CN103594605A - LED photoelectric component - Google Patents

Abstract

An LED optoelectronic component, comprising a carrier component, a connection component, an insulating seat body integrally formed with the carrier component and the connection component, and a photoelectric chip, the carrier component includes a central bearing area, and an insulating base extending from the central bearing area The pins outside the base, the connecting component includes two pins extending out of the insulating base from different directions, the two pins of the connecting component are provided with solid welding areas, the insulating base includes a base, and The package cavity is formed by recessing from the middle of the base, and a cover layer is formed on the bottom of the package cavity during the integral molding process of the insulating base body. The carrier component and the connection component are located at the bottom of the package cavity except the central bearing area, The parts other than the two solid welding areas are covered by the covering layer, and the LED photoelectric component of the present invention can effectively improve the airtightness and reflectivity of the product.

Description

LED optoelectronic components

technical field

The invention relates to the field of LED lighting, in particular to an LED photoelectric component.

Background technique

U.S. Patent No. 6,469,321 discloses a LED optoelectronic assembly, which includes a chip carrier assembly carrying an optoelectronic chip, a connecting assembly for connecting the optoelectronic chip, and a device for holding the carrier assembly and the connecting assembly as a whole. Insulation enclosure. A storage cavity is recessed in the middle of the insulating cover, the surface of the carrier component and the connection component at the bottom of the storage cavity are all exposed on the bottom wall of the storage cavity, and the photoelectric chip is packaged on the surface of the carrier component at the bottom of the storage cavity and connect the carrier component and the connection component through gold wires for electrical conduction. The carrier component is made of high thermal conductivity material and includes at least two heat conduction feet extending out of the enclosure from different directions.

The carrier components of the aforementioned LED optoelectronic components extend multiple heat conduction feet from different positions of the enclosure, which alleviates the heat dissipation problem of the chip to a certain extent, but with the improvement of air tightness requirements for outdoor lighting equipment, LED optoelectronic The requirements for airtightness need to be further improved.

Contents of the invention

The purpose of the present invention is to provide a highly airtight and highly reflective LED optoelectronic component.

In order to solve the above-mentioned technical problems, the present invention provides an LED optoelectronic component, including a carrier component, a connection component, an insulating seat body in which the carrier component and the connection component are integrally formed, and a photoelectric chip. The carrier component includes a central bearing area, and pins extending out of the insulating base from the central bearing area, the connecting component is set at a certain distance from the carrier component and includes at least one pin extending out of the insulating base, the pins of the carrier component, And the pins of the connecting component are provided with a solid soldering area near the central bearing area. The insulating base includes a base and a package cavity formed by recessing from the middle of the base. The central bearing area of the carrier component is located at the center of the package cavity. In the center position, a cover layer is formed on the bottom of the package cavity during the integral molding process of the insulating base body, and the carrier component and the connection component are located at the bottom of the package cavity except the central bearing area and two solid welding areas The outer part is covered by the covering layer, and the optoelectronic chip is electrically connected to the solid welding area of the carrier component and the connection component respectively.

In order to solve the above-mentioned technical problems, the present invention also provides an LED optoelectronic component, including a carrier component, a connection component, an insulating seat body in which the carrier component and the connection component are integrally formed, and a photoelectric chip. The carrier component includes a center The bearing area and the pins extending out of the insulating base from the central bearing area, the connecting assembly includes two pins extending out of the insulating base from different directions and are arranged at a certain distance from the carrier assembly, the connecting assembly The two pins of the two pins are provided with solid soldering areas near the central bearing area. The insulating base includes a base and a package cavity formed by recessing from the middle of the base. The central bearing area of the carrier component is located in the center of the package cavity. position, a covering layer is formed at the bottom of the package cavity during the integral molding process of the insulating base body, and the carrier component and the connection component are located at the bottom of the package cavity except for the central bearing area and between the two soldering areas The outer part is covered by the covering layer, and the optoelectronic chips are respectively electrically connected to the two solid welding areas of the connecting component.

Compared with the prior art, the LED optoelectronic component of the present invention has a covering layer formed on the bottom of the packaging cavity during the molding process of the insulating seat body. The parts outside the solid welding area are all molded and covered inside, which increases the molded joint surface between the carrier component and the connecting component and the insulating seat body, and enhances the airtightness of the LED photoelectric component. At the same time, the cover layer is provided with an inclined step-shaped second reflective surface around the central carrying area where the optoelectronic chip is placed, which increases the reflection effect of the light source of the LED optoelectronic chip.

Description of drawings

Fig. 1 is a perspective view of the first embodiment of the LED optoelectronic component of the present invention.

Fig. 2 is a three-dimensional exploded view of the first embodiment of the LED optoelectronic component of the present invention.

Fig. 3 is a top view of the first embodiment of the LED optoelectronic component of the present invention.

Fig. 4 is a top view of the second embodiment of the LED optoelectronic component of the present invention.

Fig. 5 is a top view of the third embodiment of the LED optoelectronic component of the present invention.

