CN103540426A - Waterborne printed circuit board cleaning agent and preparation method thereof - Google Patents
Waterborne printed circuit board cleaning agent and preparation method thereof Download PDFInfo
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- CN103540426A CN103540426A CN201310523756.XA CN201310523756A CN103540426A CN 103540426 A CN103540426 A CN 103540426A CN 201310523756 A CN201310523756 A CN 201310523756A CN 103540426 A CN103540426 A CN 103540426A
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- cleaning agent
- acid
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- ethanol
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000012459 cleaning agent Substances 0.000 title abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims abstract description 8
- CDOUZKKFHVEKRI-UHFFFAOYSA-N 3-bromo-n-[(prop-2-enoylamino)methyl]propanamide Chemical compound BrCCC(=O)NCNC(=O)C=C CDOUZKKFHVEKRI-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000008367 deionised water Substances 0.000 claims abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 7
- 235000019329 dioctyl sodium sulphosuccinate Nutrition 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000003647 oxidation Effects 0.000 claims abstract description 4
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 10
- 239000012752 auxiliary agent Substances 0.000 claims description 7
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 6
- IMQLKJBTEOYOSI-GPIVLXJGSA-N Inositol-hexakisphosphate Chemical compound OP(O)(=O)O[C@H]1[C@H](OP(O)(O)=O)[C@@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@@H]1OP(O)(O)=O IMQLKJBTEOYOSI-GPIVLXJGSA-N 0.000 claims description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- IMQLKJBTEOYOSI-UHFFFAOYSA-N Phytic acid Natural products OP(O)(=O)OC1C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C1OP(O)(O)=O IMQLKJBTEOYOSI-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 229940047662 ammonium xylenesulfonate Drugs 0.000 claims description 6
- 239000003153 chemical reaction reagent Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 6
- 229940068041 phytic acid Drugs 0.000 claims description 6
- 239000000467 phytic acid Substances 0.000 claims description 6
- 235000002949 phytic acid Nutrition 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 claims description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 3
- OPGYRRGJRBEUFK-UHFFFAOYSA-L disodium;diacetate Chemical compound [Na+].[Na+].CC([O-])=O.CC([O-])=O OPGYRRGJRBEUFK-UHFFFAOYSA-L 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 239000001632 sodium acetate Substances 0.000 claims description 3
- 235000017454 sodium diacetate Nutrition 0.000 claims description 3
- 229960004418 trolamine Drugs 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- 235000021314 Palmitic acid Nutrition 0.000 abstract 1
- HDMGIDHAXIXUIQ-UHFFFAOYSA-N azanium;3,4-dimethylbenzenesulfonate Chemical compound [NH4+].CC1=CC=C(S([O-])(=O)=O)C=C1C HDMGIDHAXIXUIQ-UHFFFAOYSA-N 0.000 abstract 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 abstract 1
- 229960001484 edetic acid Drugs 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 230000005764 inhibitory process Effects 0.000 abstract 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 abstract 1
- 230000035699 permeability Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- ZMQBAPPSYGILGT-UHFFFAOYSA-N sodium;2,3-bis(hydroxymethyl)butanedioic acid Chemical compound [Na+].OCC(C(O)=O)C(CO)C(O)=O ZMQBAPPSYGILGT-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a waterborne printed circuit board cleaning agent. The cleaning agent is prepared from the following raw materials in parts by weight: 3-5 parts of dodecylbenzene sulfonic acid, 1-2 parts of triethanolamine, 2-3 parts of 3,4-dimethylbenzenesulfonic acid ammonium salt, 3-4 parts of dioctyl sodium sulfosuccinate, 40-50 parts of ethanol, 1-2 parts of palmitic acid, 2-3 parts of ethylene diamine tetraacetic acid, 4-5 parts of auxiliary and 100-120 parts of deionized water. The cleaning agent has the beneficial effects that the cleaning agent has good permeability, can achieve cleaning without dead corners, has excellent capability of cleaning rosin, welding flux, organic matters and inorganic matters and good corrosion inhibition effect, is low in cost, is environment-friendly and pollution-free, is nontoxic to human bodies and is suitable for cleaning of various circuit boards; the auxiliary can form a protective film on the surface of the circuit board to isolate air to prevent water and other molecules in the air from corroding the circuit board; the cleaning agent is resistant to oxidation, prevents short circuit and is convenient for operation of the next preparation process.
