CN103559996A - Planar electronic device and method for manufacturing - Google Patents
Planar electronic device and method for manufacturing Download PDFInfo
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- CN103559996A CN103559996A CN201310180164.2A CN201310180164A CN103559996A CN 103559996 A CN103559996 A CN 103559996A CN 201310180164 A CN201310180164 A CN 201310180164A CN 103559996 A CN103559996 A CN 103559996A
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Abstract
A method of manufacturing a planar board substrate (220) for receiving a magnetic core comprises steps of providing a cover layer (222) having a layer side (262), providing a base layer (224) having first and second sides (252, 254), the base layer including a material hole (250) that extends completely through the base layer between the first and second sides, coupling the cover layer and the base layer to each other along the first side and the layer side, the cover layer extending over at least a portion of the material hole, and providing a dielectric member (226) within the material hole, wherein a core-holding channel (272) exists between the dielectric member and the base layer, the core-holding channel extending circumferentially around the dielectric member and configured to have the magnetic core (288, 488, 588) therein.
Description
Technical field
The present invention relates to electronic device, for example transformer, inductor, balanced-to-unbalanced transformer (baluns), coupler or filter.
Background technology
Some known electronic devices comprise planar body, circuit board for example, one or more magnetic parts that it is set up in planar body.Magnetic part can comprise FERRITE CORE, and this FERRITE CORE has the conductive winding around its extension.Some in these magnetic parts comprise two conductive winding of not electric coupling each other (couple).For example, conductive winding is physics or mechanical couplings not, makes electric current can directly not flow to another conductive winding via a conductive winding.The electric current of the conductive winding of flowing through produces magnetic field in core and another conductive winding, and the magnetic field in another winding produces an electric current.The electrical property of device is decided by various parameters, and for example the ratio of the number of turn of the number of turn of the first winding and the second winding is, impedance of the shape of the first and/or second winding, the first and second windings etc.
The manufacturing process of some known plane electronics devices comprises that boring or routing (routing) are in flat substrate.More specifically, flat substrate can comprise a plurality of substrate layers (for example FR-4 and other PCB shaped materials).The substrate layer of part can remove by controlled degree of depth routing.In controlled degree of depth routing, drill bit moves to remove backing material and depression or chamber is provided in flat substrate along predefined paths.Depression can not extend fully through flat substrate.After forming depression, magnetic core (for example FERRITE CORE) can be loaded in depression.Although controlled degree of depth routing can provide enough depressions during the manufacture of plane electronics device, controlled degree of depth routing can significantly increase the cost of plane electronics device in some cases.
Need to reduce the manufacturing cost of flat substrate.
Summary of the invention
According to the present invention, for receiving the manufacture method of the flat substrate of magnetic core, comprise the steps: to provide the cap rock with layer side; The basic unit with the first and second sides is provided, and basic unit comprises the material hole that extends fully through the basic unit between the first and second sides; Make cap rock and basic unit coupled to each other along the first He Ceng side, side, cap rock extends at least a portion of material hole; And dielectric component is provided in material hole, and wherein between dielectric component and basic unit, having core and keep passage, core keeps passage circumferentially extend and be configured to have therein magnetic core around dielectric component.
Accompanying drawing explanation
Fig. 1 is the perspective view of an embodiment with the plane electronics device of magnetic part array;
Fig. 2 is the top view of the magnetic part of the electronic device shown in Fig. 1;
Fig. 3 manufactures the exploded view of assembly and flat substrate according to the plate of an embodiment;
Fig. 4 is the manufacture assembly of Fig. 3 during lamination process and the sectional view of plate substrate;
Fig. 5 illustrates the amplification sectional view of plate substrate that core keeps Fig. 3 of passage;
Fig. 6 illustrates the amplification view of plate substrate that core keeps Fig. 3 of passage;
Fig. 7 is the amplification sectional view that the plate substrate of the core maintenance passage wherein with magnetic core is shown;
Fig. 8 manufactures the exploded view of assembly and flat substrate according to the plate of an embodiment;
Fig. 9 shows the top plan view of the plate substrate of Fig. 8;
Figure 10 is before substrate removal technique, the amplification sectional view of the plate substrate of Fig. 8;
Figure 11 is after substrate removal technique, the amplification sectional view of the plate substrate of Fig. 8;
Figure 12 is according to the exploded view of the flat substrate of an embodiment formation;
Figure 13 is according to the sectional view of the plane electronics device of the plate substrate that comprises Figure 12 of an embodiment formation;
Figure 14 is according to the exploded view of the flat substrate of an embodiment formation;
Figure 15 is according to the sectional view of the plane electronics device of the plate substrate that comprises Figure 14 of an embodiment formation;
Figure 16 illustrates to manufacture according to the flow chart of the method for the flat substrate of each embodiment;
Figure 17 is the perspective view of operable hollow boring bit during the manufacture of flat substrate;
Figure 18 shows the flat substrate of the different fabrication stages of using hollow boring bit;
Figure 19 is the perspective view of operable Forstner drill bit during the manufacture of flat substrate;
Figure 20 shows in the flat substrate of using the different fabrication stages of Forstner drill bit.
Embodiment
One or more embodiment described here provides a kind of plane electronics device, and it comprises the flat substrate that keeps as be the magnetic part of flat surface transformer.Magnetic part can comprise the magnetic core (for example Ferrite Material main body) being embedded in respective plate substrate.Magnetic part can comprise conductive winding or the coil (loop) that is wound around magnetic core.Plate substrate can have and is similar to the construct (composition) of printed circuit board (PCB) (PCB) and comprises a plurality of substrate layers.Substrate layer can comprise basic unit's (or ground floor) and cap rock (or second layer).Substrate layer can have the one or more material holes through its extension, and its size and dimension is configured to receive magnetic core separately.Cap rock extends and cladding material hole or only part cladding material hole completely along a side of basic unit.In a particular embodiment, material hole extends fully through basic unit.
Flat substrate is configured in a predetermined manner predetermined orientation and/or the position of basic unit (for example with respect to) and keeps magnetic core.Basic unit and/or cap rock can comprise alignment characteristics, so that magnetic core is positioned in plate substrate.For example, in certain embodiments, basic unit can comprise alignment characteristics, and it limits at least in part material hole and when magnetic core is loaded in material hole, engages magnetic core.In certain embodiments, cap rock also can be configured to keep magnetic core.In this embodiment, cap rock is characterised in that central core.For example, cap rock can comprise that size is less than the lid hole of magnetic core.When magnetic core be loaded into cover the material hole of aiming in hole in time, magnetic core can be able to engage limits the edge that covers hole.Edge can keep magnetic core in a predetermined manner.
