CN103586600A - Lead-free soldering tin alloying pellet - Google Patents
Lead-free soldering tin alloying pellet Download PDFInfo
- Publication number
- CN103586600A CN103586600A CN201310559428.5A CN201310559428A CN103586600A CN 103586600 A CN103586600 A CN 103586600A CN 201310559428 A CN201310559428 A CN 201310559428A CN 103586600 A CN103586600 A CN 103586600A
- Authority
- CN
- China
- Prior art keywords
- solder
- ball
- soldering tin
- lead
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract description 17
- 239000008188 pellet Substances 0.000 title abstract 14
- 238000005275 alloying Methods 0.000 title abstract 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 112
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 48
- 239000000956 alloy Substances 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 11
- 238000003466 welding Methods 0.000 abstract description 7
- 230000032683 aging Effects 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910020816 Sn Pb Inorganic materials 0.000 description 4
- 229910020922 Sn-Pb Inorganic materials 0.000 description 4
- 229910008783 Sn—Pb Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017750 AgSn Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 206010023126 Jaundice Diseases 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- 244000144972 livestock Species 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- -1 siloxanes Chemical class 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a lead-free soldering tin alloying pellet. The lead-free soldering tin alloying pellet is characterized by being formed by a solder pellet component. The solder pellet component comprises, by mass, 1.0-4.0% of Ag, 0.05-2.0% of Cu, 0.0005-0.005% of P, and the balance Sn. The solder pellet component of the lead-free soldering tin alloying pellet preferably contains, by mass, 1.0-3.5% of Ag and 0.05-0.75% of Cu. The diameter of the lead-free soldering tin alloying pellet is 0.04-0.5 millimeter. The lead-free soldering tin alloying pellet is arranged on an electrode of a BGA substrate. The lead-free soldering tin alloying pellet has the advantages that the surface of the lead-free soldering tin alloying pellet can not turn yellow when the lead-free soldering tin alloying pellet forms a soldering tin protruding block on the electrode, packaged through the BGA, of an electronic part, the soldering tin pellet has excellent wettability, gaps can not be formed easily in the welding process, and the diameter of the soldering tin pellet is tiny.
Description
Technical field
The present invention relates to a kind of solder ball, particularly a kind of Pb-free solder alloy ball.
Background technology
In the past, be used to form above the most frequently used Sn and the alloy of Pb, particularly 63Sn-Pb alloy of soldering alloy ball of solder bump of BGA, and it is the eutectic composition of Sn-Pb alloy.Yet through finding, the use of leaded scolding tin comprises leaded soldering alloy ball, and it is an environomental pollution source.When the electronic component with Sn-Pb scolding tin breaks down or become outmoded and no longer during convenient use, they are dropped and as processing.After this equipment is abandoned, some part of equipment can reuse or reclaim.For example, the plastics in container, metal and the noble metal in electronic component in framework often can be recycled.In contrast, the printed circuit board (PCB) with scolding tin is bonding, can not reuse or reclaim.Therefore, discarded printed circuit board (PCB) is pulverized conventionally, then buries at landfill and disposes.If the printed circuit board (PCB) of processing in the mode of burying adopts solder containing pb, as Sn-Pb scolder, and if printed circuit board (PCB) contacts with the acid rain with high pH value, the lead in Sn-Pb scolder can be dissolved out, and mixes, and enter underground water with rainwater.If the mankind or the leaded underground water of livestock long-term drinking, lead can be accumulated in vivo, may cause lead poisoning thus.For fear of relevant environment and the health problem of using solder containing pb to cause, in electronics industry, having brought into use now lead-free is so-called lead-free solder.
Summary of the invention
The object of the present invention is to provide a kind of Pb-free solder alloy ball, in order to solve above-mentioned existing issue.
Technical scheme of the present invention is as follows: a kind of Pb-free solder alloy ball, it is characterized in that: Pb-free solder alloy ball is formed and point formed by solder ball, this composition comprises 1.0 4.0%(quality) Ag, 0.05 2.0%(quality) Cu, 0.0005 0.005%(quality) P, and the Sn of surplus.
