CN103558426B - Cross prober card - Google Patents
Cross prober card Download PDFInfo
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- CN103558426B CN103558426B CN201310565733.5A CN201310565733A CN103558426B CN 103558426 B CN103558426 B CN 103558426B CN 201310565733 A CN201310565733 A CN 201310565733A CN 103558426 B CN103558426 B CN 103558426B
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- probe
- cross
- test
- prober
- pins
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- 238000012360 testing method Methods 0.000 claims abstract description 56
- 239000000523 sample Substances 0.000 claims description 91
- 239000011111 cardboard Substances 0.000 abstract description 5
- 238000011990 functional testing Methods 0.000 abstract description 3
- 238000001467 acupuncture Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A cross prober card comprises a prober card board, test terminals and prober pins. The prober card board is used for bearing the functional test terminals, the test terminals are distributed and arranged on the edge of the circumference of the prober card board, and the prober pins correspond to the prober pads of a device to be tested, are distributed in a cross shape, and are arranged in the middle of the prober card board. The cross prober card can simultaneously complete a transverse module test and a longitudinal module test on a tested unit, chip angle rotation is not needed, WAT test time is greatly shortened, and test efficiency is improved. Meanwhile, according to the cross prober card, it is guaranteed that the prober pins can be arranged in the same plane, and WAT test abnormity due to the fact that the prober pins are arranged in different planes is avoided.
Description
Technical field
The present invention relates to semiconducter device testing technical field, more particularly, to a kind of cross probe card.
Background technology
With the development of semiconductor technology, integrated circuit（Integrated Circuit,IC）Integrated level more and more higher, and
In described chip（Chip）Surrounding's design probe pads（Pad）So as to surrounding has some cross probe pads, described chip is just
Including transverse test module and testing longitudinal module.In wafer acceptance test（Wafer Accepted Test,WAT）Process
In, described probe card is the tie between described tester table and described device under test, for electrically connect described tester table with
Described device under test.
Refer to Fig. 4（a）, Fig. 4（b）, Fig. 4（a）～Fig. 4（b）It show the structural representation of existing probe card.But,
The probe 31 of existing probe card 3 is usually single or two-row structure design.During wafer acceptance test, need to build
The probe menu of vertical both direction, i.e. horizontal probe menu and longitudinal probe menu.
As those skilled in the art it is readily appreciated that ground, under described horizontal probe menu, it is only capable of carrying out horizontal module survey
Examination；Under longitudinal probe menu, it is only capable of carrying out longitudinal module test.Therefore, after the horizontal module test completing described chip, need
Described chip is rotated 90 °, and has an acupuncture treatment again, to complete described longitudinal module test.It is apparent that the multiple rotation of described chip
Turning, and repeat acupuncture treatment to affect described wafer acceptability test efficiency.
Therefore it is directed to the problem that prior art exists, this case designer, by being engaged in the industry experience for many years, actively studies
Improvement, then has a kind of cross probe card of the present invention.
Content of the invention
The present invention be directed in prior art, when described traditional wafer acceptability test is tested, described chip needs
Want multiple rotary, and the defects such as the wafer acceptability test inefficiency leading to a kind of cross probe of offer of having an acupuncture treatment is provided
Card.
For realizing the purpose of the present invention, the present invention provides a kind of cross probe card, and described cross probe card includes：Visit
Pin clamp, described probe clamp is used for carrying described functional test terminal；Calibrating terminal, described calibrating terminal distribution is arranged on institute
State the circumferential edge edge of probe clamp；Probe pins, described probe pins are corresponding with the probe pads of described device under test, in cross
Arrangement, and it is arranged on the middle part of described probe chuck.
Alternatively, described distribution be arranged on the calibrating terminal on circumferential edge edge of described probe clamp quantity be 48.
Alternatively, described in cross arrangement, and between being arranged among described probe clamp the probe pins at position number
Measure as 24.
Alternatively, position between described probe pins are symmetric and are arranged among described probe clamp.
Alternatively, described probe pins described probe pins in either direction are in parallel cross arrangement, and described probe draws
Foot does not intersect.
