CN103582282B - Circuit board, electronic module and light emitting module including the circuit board - Google Patents
Circuit board, electronic module and light emitting module including the circuit board Download PDFInfo
- Publication number
- CN103582282B CN103582282B CN201210260842.1A CN201210260842A CN103582282B CN 103582282 B CN103582282 B CN 103582282B CN 201210260842 A CN201210260842 A CN 201210260842A CN 103582282 B CN103582282 B CN 103582282B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- barrier
- circuit layer
- face
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 239000003344 environmental pollutant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The present invention relates to a kind of circuit boards（10）, including substrate（1）Be printed on the substrate（1）On circuit layer（2）, which is characterized in that it further includes and is formed in the substrate（1）Be printed with the circuit layer（2）The first face（A）On barrier（3）, the barrier（3）Protrude from first face（A）And around the circuit layer（2）.In addition the invention further relates to a kind of electronic module including the circuit board and a kind of light emitting modules.
Description
Technical field
The present invention relates to a kind of circuit board, a kind of electronic module including the circuit board and a kind of light emitting modules.
Background technology
A large amount of electronic modules with various functions are applied in modern electronic device.In order to meet various applied fields
The needs of conjunction, these electronic modules need the processing by water proof and dust proof, particularly across the encapsulation process of high leakproofness.It is encapsulating
In the process, cast using the encapsulating material of liquid to placing housing in a mold and circuit board, middle casing is covered in
The one side of circuit board can be used as in the fringe region of fringe region and housing that circuit board is not printed with circuit layer and be bonded to each other
Engaging portion, encapsulating material after hardening can be with the gap between seal junction.
It must take into consideration in the encapsulation process, whether excessive encapsulating material can further flow by gap to be sealed
The middle section that housing and circuit board limit, and then pollute the circuit layer being located in the region and its electronic device of carrying.
It is composed since the circuit layer being printed in the substrate of circuit board is interlocked by conductive region and non-conducting areas, wherein conduction region
Domain is typically to have certain thickness copper film, and non-conducting areas is then the basal region not covered by copper film.Due to circuit layer
Thickness is irregular, thus excessive liquid encapsulating material can pass through from the fringe region of circuit board it is recessed compared with conductive region
Sunken non-conducting areas flows to circuit board center, thus will pollute conductive layer, and and then influences the electrical characteristics of electronic device.
In the prior art in order to avoid the generation of the above situation, before being packaged to circuit board and housing, usually
The filling sealing agent in the groove for being used to accommodate component to be packaged of mold.These sealants are for example applied on bottom portion of groove
On fringe region.Although the possibility of encapsulating material inflow circuit layer can be reduced to a certain extent by means of sealant,
It is difficult to be smeared or be arranged in predetermined region exactly but since the viscosity of sealant is higher.Therefore this
Kind solution method has the characteristics that cost is higher, manipulation process is complicated.
The content of the invention
Therefore it is an object of the present invention to propose a kind of circuit board, this circuit board can simply with housing into
Row encapsulation, and may insure that in encapsulation process the element of the circuit layer on circuit board and its carrying will not contact package material
Material.
The circuit board proposed according to the present invention, including substrate, the circuit layer of printing on the substrate, which is characterized in that
The barrier being printed on the first face of the circuit layer for being formed in the substrate is further included, the barrier protrudes from described
First face simultaneously surround the circuit layer.
Since circuit layer is by non-conducting areas（Exposed part substrate）With compared with non-conducting areas, have certain thickness
Conductive region（Conductive layer）Composition, therefore limit groove between two adjacent conductive regions.It is outer in order to avoid coming from
Excessive liquid encapsulating material may extend by these grooves in circuit layer in the pollutant on boundary, such as encapsulation process, shadow
It rings its electrical characteristics and can also pollute installation other devices on circuit boards, particularly on the first face of substrate, i.e. circuit
The barrier protected to circuit layer is set on the side where layer.Barrier is preferably provided in the outer of circuit layer
Side is particularly closed in the region of substrate edges, so as on the premise of the electrical characteristics of circuit layer are not influenced that circuit layer is comprehensive
It surrounds.
A preferred design according to the present invention, the height that the barrier protrudes from the substrate are equal to or more than
The thickness of the circuit layer.In order to ensure barrier can stop completely from extraneous pollutant, particularly in encapsulated circuit
During plate, barrier compared with substrate height cannot be less than circuit layer thickness, this circuit board, bearer circuit plate plane with
And the closed cavity for accommodating circuit layer is limited positioned at barrier between the two, to prevent pollutant from entering the closed cavity
In.
