CN103567683A - Positioning tool for chip welding - Google Patents
Positioning tool for chip welding Download PDFInfo
- Publication number
- CN103567683A CN103567683A CN201210248939.0A CN201210248939A CN103567683A CN 103567683 A CN103567683 A CN 103567683A CN 201210248939 A CN201210248939 A CN 201210248939A CN 103567683 A CN103567683 A CN 103567683A
- Authority
- CN
- China
- Prior art keywords
- positioning tool
- chips
- welding
- alignment pin
- top cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a positioning tool for chip welding. The positioning tool comprises a base and a top cover positioned above the base, wherein a plurality of positioning holes are formed in the top cover, a positioning pin capable of sliding in each of the positioning holes vertically is arranged in each of the positioning holes, and one end of the positioning pin close to the base is used for abutting against chips to be welded. By arranging a plurality of positioning pins formed in the top cover and sliding freely to apply a certain pressure on the chips to be welded, the chips, welding lugs and a DBC base plate are fixed relatively, and the chips cannot be damaged by pressing. Therefore, position offset of the chips during welding is avoided, voidage of chip welding is reduced, the welding is firm, and quality and performance of welded products are effectively improved.
Description
Technical field
The present invention relates to semiconductor packaging, relate in particular to a kind of chips welding positioning tool.
Background technology
Now, semiconductor packaging is just towards high density, high-speed, high reliability direction sustainable development.Insulated gate bipolar transistor (English full name: Insulated Gate Bipolar Transistor, be called for short IGBT), the compound full-control type voltage driven type power semiconductor being formed by double pole triode (BJT) and insulating gate type field effect tube (MOS), the characteristic of igbt because having high-frequency, high voltage, large electric current, easily turning on and off is the Power Electronic Technique of generally acknowledging the in the world the most representative product of revolution for the third time.The packaging technology of igbt relates to a plurality of key technologies, the welding of its chips and heat conductive insulating ceramic copper-clad base plate (hereinafter to be referred as DBC substrate) is again the primary key technology in packaging technology, because the welding quality of chip and DBC substrate can directly affect the quality of whole packaging technology and the operating efficiency of whole piece packing producing line.
Prior art be by positioning tool (in production and processing field, frock refers to production process technology equipment, it is the general name of various tool used in manufacture process, wherein can comprise cutter, fixture, mould, measurer, cubing, location accessory, small tool, working position apparatus etc., positioning tool generally includes positioning pedestal and location top cover) by the advanced windrow superimposition of chip, weld tabs and DBC substrate location, send into afterwards soldering furnace and weld.But chip, weld tabs and DBC substrate behind location be owing to not being fixed, therefore can occurrence positions skew in the process of putting into soldering furnace, also can make to weld voidage higher simultaneously, thus the quality and performance of product after impact welding.Yet, if adopt common clamping mode to make chip, weld tabs and DBC substrate relatively fixing, easily damage again chip by pressure.
Summary of the invention
The invention provides a kind of chips welding positioning tool, easy occurrence positions skew while having solved the welding of prior art chips, and the higher technical problem of the voidage of chips welding.
A kind of chips welding positioning tool provided by the present invention, comprise pedestal and the top cover that is positioned at described pedestal top, wherein, on described top cover, be provided with several locating holes, in described each locating hole, be provided with can be in locating hole the alignment pin that slides of easy on and off, described alignment pin near one end of described pedestal in order to compress chip to be welded.
Chips welding positioning tool provided by the present invention, than prior art, has following beneficial effect:
Chips welding positioning tool of the present invention, the alignment pin being free to slide being arranged on top cover by several imposes on the certain pressure of chip to be welded, make between chip, weld tabs and DBC substrate relatively fixing, but can not damage chip by pressure, while therefore making chips welding, can not be offset by occurrence positions, also reduced the voidage of chips welding, made welding more firm, thereby effectively improved the quality and performance of product after welding simultaneously.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of positioning tool for the chips welding of the embodiment of the present invention;
Fig. 2 is the top view of the top cover in positioning tool for the chips welding of the embodiment of the present invention;
Fig. 3 is the front view of the alignment pin in positioning tool for the chips welding of the embodiment of the present invention.
The specific embodiment
Below by specific embodiment, also the present invention is described in further detail by reference to the accompanying drawings.