Alternatively, described cross probe card can complete the horizontal module test to described test cell and longitudinal mould simultaneously
Group test, and chip angle rotation need not be carried out.
In sum, cross probe card of the present invention can complete the horizontal module test to described test cell simultaneously
Test with longitudinal module, and chip angle rotation need not be carried out, greatly shorten the WAT testing time, improve testing efficiency.
Meanwhile, cross probe card of the present invention can ensure that described probe pins are generally aligned in the same plane, it is to avoid probe pins antarafacial is led
The WAT test causing is abnormal.
Brief description
Fig. 1 show the structural representation of the cross probe card of the present invention；
Fig. 2（a）It show the top view of the probe pins of the cross probe card of the present invention；
Fig. 2（b）It show the upward view of the probe pins of the cross probe card of the present invention；
Fig. 3 show the test structure schematic diagram of the cross probe card of the present invention；
Fig. 4（a）～Fig. 4（b）It show the structural representation of existing probe card.
Specific embodiment
For describing technology contents, structural features, institute's reached purpose and effect of the invention in detail, below in conjunction with reality
Apply example and coordinate accompanying drawing to be described in detail.
Refer to Fig. 1, Fig. 1 show the structural representation of the cross probe card of the present invention.Described cross probe card 1 is wrapped
Include：Probe clamp（Prober Card Board,PCB）11, described probe clamp 11 is used for carrying described functional test terminal；
Calibrating terminal 12, described calibrating terminal 12 distribution is arranged on the circumferential edge edge of described probe clamp 11；Probe pins 13, described spy
Pin pin 13 and the probe pads of described device under test（Not shown）Corresponding, in cross arrangement, and it is arranged on described probe chuck
11 middle part.
As specific embodiment, nonrestrictive enumerate, in the present invention, described distribution is arranged on described probe clamp
The quantity of the calibrating terminal 12 on 11 circumferential edge edge is 48；Described in cross arrangement, and be arranged on described probe clamp 11
The probe pins 13 of middle part quantity be 24.More specifically, described probe pins 13 are symmetric and are arranged on institute
State the middle part of probe clamp 11.
Refer to Fig. 2（a）, Fig. 2（b）, and combine refering to Fig. 1, Fig. 2（a）It show the spy of the cross probe card of the present invention
The top view of pin pin.Fig. 2（b）It show the upward view of the probe pins of the cross probe card of the present invention.For ease of described ten
The manufacture of font probe card 1, that is, arrangement in described cross probe card 1 for the described probe pins 13 is it is preferable that at either one
Described probe pins are in parallel cross arrangement upwards, and described probe pins 13 do not intersect.
Refer to Fig. 3, and with continued reference to Fig. 1, Fig. 3 show the test structure schematic diagram of the cross probe card of the present invention.
In order to intuitively disclose the technical scheme of the present invention, highlight the beneficial effect of the present invention, without limitation, with described cross spy
Pin card 1 is to by described first chip 21, the second chip 22, the 3rd chip 23, and the test cell 2 of fourth chip 24 composition enters
It is illustrated as a example row WAT test.The number of chips of described test cell 2 is not construed as the restriction to technical solution of the present invention.
It is apparent that when described test cell 2 is carried out with WAT test it is only necessary to acupuncture treatment once, just can complete to described test
The horizontal module test of unit 2 and longitudinal module test, and core need not be carried out after described chip transmits to described tester table
Piece angle rotates, and greatly shortens the WAT testing time, improves testing efficiency.On the other hand, cross spy of the present invention
Pin card 1 can ensure that described probe pins 13 are generally aligned in the same plane, it is to avoid the WAT test that probe pins 13 antarafacial leads to is abnormal.
In sum, cross probe card of the present invention can complete the horizontal module test to described test cell simultaneously
Test with longitudinal module, and chip angle rotation need not be carried out, greatly shorten the WAT testing time, improve testing efficiency.
Meanwhile, cross probe card of the present invention can ensure that described probe pins are generally aligned in the same plane, it is to avoid probe pins antarafacial is led
The WAT test causing is abnormal.
Those skilled in the art all it will be appreciated that without departing from the spirit or scope of the present invention, can be to the present invention
Carry out various modifications and deform.Thus, if any modification or modification fall into the protection model of appended claims and equivalent
It is believed that the present invention covers these modifications and deforms when enclosing interior.