A preferred design according to the present invention, the barrier pass through typography and one similar shape of circuit layer
Into.Barrier and circuit layer can be printed on substrate simultaneously by means of such as silk-screen printing technique or other suitable techniques
On.So it is greatly reduced the manufacture cost of circuit board.Barrier can certainly be additionally provided on and be printed with
On the circuit board of circuit layer, and circuit layer is surrounded wherein.
Another preferred embodiment according to the present invention proposes that the barrier is the edge for being arranged on the substrate
Frame in region.Since circuit board usually has rectangular profile, the barrier being printed in the fringe region of circuit board
Rectangular shaped rim is also preferably designed as, it is possible thereby to which region as much as possible is looped around inside rectangular shaped rim.
The material identical of a preferred design according to the present invention, the barrier and the circuit layer.Thus may be used
To simplify the manufacturing process of circuit board, production efficiency is improved.
A preferred design according to the present invention, the circuit layer and the barrier are made of copper.Preferably, example
Etching process such as is passed through to the copper film for covering substrate whole surface, obtain remaining annular copper film frame and it is looped around by copper film frame
In circuit layer, copper film frame is separated from each other as barrier and circuit layer.
The invention further relates to a kind of electronic modules, exist including housing, encapsulating material and at least one electronic device, feature
In foregoing circuit plate being further included, wherein at least one electronic device is fixed on the circuit board.This electronic module can
To be encapsulated by simple and high leakproofness, and the device inside electronic module will not be packaged material contamination.
A preferred design according to the present invention, the free end face of the barrier are resisted against the housing towards institute
On the second face for stating the first face of circuit board so that the barrier stops that the encapsulating material contacts the circuit layer.Housing
Groove is limited in one side, circuit board can be placed in a groove, and wherein the first of circuit board is facing towards the bottom wall of groove.It borrows
Helping encapsulating material can position circuit board in a groove and in the fringe region being filled between the first and second faces.By
In barrier away from one end of circuit board against on the second surface, therefore stop that encapsulating material enters along the second surface current in encapsulation
Thus the middle section of groove avoids the circuit layer and electronic device of encapsulating material pollution circuit board.
A preferred design according to the present invention, the housing and the first face also define to accommodate it is described at least
The space of one electronic device, at least one electronic device are fixed on the circuit layer.Since electronic device also has
Certain height, therefore the second face of housing has with respect to the horizontal plane concave region in middle section, is used for and circuit board
Limit the space for accommodating electronic device.It may thereby be ensured that barrier can be always resisted against on the fringe region in the second face.
The invention further relates to a kind of light emitting modules, which is characterized in that including above-mentioned electronic module, wherein being fixed on the electricity
At least one electronic device on the plate of road is light source.In the case, the part or all of region in housing towards the first face is designed
For transmission region.It is particularly preferred that the region of housing towards light source is designed as lens area.
A preferred design according to the present invention, at least one electronic device are LED chip.It is possible thereby to it carries
The light efficiency of high light emitting module, and reduce its power consumption.
It should be understood that above generality describes and the following detailed description is all enumerated and illustrative, it is therefore an objective to
In order to provide further instruction to claimed invention.
Description of the drawings
Attached drawing forms the part of this specification, is used to help further understand the present invention.These attached drawings illustrate this hair
Bright embodiment, and together with specification be used for illustrate the principle of the present invention.The identical label of component identical in the accompanying drawings
It represents.It is shown in figure：
Fig. 1 is the first embodiment of circuit board according to the present invention；
Fig. 2 is the perspective, cut-away view of the first embodiment of electronic module according to the present invention.
Specific embodiment
Fig. 1 is the first embodiment of circuit board according to the present invention.Circuit board 10 according to the present invention includes substrate 1 and print
The circuit layer 2 of system on substrate 1.The circuit layer 2 for example can be by means of silk-screen printing technique or other suitable typographies
It is fixed on at least one side of the substrate 1 with insulation characterisitic.