Fig. 1 is the overall structure schematic diagram of positioning tool for the chips welding of the embodiment of the present invention.Fig. 2 is the top view of the top cover in positioning tool for the chips welding of the embodiment of the present invention.Fig. 3 is the front view of the alignment pin in positioning tool for the chips welding of the embodiment of the present invention.As shown in Figure 1 to Figure 3, a kind of chips welding positioning tool that one embodiment of the invention provides, comprise pedestal 1 and the top cover 2 that is positioned at pedestal 1 top, wherein, on top cover 2, be provided with several locating holes 20, in each locating hole 20, be provided with can be in locating hole the alignment pin 21 that slides of easy on and off, alignment pin 21 near one end of pedestal 1 in order to compress chip to be welded 3.As shown in Figure 1, after DBC substrate 5, weld tabs 4 and chip 3 are sequentially superimposed on pedestal 1, can impose on the certain pressure of chip to be welded 3 by being arranged on the deadweight of the alignment pin being free to slide 21 on top cover 2, make between chip 3, weld tabs 4 and DBC substrate 5 relatively fixing
On the basis of technique scheme, the weight of alignment pin 21 is preferably 60 grams to 80 grams.This is because if alignment pin 21 is too heavy, can cause 3 built-up welding around of welding process chips, be difficult for processing, and likely can scratch chip 3, even can crush chip 3, but alignment pin 21 kicks the beam, do not have again corresponding pressuring action, therefore to the weight of alignment pin 21, must be limited, specifically, the weight of alignment pin 21 can be limited according to the size of chip 3, when chip 3 is larger, the weight of alignment pin 21 can be bigger than normal.Like this, because the deadweight of alignment pin 21 is light and can slide by easy on and off, therefore, it plays the pressuring action that makes chip 3 that skew not occur on the one hand, also can not damage chip 3 by pressure on the other hand.
As shown in Figure 1, on the basis of technique scheme, the two ends of alignment pin 21 are preferably upper surface and the lower surface that protrudes from respectively top cover 2, so that alignment pin 21 has enough sliding strokes with respect to the locating hole 20 of top cover 2, and can be under the effect of self gravitation, the upper surface close contact of one end and chip 3.
As shown in Figures 2 and 3, on the basis of technique scheme, the shape of the locating hole 20 in the present embodiment is preferably circle, and the cross sectional shape of alignment pin 21 is also preferably circle, it is cylindric to be that the shape of alignment pin 21 can be preferably, to adapt with the shape of locating hole 20.Certainly, those skilled in the art should understand, the shape of the locating hole 20 in the present embodiment also can be changed as rectangle or other shape, the cross sectional shape of alignment pin 21 also can change as rectangle or other shape, the shape that is alignment pin 21 also can be rectangle column or other shape, to adapt with the shape of locating hole 20.
In sum, the chips welding positioning tool that the embodiment of the present invention provides, than prior art, has following beneficial effect:
The chips welding positioning tool of the embodiment of the present invention, the alignment pin being free to slide 21 being arranged on top cover 2 by several imposes on the certain pressure of chip to be welded 3, make between chip 3, weld tabs 4 and DBC substrate 5 relatively fixing, but can not damage chip 3 by pressure, therefore in the whole welding process that makes chip weld in being placed into soldering furnace, can not be offset by occurrence positions, also reduced the voidage of chips welding simultaneously, make welding more firm, thereby effectively improved the quality and performance of product after welding.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record previous embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of embodiment of the present invention technical scheme.
Claims (7)
1. a chips welding positioning tool, comprise pedestal and the top cover that is positioned at described pedestal top, it is characterized in that, on described top cover, be provided with several locating holes, in described each locating hole, be provided with can be in this locating hole the alignment pin that slides of easy on and off, described alignment pin near one end of described pedestal in order to compress chip to be welded.
2. chips welding positioning tool according to claim 1, is characterized in that, the two ends of described alignment pin protrude from respectively upper surface and the lower surface of described top cover.
3. chips welding positioning tool according to claim 1 and 2, is characterized in that, described locating hole be shaped as circle.
4. chips welding positioning tool according to claim 3, is characterized in that, the cross sectional shape of described alignment pin is circular.
5. chips welding positioning tool according to claim 1 and 2, is characterized in that, described locating hole be shaped as rectangle.
6. chips welding positioning tool according to claim 5, is characterized in that, the cross sectional shape of described alignment pin is rectangle.