Description
Technical field
The present invention relates to clean-out system field, relate in particular to a kind of water-based printing circuit card clean-out system and preparation method thereof.
Background technology
Along with the high speed development of unicircuit, the volume of circuit card is more and more less, and electronic component is more and more less, and density is increasing.If the dirt dust of the inside does not clean up in making processes, likely can cause the problems such as short circuit, corrosion, affect the normal operation of circuit card.At present majority circuit plate sanitising agent is all made with organism, and cleaning effect is good, is difficult for causing the problems such as short circuit, corrosion, and still, organic compound not only cost is high, and contaminate environment, damage the ozone layer, harmful to HUMAN HEALTH.Also have minority waterborne cleaning agent, but cleaning performance is limited, has security risk, require further improvement formula, technique, to reach clean thorough, pollution-free, the object of corroding little, healthy, circuit safety, reducing costs.
Summary of the invention
The object of the present invention is to provide a kind of water-based printing circuit card clean-out system and preparation method thereof, this clean-out system has advantages of without dead angle cleaning, pollution-free, cost is low.
Technical scheme of the present invention is as follows:
A kind of water-based printing circuit card clean-out system, it is characterized in that being made by the raw material of following weight part: Witco 1298 Soft Acid 3-5, trolamine 1-2,3,4-ammonium xylene sulfonate 2-3, dioctyl sodium sulfosuccinate 3-4, ethanol 40-50, palmitinic acid 1-2, disodium ethylene diamine tetraacetate 2-3, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl acrylate 3-4, PTMG 2-3, sodium Diacetate 1-2, oxidation inhibitor 1035 1-2, ethanol 12-15; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
The preparation method of described water-based printing circuit card clean-out system, it is characterized in that comprising the following steps: by deionized water, Witco 1298 Soft Acid, 3,4-ammonium xylene sulfonate, dioctyl sodium sulfosuccinate, ethanol, palmitinic acid, disodium ethylene diamine tetraacetate are mixed, under 800-1100 rev/min of stirring, speed with 6-8 ℃/minute is heated to 60-70 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
Beneficial effect of the present invention
Clean-out system good penetrability of the present invention, can clean without dead angle, rosin, welding agent, organism, inorganics are all had to excellent cleansing power, and corrosion mitigating effect be good, cost is low, and environmentally safe, nontoxic to human body is applicable to the cleaning of multiple circuit card.Auxiliary agent of the present invention can form protective membrane at circuit board surface, and isolated air, prevents water and other molecule open circuit potential plates in atmosphere, and anti-oxidant, anti-short circuit, facilitates next step manufacture craft to carry out.
Embodiment
A kind of water-based printing circuit card clean-out system, by following weight part (kilogram) raw material make: Witco 1298 Soft Acid 4, trolamine 2,3,4-ammonium xylene sulfonate 3, dioctyl sodium sulfosuccinate 3, ethanol 43, palmitinic acid 2, disodium ethylene diamine tetraacetate 2, auxiliary agent 4, deionized water 110;
Described auxiliary agent by following weight part (kilogram) raw material make: Silane coupling reagent KH-570 2.5, phytic acid 1.5, methyl acrylate 3.5, PTMG 2.5, sodium Diacetate 1.5, oxidation inhibitor 1,035 1.5, ethanol 14; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 65 ℃, stirs after 25 minutes, then adds other remaining component, is warming up to 83 ℃, stirs 35 minutes, obtains.
The preparation method of described water-based printing circuit card clean-out system, comprise the following steps: by deionized water, Witco 1298 Soft Acid, 3,4-ammonium xylene sulfonate, dioctyl sodium sulfosuccinate, ethanol, palmitinic acid, disodium ethylene diamine tetraacetate are mixed, under 1000 revs/min of stirrings, with the speed of 7 ℃/minute, be heated to 67 ℃, add other remaining components, continue to stir 17 minutes, obtain.