In the solder ball composition of Pb-free solder alloy ball, preferably contain 1.0 3.5%(quality) Ag.
In the solder ball composition of Pb-free solder alloy ball, preferably comprise 0.05 075%(quality) Cu.
The diameter of Pb-free solder alloy ball is 0.04 0.5 millimeter.
Pb-free solder alloy ball is placed on the electrode of BGA substrate.
The invention has the beneficial effects as follows: Pb-free solder alloy ball is when electronic component forms solder bump on as the electrode of BGA encapsulation, and its surface can flavescence, and this solder ball has excellent wetability, do not form space during welding, it also has small diameter simultaneously.
The specific embodiment
Pb-free solder alloy ball of the present invention, it is characterized in that: Pb-free solder alloy ball is formed and point formed by solder ball, and this composition comprises 1.0 4.0%(quality) Ag, 0.05 2.0%(quality) Cu, 0.0005 0.005%(quality) P, and the Sn of surplus.In the solder ball composition of Pb-free solder alloy ball, preferably contain 1.0 3.5%(quality) Ag.In the solder ball composition of Pb-free solder alloy ball, preferably comprise 0.05 075%(quality) Cu.The diameter of Pb-free solder alloy ball is 0.04 0.5 millimeter.Pb-free solder alloy ball is placed on the electrode of BGA substrate.
According to the present invention, in Pb-free solder alloy ball, if the content of Ag is less than 1.0%(quality) time, liquidus temperature uprises, welding temperature is inevitable also to be uprised, thereby in the welding process of solder ball, BGA encapsulation or other electronic components also can be increased by the possibility of fire damage.Ag is also a kind of element that affects solderability.If the content of Ag is less than 1.0%(quality), solderability variation, weld defect possibility can increase.But, if the content of Ag surpasses 8.0%(quality), can there is remarkable alligatoring in AgSn compound, and joint reliability declines.In addition, scolding tin temperature does not wish to increase due to the liquidus temperature of solder alloy.Therefore, in the present invention, the scolder lower limit of Ag is 1.0%(quality), be above limited to 8.0%(quality).Preferably, the content of Ag is that 1.0-3.5 quality % is best.
At Sn-Ag, be associated in gold, add Cu and can fall low-alloyed fusion temperature, and increase its intensity.If Cu containing quantity not sufficient 0.05%(quality), can not obtain these effects.But, if the content of Cu surpasses 2.0%(quality) time, the liquidus temperature of this alloy rises, thereby not only makes welding temperature uprise, and a large amount of SnCu intermetallic compounds separates out, thereby makes solderability variation.Therefore, Cu content is 0.05 2.0%(quality), be preferably 0.05-0.75%(quality).
Usining in the solder alloy of Sn as main component, the interpolation of P is effectively, and it can not only prevent peeling off of solder projection after aging, and prevents its flavescence.Yet if add a large amount of P, depositing of it can make wetability variation, and cause space to form.At Sn-Ag-Cu, be associated in gold, if the content of P is lower than 0.0005%(quality), P can prevent that the effect of flavescence from just can not reach, and if the content of P surpasses 0.005%(quality), add P can make solderability variation, and cause space to form.Therefore, in the present invention, the content of P is 0.0005-0.005%(quality).
According to the present invention, Pb-free solder alloy is being installed on BGA electrode of substrate, and in reflow ovens, heats to melt and form behind solder projection surface, preferably makes it can flavescence.This is because as previously mentioned, surperficial flavescence meeting causes can making a mistake when checking BGA encapsulation with image processing equipment.
In addition, according to the present invention, even Pb-free solder alloy ball when not carrying out melt operation under higher temperature, preferably can flavescence yet.Solder ball had better not make the reason of its jaundice be under higher temperature, the situation that there is no surperficial flavescence be Pb-free solder alloy ball user carry out an acceptance inspection test a necessary requirement.If solder ball is not can flavescence under high temperature, when fusing, it can flavescence yet so.
