CN103579282A - Multi-channel integrated optical couplers and method for manufacturing same - Google Patents

Abstract

In the multi-channel integrated optocoupler device described in the present invention, the optocoupler units are arranged on the same side of the substrate, and the one-to-one correspondence between the organic electroluminescent components and the organic photosensitive components can be realized without increasing the area of the optocoupler units, and each is independent The optocoupler does not need to be packaged separately, and the integration level is high; there are light-proof isolation columns between the optocoupler units, and there is no optical signal crosstalk between adjacent optocoupler units, and the anti-interference ability is strong; each component is made of organic materials , so that the multi-channel integrated optocoupler device is flexible, light, thin, small in size and wide in application. The preparation method of a multi-channel integrated optocoupler device according to the present invention adopts the preparation process of an organic thin film device, arranges each optocoupler unit on the same side of the substrate, has a high degree of integration, and is provided with an impermeable barrier between each optocoupler unit. The optical isolation column has no optical signal crosstalk between adjacent optocoupler units, has strong anti-interference ability, and adopts the existing production technology of organic thin film devices, with mature technology and low preparation cost.

Description

A kind of multi-channel integrated optocoupler device and its preparation method

technical field

The invention relates to the field of optoelectronics, in particular to a multi-channel integrated optocoupler device and a preparation method thereof.

Background technique

An optocoupler is an optoelectronic device that is usually used to transmit signals while being electrically isolated. It can convert a signal into an optical signal, and then convert the optical signal into another signal that can be detected. It generally includes at least three important functional components: a functional component that can convert electrical signals into light and output light, and has Electrically insulating and isolating components that are electrically insulated and capable of transmitting light, and photosensitive functional components that take optical signals as input and output as detectable signals. The most commonly used optocoupler device, as shown in Figure 1, uses an electroluminescent component A to convert an electrical signal into an optical signal, and then uses a photosensitive component B, such as a photosensitive resistor, photosensitive capacitor, photodiode or phototransistor, etc. The optical signal is converted into an electrical signal, and A and B are electrically isolated by an electrical insulation isolation component C. Optocoupler devices have a wide range of applications. For example, they can be applied to high-voltage electrical isolation control. The control electrical signal is loaded on the electroluminescent component at the low-voltage end to obtain an optical signal reflecting the electrical signal, and then the light is irradiated to the high-voltage potential. The electrical signal loaded on the high voltage is obtained from the photosensitive device, and the electrical signal can be used to control the circuit and equipment at the high voltage end.

The integrated circuit is small in size, light in weight, less in lead wires and solder joints, and high in reliability; compared with separate component circuits, the performance index of the whole machine circuit composed of integrated circuits is higher, and the stable working time of the equipment can also be greatly improved. Improvement, while the cost price is lower, which is convenient for large-scale production. Therefore, it is widely used in industry, civilian electronic equipment, military, communication, remote control, etc., and it plays an irreplaceable role in realizing the miniaturization and high resolution of electronic equipment. However, at present, most optocoupler devices are composed of inorganic light-emitting components and inorganic photosensitive components. Since inorganic light-emitting devices are difficult to integrate in high density, it is difficult to realize multi-channel integrated optocouplers, and it is impossible to prepare high-density multi-channel integrated photocouplers in situ. couple. Therefore, it is of great significance to realize the high integration of optocouplers for the application of optocouplers in the electronics industry.

Organic light-emitting diodes and organic semiconductor photosensitive devices are thin-film devices made of organic semiconductor materials, which can achieve high-resolution integration, which makes it possible to realize high-density integration of optocoupler devices using organic light-emitting and organic semiconductor photosensitive technologies.

There have been some researches on the application of organic optocoupler devices (see patent documents CN101442043A, CN1897311A, CN101783358A), but in these studies, the substrate is usually used as an electrically isolated insulating part, and the light-emitting part and the photosensitive part share a substrate, and are set separately on both sides of the base. In optocoupler devices, the light-emitting components and photosensitive components need to correspond one-to-one. Under this condition, the light-emitting components and photosensitive components arranged on both sides of the substrate must have a certain size to meet the corresponding requirements, thus limiting their use in integrated circuits. However, the advantages of organic thin film devices in high-resolution integration have not been effectively utilized.

Contents of the invention

Therefore, the present invention aims to solve the technical problem that the existing organic optocoupler devices cannot achieve high integration, and provides a highly integrated multi-channel integrated optocoupler device and a preparation method thereof.

In order to solve the problems of the technologies described above, the technical scheme adopted in the present invention is as follows:

A multi-channel integrated optocoupler device according to the present invention includes a plurality of optocoupler units arranged on the same side of the substrate, and a light-tight and insulating isolation column is arranged between adjacent optocoupler units. The posts are used for optically isolating the adjacent optocoupler units.

The optocoupler unit includes an organic electroluminescence component, a transparent electrical insulation isolation component and an organic photosensitive component stacked on the substrate, and the organic electroluminescence component and the organic photosensitive component are arranged on the electrical insulation isolation component. On both sides of the organic electroluminescent component and the organic photosensitive component, the electrodes close to the electrically insulating and isolating component are the same or different transparent electrodes.