Fig. 6 is a three-dimensional exploded view of the third embodiment of the LED optoelectronic component of the present invention.

Fig. 7 is a top view of the fourth embodiment of the LED optoelectronic component of the present invention.

Detailed ways

Please refer to the first embodiment of the present invention shown in FIGS. 1 to 3 , the LED optoelectronic component of the present invention includes a carrier component 20 , a connecting component 30 , an insulating base 10 that integrally forms the carrier component 20 and the connecting component 30 , And the optoelectronic chip 90 packaged inside.

The carrier component 20 includes a central bearing area 21 for placing the optoelectronic chip 90 , and pins 22 extending from the central bearing area 21 out of the insulating base 10 in three different directions. The ends of the pins 22 are provided with welding feet 24 . At least one pin 22 connected to the central bearing area 21 is provided with a soldering area 23 , and each pin 22 is provided with a holding hole 25 in the molding area of the insulating base 10 .

The connection component 30 is set at a certain distance from the carrier component 20 , and the connection component 30 is provided with a solid welding area 31 adjacent to the central bearing area 21 and pins extending from the solid welding area 31 to the outside of the insulating base 10 32, the end of the pin 32 is provided with a welding foot 3, and the integrally formed area of the connecting component 30 and the insulating base 10 is provided with a holding hole 34.

Focusing on Fig. 3, the four pins 22, 32 of the carrier component 20 and the connection component 30 extend from the two sides of the insulating seat body 10 respectively, wherein the pins 32 of the connection component 30 and the pins 32 of the carrier component 20 A pin 22 extends from one side of the insulating base body 10, while the other two pins 22 of the carrier assembly 20 extend from the opposite side of the insulating base body 10. The central carrying area 21 of the carrier assembly 20 is located at the center of the four pins 22 , 32 .

Please refer to FIGS. 1 to 3 . The insulating base 10 includes a base 11 and a package cavity 12 recessed from the center of the base 11 . An inclined first reflective surface 15 is formed around the package cavity 12 . The central bearing area 21 of the carrier component 20 is located at the center of the bottom of the package cavity 12, the central bearing area 21 of the carrier component 20, the solid soldering area 23 on one of the pins 22, and the connecting component 30 The surface of the solid soldering area 31 is exposed to the outside world. The carrier component 20 and the connection component 30 are located at the bottom of the package cavity 12 and are covered by the covering layer 13 integrally formed with the insulating base 10 except the central carrying area 21 and the two soldering areas 23 and 31 . The cover layer 13 forms an inclined and stepped second reflective surface 14 around the central carrying area 21 of the carrier assembly 20, and the inclination of the second reflective surface 14 is approximately the same as the inclination of the first reflective surface 15. same. The optoelectronic chip 90 is packaged on the central carrying area 21 of the carrier component 20 and connected to the soldering area 23 of the carrier component 20 and the soldering area 31 of the connection component 30 respectively through gold wires. The solid welding area 23 of the carrier component 20 and the solid welding area 31 of the connection component 30 are located at both ends of the diagonal of the insulating base 10 .

The carrier component 20 is made of a metal material with good thermal conductivity, and the heat generated by the optoelectronic chip 90 is conducted to the outside of the optoelectronic component through the three pins 22 of the carrier component 20 to achieve a good heat dissipation effect.

Please refer to the second embodiment of the present invention shown in FIG. 4 . Compared with the first embodiment, the difference of the second embodiment is that the carrier component 20 and the connection component 30 are on a diagonal line between a pin 22 and The carrier component 20 is separated to form a connecting component 30 , so that the two solid soldering regions 31 , 33 are both provided on the connecting component 30 , and the carrier component 20 will only undertake the heat dissipation function to achieve the effect of thermoelectric separation.

Please refer to the third embodiment of the present invention shown in FIG. 5 and FIG. 6. Compared with the first embodiment, the carrier assembly 40 of the LED optoelectronic component of the third embodiment also includes a The central bearing area 41 of the position, and the two pins 42 from the central bearing area 41 to the opposite sides of the insulating seat body 10, the central bearing area 41 is located at the center of the two pins 42 and away from the two pins 42 direction is highlighted. The connection assembly 50 is located on one side of the carrier assembly 40 and is spaced from the carrier assembly 40 by a certain distance. Pins 52 , the connection assembly 50 is located at the bottom of the package cavity 12 corresponding to the central bearing area 41 and is recessed to form a recess 51 away from the central bearing area 41 , so that the central bearing area 41 of the carrier assembly 40 protrudes into the concave portion 51 and is located at the center of the packaging cavity 12 . Wherein, two soldering areas (not labeled) are respectively provided on two pins 42 , 52 on the diagonal line between the carrier component 40 and the connection component 50 . The packaging cavity 12 , cover layer 13 , and second reflective surface 14 of the insulating base 10 are the same as those in the first embodiment, and will not be repeated here.

Please refer to the fourth embodiment shown in FIG. 7 . Compared with the third embodiment, the difference is that the connection assembly 50 is cut into two parts from the recessed part 51 .

