CN103579473A - Welding and temperature detecting method for LED element - Google Patents

Abstract

The invention relates to a method for welding and temperature detection of LED components, which mainly integrates the high temperature detection of LED backlight modules into the welding and manufacturing process of LED components, and can be used synchronously when the welding and manufacturing process of LED components is completed. High-temperature inspection to see if the bonding wire inside the LED element is broken, which helps to shorten the manufacturing process time of the LED backlight module.

Description

Soldering and temperature detection method of LED components

technical field

The invention relates to a welding manufacturing process method, in particular to a method for welding and temperature detection of an LED element that can simultaneously detect the temperature of the LED element.

Background technique

Light-emitting diode (Light-Emitting Diode, LED) is a widely used light-emitting element at present. Because of its small size and long service life, it is widely used in human daily life.

Light-emitting diodes have been widely used in backlight modules. Please refer to FIG. 1, which is a perspective view of a known light-emitting diode backlight module. As shown in FIG. 1, the light-emitting diode backlight module 1' includes: a cover Body 11', circuit layer 12', multiple LED elements 13', and reflective layer 14'. Wherein the cover 11' has a cover bottom 111', and the circuit layer 12' is disposed on the cover bottom 111' by insulating and heat-conducting glue 18'. The plurality of LED elements 13' are accommodated in the housing 11' and soldered on the circuit layer 12'.

Usually, when the LED backlight module 1' is shipped, samples must be sampled for product high temperature testing to confirm that the above-mentioned LED elements 13' soldered to the circuit layer 12' can still emit light normally in a high temperature environment. However, for the purchaser of the LED backlight module 1', sampling inspection cannot effectively ensure that each LED backlight module 1' purchased by it can maintain a normal light-emitting state in a high-temperature environment; therefore, now The conventional sampling inspection can no longer meet the needs of buyers of the LED backlight module 1 ′.

In view of the above reasons, the inventor of this case made great efforts in research and creation, and finally developed a method for welding and temperature detection of LED components.

Contents of the invention

The object of the present invention is to provide a method for welding and temperature detection of LED components, which integrates the high temperature detection of LED backlight modules into the welding and manufacturing process of LED components, and can be used while completing the welding and manufacturing process of LED components. High-temperature inspection to see if the bonding wire inside the LED element is broken, which helps to shorten the manufacturing process time of the LED backlight module.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. According to the welding and temperature detection method of the LED element proposed by the present invention, it comprises the following steps:

(1) Attach the circuit layer (12) to the circuit setting part (111) of the cover (11) using insulating and heat-conducting adhesive (18);

(2) Execute the forming and manufacturing process of the cover body (11);

(3) Executing the tinning manufacturing process, so that the multiple soldering legs of the multiple LED components (13) are covered with solder;

(4) Corresponding to the plurality of soldering points on the circuit layer (12), disposing the plurality of LED elements (13) on the circuit layer (12);

(5) Place the cover (11) on the heating device (2);

(6) power on to the line layer (12);

(7) heating the heating device (2) to the welding temperature to melt the solder on the above welding point;

(8) Make the heating device (2) maintain the detection temperature and after a period of soldering time, so that the above-mentioned LED element (13) is soldered on the circuit layer (12);

(9) Continue heating the heating device (2) to the detection temperature;

(10) Make the heating device (2) maintain the detection temperature and pass a period of detection time;

(11) Judging whether all the above-mentioned LED elements (13) emit light normally and do not blink, if yes, perform step (12), if not, perform step (13);

(12) If it is judged as a good product, the step ends; and

(13) It is judged as a defective product, and the step ends.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned LED component welding and temperature detection method, the heating device (2) used in step (5) is a heating plate.

In the foregoing LED component welding and temperature detection method, the heating device (2) used in steps (8) to (10) is a heating plate.

In the aforementioned method for soldering and temperature detection of LED components, the temperature range of the soldering temperature is 170°C-220°C.

In the aforementioned method for soldering and temperature detection of LED components, the detection temperature ranges from 150°C to 200°C, and the detection time ranges from 5 seconds to 10 seconds.

In the aforementioned LED component welding and temperature detection method, step (6) is completed by passing a current with a current value ranging from 100 μA to 150 μA into the circuit layer (12).