The organic electroluminescent component further includes a first electrode of the organic electroluminescent component, an organic light-emitting functional layer, and a second electrode of the organic electroluminescent component.

The organic photosensitive component is an organic photosensitive device containing a photoconductive or photosensitive organic semiconductor material, and further includes a first electrode of the organic photosensitive component, a photosensitive functional layer, and a second electrode of the organic photosensitive component.

The isolation columns include multiple sets of first isolation columns arranged on the substrate, the first isolation columns in the same group are parallel to each other, and the straight lines where the first isolation columns of different groups intersect; the first isolation columns are composed of high isolation column groups and a low isolation column group; the high isolation column group divides the optocoupler unit into columns, and the height of the high isolation column group is equal to the distance away from the substrate in the organic light-emitting functional layer and the photosensitive functional layer The height of the upper surface in one layer, the height of the low spacer column group is equal to the height of the lower surface in the layer close to the substrate among the organic light-emitting functional layer and the photosensitive functional layer.

The isolation column also includes a second isolation column arranged on the same layer as the electrical insulation isolation component, the height of the second isolation column is the same as the thickness of the electrical insulation isolation component, and the second isolation column is placed on the same layer as the electrical insulation isolation component. The projection on the base plate coincides with the projection of the set of low isolation posts on the base plate.

The relative positions of the organic electroluminescence component and the organic photosensitive component in all the optocoupler units are the same.

The organic electroluminescent component is an organic light emitting diode or an organic electrochemical cell.

The organic photosensitive device is one of an organic photoresistor, an organic photodiode, an organic phototransistor or an organic phototransistor.

The isolation column is a stacked structure of one or more of silicon nitride, silicon carbide, silicon oxide, polyimide or photoresist.

The electrical insulation isolating part is a transparent film structure formed by stacking one or more of fluoropolymer, polymethyl methacrylate and polydimethylsiloxane.

The transparent electrode is an alloy of one or more of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, and silver, or an alloy of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, or silver One or more electrode layers formed alternately with its fluoride, or one of indium tin oxide, polythiophene/sodium polyvinylbenzenesulfonate, polyaniline, carbon nanotubes, and graphene.

The substrate is a flexible substrate.

An encapsulation layer is also provided above the optocoupler unit for encapsulation of the through-channel integrated optocoupler device.

A method for preparing a multi-channel integrated optocoupler device according to the present invention comprises the following steps:

S1, forming the first electrode of the organic electroluminescent component, the second electrode pin of the organic electroluminescent component, the first electrode pin of the organic photosensitive component, and the second electrode pin of the organic photosensitive component on the substrate;

S2. Form a plurality of sets of first isolation columns on the first electrode of the organic electroluminescent component. The first isolation columns in the same group are parallel to each other, and the lines where the first isolation columns of different groups intersect to form the exposed part of the organic electroluminescent component. An array of openings of the first electrode of the luminescence component to define an optocoupler unit, the first isolation column is composed of a high isolation column group and a low isolation column group; the high isolation column group divides the opening into columns, the The height of the high spacer group is equal to the height of the upper surface of the photosensitive functional layer in the organic photosensitive component, and the height of the low spacer group is equal to the height of the upper surface of the organic light-emitting functional layer in the organic electroluminescent component;

S3, sequentially forming an organic light-emitting functional layer in the opening, and the second electrode of the organic electroluminescent component covering the low spacer column group, the second electrode of the organic electroluminescent component is connected to the organic electroluminescent component the second electrode pin of the light emitting component is electrically connected;

S4. Directly forming a second isolation column on the second electrode of the organic electroluminescent component, the second isolation column and the first isolation column covered by the second electrode of the organic electroluminescent component The position of the projection on the substrate is the same, and the uncovered part of the second spacer column and the first spacer column forms an array of openings exposing part of the second electrode of the organic electroluminescent component; The optocoupler units defined in S2 correspond one-to-one, and an electrically insulating isolating member covering the second electrode of the organic electroluminescent component is formed in the opening array, and the thickness of the electrically insulating isolating member is the same as that of the first electrode. The height of the two spacers is the same;

S5, directly forming the first electrode of the organic photosensitive component covering the second isolation column on the electrically insulating isolation component, the first electrode of the organic photosensitive component is electrically connected to the first electrode pin of the organic photosensitive component connect;

S6, forming photosensitive units separated from each other on the first electrode of the organic photosensitive component through a photomask process, the photosensitive units correspond to the photocoupler units defined in step S2 one by one;

S7, directly forming the second electrode of the organic photosensitive component covering the high spacer column group on the photosensitive unit, the second electrode of the organic photosensitive component is electrically connected to the second electrode pin of the organic photosensitive component connect.