Compared with the prior art, the LED optoelectronic component of the present invention is formed with a covering layer 13 at the bottom of the packaging cavity 12 during the molding process of the insulating base 10, and the covering layer connects the carrier components 20, 40, and The components 30, 50 except the central carrying area 21, 41 and the two soldering areas 23, 31 are molded and covered inside, and the carrier components 20, 40 and the connection between the components 30, 50 and the insulating base 10 are added. The molded joint surface enhances the airtightness of LED optoelectronic components. At the same time, the cover layer 13 is provided with an inclined step-shaped second reflective surface 14 around the central carrying areas 21 and 41 where the optoelectronic chip 90 is placed, which increases the reflection effect of the light source of the LED optoelectronic chip 90 .

Claims (10)

1. A kind of LED optoelectronic component, comprises carrier assembly, connection assembly, the insulating seat body that described carrier assembly and connection assembly are molded into one, and optoelectronic chip, it is characterized in that: described carrier assembly includes central carrying area, and self-contained The central bearing area extends out of the pin outside the insulating seat, the connecting component is arranged at a certain distance from the carrier component and includes at least one pin extending out of the insulating seat, the pin of the carrier component, and the pin of the connecting component The pin is provided with a solid soldering area near the central bearing area, and the insulating base includes a base and a package cavity formed by recessing from the middle of the base. The central bearing area of the carrier component is located at the center of the package cavity. The insulating seat is formed with a covering layer at the bottom of the packaging cavity during the integral molding process, and the part of the carrier component and the connecting component located at the bottom of the packaging cavity except the central bearing area and the two solid soldering areas All are covered by the covering layer, and the optoelectronic chips are respectively electrically connected to the carrier component and the solid welding area of the connection component. 2. The LED optoelectronic component according to claim 1, wherein an inclined first reflective surface is formed around the encapsulation cavity. 3. The LED optoelectronic component as claimed in claim 2, characterized in that: the cover layer forms a second reflective surface in the shape of an inclined step around the central bearing area to improve the light source generated by the optoelectronic chip located in the center of the second reflective surface, The inclination of the first reflective surface is substantially the same as the inclination of the second reflective surface. 4. The LED optoelectronic component according to claim 1, wherein the carrier component includes three pins extending out of the insulating base from different directions of the insulating base, and at least one pin of the carrier component is A soldering area is provided, and the central bearing area of the carrier component, the soldering area, and the soldering area of the connecting component are exposed to the cover layer at the bottom of the package cavity. 5. The LED optoelectronic component according to claim 1, wherein the carrier component includes two pins extending out of the insulating base in different directions, and at least one pin of the carrier component is provided with There is a solid welding area, the connection assembly includes two pins extending from the insulating base in different directions, at least one pin of the connection assembly is provided with a solid welding area, and the carrier assembly The central carrying area, the soldering area, and the soldering area of the connection component are exposed to the cover layer at the bottom of the package cavity. 6. The LED optoelectronic component as claimed in claim 5, characterized in that: the central bearing area of the carrier component protrudes toward the two pins away from the carrier component, and the corresponding position of the connecting component is away from the The direction of the central carrying area is recessed to form a recessed portion for accommodating the central carrying area so that the central carrying area is located at the center of the packaging cavity. 7. The LED optoelectronic component as claimed in claim 4 or 5, characterized in that: each pin of the carrier component and the pin of the connecting component are provided with a pin that is held by the insulating seat during the molding process. holding hole. 8. A LED optoelectronic component, comprising a carrier component, a connection component, an insulating seat body formed with the carrier component and the connection component, and a photoelectric chip, characterized in that: the carrier component includes a central bearing area, and a self- The central bearing area extends out of the pins outside the insulating base, and the connecting assembly includes two pins extending out of the insulating base from different directions and is arranged at a certain distance from the carrier assembly. The two pins of the connecting assembly A solid soldering area is provided near the central bearing area, the insulating base includes a base, and a packaging cavity formed by recessing from the middle of the base, the central loading area of the carrier assembly is located at the center of the packaging cavity, and in the During the integral molding process, the insulating seat body is formed with a cover layer at the bottom of the package cavity, and the part of the carrier component and the connection component located at the bottom of the package cavity except the central bearing area and the two solid soldering areas are all covered The cover layer is molded to cover the interior, and the photoelectric chips are respectively electrically connected to the two solid welding areas of the connection component. 9. The LED optoelectronic component according to claim 8, wherein an inclined first reflective surface is formed around the encapsulation cavity, and an inclined and stepped second reflective surface is formed around the central carrying area by the cover layer to improve The light source generated by the photoelectric chip located at the center of the second reflective surface, the inclination of the first reflective surface is approximately the same as the inclination of the second reflective surface. 10. The LED optoelectronic component according to claim 1, wherein the carrier component includes two pins extending from the insulating base in different directions to conduct heat outside the insulating base, and the center of the carrier component The carrying area and the two solid soldering areas of the connecting component are exposed to the covering layer at the bottom of the package cavity.

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