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CN103591480B - 发光二极管照明装置 - Google Patents

发光二极管照明装置 Download PDF

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CN103591480B
CN103591480B CN201210293669.5A CN201210293669A CN103591480B CN 103591480 B CN103591480 B CN 103591480B CN 201210293669 A CN201210293669 A CN 201210293669A CN 103591480 B CN103591480 B CN 103591480B
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CN103591480A (zh
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陈隆欣
曾文良
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Priority to TW101131076A priority patent/TWI469316B/zh
Priority to US13/663,492 priority patent/US20140049955A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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Abstract

一种发光二极管照明装置,其包括发光部以及承载座。所述发光部包括透光基板、分别设置在该透光基板两端的第一电极以及设置在该透光基板上并与第一电极电连接的发光二极管。所述承载座承载所述发光部,所述承载座由透光材料构成,其上设有与所述第一电极电连接的第二电极。发光二极管发出的光线可从发光二极管照明装置的正面射出,并且还可以穿过透光基板以及承载座从背面和侧面射出,从而实现了多角度发光。

Description

发光二极管照明装置
技术领域
本发明涉及一种发光二极管照明装置。
背景技术
发光二极管是一种节能、环保、长寿命的固体光源,因此近十几年来对发光二极管技术的研究一直非常活跃,发光二极管也有渐渐取代日光灯、白炽灯等传统光源的趋势。在现有技术中,发光二极管照明装置一般只能朝向一个方向发光,而无法实现多角度发光,在一些特定场合,不能够满足实际需要。
发明内容
有鉴于此,有必要提供一种可实现多角度发光的发光二极管照明装置。
一种发光二极管照明装置,其包括发光部以及承载座。所述发光部包括透光基板、分别设置在该透光基板两端的第一电极以及设置在该透光基板上并与第一电极电连接的发光二极管。所述承载座承载所述发光部,所述承载座由透光材料构成,其上设有与所述第一电极电连接的第二电极。
上述的发光二极管照明装置中,发光二极管发出的光线可从发光二极管照明装置的正面射出,并且还可以穿过透光基板以及承载座从背面和侧面射出,从而实现了多角度发光。
附图说明
图1为本发明实施方式中的发光二极管照明装置的结构示意图。
图2为图1中的发光二极管照明装置的分解结构示意图。
图3为图2中的发光二极管照明装置的发光部的俯视图。
图4为图2中的发光二极管照明装置的承载座的俯视图。
图5为图4中的承载座的沿VI-VI方向的截面图。
主要元件符号说明
发光二极管照明装置 100
发光部 10
承载座 20
透光基板 11
发光二极管 12
第一电极 13
第一荧光层 14
固定部 131
第一连接部 132
第二连接部 133
透光底壁 21
透光侧壁 22
凹槽 23
第二荧光层 24
第二电极 25
水平延伸部 251
垂直延伸部 252
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合附图,对本发明作进一步的详细说明。
请参阅图1以及图2,本发明实施方式提供的一种发光二极管照明装置100包括一发光部10以及承载该发光部10的一承载座20。
所述发光部10包括一透光基板11、设置在该透光基板11上的若干间隔设置的发光二极管12、分别设置在该透光基板11相对两端的第一电极13以及覆盖发光二极管12的第一荧光层14。
请接着参阅图3,所述透光基板11为纵长板状结构,其由玻璃、塑胶等透光材料构成。所述发光二极管12呈直线排列设置在透光基板11的远离承载座20的上表面上,各发光二极管12之间相互串联,并且两端的发光二极管12分别与第一电极13电连接。
所述第一电极13分别设置在透光基板11的相对两端,其包括一方形的固定部131、由该固定部131的底部延伸形成的第一连接部132以及由该固定部131的顶部延伸形成的第二连接部133。该固定部131固定在透光基板11的上表面。该第一连接部132及第二连接部133的延伸方向相反,且其末端均超出固定部的边缘并分别位于固定部的相对两侧。具体的,该第一连接部132贴附在所述透光基板11上表面并朝向发光二极管12水平延伸,用于与发光二极管12电连接。该第二连接部133朝向远离发光二极管12方向水平延伸,用于与所述承载座20电连接。所述固定部131的外侧面与所述透光基板11的两端的端面齐平。
所述第一荧光层14覆盖所述发光二极管12以及透光基板11表面,其为一透明结构,材质可为硅、玻璃、环氧树脂等。荧光粉材质可选自石榴石、硅酸盐、氮化物、氮氧化物、磷化物、硫化物中之一或几种组合的化合物。
请接着参阅图4以及图5,所述承载座20为透光材料构成,其包括一纵长板状结构的透光底壁21以及由该透光底壁21的四个侧边垂直向上延伸的透光侧壁22。该透光底壁21和该透光侧壁22共同围成一凹槽23,该凹槽23的大小与所述发光部10的透光基板11的大小大致相当,其用于收容所述透光基板11。该凹槽23的内表面涂覆有第二荧光层24。
所述承载座20与所述透光基板11上的第一电极13相对应的两透光侧壁22上分别设置有第二电极25。该第二电极25包括设置在透光侧壁22顶部的水平延伸部251以及由该水平延伸部251沿透光侧壁22外表面垂直向下延伸的垂直延伸部252。该第二电极25的水平延伸部251用于与第一电极13电连接,垂直延伸部252用于与外部电源电连接。
在组装时,首先将发光部10的透光基板11收容于承载座20的凹槽23中,此时,第一电极13的第二连接部133覆盖在第二电极25的水平延伸部251上,然后焊接第一电极13的第二连接部133与第二电极25的水平延伸部251,从而将发光部10固定于承载座20中。
在使用时,发光二极管12发出的光线可从发光二极管照明装置100的正面射出,并且发光二极管12发出的光线还可以穿过透光基板11以及承载座20的透光底壁21从背面射出,也可以穿过透光基板11以及承载座20的透光侧壁22从侧面射出,从而实现了多角度发光。另外,发光二极管12正向发出的光线主要激发第一荧光层14,而背向以及侧向发出的光线主要激发涂覆在凹槽23的内表面的第二荧光层24,因此通过选择不同的荧光粉材料,可以实现发光二极管照明装置100正向光线与背向以及侧向光线的颜色不同,可以满足不同的实际需要。
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种像应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (3)