A method for preparing a multi-channel integrated optocoupler device according to the present invention comprises the following steps:

S1, forming the second electrode of the organic photosensitive component, the first electrode pin of the organic photosensitive component, the first electrode pin of the organic electroluminescent component, and the second electrode pin of the organic electroluminescent component on the substrate;

S2. Form multiple groups of first spacer columns on the second electrode of the organic photosensitive component, the first spacer columns in the same group are parallel to each other, and the lines where the first spacer columns of different groups intersect to form a part of the organic photosensitive component exposed The opening array of the second electrode is to define the optocoupler unit, and the first isolation column is composed of a high isolation column group and a low isolation column group; the high isolation column group divides the opening into columns, and the high isolation column group The height is equal to the height of the upper surface of the organic light-emitting functional layer in the organic electroluminescent component, and the height of the low spacer group is equal to the height of the upper surface of the photosensitive functional layer in the organic photosensitive component;

S3, sequentially forming a photosensitive functional layer in the opening from bottom to top, and the first electrode of the organic photosensitive component covering the low spacer group, the first electrode of the organic photosensitive component and the organic photosensitive component the first electrode pin is electrically connected;

S4, directly forming a second isolation column on the first electrode of the organic photosensitive component, the second isolation column and the first isolation column covered by the first electrode of the organic photosensitive component are on the substrate The positions of the projections are the same, and the uncovered part of the second spacer column and the first spacer column forms an array of openings exposing part of the second electrode of the organic electroluminescent component; the openings are defined in step S2 The optocoupler units are in one-to-one correspondence, and an electrically insulating spacer covering the first electrode of the organic photosensitive component is formed in the opening array, and the thickness of the electrically insulating spacer is the same as the height of the second spacer column ;

S5. Directly forming a second electrode of an organic electroluminescent component covering the second isolation column on the electrically insulating isolation component, the organic electroluminescent component is electrically connected to a pin of the organic electroluminescent component;

S6. Forming organic light-emitting functional units separated from each other on the organic electroluminescent component through a photomask process, the organic light-emitting functional units correspond to the optocoupler units defined in step S2 one by one;

S7. Directly form the first electrode of the organic electroluminescent component covering the high spacer column group on the organic light emitting functional unit, the first electrode of the organic electroluminescent component is connected with the organic electroluminescent component The first electrode pins of the components are electrically connected.

After step S7, a step of forming an encapsulation layer and encapsulating the multi-channel integrated optocoupler device is also included.

Both the first electrode of the organic photosensitive component and the second electrode of the organic electroluminescence component are transparent electrodes.

The transparent electrode is an alloy of one or more of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, and silver, or an alloy of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, or silver One or more electrode layers formed alternately with its fluoride, or one of indium tin oxide, polythiophene/sodium polyvinylbenzenesulfonate, polyaniline, carbon nanotubes, and graphene.

The isolation column is a stacked structure of one or more of silicon nitride, silicon carbide, silicon oxide, polyimide or photoresist.

The electrical insulation isolating part is a transparent film structure formed by stacking one or more of fluoropolymer, polymethyl methacrylate and polydimethylsiloxane.

The above technical solution of the present invention has the following advantages compared with the prior art:

1. In the multi-channel integrated optocoupler device of the present invention, the optocoupler unit is arranged on the same side of the substrate, so that the one-to-one correspondence between the organic electroluminescence component and the organic photosensitive component can be realized without increasing the area of the optocoupler unit, and Each optocoupler unit does not need to be individually packaged, and the integration level is high; moreover, there is an opaque isolation column between each optocoupler unit, so there is no optical signal crosstalk problem between adjacent optocoupler units, and the anti-interference ability is strong.

2. In the multi-channel integrated optocoupler device of the present invention, each component is made of organic materials, so that the multi-channel integrated optocoupler device is flexible and has a wide range of applications.

3. A multi-channel integrated optocoupler device according to the present invention, each component is an organic thin film device, which is light, thin and small in size.

4. The preparation method of a multi-channel integrated optocoupler device according to the present invention adopts the preparation process of an organic thin film device, and each optocoupler unit is arranged on the same side of the substrate, and there is no need for separate packaging between each optocoupler unit, not only the integration degree High and simple preparation process; at the same time, opaque isolation columns are arranged between each optocoupler unit, so there is no optical signal crosstalk problem between adjacent optocoupler units, and the anti-interference ability is strong.

5. The method for preparing a multi-channel integrated optocoupler device according to the present invention adopts the existing production technology of organic thin film devices, and has mature technology and low preparation cost.

Description of drawings

In order to make the content of the present invention more easily understood, the present invention will be described in further detail below according to specific embodiments of the present invention in conjunction with the accompanying drawings, wherein

1 is a schematic diagram of the principle of a single-channel organic optocoupler device in the prior art;

Fig. 2 is the structural representation of multi-channel integrated optocoupler device described in embodiment 1;

Fig. 3 is the structural representation of multi-channel integrated optocoupler device described in embodiment 2;

Fig. 4 is a schematic structural diagram of an organic electroluminescence component;

5 is a schematic structural view of an organic photosensitive component;

Figures 6-1 to 6-10 are the flow charts of the preparation of the multi-channel integrated optocoupler device shown in Figure 2;

Fig. 7 is a cross-sectional view of the multi-channel integrated optocoupler device shown in Fig. 6-1 to Fig. 6-10;

Fig. 8 is a circuit diagram of a multi-channel integrated optocoupler device shown in Fig. 7;

Fig. 9 is a relation diagram of the input current signal and the output current signal of two optocoupler units in the multi-channel integrated optocoupler device described in Embodiment 1;

FIG. 10 is a frequency response diagram of the multi-channel integrated optocoupler device described in Embodiment 1. FIG.