Claims (4)
1. a kind of cross probe card is it is characterised in that described cross probe card includes：
Probe clamp, described probe clamp is used for bearing test terminal；
Calibrating terminal, described calibrating terminal distribution is arranged on the circumferential edge edge of described probe clamp；
Probe pins, described probe pins are corresponding with the probe pads of device under test, in cross arrangement, and are arranged on probe chuck
Middle part, in either direction described probe pins be in parallel cross arrangement, described probe pins do not intersect, described
Cross probe card can complete the horizontal module test of device under test and longitudinal module test simultaneously, and need not carry out die corner
Degree rotation.
2. as claimed in claim 1 cross probe card it is characterised in that described distribution is arranged on the circle of described probe clamp
The quantity of the calibrating terminal at all edges is 48.
3. as claimed in claim 1 cross probe card it is characterised in that described in cross arrangement, and be arranged on described
Between among probe clamp, the quantity of the probe pins at position is 24.
4. cross probe card is arranged on institute it is characterised in that described probe pins are symmetric as claimed in claim 3
Position between stating among probe clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310565733.5A CN103558426B (en) | 2013-11-13 | 2013-11-13 | Cross prober card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310565733.5A CN103558426B (en) | 2013-11-13 | 2013-11-13 | Cross prober card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103558426A CN103558426A (en) | 2014-02-05 |
| CN103558426B true CN103558426B (en) | 2017-02-08 |
Family
ID=50012728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310565733.5A Active CN103558426B (en) | 2013-11-13 | 2013-11-13 | Cross prober card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103558426B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103926433B (en) * | 2014-03-20 | 2016-06-08 | 上海华力微电子有限公司 | Probe |
| US9885748B2 (en) | 2015-06-09 | 2018-02-06 | International Business Machines Corporation | Module testing utilizing wafer probe test equipment |
| CN113075430B (en) * | 2021-03-30 | 2023-03-31 | 云谷（固安）科技有限公司 | Pin card structure and test equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1670540A (en) * | 2004-03-16 | 2005-09-21 | 木本军生 | Electric signal connecting device, probe assembly and detector using the same |
| CN101105506A (en) * | 2006-07-13 | 2008-01-16 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical high-frequency probe card |
| CN101211806A (en) * | 2006-12-26 | 2008-07-02 | 采钰科技股份有限公司 | Wafer level testing module and testing method for image sensing chip |
| CN102401846A (en) * | 2010-09-19 | 2012-04-04 | 旺矽科技股份有限公司 | Multi-power circuit board and its application probe card |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04241437A (en) * | 1991-01-16 | 1992-08-28 | Nec Corp | Prober |
| JP3416668B2 (en) * | 2001-11-21 | 2003-06-16 | 東京エレクトロン株式会社 | Probing card |
| JP2010107319A (en) * | 2008-10-29 | 2010-05-13 | Japan Electronic Materials Corp | Manufacturing method of contact probe |
| US8674715B2 (en) * | 2010-01-20 | 2014-03-18 | Celadon Systems, Inc. | Test apparatus having a probe core with a twist lock mechanism |
-
2013
- 2013-11-13 CN CN201310565733.5A patent/CN103558426B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1670540A (en) * | 2004-03-16 | 2005-09-21 | 木本军生 | Electric signal connecting device, probe assembly and detector using the same |
| CN101105506A (en) * | 2006-07-13 | 2008-01-16 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical high-frequency probe card |
| CN101211806A (en) * | 2006-12-26 | 2008-07-02 | 采钰科技股份有限公司 | Wafer level testing module and testing method for image sensing chip |
| CN102401846A (en) * | 2010-09-19 | 2012-04-04 | 旺矽科技股份有限公司 | Multi-power circuit board and its application probe card |
Non-Patent Citations (1)
| Title |
|---|
| IC工艺流程检测;杜支华;《微电子技术》;19981231;第26卷(第4期);第52-60页 * |
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| Publication number | Publication date |
|---|---|
| CN103558426A (en) | 2014-02-05 |
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