In plane electronics device, magnetic core can be encapsulated in to be arranged to provide in the low stress adhesive of appropriate electrical environment, for example low-strees epoxy resin.At solid state, that in fact epoxy resin approaches is solid-state, have flexible and/or elasticity.The elasticity of cured epoxy resin and/or flexible meeting change according to the composition of used curing agent and/or epoxy resin.Be arranged in flat substrate or in one or more conductive material layer (for example copper) and the conductive through hole that extends through plate substrate magnetic part, for example transformer can be provided.
Fig. 1 is the perspective view of an embodiment with the plane electronics device 116 of magnetic part 102 arrays 100.Magnetic part 102 shown in Fig. 1 is transformer apparatus.Alternatively, magnetic part 102 can be or comprise another electronic device or parts, such as inductor, filter, balanced-to-unbalanced transformer, coupler etc.Magnetic part 102 can comprise magnetic core, for example ferrite or other magnetic material.Magnetic part 102 can be arranged in planar dielectric or nonconductive plate substrate 104.Described magnetic part 102 is normally oval, but can have different shapes, for example circular.
For each magnetic part 102, on the upside 112 of plate substrate 104, be provided with several upper conductor 106 and on the downside 110 of plate substrate 104, be provided with several bottom conductor (not shown).Bottom conductor can have identical size and/or shape with upper conductor 106.Plate substrate 104 is included in the through hole 114 that extends through plate substrate 104 between the lower and upper side 110,112 of plate substrate 104.Through hole 114 is filled or is electroplate with electric conducting material, so that the conductive through hole through plate substrate 104 to be provided.The relative end of each through hole 114 and the conductor 106 on plate substrate 104 and bottom conductor electric coupling.Through hole 114, upper conductor 106 and bottom conductor form around the coil or the winding conductive path that are arranged on magnetic core 200 (Fig. 2) in plate substrate 104 and are wound around a few.
Fig. 2 is the top view of two magnetic parts 102 shown in Fig. 1.For each magnetic part 102, upper conductor 106 and the relative end electric coupling of through hole 114 in upper conductor 106.As mentioned above, through hole 114 comprise electric conducting material and with the bottom conductor (not shown) electric coupling being arranged on the downside 110 (Fig. 1) of plate substrate 104.
The conductive path forming by upper conductor 106, through hole 114 and bottom conductor can be described as the first and second conductive coils 206,208 that extend around magnetic core 200.Each Reference numeral 206,208 in Fig. 2 points to around the dotted line frame of the different conductive coils of same magnetic parts 102.Each conductive coil 206,208 comprises the several circles 210 around magnetic core 200.The combination of conductive coil 206,208 and magnetic core 200 forms magnetic part 102.The conductive coil 206,208 being wound around around same core 200 can non-conductively be coupled each other.In one embodiment, the first conductive coil 206 of magnetic part 102 can receive electric power from the first circuit 202.The second conductive coil 208 of same magnetic parts 102 can with second circuit 204 electric coupling.
The first and second conductive coils 206,208 can be responded to coupling to transfer to the second conductive coil 208 through the electric current induction of the first conductive coil 206 each other by magnetic core 200.For example,, through the variable-current of the first conductive coil 206 magnetic flux that can change in magnetic core 200.The change magnetic flux magnetic field that changes in the second conductive coil 208.Variation magnetic field causes in the second conductive coil 208, change electromotive force or voltage.The second conductive coil 208 transmits induced voltage to second circuit 204.
Fig. 3-16 described can with for example various flat substrate for using together with the plane electronics device of the electronic device 116 shown in Fig. 1.Flat substrate can be configured to keep magnetic part, for example transformer.Fig. 3-16 also show the different modes of wherein manufacturing plate substrate.As said, term " flat substrate " comprises the plate substrate of revising subsequently.For example, the flat substrate of each shown in Fig. 3-16 can be by removing (for example, by boring, punching press or etching) or increasing (for example, by increasing other substrate layer, sealant or other dielectric substance) backing material and revise by increase or etching electric conducting material.In other words, flat substrate described herein needed additional modifications before being suitable for use in plane electronics device.
Fig. 3 be flat substrate 220 various elements and can be for the manufacture of the perspective view of the element of this flat substrate 220.As shown, plate substrate 220 can comprise cap rock 222, basic unit 224 and dielectric component 226.Also show, plate is manufactured assembly 230 can comprise the first and second molded or extrusion structures 232,234.Manufacture assembly 230 can by or as stacked press to use with, with in conjunction with a plurality of substrate layers, for example cap rock and basic unit 222,224.In described embodiment, the first and second molded structures 232,234 comprise rigid material.For example, the first and second molded structures can be steel or aluminium sheet or dividing plate.This plate can have not containing the smooth surface of defect and have the size and dimension identical with composite lay-up.This plate can be for contacting with coating at curing process device, with transmit normal force and complete stacking on form smooth surface.The first and second molded structures 232,234 are configured to withstand pressure and the heat that the lamination process of circuit board is followed.
The first and second molded structures 232,234 comprise respectively composition surface 236,238, and it is configured to connect and stripper plate substrate 220.Composition surface 236,238 is facing each other and be configured to make cap rock 222, basic unit 224 and dielectric component 226 between them.In described embodiment, composition surface 236 is planes.Yet composition surface 236 can be shaped as for the manufacture of the needed shape of plate substrate 220.
The second molded structure 234 comprises a plurality of platforms 240, and it is coupled to composition surface 238 and away from its protrusion.In certain embodiments, the second molded structure 234 is that single continuous structure for example, so that composition surface 234 and platform 240 are manufactured from the same material (steel, aluminium etc.).Platform 240 is vertical with respect to composition surface 238 substantially.For example, each platform 240 can have outside or peripheral surface 242, and it is perpendicular to composition surface 238 extensions and radially deviate from corresponding platform 240.Yet in other embodiments, peripheral surface 242 can tilt to extend with respect to composition surface 238.Composition surface 238 can be in fact all plane, except platform 240 protrudes part from it.
