.2GHz CMOS ultra-broadband radio frequency power amplifier according to claim 1, wherein the drain of the NMOS transistor M0 in the driver stage bias and input matching circuit is connected in series with the first resistor R0 to the voltage node VDD , the gate of the NMOS transistor M0 is connected to the drain, and connected in series with the second resistor R1 to bias the gate of the NMOS transistor M1.
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CN105577126A (en) * 2015-12-15 2016-05-11 清华大学 Circuit topology of distributed amplifier with graphene transmission line as interstage matching
CN106301255A (en) * 2016-11-04 2017-01-04 杭州迦美信芯通讯技术有限公司 Wideband power amplifer and active matching circuit thereof
CN106301255B (en) * 2016-11-04 2023-05-12 杭州迦美信芯通讯技术有限公司 Broadband power amplifier and active matching circuit thereof
CN108336976A (en) * 2018-02-07 2018-07-27 广州慧智微电子有限公司 A kind of multiband low-noise amplifier and amplification method
CN112003574A (en) * 2020-07-14 2020-11-27 天津工业大学 A K-band CMOS high-efficiency RF power amplifier circuit
CN112003574B (en) * 2020-07-14 2024-02-09 天津工业大学 K-band CMOS efficient radio frequency power amplifier circuit
CN112910420A (en) * 2021-01-18 2021-06-04 温州大学 High-linearity radio frequency power amplifier
CN112702029A (en) * 2021-03-25 2021-04-23 成都知融科技股份有限公司 CMOS power amplifier chip with on-chip integrated detection function
CN113612450A (en) * 2021-10-09 2021-11-05 成都嘉纳海威科技有限责任公司 Ultra-wideband driving amplification circuit
CN113612450B (en) * 2021-10-09 2022-01-04 成都嘉纳海威科技有限责任公司 Ultra-wideband driving amplification circuit

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