For the most frequently used of many BGA encapsulation, be that diameter is the solder ball of 0.5-0.76 millimeter, but be that diameter is the small solder ball of 0.04-0.5 millimeter for the circle of CSP and wafer.According to the present invention, lead-free solder ball has extremely low space that possibility occurs, so even small spherical form, it also can keep high bond strength.Therefore,, according to the present invention, this solder ball can increase the reliability that diameter is the minute solder ball of 0.04-0.5 millimeter.
In use, the BGA equipment in electronic installation is often exposed at higher temperature, may surpass 100 degree.According to the present invention, by using this solder ball to form solder bump, solder bump can not peel off, but in fact due to aging, its bond strength will increase, thereby under severe condition, needs to use stronger combination reliability.
According to the present invention, the manufacture method of solder ball has no particular limits, and it can use the manufacture of any method easily.For example, can manufacture by the method for oil bath, solder sheet wherein be put in the oil bath of heating; Or by direct method, by aperture or nozzle, splash into or allow its drop form with an intended size to drip in the scolder of melting, when then the working days are by a chamber, solidified.The technical staff that these two kinds of methods are all fields own is well-known, so be not here just described in detail.
Below, the present invention will describe in further detail by following example.
example 1
The solidus temperature (ST) and the liquidus temperature (LT) that by differential thermal analysis, from heating curves, draw every kind of alloy are mutually to determine.Diameter is that the solder ball of 0.5mm is prepared by oil bath method.Can say that solder ball puts into the air 12 hours of 125 degree, to assess its yellow, the yellowing degree on then visualization solder ball surface.Surface does not have the solder ball of flavescence to be evaluated as good solder ball, and those solder ball with a small amount of yellow are medium, and those solder ball with serious yellow are bad.In order to assess the space of solder ball, occur, solder ball can be placed on the electrode on BGA substrate, then it is heated in containing the reflow ovens that oxygen is 100ppm or lower nitrogen atmosphere, wherein peak temperature more than BGA substrate maintenance LT temperature is at 240 ℃, to keep 40 seconds, so that solder ball is formed to solder bump.Then whether the existence in checkout gear check space, can assess these projections according to space ratio.Space ratio is less than 10% and is be evaluated as well, and ratio being evaluated as between 10-30% in space is medium, space ratio more than 30% be evaluated as poor.
Result will illustrate this Pb-free solder alloy ball and significant surperficial flavescence can not occur or form significant space ratio.According to the present invention, when Pb-free solder alloy ball forms projection on BGA substrate, can detect with image processing equipment.The wrong detection phenomenon causing due to surperficial flavescence can not occur, and therefore can check exactly.In addition, the defect producing while not only welding reduces, but also can obtain high bond strength.
example 2
In this example, according to the present invention, in aging front and back, be exposed to before and after high temperature, the effect to scolding tin ball bond reliability after adding P is measured.The P that contains 0-400 ppm in solder composition Sn-3.OAg O.SCu soldering alloy or Sn-4.OAg O.SCu soldering alloy in this example, said composition is the solder ball of 0.5 millimeter for prepare diameter by oil bath method.Solder ball is placed on printed circuit board plane, then in reflow ovens, heats, so that solder ball is formed to solder bump.Printed circuit board (PCB) can be gold-plated or the pre-solder flux in the organic surface of Cu-OSP().Oxygen concentration is that the reflow ovens below 100ppm is nitrogen atmosphere.By refluxing in temperature, higher than the peak temperature of liquidus temperature, be at 240 ℃, to operate 40 seconds again.Then by consequent solder projection in the air of 150 ℃ aging 200 hours.In aging front and back, all will use pulling rate degree is that the 4000 series of tests instrument of drawing squares of 300 micro-meter per seconds carry out the tension test of 2 seconds to solder bump.In aging front and back, in tensile test, the percentage that peels off of 50 projection samples shows.The percentage that projection peels off is lower, and its performance is better.The mean value of these 50 projection maximum intensitys can 2 seconds draw process of the test in obtain.
Then draw, the rate of peeling off immediately after backflow is the impact that not existed by P, yet, aging after, for gold-plated and pre-solder flux circuit board, the solder alloy that contains P will reduce the rate of peeling off more.This effect is because a small amount of P adding has changed the structure in conjunction with conversion zone.