Each platform 240 has the outer perimeter 241 being limited by peripheral surface 242.When directly downwards when composition surface 238 is watched, outer perimeter 241 can comprise crooked outline.For example, in described embodiment, the outer surface 242 that can be shaped makes outer perimeter 241 form whole circle.Yet the outer perimeter 241 of platform 240 can have other shape that comprises crooked outline.For example, outer perimeter 241 can essence be circular, semicircle, oval etc.In addition, crooked outline can comprise the crooked part of outer perimeter 241 and other linear part.In addition,, although platform 240 has identical shapedly in described embodiment, other embodiment can comprise having difform platform.For example, platform 240 can be circular, and another 240 can be ellipse or square.
Again as shown in Figure 3, each platform 240 can comprise a member cavity 244.Member cavity 244 completely by corresponding platform 240 around and at the direction opening away from composition surface 238.In described embodiment, the size and dimension of member cavity 244 is set to receive corresponding dielectric component 226.Each member cavity 244 is limited by respective inner or the inner surface 246 (shown in Fig. 4) of corresponding platform 240.Inner surface 246 can limit interior circumference 248.Interior circumference 248 can have and the similar shape of outer perimeter 241 (what for example, interior and outer perimeter 248,241 can be for the circle of different size or different size is square).In other embodiments, interior outer perimeter 248,241 can be difform.
Cap rock 222 comprises can be for the manufacture of the backing material of circuit board.For example it should be understood that, as comprised a plurality of stacking substrate layers (sublayer) for the substrate layer of cap rock 222He basic unit 224.Backing material can comprise or be formed by dielectric substance, for example, be suitable for filling glass resin (for example FR-4), thermosets or the thermoplastic of printed circuit board (PCB) (PCB).Backing material can be the alternating layer of complete cured substrate and uncured B state material, unless material is that thermoplasticity or fluidised form (fluid stage) are heat cured.The gauge 256 of basic unit 224 can consist of a thick-layer or several prepregs or the alternating layer with similar pattern.Can use other rigidity or semi-rigid material.Cap rock 222 comprises relative first and second layers of side 260,262 and the gauge 264 extending between it.In described embodiment, cap rock 222 can form before being stacked in basic unit 224.Yet in other embodiments, cap rock 222 can be formed in basic unit 224.For example, adhesive polymer material can be scattered and solidify subsequently to form cap rock 222 along basic unit 224.In described embodiment, cap rock 222 is the continuous main bodys that do not comprise any hole.
Basic unit 224 also comprises the backing material that is similar to the material of describing about cap rock 222 above.The gauge 256 that basic unit 224 has the first and second sides 252,254 and extends between it.The first and second sides 252,254 also can be described as a layer Huo Ji side, side.As shown, basic unit 224 comprises a plurality of material holes 250.Material hole 250 can be formed in the passage that extends fully through basic unit 224 between the first and second sides 252,254.In the embodiment shown in fig. 3, the size and dimension of material hole 250 is configured to receive to corresponding platform 240.
Material hole 250 can form by removing the backing material of basic unit 224.For example, material hole 250 can by for example accurately during Sheet Metal Forming Technology punching press basic unit 224 form.When forming material hole 250Shi， basic unit 224, punching press basic unit 224 can be arranged between stamping machine (not shown) and corresponding punch die (not shown).Stamping machine has to be configured as and is similar to the required hole dimension of material hole 250 and the end of shape.Punch die generally includes depression or the chamber that size and dimension is configured to receive be stamped material and stamping machine end.By basic unit 224 is arranged between stamping machine and punch die, stamping machine is driven through basic unit 224 and enters punch die.The backing material that stamping machine is sheared basic unit 224 forms material hole 250 thus.
In the embodiment of punching press basic unit 224, what limit material hole 250 can be shear surface to inner surface 276 (shown in Fig. 5).More clearly, to inner surface 276, can show quality, performance and/or the feature relevant to being sheared surface.Can utilize identical drift to carry out for several times independent punching press to form a plurality of material holes 250 to basic unit 224.In other embodiments, a plurality of drifts can be for form material hole 250 simultaneously.For example, bull machinery can be driven into a plurality of drifts corresponding a plurality of punch die to produce a plurality of material holes 250 simultaneously.
Yet material hole 250 can otherwise form.For example, material hole can by boring or routing in forming.Can utilize hollow boring bit, Forstner drill bit or Standard PC B drill bit to carry out boring.When routing, standard recommanded practice drill bit, although can be used other.What in this embodiment, limit material hole 250 is boring surfaces to inner surface 276.In other embodiments, material hole 250 can form to limit material hole 250 by etched surfaces by etching basic unit 224.Can complete etching by reactive ion etching (RIE) or plasma etching.In either case, to inner surface 276, can show to material hole 250 how to manufacture relevant quality, characteristic and/or feature.The manufacture method (for example punching press, boring, etching etc.) that forms material hole 250 can be determined based on inspection panel substrate or the electronic device forming subsequently.The check of plate substrate or electronic device can utilize scanning electron microscopy (SEM) or other microscope.
Within the size and dimension of dielectric component 226 is arranged to be suitable for being positioned at the respective members chamber 244 of molded structure 234.For example, dielectric component 226 can have the shape that is similar to the shape being limited by interior circumference 248.Yet the size of dielectric component 226 can be less than the size in respective members chamber 244.The gauge 258 of dielectric component 226 can equal in fact the gauge 256 of basic unit 224.In certain embodiments, the backing material that dielectric component 226 can You Cong basic unit 224 removes forms.For example 224 punching presses of ，You basic unit also can be used as a dielectric component 226 to form the backing material of a material hole 250.
In certain embodiments, it can be also desirable for example using the material in fluidised form for thermosetting resin or thermoplastic resin, rather than uses as be the curing C state material in advance of FR-4.Fluid resin can and flow in the gap that is limited to required size in molded structure 234 not containing glass.
Fig. 4 is at the sectional view of each element of a part of plate substrate 220 during cascade.As shown, cap rock 222 is stacking with respect to basic unit 224.More specifically, the first side 252 of basic unit 224 connects with the layer side 262 of cap rock 222.Dielectric component 226 is positioned at respective members chamber 244 and has the component surface separately 268 connecting with the layer side 262 of cap rock 222.In described embodiment, gauge 256,258 equals in fact the height 270 of platform 240.In other embodiments, gauge 258 and gauge 256 can be greater than or less than described height 270, if basic unit 224 and dielectric component 226 still can be coupled to cap rock 222.