The reference signs in the figure are represented as: A-organic electroluminescent component, B-organic photosensitive component, C-electrical insulation isolation component, D-isolation column, D11-high isolation column group, D12-low isolation column group, D2- The second spacer column, 1-substrate, 41-the first electrode of the organic electroluminescent component, 42-the organic light-emitting functional layer, 43-the second electrode of the organic electroluminescent component, 431-the second electrode of the organic electroluminescent component Electrode, 51-first electrode of organic photosensitive component, 511-first electrode pin of organic photosensitive component, 52-photosensitive functional layer, 53-second electrode of organic photosensitive component, 531-second electrode lead of organic photosensitive component Pin, 6-package layer.

Detailed ways

In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe in detail the embodiments of the present invention in conjunction with the accompanying drawings.

This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, and the present invention will only be defined by the appended claims. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on" or "disposed on" another element, it can be directly on the other element or present middle element. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.

Example 1

This embodiment provides a multi-channel integrated optocoupler device, as shown in FIG. The organic photosensitive component B above the organic electroluminescent component A, and the transparent electrically insulating isolating component C that isolates the organic electroluminescent component A and the organic photosensitive component B, the organic electroluminescent component A and the organic photosensitive component B are close to all The electrodes of the electrically insulating and isolating part C are the same or different transparent electrodes. All the optocoupler units are disposed on the same side of the substrate 1 ; light-tight and insulating isolation columns D are arranged between adjacent optocoupler units to optically isolate adjacent optocoupler units.

The substrate 1 may be a glass substrate or a polymer substrate, and a flexible polyimide substrate is preferred in this embodiment.

In this embodiment, the organic electroluminescent component A is preferably an organic light-emitting diode, which may be an organic small molecule light-emitting device or a polymer light-emitting device, including a first electrode 41 of the organic electroluminescent component, an organic light-emitting functional layer 42, an organic The second electrode 42 of the electroluminescent component, as shown in Figure 4, the organic light-emitting functional layer 42 further includes an organic light-emitting layer, and one of a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer. one or more combinations.

In this embodiment, the organic electroluminescent component includes a first electrode 41 of the organic electroluminescent component, a hole injection layer, a hole transport layer, and a light emitting layer from bottom to top in a direction perpendicular to the substrate 1. . The second electrode 42 of the organic electroluminescence component.

The first electrode 41 of the organic electroluminescent component can be made of inorganic conductive materials or organic conductive materials. The inorganic materials are generally metal oxides such as indium tin oxide (hereinafter referred to as ITO), zinc oxide, tin zinc oxide, or gold, copper, and silver. , metals with high work function such as nickel aluminum alloy, organic conductive materials are generally polythiophene/sodium polyvinylbenzene sulfonate (hereinafter referred to as PEDOT: PSS), polyaniline (hereinafter referred to as PANI), carbon nanotubes, graphene, In this embodiment, nickel-aluminum alloy is preferred.

The material used for the hole injection layer, the hole transport layer, and the light-emitting layer and the preparation method are the same as those of the prior art. The hole injection layer described in this embodiment is preferably copper phthalocyanine (CuPc); the hole transport layer can use aromatic amines and branched Polymer family low molecular material, preferably N,N'-di-(1-naphthyl)-N,N'-diphenyl-1,1-biphenyl-4,4-diamine (NPB) ; The light-emitting layer can be a fluorescent material or a phosphorescent material, such as a metal-organic complex, which can be selected from three (8-hydroxyquinoline) aluminum (Alq ₃ ), (salicylaldehyde anteline phenol)-(8-hydroxyquinoline ) Al(Ⅲ) (Al(Saph-q)) compounds, the small molecule material can be doped with dyes, the doping concentration is 0.01wt%~20wt% of the small molecule material, and the dyes are generally aromatic fused ring materials , such as 5,6,11,12-tetraphenyltetracene (rubrene for short), coumarin materials, such as N,N'-dimethylquinacridone (DMQA for short), 10-(2- Benzothiazole)-1,1,7,7,-tetramethyl-2,3,6,7-tetrahydro-1H,5H,11H-benzo[1]pyran[6,7,8-ij ] quinolinazine (referred to as C545T), or bispyran materials, such as 4-4-dicyanomethylene-2-tert-butyl-6-(1,1,7,7-tetramethyl- Julonidine-9-vinyl)-4H-pyran (DCJTB for short); carbazole derivatives such as 4,4'-N,N'-dicarbazole-biphenyl (CBP for short) can also be used as the light-emitting layer material ), polyvinylcarbazole (PVK), the material can be doped with phosphorescent dyes, such as tris(2-phenylpyridine) iridium (Ir(ppy)3), bis(2-phenylpyridine) (acetylacetonate) iridium (Ir(ppy)2(acac)), platinum octaethylporphyrin (PtOEP), etc. Alq ₃ and DCJTB are preferred in this embodiment.

The second electrode 43 of the organic electroluminescent component is generally made of metals with low work functions such as lithium, magnesium, calcium, strontium, aluminum, indium, or their alloys with copper, gold, and silver, or the metals formed alternately with their fluorides. The electrode layer, or ITO is also used, and the light emitted by the organic light-emitting component A must pass through this layer to exit, and Ag electrodes are preferred in this embodiment.