7. chips welding positioning tool according to claim 1 and 2, is characterized in that, the weight of described alignment pin is 60 grams to 80 grams.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210248939.0A CN103567683A (en) | 2012-07-18 | 2012-07-18 | Positioning tool for chip welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210248939.0A CN103567683A (en) | 2012-07-18 | 2012-07-18 | Positioning tool for chip welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103567683A true CN103567683A (en) | 2014-02-12 |
Family
ID=50040858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210248939.0A Pending CN103567683A (en) | 2012-07-18 | 2012-07-18 | Positioning tool for chip welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103567683A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104174988A (en) * | 2014-08-23 | 2014-12-03 | 华东光电集成器件研究所 | Multi-chip eutectic-bonding pressure dividing device |
| CN104191063A (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | Improved welding mold for welding semiconductor power module |
| CN105171308A (en) * | 2015-08-30 | 2015-12-23 | 深圳英飞自动化设备有限公司 | Automatic welding fixture of semiconductor chip |
| CN105632988A (en) * | 2014-11-07 | 2016-06-01 | 西安永电电气有限责任公司 | Chip welding positioning tooling |
| CN107004671A (en) * | 2014-12-05 | 2017-08-01 | 三星电子株式会社 | Equipment for manufacturing semiconductor device and method for manufacturing semiconductor package using the same |
| CN109570867A (en) * | 2018-12-10 | 2019-04-05 | 安徽华东光电技术研究所有限公司 | For improving the welding tooling and its welding method of large-area substrates welding penetration rate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0504601A2 (en) * | 1991-03-21 | 1992-09-23 | International Business Machines Corporation | Substrate soldering in a reducing atmosphere |
| US5927589A (en) * | 1997-11-25 | 1999-07-27 | Lucent Technologies Inc. | Method and fixture for use in bonding a chip to a substrate |
| CN1436033A (en) * | 2002-01-26 | 2003-08-13 | 华为技术有限公司 | Interlayer connecting method and apparatus |
| CN201557328U (en) * | 2009-11-26 | 2010-08-18 | 上海德科电子仪表有限公司 | Clamp for welding circuit board component |
| CN101890605A (en) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | Power semiconductor chip welding device |
| CN102361257A (en) * | 2011-07-07 | 2012-02-22 | 福建省电力有限公司漳州电业局 | Front clamp of decomposition type ground potential replacement clamp |
-
2012
- 2012-07-18 CN CN201210248939.0A patent/CN103567683A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0504601A2 (en) * | 1991-03-21 | 1992-09-23 | International Business Machines Corporation | Substrate soldering in a reducing atmosphere |
| US5927589A (en) * | 1997-11-25 | 1999-07-27 | Lucent Technologies Inc. | Method and fixture for use in bonding a chip to a substrate |
| CN1436033A (en) * | 2002-01-26 | 2003-08-13 | 华为技术有限公司 | Interlayer connecting method and apparatus |
| CN201557328U (en) * | 2009-11-26 | 2010-08-18 | 上海德科电子仪表有限公司 | Clamp for welding circuit board component |
| CN101890605A (en) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | Power semiconductor chip welding device |
| CN102361257A (en) * | 2011-07-07 | 2012-02-22 | 福建省电力有限公司漳州电业局 | Front clamp of decomposition type ground potential replacement clamp |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104174988A (en) * | 2014-08-23 | 2014-12-03 | 华东光电集成器件研究所 | Multi-chip eutectic-bonding pressure dividing device |
| CN104191063A (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | Improved welding mold for welding semiconductor power module |
| CN104191063B (en) * | 2014-09-01 | 2016-04-27 | 徐州汉通电子科技有限公司 | A kind of weldering mould of welding semi-conductor power module of improvement |
| CN105632988A (en) * | 2014-11-07 | 2016-06-01 | 西安永电电气有限责任公司 | Chip welding positioning tooling |
| CN107004671A (en) * | 2014-12-05 | 2017-08-01 | 三星电子株式会社 | Equipment for manufacturing semiconductor device and method for manufacturing semiconductor package using the same |
| US10319619B2 (en) | 2014-12-05 | 2019-06-11 | Samsung Electronics Co., Ltd. | Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package components |
| CN107004671B (en) * | 2014-12-05 | 2019-11-19 | 三星电子株式会社 | Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor package using the same |
| CN105171308A (en) * | 2015-08-30 | 2015-12-23 | 深圳英飞自动化设备有限公司 | Automatic welding fixture of semiconductor chip |
| CN105171308B (en) * | 2015-08-30 | 2016-10-12 | 深圳英飞自动化设备有限公司 | Semiconductor chip automatic welding fixing device |
| CN109570867A (en) * | 2018-12-10 | 2019-04-05 | 安徽华东光电技术研究所有限公司 | For improving the welding tooling and its welding method of large-area substrates welding penetration rate |
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Application publication date: 20140212 |