Cap rock and basic unit 222,224 can aim in a predefined manner when stacking each other.In the first and second molded structures 232,234 one or both can comprise the plate alignment characteristics (not shown) that engages cap rock and basic unit 222,224.For example, the second molded structure 234 can comprise a plurality of post (not shown) that received by the respective channel (not shown) of basic unit 224 and cap rock 222.Passage can be orientated as along the surrounding of cap rock and basic unit 222,224 and/or towards the centre of cap rock and basic unit 222,224.
Cap rock and basic unit 222,224 can be coupled to each other during lamination process.For example, B state (B-Stage) or prepreg (not shown) can be orientated as along the interface 223 between cap rock and basic unit 222,224 and the interface 227 between cap rock 222 and dielectric component 226.When cap rock 222He basic unit 224 is stacking each other, these sheets can be parts for cap rock and/or basic unit 222,224.Sheet heating and pressurization for example, are arrived to cap rock 222 with cured sheets Qie Jiang basic unit 224 and dielectric component 226 couplings (engaging).If needed, can use vacuum.For example, thereby basic unit 224 and dielectric component 226 simultaneously (during identical lamination process) be coupled to cap rock 222, even if basic unit 224 and dielectric component 226 are different and parts independently.Yet, be more than only used for an example of method that cap rock and basic unit 222,224 and dielectric component are laminated to each other.Can with similarly or different technique element is coupled.
Fig. 5 and 6 is enlarged drawings of plate substrate 220, and it illustrates in greater detail the material hole 250 after basic unit 224 and dielectric component 226 are coupled to cap rock 222.Fig. 5 is that sectional view and Fig. 6 of part plate substrate 220 is top plan view.It should be noted that Fig. 5 and Fig. 6 put upside down about Fig. 3 and 4.As shown, when dielectric component 226 is provided to material hole 250, form core and keep passage 272.Core keeps passage 272 to be present between dielectric component 226He basic unit 224.Core keeps passage 272 to be limited by inner surface 276-278, inner surface 276-278 comprise basic unit 224 to inner surface 276, dielectric component 226 to outer surface 277 and the basal surface 278 that limited by cap rock 222.The width dimensions 280 (Fig. 5) that core keeps passage 272 is to inner surface 276 with to extending between outer surface 277.In certain embodiments, width dimensions 280 runs through core to keep passage 272 is in fact identical.Yet in other embodiments, core keeps the width dimensions 280 of passage 272 to change.
Core keeps passage 272 to be configured with the magnetic core 288 (shown in Fig. 7) being positioned at wherein, and it can be similar to magnetic core 200 (Fig. 2).Core keeps passage 272 circumferentially to extend around dielectric component 262.In described embodiment, core keeps passage 272 around dielectric component 226, with essence circular path, to extend completely, and making core keep passage 272 is annulars.Yet embodiment is not limited to embodiment described in Fig. 5 and 6.As used herein, term " circumferentially around " only comprises that the core that a part is extended around dielectric component 226 in fact keeps passage 272.For example, core keeps passage 272 can form the C shape arc only extending at least about half around dielectric component 226.In addition, term " circumferentially around " does not require it is circular path or crooked route, but can comprise other shape.For example, core keeps passage 272 around dielectric component 226, to extend along the path that is square configuration, rectangular shape or polygonal shape.
In some cases, cap rock and basic unit 222,224 coupled to each other after, core keeps passage 272 may be unsuitable for receiving magnetic core 288.For example core keeps passage 272 may be inappropriate size or may within core keeps passage 272, have undesirable material, for example the resin in during cascade flowing to core maintenance passage 272, maybe may have the uneven surface for example, producing by removing technique (punching press).In this case, can etching or boring (or routing) core keep passage 272 to keep passage 272 or remove any unwanted material with shaped core suitably.For example,, to inner surface 276, can there is at least one in outer surface 277 or basal surface 278 backing material removing from it.In certain embodiments, because material removes technique, for example boring, etching etc., therefore can increase width dimensions 280.
Fig. 7 is the amplification sectional view of plate substrate 220, and it shows and is positioned at the magnetic core 288 that core keeps passage 272.Core maintenance passage 272 can comprise the inside and outside alignment characteristics 282,284 that limits at least in part material hole 250 or core maintenance passage 272.Alignment characteristics 282,284 can remove by above-mentioned material technique (for example, by etching or the boring of inner surface 276-278) or during independent material removes technique, form.In some cases, only the inner surface 276-278 of etching or boring part, makes can keeping by the surface quality that forms the technique generation of material hole 250 to inner surface 276 with to outer surface 277 of part.For example, at least a portion to inner surface 276 can Shi You punching press basic unit 224 shear surface that form while forming material hole 250, and can be boring surface to another part of inner surface 276.
Alignment characteristics 282,284 can be shaped as when magnetic core 288 is arranged in core maintenance passage 272 to have centering effect on magnetic core 288.Alignment characteristics 282,284 can extend towards magnetic core 288.In described embodiment, alignment characteristics 282 is included in the inclined surface 283 extending between outer surface 277 and basal surface 278.Alignment characteristics 284 is included in the inclined surface 285 extending between inner surface 276 and basal surface 278.Yet alignment characteristics 282,284 can have other structure in other embodiments.
Alignment characteristics 282,284 can reduce tolerance relevant to the location of magnetic core 288 in manufacturing process.Alignment characteristics 282,284 can also produce and be present in magnetic core 288 and to inner surface 276 and to each gap 290,291 between outer surface 277.Gap 292 can also be present between magnetic core 288 and basal surface 278.In subsequent technique, gap 290-292 can be convenient to flowing of encapsulating material and allow expansion and/or the compression of magnetic core 288 to stacked relevant heating and pressure dwell.
Fig. 8 is flat substrate 320 and can manufactures for the manufacture of the plate of plate substrate 320 exploded view of each element of assembly 330.As shown, plate substrate 320 can comprise cap rock 322 and one or more 324A of basic unit, 324B.The cap rock 322He 324A of basic unit, 324B can comprise the backing material similar with basic unit 224 (Fig. 3) to above-described cap rock 222 (Fig. 3) and/or can be manufactured by method similar to the above.The 324A of basic unit has relative layer side 340A, the 342A ，Qie 324B of basic unit and has relative layer side 340B, 342B.Cap rock 322 has relative layer side 344,346.