The organic photosensitive component B is an organic photosensitive device containing photoconductive or photosensitive organic semiconductor materials, and can be one of organic photoresistors, organic photodiodes, organic phototransistors, and organic phototransistors.

In this embodiment, an organic photoresistor is preferred, and its structure is shown in Figure 5, which includes the first electrode 51 of the organic photosensitive component, the photosensitive functional layer 52, and the first electrode of the organic photosensitive component from bottom to top in the direction perpendicular to the substrate 1. Two electrodes 53 .

The preparation materials and methods of the photoresistor are the same as those of the prior art, wherein the photosensitive functional layer 52 can be acene, phthalocyanine and azobenzene materials, and the pentacene film is preferred in this embodiment; the first organic photosensitive component An electrode 51 should be a transparent lead electrode, which can be lithium, magnesium, calcium, strontium, aluminum, indium,

An alloy of one or more of copper, gold, silver, or an electrode layer formed alternately of one or more of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, silver and its fluoride, or One of indium tin oxide, polythiophene/sodium polyvinylbenzenesulfonate, polyaniline, carbon nanotubes, and graphene, the preferred ITO electrode in this embodiment; the second electrode 53 of the organic photosensitive component can be an opaque metal electrode , preferably Ag electrodes.

The electrical insulation isolation part C is a transparent film structure formed by stacking one or more of fluoropolymer, polymethyl methacrylate, and polydimethylsiloxane. In this embodiment, a transparent fluoropolymer film is preferred. .

The preparation process of the multi-channel integrated optocoupler device is shown in Figure 6-1 to Figure 6-10, and the specific preparation method is as follows:

S1. As shown in Figure 6-1, a nickel-aluminum alloy conductive film is formed on the substrate 1 by a magnetron sputtering process, and it is prepared into a horizontal strip-shaped organic electroluminescent component by using a photolithography and etching process. An electrode 41, and the second electrode pin 431 of the organic electroluminescent component, the first electrode pin 511 of the organic photosensitive component, and the second electrode pin 531 of the organic photosensitive component.

S2. As shown in Figure 6-2, two sets of first isolation pillars D11 and D12 are formed on the first electrode 41 of the organic electroluminescent component by photosensitive glue exposure and development. The columns are parallel to each other, and the straight lines where different groups of the first isolation columns are located intersect each other. The first isolation columns are preferably RS1100 type photoresist produced by Taiwan New Applied Materials Company; The array of openings defines the optocoupler unit.

Among the first spacers described in this embodiment, the vertical high spacer group D11 and the horizontal low spacer group D12 divide the opening array into opening columns, thereby obtaining the first spacer layer of black mesh; the low spacer group D12 The height is related to the thickness of the organic electroluminescent component A. In this embodiment, the height of the low spacer group D12 is 100 nm, which is the same as the height of the upper surface of the organic light-emitting functional layer; the height of the high spacer group D11 is related to the height of the organic electroluminescent component A. The total thickness of the light-emitting component A, the organic photosensitive component B and the electrical insulation isolation component C is related. The height of the high isolation column group D11 in this embodiment is 680nm, which is the same as the height of the upper surface of the photosensitive functional layer in the organic photosensitive component.

In this embodiment, there are only two groups of first isolation columns, and the optocoupler unit is limited to a quadrilateral. As other embodiments of the present invention, there can be multiple groups of the first isolation columns, and the optocoupler unit can be any Polygons can all achieve the purpose of the present invention and belong to the protection scope of the present invention.

S3. As shown in FIG. 6-3, the organic light-emitting functional layer 42 in the organic electroluminescent component A is deposited layer by layer on the substrate 1 with the isolation column D through a vacuum evaporation process, that is, copper phthalocyanine of 100 nm, copper phthalocyanine of 20 nm NPB, as well as evaporating 30nm Alq ₃ and DCJTB by two-source co-evaporation in vacuum; they are divided into different light-emitting units by meshed isolation columns. As shown in Figure 6-4, a 30nm Ag electrode is directly vacuum-deposited on the organic light-emitting functional layer 42 to form the second electrode 43 of the organic electroluminescent component covering the shared spacer. The second electrode 43 of the second electrode 43 covers the horizontal low spacer group D12, and is separated into strips by the high spacer group D11 in the vertical direction, and the second electrode 43 of the organic electroluminescent component of each strip electrode is connected to the organic electroluminescence. The second electrode pins 431 of the light emitting part are electrically connected.

S4. As shown in Figure 6-5, a layer of 300nm opaque photoresist (RS1100 photoresist produced by Taiwan New Applied Materials Co., Ltd.) is deposited by vacuum evaporation, and the second layer is formed by dry stripping photolithography. isolation column D2, the second isolation column D2 is projected on the same position as the first isolation column (that is, D12) covered by the second electrode 43 of the organic electroluminescent component on the substrate 1, the The second spacer D2 and the uncovered part (ie D11) of the first spacer form an array of openings exposing part of the second electrode 43 of the organic electroluminescent component; the openings are defined in step S2 There is a one-to-one correspondence between the optocoupler units. As shown in Figure 6-6, a 300nm transparent fluoropolymer (preferably Teflon polytetrafluoroethylene resin produced by DuPont) film is deposited by vacuum evaporation to form a second layer covering the organic electroluminescent component. The electrically insulating spacer part C of the electrode 43 is divided into strips by the high spacer column group D11 in the longitudinal direction. An electrically insulating spacer C covering the second electrode 43 of the organic electroluminescence component is formed in the array of openings.