This water-based printing circuit card clean-out system is used for cleaning copper printed circuit board (PCB), through 10 times of amplification detection of Olympus microscope, surface is clean without pollutents such as obvious rosin, scolding tin, greasy dirt, fingerprints, cleaning solution resistivity is greater than 2*106 Ω .cm, First Pass Yield reaches 80%, is better than normal level.
Claims (2)
1. a water-based printing circuit card clean-out system, it is characterized in that being made by the raw material of following weight part: Witco 1298 Soft Acid 3-5, trolamine 1-2,3,4-ammonium xylene sulfonate 2-3, dioctyl sodium sulfosuccinate 3-4, ethanol 40-50, palmitinic acid 1-2, disodium ethylene diamine tetraacetate 2-3, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl acrylate 3-4, PTMG 2-3, sodium Diacetate 1-2, oxidation inhibitor 1035 1-2, ethanol 12-15; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
2. the preparation method of water-based printing circuit card clean-out system according to claim 1, it is characterized in that comprising the following steps: by deionized water, Witco 1298 Soft Acid, 3,4-ammonium xylene sulfonate, dioctyl sodium sulfosuccinate, ethanol, palmitinic acid, disodium ethylene diamine tetraacetate are mixed, under 800-1100 rev/min of stirring, speed with 6-8 ℃/minute is heated to 60-70 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
Priority Applications (1)
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CN201310523756.XA CN103540426A (en) | 2013-10-30 | 2013-10-30 | Waterborne printed circuit board cleaning agent and preparation method thereof |
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CN201310523756.XA CN103540426A (en) | 2013-10-30 | 2013-10-30 | Waterborne printed circuit board cleaning agent and preparation method thereof |
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CN201310523756.XA Pending CN103540426A (en) | 2013-10-30 | 2013-10-30 | Waterborne printed circuit board cleaning agent and preparation method thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104388197A (en) * | 2014-11-25 | 2015-03-04 | 苏州路路顺机电设备有限公司 | Decontamination cleaning agent and preparation method thereof |
CN105483720A (en) * | 2015-12-29 | 2016-04-13 | 马鞍山采石矶涂料有限公司 | Environmental water-based degreasing agent and preparation method thereof |
CN106190606A (en) * | 2016-07-29 | 2016-12-07 | 广东工业大学 | A kind of water-based printing circuit board abluent and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101748001A (en) * | 2008-12-16 | 2010-06-23 | 中国药品生物制品检定所 | Washing agent special for labs |
CN102399915A (en) * | 2011-10-13 | 2012-04-04 | 四川大学 | A kind of environment-friendly raw hide preservative and preparation method thereof |
CN103214886A (en) * | 2013-02-04 | 2013-07-24 | 安徽省繁昌县皖南阀门铸造有限公司 | A metal antirust oil containing butyl acrylate |
-
2013
- 2013-10-30 CN CN201310523756.XA patent/CN103540426A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101748001A (en) * | 2008-12-16 | 2010-06-23 | 中国药品生物制品检定所 | Washing agent special for labs |
CN102399915A (en) * | 2011-10-13 | 2012-04-04 | 四川大学 | A kind of environment-friendly raw hide preservative and preparation method thereof |
CN103214886A (en) * | 2013-02-04 | 2013-07-24 | 安徽省繁昌县皖南阀门铸造有限公司 | A metal antirust oil containing butyl acrylate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104388197A (en) * | 2014-11-25 | 2015-03-04 | 苏州路路顺机电设备有限公司 | Decontamination cleaning agent and preparation method thereof |
CN105483720A (en) * | 2015-12-29 | 2016-04-13 | 马鞍山采石矶涂料有限公司 | Environmental water-based degreasing agent and preparation method thereof |
CN106190606A (en) * | 2016-07-29 | 2016-12-07 | 广东工业大学 | A kind of water-based printing circuit board abluent and preparation method thereof |
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PB01 | Publication | ||
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Application publication date: 20140129 |