Each 324A of basic unit, 324B comprise material hole 348,350.Material hole 348,350 extends fully through the corresponding 324A of basic unit or 324B.At the described embodiment Zhong， 324A of basic unit, 324B, comprise respectively multipair material hole 348A, 350A and 348B, 350B.In described embodiment, material hole 348A, 350A and material hole 348B, 350B are semicircle and towards another material hole of this centering.Yet, in other embodiments, can use almost completely around the single material hole extending.For example, single material hole can be C shape or have almost completely circular path.Material hole 348A, 350A and 348B, 350B can adopt described above and material hole 250 (Fig. 3) similarly mode manufacture.For example, can punching press, boring and/or etching material hole 348A, 350A and 348B, 350B.Material hole 348A, 350A along the 324A of basic unit can carry out moulding in the similar mode of material hole 348B, 350B with along the 324B of basic unit.Like this 324A of ，Dang basic unit, 324B each other the material hole 348A of the stacking Shi， 324A of basic unit and the material hole 348B of the 324B of basic unit aims at and the material hole 350A of the 324A of basic unit and the material hole 350B of the 324B of basic unit aim at.
The backing material of the 324A of basic unit, 324B can comprise or be formed by dielectric substance, for example, be suitable for filling glass resin (for example FR-4), thermosets or the thermoplastic of printed circuit board (PCB) (PCB).Backing material can be the alternating layer of complete cured substrate and uncured B state material, unless material be thermoplastic or fluid state heat cured.The gauge of basic unit can consist of a thick-layer or several prepregs or the alternating layer with kindred type.Can use other rigidity or semi-rigid material.
When material hole 348A, 350A are when forming, can also form corresponding substrate extension 352A.When material hole 348B, 350B are when forming, can also form corresponding substrate extension 352B.In described embodiment, each in substrate extension 352A, 352B is extended respectively between respective material hole is to 348A, 350A and 348B, 350B.Material hole 348A, 350A are separated by substrate extension 352A each other, and material hole 348B, 350B are each other by substrate extension 352B separately.Yet substrate extension can also form when only manufacturing a material hole.As mentioned above, if almost completely form circle if material hole is for example C shape or material hole, substrate extension can be limited by single material hole.
Also illustrate, plate is manufactured assembly 330 can comprise the first and second molded or extrusion structures 332,334.Be similar to and manufacture assembly 230 (Fig. 3), the first and second molded structures 332,334 comprise rigid material and are configured to stand pressure and the heat that the lamination process of circuit board is followed.The first and second molded structures 332,334 comprise respectively composition surface 336,338, and it is configured to and the element of plate substrate 320 is connected and they are pressed together.Composition surface 336,338 toward each other, is provided with the cap rock 322He 324A of basic unit, 324B between it.In described embodiment, composition surface 336,338 is plane substantially.
Cap rock and basic unit 322,324A, 324B can be with above-mentioned about cap rock and basic unit 222,224 (Fig. 3), similarly mode be coupled to each other.For example, cap rock and basic unit 322,324A, 324B can be coupled to each other during lamination process.Cap rock and basic unit 322,324A, 324B are can be each other stacking and aim at, and each of substrate extension 352A of the 324A of basic unit is aimed at the corresponding substrate extension 352B of the 324B of basic unit.Before stacking, can locate B state or prepreg (not shown) so that a slice arranges along the interface between the cap rock 322He 324A of basic unit, and between the 324A of another Pian Yan basic unit, 324B, interface arranges.These sheets stand heating and pressurize solidify the 324A of these Pian Qiejiang basic units, 324B (for example engaging) coupled to each other and cap rock 322 is coupled to the 324A of basic unit.Now, substrate extension 352A, the 352B of the aligning of the 324A of basic unit, 324B can be engaged with each other.
Fig. 9 and 10 comprises that respectively material removes plane graph and the sectional view of operation plate substrate 320 before.Fig. 9 and 10 puts upside down with respect to Fig. 8, and making Fig. 9 is that layer plane graph of side 342B and Figure 10 have cap rock 322 in the bottom of figure.With reference to Figure 10, substrate extension 352A, the 352B of the 324A of basic unit, 324B be stacking and coupling each other.In an exemplary embodiment, substrate extension 352A comprises dielectric component 354A, and it is coupled to the remainder of the 324A of basic unit by one or more contact 356A.Similarly, substrate extension 352B comprises dielectric component 354B, and it is coupled to the remainder of the 324B of basic unit by one or more contact 356B.For the object of describing, in Fig. 9, also show dielectric component 354B and the contact 356B of substrate extension 352B.
With reference to Figure 10, after cap rock and basic unit 322,324A, 324B are coupled to each other, contact 356A, 356B can remove operation by material and remove.As an instantiation, drill bit can be embedded in the material hole 348 of two alignings as shown in figure 10 and around a path routing to remove contact 356A, 356B.In the case, owing to having removed two contacts from each of the 324A of basic unit, 324B, whole four contact 356A, 356B have therefore been removed.
But Figure 11 shows contact 356A identical with Figure 10,356B (Figure 10) and removes view afterwards.With reference to Figure 11, core keeps passage 372 to exist around stacking dielectric component 354A, 354B.When dielectric component 354A, 354B pile superimposition when coupling as shown in figure 11, dielectric component 354A, 354B can be thought of as core keep passage 372 around single dielectric component 373.Core keeps passage 372 can be similar to core maintenance passage 272 (Fig. 5) and circumferentially extend around dielectric component 373.After removing contact 356A, 356B, material hole 348,350 (Fig. 8) becomes homogenous material hole 374.
An embodiment has been described in Fig. 8-11, wherein the 324A of Liang Ge basic unit, 324B is stacking and be coupled.Yet, in other embodiments, can only use Yi Ge basic unit or alternatively, can be stacking each other more than the basic units of two.In addition, in other embodiments, each substrate extension can comprise an only contact.Basic unit can construct similarly, so that contact can be stacking each other.Alternatively, contact can have different positions so that contact is directly not stacking each other.In this embodiment, drill bit only needs once to remove a contact, rather than two stacking contacts once for example.