S5, as shown in Figure 6-7, directly deposit the 80nm ITO transparent film covering the D2 of the second isolation column on the electrical insulation isolation member C by the method of magnetron sputtering, as the first organic photosensitive member The electrode 51 is also divided into strips by the high spacer group D11, the first electrode 51 of the organic photosensitive component is electrically connected to the first electrode pin 511 of the organic photosensitive component.

S6, as shown in Fig. 6-8, on the first electrode 51 of described organic photosensitive member vacuum vapor deposition 50nm pentacene film as photoresistor layer by photomask process, form photosensitive functional layer 52, after photomask and Under the combined action of the high spacer column group D11, the photosensitive functional layer 52 is divided into photosensitive units independent of each other, and the photosensitive units correspond to the photocoupler units defined in step S2 one by one.

S7, as shown in Figure 6-9, directly deposit 150nm Ag electrode on described photosensitive unit by vacuum evaporation process, form the second electrode 53 of described organic photosensitive component that covers described connected spacer D, on the template Under action, the electrode is a horizontal strip film, and the second electrode 53 of the organic photosensitive component is electrically connected to the second electrode pin 531 of the organic photosensitive component.

S8. As shown in FIG. 6-10, deposit a layer of Al ₂ O ₃ thin film as encapsulation layer 6 on the second electrode 53 of the organic photosensitive component by magnetron sputtering process. At this time, it is integrated on a substrate 1 The preparation of multi-channel optocoupler devices isolated from each other is completed. The cross-sectional view of the multi-channel integrated optocoupler device is shown in FIG. 7 , and FIG. 8 is a circuit diagram of the structure shown in FIG. 7 .

The multi-channel integrated optocoupler device is tested, and the Agilent device analyzer is used to test the electrical signal, and the electrical signal of each optocoupler unit is extracted and imported into the processing terminal for data processing. The data are shown in Figures 9 and 10.

Figure (a) and figure (b) in accompanying drawing 9 are respectively the relationship between the input current signal and the output current signal of two optocoupler units in the described multi-channel integrated optocoupler device, and the optocoupler of this device can be seen from the figure The units have good consistency, and the input and output have a very good linear relationship, which can be compared with the inorganic optocoupler devices in the prior art.

Accompanying drawing 10 is the frequency response figure of described multi-channel integrated optocoupler device, as seen from the figure, the input and output of this device have very good linear relationship, and its cut-off frequency can be greater than 400kHz, and inorganic in the prior art comparable to optocoupler devices. And because the organic polymer flexible material is used as the substrate of the organic optocoupler, the entire optocoupler is flexible and bendable, which greatly expands the broad field of the multi-channel integrated optocoupler device.

Example 2

This embodiment provides a multi-channel integrated optocoupler device, as shown in Figure 3, the preparation method and the materials used are the same as in Embodiment 1, the only difference is that the first preparation on the substrate is that the organic A photosensitive part B, an electrical insulating part C and an organic electroluminescence part A. The specific preparation method is:

S1, forming the second electrode of the organic photosensitive component, the first electrode pin of the organic photosensitive component, the first electrode pin of the organic electroluminescent component, and the second electrode pin of the organic electroluminescent component on the substrate 1;

S2. Form multiple groups of first spacer columns on the second electrode of the organic photosensitive component, the first spacer columns in the same group are parallel to each other, and the lines where the first spacer columns of different groups intersect to form a part of the organic photosensitive component exposed The opening array of the second electrode is used to define the optocoupler unit, and the height of each connected first isolation column in the openings of the same column is greater than the height of the shared first isolation column;

S3, sequentially forming a photosensitive functional layer in the opening from bottom to top, and covering the first electrode of the organic photosensitive component sharing the first spacer column in the same row of openings, the first electrode of the organic photosensitive component and the first electrode of the organic photosensitive component The first electrode pin of the organic photosensitive component is electrically connected;

S4, directly forming a second isolation column on the first electrode of the organic photosensitive component, the second isolation column and the first isolation column covered by the first electrode of the organic photosensitive component are on the substrate The positions of the projections are the same, and the uncovered part of the second spacer column and the first spacer column forms an array of openings exposing part of the second electrode of the organic electroluminescent component; the openings are defined in step S2 The optocoupler units are in one-to-one correspondence, and an electrically insulating isolation member covering the first electrode of the organic photosensitive member is formed in the opening array;

S5. Directly forming a second electrode of an organic electroluminescent component covering the second isolation column on the electrically insulating isolation component, the organic electroluminescent component is electrically connected to a pin of the organic electroluminescent component;

S6. Forming organic light-emitting functional units separated from each other on the organic electroluminescent component through a photomask process, the organic light-emitting functional units correspond to the optocoupler units defined in step S2 one by one;

S7, directly forming the first electrode of the organic electroluminescent component covering the connected isolation column on the organic light emitting functional unit, the first electrode of the organic electroluminescent component is connected to the organic electroluminescent component The first electrode pin is electrically connected;

S8. Prepare an encapsulation layer on the first electrode of the organic electroluminescence component.