For this circuit board of two types, no matter whether there is P in the soldering alloy ball of formation solder bump, aging front conversion zone is not affected.The release surface that extension test causes is that P-is rich in the contact-making surface between layer (when adding P) and conversion zone Au-plated board, and is also Cu and the Cu of pre-solder flux circuit board
6sn
5between contact-making surface.
For Au-plated board, while not comprising P in solder alloy, the stripper surface after aging is identical with the contact-making surface that P-is rich in layer and conversion zone.But for the soldering alloy that contains P, stripper surface moves to conversion zone (contact-making surface between ground floor and the second layer) inside.
For pre-solder flux circuit board, release surface is the Cu of two kinds of alloy composites
3sn/Cu
6sn
5contact-making surface.But while containing P in composition, Cu
6sn
5layer is very thin.
In this manner, owing to forming the second layer the Au-plated board in the situation that, and owing to making Cu the pre-solder flux circuit board in the situation that
6sn
5layer attenuation, in long use procedure and hot environment, need to increase joint reliability.
It is a kind of phenomenon that above-mentioned interpolation P can improve joint reliability, and this effect is not subject to the impact of solder ball diameter.
Next, set forth down the industrial applicibility of this Pb-free solder alloy ball.
According to the present invention, even if Pb-free solder ball melts or is exposed under high temperature, its surface can flavescence yet.Therefore, according to the present invention, using Pb-free solder ball to form after solder bump on the electrode of BGA encapsulation, can check accurately with image processing equipment, to determine whether solder bump suitably forms.In addition,, according to the present invention, Pb-free solder ball has excellent wetability with respect to electrode or the printed circuit board surface of BGA encapsulation, therefore, not only can not produce weld defect, and the possibility that space produces is also very little, thereby can obtains high bond strength.
According to the present invention, when Pb-free solder ball being used for form solder bump in BGA encapsulation, solder ball can provide above-mentioned excellent effect.But it also can be used to form the solder bump on miscellaneous part, for example, have than the less wafer of electrode of BGA encapsulation.Being used to form the solder ball of solder bump on wafer and having a very little diameter, be 0.1 millimeter or less, and bonding area is also very little.Therefore, if bond strength also can be had a great impact even if produce ，Gai space, a little space in welding point.Yet according to the present invention, Pb-free solder ball can produce space hardly.Therefore,, when it is when forming solder bump on wafer, can obtain high bond strength.In addition,, according to the present invention, even be exposed under hot environment in long-time, this solder ball also can form the solder bump with excellent joint reliability.Particularly, owing to adding trace P, the invention provides beyond thought effect, can show and improve the performance that its resistance is peeled off.Therefore, when produced substrate is arranged in automobile or industrial equipment, wherein substrate normally scribbles resin as siloxanes, and this aging impact causing is favourable.Therefore,, according to the present invention, solder ball can promote to improve the reliability of electronic equipment greatly.
Claims (5)
1. a Pb-free solder alloy ball, is characterized in that:
Pb-free solder alloy ball is formed and point is formed by solder ball, and this composition comprises 1.0 4.0%(quality) Ag, 0.05 2.0%(quality) Cu, 0.0005 0.005%(quality) P, and the Sn of surplus.
2. Pb-free solder alloy ball according to claim 1, is characterized in that: in the solder ball composition of Pb-free solder alloy ball, preferably contain 1.0 3.5%(quality) Ag.
3. Pb-free solder alloy ball according to claim 1, is characterized in that: in the solder ball composition of Pb-free solder alloy ball, preferably comprise 0.05 075%(quality) Cu.
4. Pb-free solder alloy ball according to claim 1, is characterized in that: the diameter of Pb-free solder alloy ball is 0.04 0.5 millimeter.