Figure 12 is according to the exploded view of the flat substrate 420 of an embodiment formation.Plate substrate 420 comprises cap rock 422He basic unit 424.Basic unit 424 has relative first and second layers of side 440,442 and comprises the material hole 450 that extends through it.Can with reference to material hole 150 (Fig. 3) and 348,350 (Fig. 8), form material hole 450 as mentioned above.In described embodiment, cap rock 422 is the continuous material sheets that there is no hole.Cap rock and basic unit 422,424 can be formed by backing material, the example backing material about cap rock 222 (Fig. 3) and basic unit 224 (Fig. 3) described above.Cap rock and basic unit 422,424 can be coupled with above-mentioned lamination process.Backing material can comprise or be formed by dielectric substance, for example, be suitable for filling glass resin (for example FR-4), thermosets or the thermoplastic of printed circuit board (PCB) (PCB).Backing material can be the alternating layer of full cured substrate and uncured B state material, unless material be thermoplastic or fluid state heat cured.The gauge of basic unit can consist of a thick-layer or several prepregs or the alternating layer with similar pattern.Can use other rigidity or semi-rigid material.
Figure 13 shows the sectional view of a part for the plane electronics device 416 that comprises plate substrate 420.After forming plate substrate 420, magnetic core 488 can be arranged in material hole 450.Magnetic core 488 can have circle or the elliptical shape of (the core void) 490 around core space.Magnetic core 488 is inserted in material hole 450 via the second side 442.Although not shown, basic unit 424 and/or cap rock 422 can comprise alignment characteristics, it is configured to magnetic core 488 to remain on the preposition in material hole 450.Alignment characteristics can form by the similar mode of backing material of the boring to above-mentioned or etching basic unit 424 and/or cap rock 422.
Once magnetic core 488 is set in material hole 450, elasticity and non-conductive encapsulating material 472 can deposit in material hole 450.Encapsulating material 472 flows in core space 490 and seals magnetic core 488.Allow cure package material 472 so that encapsulating material 472 sclerosis and completely around magnetic core 488.Thereby dielectric component 491 is formed in core space 490.
As shown in figure 13, another substrate layer 474 can be stacked to the second side 442.Then conductive layer 476,478 can utilize insulating binder to be adhered to respectively substrate layer 474 and cap rock 422.Then can pass top conductive layer 476, substrate layer 474, basic unit 424, cap rock 422 and bottom conductive layer 478 and drill through hole 480.Then can pass top conductive layer 476, substrate layer 474, dielectric component 491, cap rock 422 and bottom conductive layer 478 and drill through hole 482.Then through hole 480,482 can be cleaned and plated conductive material to form conductive through hole 484,486.Then can etching conductive layer 476,478 to form along the upper conductor 492 of substrate layer 474 with along the bottom conductor 494 of cap rock 422.
Although not shown, other modification and/or feature can be added plane electronics device 416 to.For example, as shown in figure 13, then electronic device 416 can be coated with coating insulation material.
Figure 14 is according to the exploded view of the flat substrate 520 of an embodiment formation.Plate substrate 520 comprises cap rock 522He basic unit 524.Basic unit 524 has the first and second relative sides 540,542 and comprises a plurality of material holes 550 that extend fully through it.Cap rock and basic unit 522,524 can be similar or be equal to cap rock and the basic unit 422,424 of Figure 13.Yet cap rock 522 can have the lid hole 551 that extends fully through cap rock 522.The shape in lid hole 551 and the material hole 550 that position class is similar to basic unit 524.More specifically, arrange cover hole 551 size and dimension to there is the size that is less than material hole 550.Cap rock and basic unit 522,524 can be coupled to each other by above-mentioned lamination process.
Figure 15 shows the sectional view of a part for the plane electronics device 516 that comprises plate substrate 520.As shown, cap rock 522 can comprise alignment characteristics 523.For example, alignment characteristics 523 can be to limit the edge 525 that covers hole 551.In specific embodiment, edge 525 forms has inclined surface 527.Edge 525 can form by boring and/or etching.During the size configurations at edge 525 becomes magnetic core 588 is held in a predetermined position.
The substrate layer 575 that comprises continuous backing material sheet can be coupled to cap rock 522 and cover thus hole 551 during lamination process.Magnetic core 588 can insert in material hole 550 and be positioned on inclined surface 527 through the second side 542.Magnetic core 588 can have around the circle in core space 590 or elliptical shape.
By magnetic core 588, be arranged in material hole 550, elasticity and non-conductive encapsulating material 572 can deposit in material hole 550.Encapsulating material 572 flows in core space 590 and seals magnetic core 588.When encapsulating material 572 solidifies, dielectric component 591 is formed in core space 590.
As shown in figure 15, another substrate layer 574 can be laminated to the second side 542.Then conductive layer 576,578 can utilize insulating binder to be adhered to respectively substrate layer 574 and substrate layer 575.Then can pass top conductive layer 576, substrate layer 574, basic unit 524, cap rock 522, substrate layer 575 and bottom conductive layer 578 and drill through hole 580.Then can pass top conductive layer 576, substrate layer 574, dielectric component 591, substrate layer 575 and bottom conductive layer 578 and drill through hole 582.Then can clear up and utilize plated with conductive material through hole 580,582 so that conductive through hole 584,586 to be provided.Then can etching conductive layer 576,578 upper conductor 592 to be provided along substrate layer 574 and to provide bottom conductor 594 along substrate layer 575.
Figure 14 and 15 has described an embodiment, and wherein, before cap rock 522He basic unit 524 is stacked together, cap rock 522 has the hole of lid 551.In other embodiments, cap rock 522 can not have the hole of lid 551 before stacked.Alternatively, cap rock 522He basic unit 524 can be stacked together to form the structure that is similar to plate substrate 420 (Figure 12).Once be coupled, can for example, in the substrate removal operation of (punching press, boring or etching) for example as mentioned above, form and be similar to the lid hole of covering hole 551.In certain embodiments, can during substrate removal technique, form inclined surface 527.Then can about Figure 14 and 15 similar modes, carry out disposable plates substrate 520 with above-mentioned.
Figure 16 is the flow chart of describing the manufacture method 700 of the plane electronics device that is for example plane electronics device 116 (Fig. 1), 416 (Figure 13) and 516 (Figure 15).The initial operation of method 700 can comprise manufacture flat substrate.Flat substrate can be similar to for example plate substrate 104 (Fig. 1) or plate substrate 220 (Fig. 3), 320 (Fig. 8), 420 (Figure 12) and 520 (Figure 14).Method may reside in various embodiment, for example, above about those described in Fig. 3-15.Although flow chart comprises the arrow of operating sequence in indicating means 700, method 700 does not need to carry out as shown because certain operations can be before other, carry out afterwards or with other simultaneously.