Apparently, the above-mentioned embodiments are only examples for clear description, rather than limiting the implementation. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. However, the obvious changes or changes derived therefrom still fall within the scope of protection of the present invention.

Claims (21)

1. A multi-channel integrated optocoupler device, characterized in that: it includes a plurality of optocoupler units arranged on the same side of the substrate, and a light-tight and insulating isolation column is arranged between adjacent said optocoupler units, said The isolation column is used for optically isolating the adjacent optocoupler units. 2. The multi-channel integrated optocoupler device according to claim 1, characterized in that: the optocoupler unit comprises an organic electroluminescence component, a transparent electrically insulating isolation component and an organic photosensitive component superimposed on the substrate , the organic electroluminescent component and the organic photosensitive component are arranged on both sides of the electrically insulating and isolating component, and the electrodes of the organic electroluminescent component and the organic photosensitive component that are close to the electrically insulating and isolating component are the same or different transparent electrodes . 3. The multi-channel integrated optocoupler device according to claim 2, characterized in that: the organic electroluminescent component further comprises a first electrode of the organic electroluminescent component, an organic light-emitting functional layer, and an organic electroluminescent component. second electrode. 4. The multi-channel integrated optocoupler device according to claim 3, characterized in that: the organic photosensitive component is an organic photosensitive device containing a photoconductive or photosensitive organic semiconductor material, further comprising a first organic photosensitive component An electrode, a photosensitive functional layer, and a second electrode of an organic photosensitive component. 5. The multi-channel integrated optocoupler device according to claim 4, characterized in that: the isolation columns include multiple groups of first isolation columns arranged on the substrate, and the first isolation columns in the same group are parallel to each other and different from each other. The straight lines where the first group of isolation columns intersect; the first isolation column is composed of a high isolation column group and a low isolation column group; the high isolation column group divides the optocoupler unit into columns, and the high isolation column group The height is equal to the height of the upper surface of the layer of the organic light-emitting functional layer and the photosensitive functional layer far away from the substrate, and the height of the low spacer column group is equal to the height of the organic light-emitting functional layer and the photosensitive functional layer. The height at which the lower surface of the layer close to the substrate is located. 6. The multi-channel integrated optocoupler device according to claim 5, characterized in that: the isolation column also includes a second isolation column arranged on the same layer as the electrically insulating isolation component, and the height of the second isolation column is The thickness of the electrically insulating isolation member is the same, and the projection of the second isolation column on the substrate coincides with the projection of the lower isolation column group on the substrate. 7 . The multi-channel integrated optocoupler device according to claim 6 , wherein the relative positions of the organic electroluminescence component and the organic photosensitive component in all the optocoupler units are the same. 8. The multi-channel integrated optocoupler device according to claim 7, wherein the organic electroluminescent component is an organic light emitting diode or an organic electrochemical cell. 9. The multi-channel integrated optocoupler device according to claim 8, wherein the organic photosensitive device is one of an organic photoresistor, an organic photodiode, an organic phototransistor or an organic phototransistor. 10. The multi-channel integrated optocoupler device according to claim 9, wherein the isolation column is one or more of silicon nitride, silicon carbide, silicon oxide, polyimide or photoresist stack structure. 11. The multi-channel integrated optocoupler device according to claim 10, characterized in that, the electrical insulation isolating part is one of fluoropolymer, polymethyl methacrylate, polydimethylsiloxane or A transparent film structure formed by multiple stacks. 12. The multi-channel integrated optocoupler device according to claim 11, wherein the transparent electrode is one or more of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, silver Alloy, or one or more of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, silver alternately formed electrode layer with its fluoride, or indium tin oxide, polythiophene/polyvinylbenzenesulfonic acid One of sodium, polyaniline, carbon nanotubes, graphene. 13. The multi-channel integrated optocoupler device according to claim 12, wherein the substrate is a flexible substrate. 14 . The multi-channel integrated optocoupler device according to claim 13 , wherein an encapsulation layer is arranged above the optocoupler unit for encapsulation of the through-channel integrated optocoupler device. 15. A method for preparing the multi-channel integrated optocoupler device described in any one of claims 1-14, comprising the steps of: S1, forming the first electrode of the organic electroluminescent component, the second electrode pin of the organic electroluminescent component, the first electrode pin of the organic photosensitive component, and the second electrode pin of the organic photosensitive component on the substrate; S2. Form a plurality of sets of first isolation columns on the first electrode of the organic electroluminescent component. The first isolation columns in the same group are parallel to each other, and the lines where the first isolation columns of different groups intersect to form the exposed part of the organic electroluminescent component. An array of openings of the first electrode of the luminescence component to define an optocoupler unit, the first isolation column is composed of a high isolation column group and a low isolation column group; the high isolation column group divides the opening into columns, the The height of the high spacer group is equal to the height of the upper surface of the photosensitive functional layer in the organic photosensitive component, and the height of the low spacer group is equal to the height of the upper surface of the organic light-emitting functional layer in the organic electroluminescent component; S3, sequentially forming an organic light-emitting functional layer in the opening, and the second electrode of the organic