During printing, typically the copper film covered on substrate 1 is etched according to circuit diagram, is used wherein retaining
Make the part copper film of conductive region, while remove remaining copper film to expose the subregion of substrate 1, which is used as non-lead
Electric region.This causes forming with certain difference in height between the conductive region of circuit layer 2 and non-conducting areas, thus two
The space of form of grooves is limited between a adjacent conductive region.When being packaged to circuit board, excessive encapsulating material
It is possible that the space from the fringe region of circuit layer 2 Jing Guo form of grooves flows into and wherein entreats region, it is possible to pollution circuit
Device on layer 2 directly affects the electrical characteristics of circuit layer 2.
For this purpose, especially it is additionally provided in protecting the barrier 3 of circuit layer 2 on the first face A of circuit board 10, so as to
External object, particularly encapsulating material contact layer 2 are prevented, so that it is guaranteed that circuit board 10 has good electrology characteristic.
In the present embodiment, circuit board 10 have rectangular profile, barrier 3 preferably by rectangular shaped rim in the form of be arranged on the first face A's
In fringe region, it may thereby be ensured that region as big as possible in the first face A is located in the area of isolation that barrier 3 limits.
Barrier 3 can be for forming the fringe region of the copper film of circuit layer 2, by means of the suitable technique such as example etching to copper
After film is handled, it is formed simultaneously positioned at the circuit layer 2 in the first face A centers and the resistance of loop circuit layer 2 and setting with interval
Retaining wall 3.Here, circuit layer 2 and barrier 3 are all made of copper, and with identical thickness.
Barrier 3 with frame shape profile can also be additionally provided on the circuit board 10 for being printed with circuit layer 2, and
By the circuit layer 2 being similarly positioned in it on the first face A around wherein.Barrier 3 therefore can also by other suitable materials,
Such as plastics are made.In the case, the distance of the 3 to the first face of barrier A can be more than the distance of the 2 to the first face of circuit layer A.
Fig. 2 is the perspective, cut-away view of the first embodiment of electronic module according to the present invention.As can be seen from Figure, electronics
Module 20 includes housing 21, electronic device 22 and the circuit board 10 for carrying electronic device 22, and wherein circuit board 10 is placed on
In inverted housing 21, and an entirety can be formed with housing 21 by means of encapsulating material.Housing 21 includes common limit
Go out the bottom wall and side wall of groove, circuit board 10 can be for example put into from top in groove, the first face A of circuit board 10 and groove
Second face B of bottom surface, i.e. housing 21 is relative to each other, and forms clearance G to be sealed between the first face A and the second face B.
Since circuit board 10 includes the annular barrier 3 extended from the fringe region of the first face A, stop in annular
In the case that wall 3 is with the thickness in the case of certain altitude, such as equal to or more than the circuit layer 2 being printed on the first face A,
The free end face of barrier 3 can be resisted against completely on the second face B.On the one hand, 3 and first face A of barrier and the second face B are total to
It is same to limit to accommodate the sealing space of circuit layer 2 and electronic device 22.On the other hand, barrier 3 and circuit board 10 and
Other regions of housing 21 limit to accommodate the region to be packaged of encapsulating material.
The fringe region of second face B is preferably designed to the horizontal plane parallel to the first face A, to realize and to hinder as far as possible
The seamless unoccupied place contact of free end face of retaining wall 3.Since the electronic device 22 being mounted on circuit layer 2 has certain thickness, because
The distance between 22 and first face A of this electronic device is more than the distance between free end face and first face A of barrier 3.In order to
Electronic device 22 is avoided to influence the leakproofness between housing 21 and circuit board 10, particularly by the subregion of the second face B, especially
It is designed as towards the region of electronic device 22 away from 10 concave curved surface of circuit board, it is possible thereby to be limited jointly with the first face A
For accommodating the space R of electronic device 22.
In the case where electronic module 20 is designed as light emitting module, at least one electronic device 22 is light source, especially excellent
Choosing is LED chip, and housing 21 can be preferably designed to lens towards the region of light source.
Electronic module 20 is further included for the conducting wire 23 to 10 supply of electrical energy of circuit board, and two conducting wires 23 shown in figure pass through
Cross the default one side for extending past 10 non-bearer circuit layer 2 of circuit board, the top surface one side shown in figure of being open on housing 21.
Circuit board 10 is electrically connected by means of conductive component, for example from the electric mortiser pin and conducting wire 23 of top surface stretching, it is possible thereby to be circuit board
10 power supplies.Can be additionally that electronic module 20 sets the cover board that electronic module 20 is closed in the top shown from figure, lid
Plate can collectively form such as closed module with rectangular profile with the housing 21 of the lower section shown in figure.It is possible thereby into one
Step improves the leakproofness of electronic module 20.