Method 700 is included in step 702 and cap rock is provided and provides ，Gai basic unit of basic unit to have at least one material hole that extends fully through it in step 704.Provide step 704 can comprise that supply is wherein pre-formed the basic unit of material hole, or selectively, method 700 can comprise to be supplied with basic unit and then form material hole.The various backing materials that existence can form material hole remove operation, routine punching press described above, boring (or routing) or etching operation.In certain embodiments, cap rock also can have the lid hole that extends fully through it, for example cap rock 522 (Figure 14).Lid hole can be pre-formed or method 700 can comprise forming and covers hole.
Method 700 is also included in step 706, and cap rock and basic unit is coupled to each other.For example, basic unit can have the first and second sides and cap rock can have a layer side.Basic unit and cap rock can be coupled to each other along the first He Ceng side, side.Cap rock is cladding material hole at least in part.In certain embodiments, cap rock cladding material hole completely.
Method 700 is also included in step 708 and dielectric component is provided in material hole and in step 710, magnetic core is loaded in material hole.Step 710 load can be step 708 provides after or before generation.For example, Fig. 3-15 have been described the variety of way of dielectric component are wherein provided in step 708.For example, about Fig. 3-7, can work as cap rock 222He basic unit 224 provides dielectric component 226 when step 706 is coupled to each other.Also can form at this moment core keeps passage 272 and the optional backing material of later use to remove operation revising.About Fig. 8-11, can work as dielectric component 373 is provided when material hole 374 removes contact 356A, 356B.By removing contact 356A, 356B, core keeps passage 372 to be present between the dielectric component 373He 324A of basic unit, 324B.
About Figure 12-13, can after the step 710 of loading magnetic core, provide dielectric component 491.More specifically, elasticity and non-conductive encapsulating material 472 can be deposited in the material hole 450 with magnetic core 488.Encapsulating material 472 can flow in the core space 490 of magnetic core 488.When encapsulating material 472 solidifies, provide dielectric component 491.As in above-mentioned example, core keeps passage to may reside between basic unit 424 and dielectric component 491.Core keeps passage circumferentially to extend around dielectric component 491.
Method 700 is also included in step 712 and makes in the encapsulating material in magnetic core insert material hole.About the embodiment of Fig. 3-7, magnetic core 288 can be provided after forming dielectric component 226 and then by deposition elasticity and non-conductive encapsulating material, carry out embedded magnetic core 288.Similarly, be similar to magnetic core 288 (Fig. 7), the core that can magnetic core be provided to Figure 11 after forming dielectric component 373 keeps by deposition elasticity and non-conductive encapsulating material, carrying out embedded magnetic core in passage 372 and then.About the embodiment of Figure 12-15, when dielectric component is provided, magnetic core embeds.Method 700 is also included in step 714 and forms one or more conductive coils around above-mentioned magnetic core.
Figure 17 and 18 has described the alternative method of manufacturing plane electronics device, and more specifically, has described the alternative method that provides material hole and/or core to keep passage in substrate.In the embodiment of Fig. 3-16, by stacking substrate layer, form material hole and core maintenance passage, in described substrate layer, at least one substrate layer has comprised hole.Yet Figure 17 and 18 embodiment can comprise directly remove backing material stacked flat substrate.After forming material hole, then can form as mentioned above plane electronics device.
Figure 17 is the perspective view of hollow boring bit 800.As shown, hollow boring bit 800 comprises the axle 802 with drill tip 804.Drill tip 804 comprises the axle cavity 806 that extends into axle 802 certain depth (not shown).Axle 802 comprises the brill wall 808 that limits axocoel 806.The inner surface that bores wall 808 defines inner diameter D
i1and the outer surface that bores wall 808 defines D outer diameter
o1.Inner surface and outer surface in drill tip 804 can be coarse to the boring of plate substrate.
Figure 18 shows the plate substrate 810 in the different phase of manufacturing.In the stage 812, utilized drill bit 800 (Figure 17) to 810 borings of plate substrate.In certain embodiments, can utilize water or cooling agent to carry out Cooling and Lubricator drill tip 804 (Figure 17).When plate substrate 810 comprises epoxy glass fiber, drill bit 800 can be diamond bit.By after 810 borings of plate substrate, form core and keep passage 814.Core keeps passage 814 to have the D outer diameter that essence equals drill bit 800
o1d outer diameter
o2and there is essence and equal inner diameter D
i1inner diameter D
i2.The 80%-100% where drill bit 800 can in officely remove the backing material that need to remove keeps passage 814 to form required core.Yet, if can not removing 100% of the backing material that need to be removed, drill bit 800 keeps passage 814 to form required core, in the stage 813, can utilize traditional drill bit (for example non-hollow boring bit) to carry out perforated plate substrate 810 subsequently.Due to optional boring, therefore can effectively increase the size that core keeps passage 814.
Figure 19 is the perspective view of Forstner drill bit 820.As shown, Forstner drill bit 820 comprises axle 822 and the drill tip 824 being coupled with axle 822.Drill tip 824 comprises main edge 826 and a pair of arcuate edge 828,830 of extending in circumferential mode from the opposite end at main edge 826.The outer surface of arcuate edge 828,830 limits the D outer diameter of drill tip 824
o3.
Figure 20 shows the plate substrate 832 of different fabrication stages.In 834 stages, utilized drill bit 820 (Figure 19) by 832 borings of plate substrate.After by 832 borings of plate substrate, form material hole 836.Material hole 836 has the D outer diameter that essence equals drill bit 820
o3d outer diameter
o4.Where drill bit 820 can in officely remove the 80%-100% of the backing material that need to remove to form material requested hole 836.Yet, if drill bit 820 can not remove the backing material that need to be removed 100% to form required material hole 836, in the stage 840, can utilize traditional drill bit by 832 borings of plate substrate subsequently.Due to boring subsequently, therefore can increase the size of material hole 836.
After forming core maintenance passage 814 (Figure 18), magnetic core can be loaded into core and keeps in passage 814 and manufacture plane electronics device in mode similar to the above.After forming material hole 836 (Figure 20), magnetic core can be loaded in material hole 836 and in mode similar to the above and manufacture plane electronics device.In certain embodiments, the material of use removes technique and can limit when core keeps the inner surface of passage 814 or material hole 836 and determine in check.Equally, surface is characterised in that core drilling surface or Forstner boring surface.