The welding and temperature detection method of the aforementioned LED element, wherein the cover body 11 can be any of the following: the U-shaped sheet metal cover body used in the backlight module, the L-shaped sheet metal cover body used in the backlight module, and the L-shaped sheet metal cover body used in the backlight module. Extruded cover.

By virtue of the above technical solution, the LED component welding and temperature detection method of the present invention at least has the advantage and beneficial effect of shortening the manufacturing process time of the LED backlight module.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited, and in conjunction with the accompanying drawings, the detailed description is as follows.

Description of drawings

FIG. 1 is a perspective view of a conventional light-emitting diode backlight module;

2 is a perspective view of an LED backlight module;

FIG. 3 is a perspective view of a ㄇ-shaped sheet metal cover used in the backlight module;

4 is a perspective view of an extruded cover used in the backlight module;

5A and 5B are flow charts of a method for welding and temperature detection of an LED element of the present invention; and

6A-6C are schematic diagrams of the manufacturing process of the LED element welding and temperature detection method.

1: LED backlight module

11: Hood 12: Circuit layer

13: LED components 111: Circuit setting department

18: Insulation and heat conduction glue 121: Main line

122: Welding point 11a: ㄇ-shaped cover

11b: Extruded cover 111a: Line setting department

112a: bottom edge 113a: bent edge

111b: Line setting part 1 112b: Bottom

123: Solder

S01～S10: method steps S12～S13: method steps

2: Heating device

1': LED lighting device

11': Housing 12': Circuit layer

13′: LED component 14′: Emitting layer

111': the bottom of the cover

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation and manufacturing method of the welding and temperature detection method of LED components proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , steps, features and effects thereof are described in detail below.

Before explaining the method for soldering and temperature detection of LED components proposed by the present invention, the LED backlight module will be introduced first. Please refer to FIG. 2 , which is a perspective view of an LED backlight module. As shown in FIG. 2 , the LED backlight module 1 includes: a cover body 11 , a circuit layer 12 and a plurality of LED elements 13 . The cover 11 is an L-shaped sheet metal cover commonly used in backlight modules, which has a wiring setting portion 111 , and the wiring layer 12 is set on the wiring setting portion 111 by means of an insulating heat-conducting adhesive 18 . The circuit layer 12 is substantially composed of a main circuit 121 and a plurality of soldering points 122 , and the plurality of LED elements 13 are soldered to the soldering points 122 .

Please continue to refer to FIG. 3 and FIG. 4 , which are perspective views of the ㄇ-shaped sheet metal cover used in the backlight module and the extruded cover used in the backlight module. Although the cover 11 in FIG. 2 is an L-shaped sheet metal cover that is often used in backlight modules, in fact, the U-shaped sheet metal cover 11a shown in FIG. 3 is also often used as the cover 11 of the LED backlight module 1 ( As shown in Figure 2), and the extruded cover 11b shown in Figure 4 is also often used as the cover 11 of the LED backlight module 1; Three kinds of covers, such as the L-shaped cover and the extruded cover, are all regarded as the covers described in the method steps of the present invention. Among them, the U-shaped cover 11a shown in FIG. 3 has a circuit setting portion 111a, a bottom edge 112a and a bent edge 113a; while the extruded cover 11b shown in FIG. 4 also has a circuit setting portion 111b and a bottom edge 112b .

Please refer to FIG. 5A and FIG. 5B, which are a flow chart of a method for soldering and temperature detection of an LED element according to the present invention; . The welding and temperature detection method of the LED element of the present invention comprises 13 basic steps:

As shown in FIG. 5A and FIG. 6A, the method first executes step (S01) and step (S02), using insulating and heat-conducting glue 18 to attach the circuit layer 12 to the circuit setting part 111 of the cover body 11, and executing the cover The molding manufacturing process of the body 11 makes the cover body 11 bent into an L-shape or a ㄇ-shape. Continuing, the method executes step (S03), as shown in FIG. 6B, executes a tinning manufacturing process, so that a plurality of soldering pins 131 of a plurality of LED elements 13 are all provided with solder 123; then execute step (S04) and step ( S05), as shown in FIG. 6C, corresponding to the plurality of welding points on the circuit layer 12, the plurality of LED elements 13 are arranged on the circuit layer 12, and the cover 11 is placed on the heating device 2 .