It these are only the preferred embodiment of the present invention, be not intended to limit the invention, for those skilled in the art
For member, the invention may be variously modified and varied.Any modification for being made within the spirit and principles of the invention, etc.
With replacement, improvement etc., should all be included in the protection scope of the present invention.
Label list
1 substrate
2 circuit layers
3 barriers
10 circuit boards
20 electronic modules
21 housings
22 electronic devices
23 conducting wires
The first faces of A
The second faces of B
G gaps
R spaces
Claims (10)
1. a kind of electronic module (20), including housing (21), encapsulating material and at least one electronic device (22), feature exists
In further including circuit board (10), the circuit board (10) includes：Substrate (1) and the circuit layer being printed on the substrate (1)
(2), wherein at least one electronic device (22) is fixed on the circuit layer (2)；With the print for being formed in the substrate (1)
The barrier (3) being formed on the first face (A) of the circuit layer (2), wherein the barrier (3) protrudes from first face
(A) and around the circuit layer (2) so that the barrier (3) stops that the encapsulating material contacts the circuit layer (2).
2. electronic module (20) according to claim 1, which is characterized in that the barrier (3) protrudes from the substrate
(1) height is equal to or more than the thickness of the circuit layer (2).
3. electronic module (20) according to claim 1, which is characterized in that the barrier (3) by typography with
The circuit layer (2) is formed together.
4. electronic module (20) according to any one of claim 1-3, which is characterized in that the barrier (3) is to set
Put the frame in the fringe region of the substrate (1).
5. electronic module (20) according to any one of claim 1-3, which is characterized in that the barrier (3) and institute
State the material identical of circuit layer (2).
6. electronic module (20) according to claim 5, which is characterized in that the circuit layer (2) and the barrier (3)
It is made of copper.
7. electronic module (20) according to any one of claim 1-3, which is characterized in that the barrier (3) from
The housing (21) is resisted against towards on second face (B) in the first face (A) of the circuit board (10) by end face.
8. electronic module (20) according to any one of claim 1-3, which is characterized in that the housing (21) and first
Face (A) also defines to accommodate the space (R) of at least one electronic device (22), at least one electronic device
(22) it is fixed on the circuit layer (2).
9. a kind of light emitting module, which is characterized in that including electronic module described in any item of the claim 1 to 8 (20), wherein
At least one electronic device (22) being fixed on the circuit board (10) is light source.
10. light emitting module according to claim 9, which is characterized in that at least one electronic device (22) is LED core
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260842.1A CN103582282B (en) | 2012-07-25 | 2012-07-25 | Circuit board, electronic module and light emitting module including the circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260842.1A CN103582282B (en) | 2012-07-25 | 2012-07-25 | Circuit board, electronic module and light emitting module including the circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103582282A CN103582282A (en) | 2014-02-12 |
| CN103582282B true CN103582282B (en) | 2018-05-18 |
Family
ID=50052886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210260842.1A Expired - Fee Related CN103582282B (en) | 2012-07-25 | 2012-07-25 | Circuit board, electronic module and light emitting module including the circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103582282B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098633B (en) * | 2016-06-30 | 2019-05-21 | 广州兴森快捷电路科技有限公司 | A kind of package substrate and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201289055Y (en) * | 2008-11-19 | 2009-08-12 | 浙江晶皓光电科技有限公司 | High power LED lamp heat radiator |
| CN201651936U (en) * | 2010-04-23 | 2010-11-24 | 矽格微电子(无锡)有限公司 | LED packaging structure provided with glass cover |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7138659B2 (en) * | 2004-05-18 | 2006-11-21 | Onscreen Technologies, Inc. | LED assembly with vented circuit board |
| KR101122037B1 (en) * | 2010-04-19 | 2012-03-09 | 심현섭 | Led lamp |
| CN102130273A (en) * | 2010-12-10 | 2011-07-20 | 深圳市华星光电技术有限公司 | Light-emitting diode packaging structure |
-
2012
- 2012-07-25 CN CN201210260842.1A patent/CN103582282B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201289055Y (en) * | 2008-11-19 | 2009-08-12 | 浙江晶皓光电科技有限公司 | High power LED lamp heat radiator |
| CN201651936U (en) * | 2010-04-23 | 2010-11-24 | 矽格微电子(无锡)有限公司 | LED packaging structure provided with glass cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103582282A (en) | 2014-02-12 |
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