1.一种发光二极管照明装置,其包括发光部以及承载座,其特征在于:所述发光部包括透光基板、分别设置在该透光基板两端的第一电极以及设置在该透光基板上并与第一电极电连接的发光二极管,所述承载座承载所述发光部,所述承载座由透光材料构成,其上设有与所述第一电极电连接的第二电极,所述承载座包含凹槽,所述透光基板收容于所述凹槽中,所述发光二极管照明装置还包括第一荧光层及第二荧光层,所述第一荧光层位于所述基板上且包覆所述发光二极管,所述第二荧光层连续设置、形成在凹槽的内表面并完全包覆所述基板的底面及侧面,所述承载座由透光底壁及由该透光底壁朝向发光部延伸的透光侧壁构成,所述透光底壁和透光侧壁共同围成所述凹槽,所述第二电极包括设置在透光侧壁顶部的水平延伸部及由该水平延伸部沿透光侧壁外表面垂直向下延伸的垂直延伸部,所述水平延伸部用于与所述透光基板的第一电极电连接,所述垂直延伸部用于与外部电源电连接,所述第一电极包括固定在透光基板表面的固定部以及从固定部的底部延伸的第一连接部和从固定部顶部延伸的第二连接部,该第一连接部及第二连接部的延伸方向相反,且其末端均超出固定部的边缘,该第一连接部朝向发光二极管水平延伸,以与发光二极管电连接,该第二连接部朝向远离发光二极管方向延伸,并覆盖在所述第二电极的水平延伸部上,与该水平延伸部焊接,所述水平延伸部夹设于所述第二连接部与透光侧壁顶部之间。
2.如权利要求1所述的发光二极管照明装置,其特征在于:所述第一荧光层和所述第二荧光层中含有不同的荧光粉。
3.如权利要求1所述的发光二极管照明装置,其特征在于:所述透光基板为纵长板状结构,所述发光二极管呈直线排列设置在该透光基板上,各发光二极管之间相互串联,并且两端的发光二极管分别与第一电极电连接。
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TW101131076A TWI469316B (zh) 2012-08-17 2012-08-27 發光二極體照明裝置
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CN104048204A (zh) * 2014-07-10 2014-09-17 宋勇飞 Led光源及其制造方法
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674316A (zh) * 2004-03-25 2005-09-28 西铁城电子股份有限公司 半导体发光器件
CN201007995Y (zh) * 2006-09-29 2008-01-16 厦门市三安光电股份有限公司 360°出光led灯
CN201661884U (zh) * 2009-12-31 2010-12-01 深圳市泰迪伦光电科技有限公司 全角度照射的led灯泡
CN201868426U (zh) * 2010-10-28 2011-06-15 王元成 一种led光源
CN201892119U (zh) * 2010-11-18 2011-07-06 郑皓嵘 全方位发光led灯泡

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040173808A1 (en) * 2003-03-07 2004-09-09 Bor-Jen Wu Flip-chip like light emitting device package
JP2007165811A (ja) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
TW201038113A (en) * 2009-04-08 2010-10-16 Aussmak Optoelectronic Corp Light emitting apparatus
TW201044904A (en) * 2009-06-02 2010-12-16 Taiwan Solutions Systems Corp Light emitting diode module and manufacture method thereof
TWM391722U (en) * 2010-05-03 2010-11-01 Ru-Yuan Yang Packing structure of white light-emitting diode with high efficiency
US8421111B2 (en) * 2010-12-27 2013-04-16 Panasonic Corporation Light-emitting device and lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674316A (zh) * 2004-03-25 2005-09-28 西铁城电子股份有限公司 半导体发光器件
CN201007995Y (zh) * 2006-09-29 2008-01-16 厦门市三安光电股份有限公司 360°出光led灯
CN201661884U (zh) * 2009-12-31 2010-12-01 深圳市泰迪伦光电科技有限公司 全角度照射的led灯泡
CN201868426U (zh) * 2010-10-28 2011-06-15 王元成 一种led光源
CN201892119U (zh) * 2010-11-18 2011-07-06 郑皓嵘 全方位发光led灯泡

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