5. according to the Pb-free solder alloy ball described in the claims arbitrary, it is characterized in that: Pb-free solder alloy ball is placed on the electrode of BGA substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310559428.5A CN103586600A (en) | 2013-11-12 | 2013-11-12 | Lead-free soldering tin alloying pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310559428.5A CN103586600A (en) | 2013-11-12 | 2013-11-12 | Lead-free soldering tin alloying pellet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103586600A true CN103586600A (en) | 2014-02-19 |
Family
ID=50077032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310559428.5A Pending CN103586600A (en) | 2013-11-12 | 2013-11-12 | Lead-free soldering tin alloying pellet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103586600A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1439480A (en) * | 2003-01-15 | 2003-09-03 | 深圳市亿铖达工业有限公司 | Oxidation-inhibited lead-free welding materials |
| CN1583352A (en) * | 2003-08-20 | 2005-02-23 | 中国科学院金属研究所 | Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
| CN1840282A (en) * | 2005-03-30 | 2006-10-04 | 青木科研有限公司 | Pb-free solder alloy composition substantially comprising tin (Sn), silver (Ag), copper (Cu) and phosphorous (P) |
| US20060222559A1 (en) * | 2005-03-30 | 2006-10-05 | Leung Wai Yin D | Pb-free solder alloy compositions comprising essentially tin(Sn), Silver(Ag), copper(Cu), and phosphorus(P) |
| CN1863639A (en) * | 2003-10-07 | 2006-11-15 | 千住金属工业株式会社 | Lead-free solder ball |
-
2013
- 2013-11-12 CN CN201310559428.5A patent/CN103586600A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1439480A (en) * | 2003-01-15 | 2003-09-03 | 深圳市亿铖达工业有限公司 | Oxidation-inhibited lead-free welding materials |
| CN1583352A (en) * | 2003-08-20 | 2005-02-23 | 中国科学院金属研究所 | Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
| CN1863639A (en) * | 2003-10-07 | 2006-11-15 | 千住金属工业株式会社 | Lead-free solder ball |
| CN1840282A (en) * | 2005-03-30 | 2006-10-04 | 青木科研有限公司 | Pb-free solder alloy composition substantially comprising tin (Sn), silver (Ag), copper (Cu) and phosphorous (P) |
| US20060222559A1 (en) * | 2005-03-30 | 2006-10-05 | Leung Wai Yin D | Pb-free solder alloy compositions comprising essentially tin(Sn), Silver(Ag), copper(Cu), and phosphorus(P) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20240363571A1 (en) | Lead-Free Solder Ball | |
| US9770786B2 (en) | Lead-free solder paste | |
| US8227536B2 (en) | Lead-free solder paste and its use | |
| US8598464B2 (en) | Soldering material and electronic component assembly | |
| US9527167B2 (en) | Lead-free solder ball | |
| KR101738841B1 (en) | HIGH-TEMPERATURE SOLDER JOINT COMPRISING Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY | |
| US20170197281A1 (en) | Low Temperature High Reliability Alloy for Solder Hierarchy | |
| CN101491866B (en) | Low-temperature leadless cored solder alloy and produced solder paste | |
| CN101380699A (en) | Tin-zinc lead-free alloy solder paste and preparation method thereof | |
| JP3925554B2 (en) | Lead-free solder balls | |
| JP5724411B2 (en) | Solder, soldering method and semiconductor device | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| US11607752B2 (en) | Solder alloy, solder joint material, and electronic circuit board | |
| US20140326490A1 (en) | Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part | |
| KR20230153507A (en) | Lead-free solder compositions | |
| US6474537B1 (en) | Soldering method using a Cu-containing lead-free alloy | |
| Warwick | Implementing lead free soldering-European consortium research | |
| EP1382413B1 (en) | Lead-free solder alloy | |
| CN103586600A (en) | Lead-free soldering tin alloying pellet | |
| Bath et al. | An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications | |
| JP2019126827A (en) | Lead-free solder alloy | |
| US10189119B2 (en) | Solder alloy for die bonding | |
| CN1799756A (en) | Sn-Co-Cu tri-elemental lead-free solder | |
| Kisiel | An overview of materials and technologies for green electronics products | |
| CN1817551A (en) | Lead-free welding materials with tin, selenium and copper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140219 |