Claims (15)
1. a manufacture is for receiving the method for the flat substrate (220,320,420,520) of magnetic core, and the method comprising the steps of:
The cap rock (222,322,422,522) with a layer side (262,346) is provided;
Provide and there is the first side (252,340A, 340B, 440,540) and the second side (254,342A, 342B, 442,542) basic unit (224,324A, 324B, 424,524), described basic unit is included between described the first side and the second side the material hole (250,348 of basic unit described in extend through completely, 350,450,550);
Along described the first side and described layer side, described cap rock and described basic unit is coupled to each other, described cap rock extends at least a portion of described material hole; And
Dielectric component (226 is provided in described material hole, 373,491,591), wherein said core keeps passage (272,372) to be present between described dielectric component and described basic unit, and described core keeps passage circumferentially to extend and be configured to around described dielectric component having therein magnetic core (288,488,588).
2. method according to claim 1, further comprises through described the second side (254,342A, 342B, 442,542) by described magnetic core (288,488,588) pack described material hole (250,348 into, 350,450,550) in, described magnetic core is around described dielectric component (226,373,491,591) extend.
3. method according to claim 2, further comprises described magnetic core (288,488,588) is embedded into and is deposited on described material hole (250,348,350,450,550) in the described encapsulating material in, and form one or more conductive coils (206 around described magnetic core (288,488,588), 208), dielectric component (226,373 described in described conductive coil extend through, 491,591) and described (224, the 324A of basic unit, 324B, 424,524).
4. method according to claim 1, wherein said material hole (250,348,350,450,550) forms by basic unit described in punching press (224,324A, 324B, 424,524).
5. method according to claim 1, is further included in while a plurality of described material holes of punching press (250,348,350,450,550) in described basic unit (224,324A, 324B, 424,524).
6. method according to claim 1, wherein said basic unit (224,324A, 324B, 424,524) comprise a plurality of described material holes (250,348,350,450,550), described cap rock (222,322,422,522) extends at least a portion of described material hole.
7. method according to claim 1, wherein said core keeps passage (272,372) by described basic unit (224,324A, 324B, 424,524) to inner surface (276) and described dielectric component (226,373,491,591) towards described to the limiting to outer surface (277) of inner surface, described at least a portion to inner surface and/or described at least a portion to outer surface are sheared.
8. method according to claim 1, wherein said core keeps passage (272,372) by described basic unit (224,324A, 324B, 424,524) to inner surface (276) and described dielectric component (226,373,491,591) towards described limiting to outer surface (277) to inner surface, described core keeps passage by being configured to engage one or more alignment characteristicses (282 that described core keeps the magnetic core (288,488,588) in passage, 284,523) partly limit.
9. method according to claim 1, wherein said core keeps passage (272,372) by described basic unit (224,324A, 324B, 424,524) to inner surface (276) and described dielectric component (226,373,491,591) towards described to the limiting to outer surface (277) of inner surface, described method further comprise by described to inner surface and described at least one to outer surface at least a portion boring.
10. method according to claim 9, wherein said boring comprises provides the alignment characteristics of the inclination that is configured to engage described magnetic core (288,488,588) (282,284,523).
11. methods according to claim 1, further comprise described basic unit (224) is encased on molded structure (234), this molded structure comprises composition surface (238) and the platform (240) protruding from this composition surface, this platform is around member cavity (244), and the size and dimension of wherein said platform is suitable for being received by the material hole of described basic unit (250) and the size and dimension of described member cavity is suitable for receiving described dielectric component (226).
12. methods according to claim 11, the coupling of wherein said cap rock (222) and described basic unit (224) comprises is coupled to described cap rock described dielectric component (226) and arrives described basic unit.
13. methods according to claim 1, wherein said dielectric component (373) is coupled to described basic unit (324A, 324B) by contact (356A, 356B), wherein saidly provides dielectric component to comprise to remove described contact.
14. methods according to claim 1, wherein said cap rock (522) comprises and covers hole (551), when described cap rock (522) is coupled with described basic unit (524), described lid hole is aimed at described material hole (550), and described lid hole has the size that is less than described material hole.
15. methods according to claim 14, are further included in described cap rock (522) and described basic unit (524) and form described lid hole (551) after being coupled.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/407,161 | 2012-02-28 | ||
| US13/407,161 US9440378B2 (en) | 2010-05-05 | 2012-02-28 | Planar electronic device and method for manufacturing |
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| Publication Number | Publication Date |
|---|---|
| CN103559996A true CN103559996A (en) | 2014-02-05 |
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ID=49771154
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310180164.2A Pending CN103559996A (en) | 2012-02-28 | 2013-02-28 | Planar electronic device and method for manufacturing |
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| CN (1) | CN103559996A (en) |
| TW (1) | TW201340812A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943306A (en) * | 2014-03-12 | 2014-07-23 | 华为技术有限公司 | Magnetic element and manufacturing method of magnetic element |
| CN107077952A (en) * | 2014-11-19 | 2017-08-18 | 株式会社村田制作所 | Coil component |
| WO2019210541A1 (en) * | 2018-04-29 | 2019-11-07 | 深南电路股份有限公司 | Transformer and manufacturing method therefor, and electromagnetic device |
-
2013
- 2013-02-27 TW TW102106853A patent/TW201340812A/en unknown
- 2013-02-28 CN CN201310180164.2A patent/CN103559996A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943306A (en) * | 2014-03-12 | 2014-07-23 | 华为技术有限公司 | Magnetic element and manufacturing method of magnetic element |
| CN107077952A (en) * | 2014-11-19 | 2017-08-18 | 株式会社村田制作所 | Coil component |
| CN107077952B (en) * | 2014-11-19 | 2018-09-07 | 株式会社村田制作所 | Coil component |
| US11769623B2 (en) | 2014-11-19 | 2023-09-26 | Murata Manufacturing Co., Ltd. | Coil component |
| WO2019210541A1 (en) * | 2018-04-29 | 2019-11-07 | 深南电路股份有限公司 | Transformer and manufacturing method therefor, and electromagnetic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201340812A (en) | 2013-10-01 |
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Application publication date: 20140205 |