electroluminescent component covering the low spacer column group, the second electrode of the organic electroluminescent component is connected to the organic electroluminescent component the second electrode pin of the light emitting component is electrically connected; S4. Directly forming a second isolation column on the second electrode of the organic electroluminescent component, the second isolation column and the first isolation column covered by the second electrode of the organic electroluminescent component The position of the projection on the substrate is the same, and the uncovered part of the second spacer column and the first spacer column forms an array of openings exposing part of the second electrode of the organic electroluminescent component; The optocoupler units defined in S2 correspond one-to-one, and an electrically insulating isolating member covering the second electrode of the organic electroluminescent component is formed in the opening array, and the thickness of the electrically insulating isolating member is the same as that of the first electrode. The height of the two spacers is the same; S5, directly forming the first electrode of the organic photosensitive component covering the second isolation column on the electrically insulating isolation component, the first electrode of the organic photosensitive component is electrically connected to the first electrode pin of the organic photosensitive component connect; S6, forming photosensitive units separated from each other on the first electrode of the organic photosensitive component through a photomask process, the photosensitive units correspond to the photocoupler units defined in step S2 one by one; S7, directly forming the second electrode of the organic photosensitive component covering the high spacer column group on the photosensitive unit, the second electrode of the organic photosensitive component is electrically connected to the second electrode pin of the organic photosensitive component connect. 16. A method for preparing the multi-channel integrated optocoupler device described in any one of claims 1-14, comprising the steps of: S1, forming the second electrode of the organic photosensitive component, the first electrode pin of the organic photosensitive component, the first electrode pin of the organic electroluminescent component, and the second electrode pin of the organic electroluminescent component on the substrate; S2. Form multiple groups of first spacer columns on the second electrode of the organic photosensitive component, the first spacer columns in the same group are parallel to each other, and the lines where the first spacer columns of different groups intersect to form a part of the organic photosensitive component exposed The opening array of the second electrode is to define the optocoupler unit, and the first isolation column is composed of a high isolation column group and a low isolation column group; the high isolation column group divides the opening into columns, and the high isolation column group The height is equal to the height of the upper surface of the organic light-emitting functional layer in the organic electroluminescent component, and the height of the low spacer group is equal to the height of the upper surface of the photosensitive functional layer in the organic photosensitive component; S3, sequentially forming a photosensitive functional layer in the opening from bottom to top, and the first electrode of the organic photosensitive component covering the low spacer group, the first electrode of the organic photosensitive component and the organic photosensitive component the first electrode pin is electrically connected; S4, directly forming a second isolation column on the first electrode of the organic photosensitive component, the second isolation column and the first isolation column covered by the first electrode of the organic photosensitive component are on the substrate The positions of the projections are the same, and the uncovered part of the second spacer column and the first spacer column forms an array of openings exposing part of the second electrode of the organic electroluminescent component; the openings are defined in step S2 The optocoupler units are in one-to-one correspondence, and an electrically insulating spacer covering the first electrode of the organic photosensitive component is formed in the opening array, and the thickness of the electrically insulating spacer is the same as the height of the second spacer column ; S5. Directly forming a second electrode of an organic electroluminescent component covering the second isolation column on the electrically insulating isolation component, the organic electroluminescent component is electrically connected to a pin of the organic electroluminescent component; S6. Forming organic light-emitting functional units separated from each other on the organic electroluminescent component through a photomask process, the organic light-emitting functional units correspond to the optocoupler units defined in step S2 one by one; S7. Directly form the first electrode of the organic electroluminescent component covering the high spacer column group on the organic light emitting functional unit, the first electrode of the organic electroluminescent component is connected with the organic electroluminescent component The first electrode pins of the components are electrically connected. 17. The method for preparing a multi-channel integrated optocoupler device according to claim 15 or 16, characterized in that, after step S7, a packaging layer is formed to package the multi-channel integrated optocoupler device. 18 . The method for preparing a multi-channel integrated optocoupler device according to claim 17 , wherein both the first electrode of the organic photosensitive component and the second electrode of the organic electroluminescent component are transparent electrodes. 19. The preparation method of multi-channel integrated optocoupler device according to claim 18, characterized in that, the transparent electrode is one of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, silver or A variety of alloys, or electrode layers formed alternately with one or more of lithium, magnesium, calcium, strontium, aluminum, indium, copper, gold, and silver and their fluorides, or indium tin oxide, polythiophene/polyvinyl One of sodium benzenesulfonate, polyaniline, carbon nanotubes, and graphene. 20. The method for preparing a multi-channel integrated optocoupler device according to claim 19, wherein the spacer column is one of silicon nitride, silicon carbide, silicon oxide, polyimide or photoresist or multiple stacked structures. 21. the preparation method of multi-channel integrated optocoupler device according to claim 20, is characterized in that, described electric insulation isolating member is in fluoropolymer, polymethyl methacrylate, polydimethylsiloxane A transparent film structure formed by stacking one or more types.

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