Continuing, the process flow of the method executes step (S06) and step (S07), energizes the circuit layer 12, and heats the heating device 2 to the soldering temperature, so as to melt the solder on the above-mentioned soldering point. Wherein, the step (S06) is completed by passing a energizing current with a current value ranging from 100 μA to 150 μA into the circuit layer 12. At the initial stage of electrification, since the LED element 13 is not soldered to the soldering point on the circuit layer 12, the LED element 13 does not emit light.

Continue the process of the method to execute step ( S08 ), make the heating device 2 maintain the detected temperature and pass a certain welding time, so that the above-mentioned LED element 13 is welded on the circuit layer 12 . At a soldering temperature between 170° C. and 220° C. for 25 seconds, the solder 123 on the above-mentioned soldering foot 131 is completely melted, so that the above-mentioned LED element 13 is welded on the circuit layer 12; The soldering pins of the LEDs have been bonded with the solder 123, so the above-mentioned LED element 13 emits light due to the energization of the circuit layer 12. In addition, it must be added that the heating device 2 used in the preceding steps is a heating plate, and the heating device 2 shown in FIG. 6C is exactly a heating plate.

After the soldering of the LED element 13 is completed, the method proceeds to step (S09) and step (S10), continuously heating the heating device 2 to the detection temperature, and making the heating device 2 maintain the detection temperature for a period of detection time; wherein, the step The heating device 2 used in (S09) and step (S10) is a heating plate, and under the detection temperature between 150°C and 200°C, the detection continues for 5 seconds to 10 seconds, and then the step (S11) is used to judge Whether all the above-mentioned LED elements 13 emit light normally and do not flicker. If it is found that some LED elements 13 cannot emit light normally, or some LED elements 13 are flickering, it means that the gold wire (bonding wire) inside some LED elements 13 has been broken, so it must be This LED backlight module 1 is regarded as a defective product (step (S13)). On the contrary, if all the above-mentioned LED elements 13 emit light normally and do not blink, the step ( S12 ) is executed, and it is judged as a good product.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but if they do not depart from the content of the technical solution of the present invention, according to the Technical Essence Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

Claims (7)

1. A soldering and temperature detection method of an LED element, characterized in that it may further comprise the steps: (1) Attach the circuit layer (12) to the circuit setting part (111) of the cover (11) using insulating and heat-conducting adhesive (18); (2) Execute the forming and manufacturing process of the cover body (11); (3) Executing the tinning manufacturing process, so that the multiple soldering legs of the multiple LED components (13) are covered with solder; (4) Corresponding to the plurality of soldering points on the circuit layer (12), disposing the plurality of LED elements (13) on the circuit layer (12); (5) Place the cover (11) on the heating device (2); (6) power on to the line layer (12); (7) heating the heating device (2) to the welding temperature to melt the solder on the above welding point; (8) Make the heating device (2) maintain the detection temperature and after a period of soldering time, so that the above-mentioned LED element (13) is soldered on the circuit layer (12); (9) Continue heating the heating device (2) to the detection temperature; (10) Make the heating device (2) maintain the detection temperature and pass a period of detection time; (11) Judging whether all the above-mentioned LED elements (13) emit light normally and do not blink, if yes, perform step (12), if not, perform step (13); (12) If it is judged as a good product, the step ends; and (13) It is judged as a defective product, and the step ends. 2. The method for soldering and temperature detection of LED components according to claim 1, characterized in that the heating device (2) used in step (5) is a heating plate. 3. The method for soldering and temperature detection of LED elements according to claim 1, characterized in that the heating device (2) used in steps (8) to (10) is a heating plate. 4. The method for soldering and temperature detection of LED elements according to claim 1, characterized in that the temperature range of the soldering temperature is 170°C to 220°C. 5. The method for soldering and temperature detection of LED components according to claim 1, characterized in that the detection temperature ranges from 150°C to 200°C, and the detection time ranges from 5 seconds to 10 seconds. 6. The method for soldering and temperature detection of LED components according to claim 1, characterized in that step (6) is achieved by passing a current in the range of 100 μA to 150 μA into the circuit layer (12). Finish. 7. The soldering and temperature detection method of LED components according to claim 1, characterized in that the cover 11 can be any of the following: a U-shaped sheet metal cover used in the backlight module, an L-shaped cover used in the backlight module Sheet metal cover and extruded cover used in backlight module.

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