CN103498160B - A kind of polishing slurries - Google Patents
A kind of polishing slurries Download PDFInfo
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- CN103498160B CN103498160B CN201310434588.7A CN201310434588A CN103498160B CN 103498160 B CN103498160 B CN 103498160B CN 201310434588 A CN201310434588 A CN 201310434588A CN 103498160 B CN103498160 B CN 103498160B
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- polishing
- polishing slurries
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- aluminum oxide
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A kind of polishing slurries of the present invention, this slurry contains the aluminum oxide polishing powder of 10 ~ 30wt%, the 3-TSL 8330 of 1 ~ 5wt%, the stearic acid of 0.1 ~ 3wt%, the glycerol of 1 ~ 2wt%, the phosphoric acid of 0.1 ~ 1wt%, 0.1 ~ 0.5wt% tensio-active agent, surplus is water.Adopt polishing slurries of the present invention while completing metal surface polishing, form layer protecting film in metallic surface and prevent ambient oxidizable metal surface.
Description
Technical field
The present invention relates to a kind of slurry for metal surface polishing.
Background technology
Metal with the Long Term Contact process of air in inevitably occur to a certain degree to be oxidized, metal is made to lose metalluster, for this reason, be before use, although existing polished finish agent can remove the zone of oxidation of metallic surface, but the metal after polishing is not if carried out rotproofing, the metallic surface after polishing very soon can be oxidized and lose metalluster.
Summary of the invention
The object of this invention is to provide a kind of polishing slurries.
To achieve these goals, the invention provides following technical scheme:
A kind of polishing slurries, the aluminum oxide polishing powder containing 10 ~ 30wt%, the 3-TSL 8330 of 1 ~ 5wt%, the stearic acid of 0.1 ~ 3wt%, the glycerol of 1 ~ 2wt%, the phosphoric acid of 0.1 ~ 1wt%, 0.1 ~ 0.5wt% tensio-active agent, surplus is water.
Further, the particle diameter of described aluminum oxide polishing powder is 4 ~ 50 μm.
Further, described tensio-active agent is sodium laurylsulfonate or polyoxyethylene nonylphenol ether NP-10.
Adopt polishing slurries of the present invention while completing metal surface polishing, layer protecting film can be formed in metallic surface and prevent ambient oxidizable metal surface.
Embodiment
Below the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein is only for instruction and explanation of the present invention, is not intended to limit the present invention.
Embodiment 1
A kind of polishing slurries, by 1 kilogram of aluminum oxide polishing powder, (particle diameter is the α-Al of 4 ~ 15 μm
2o
3), the 3-TSL 8330 (CAS:13822-56-5) of 0.1 kilogram, the stearic acid of 0.2 kilogram, the glycerol of 0.1 kilogram, the phosphoric acid of 0.01 kilogram, the water of the sodium laurylsulfonate of 0.01 kilogram and 8.58 kilograms, ground and mixed evenly after obtain.
Embodiment 2
A kind of polishing slurries, by 2 kilograms of aluminum oxide polishing powders, (particle diameter is the α-Al of 10 ~ 25 μm
2o
3), the 3-TSL 8330 of 0.3 kilogram, the stearic acid of 0.3 kilogram, the glycerol of 0.1 kilogram, the phosphoric acid of 0.1 kilogram, the water of the sodium laurylsulfonate of 0.05 kilogram and 7.15 kilograms, ground and mixed evenly after obtain.
Embodiment 3
A kind of polishing slurries, by 3 kilograms of aluminum oxide polishing powders, (particle diameter is the α-Al of 25 ~ 50 μm
2o
3), the 3-TSL 8330 of 0.5 kilogram, the stearic acid of 0.01 kilogram, the glycerol of 0.2 kilogram, the phosphoric acid of 0.05 kilogram, the water of polyoxyethylene nonylphenol ether NP-10 and 6.21 kilogram of 0.03 kilogram, obtains after ground and mixed is even.
The use of this polishing slurries: use spray gun to be sprayed pending aluminum hardware by slurry, after showing metalluster to utensil, place 10 ~ 20 minutes, then rinse with water.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. prevent the polishing slurries on ambient oxidizable metal surface, the aluminum oxide polishing powder containing 10 ~ 30wt%, the 3-TSL 8330 of 1 ~ 5wt%, the stearic acid of 0.1 ~ 3wt%, the glycerol of 1 ~ 2wt%, the phosphoric acid of 0.1 ~ 1wt%, 0.1 ~ 0.5wt% tensio-active agent, surplus is water.
2. polishing slurries according to claim 1, is characterized in that, the particle diameter of described aluminum oxide polishing powder is 4 ~ 50 μm.
3. polishing slurries according to claim 1, is characterized in that, described tensio-active agent is sodium laurylsulfonate or polyoxyethylene nonylphenol ether NP-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310434588.7A CN103498160B (en) | 2013-09-23 | 2013-09-23 | A kind of polishing slurries |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310434588.7A CN103498160B (en) | 2013-09-23 | 2013-09-23 | A kind of polishing slurries |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103498160A CN103498160A (en) | 2014-01-08 |
| CN103498160B true CN103498160B (en) | 2016-01-20 |
Family
ID=49863414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310434588.7A Expired - Fee Related CN103498160B (en) | 2013-09-23 | 2013-09-23 | A kind of polishing slurries |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103498160B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002002706A1 (en) * | 2000-07-05 | 2002-01-10 | Cabot Microelectronics Corporation | Polishing composition for metal cmp |
| CN1440449A (en) * | 2000-07-05 | 2003-09-03 | 卡伯特微电子公司 | Silane containing polishing composition for CMP |
| CN1809620A (en) * | 2003-04-21 | 2006-07-26 | 卡伯特微电子公司 | Coated metal oxide particles for CMP |
| CN101058713A (en) * | 2001-10-31 | 2007-10-24 | 日立化成工业株式会社 | Polishing slurry and polishing method |
| CN101928521A (en) * | 2009-06-26 | 2010-12-29 | 盟智科技股份有限公司 | Slurry composition and damascene structure manufacturing method using the slurry composition |
-
2013
- 2013-09-23 CN CN201310434588.7A patent/CN103498160B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002002706A1 (en) * | 2000-07-05 | 2002-01-10 | Cabot Microelectronics Corporation | Polishing composition for metal cmp |
| CN1440449A (en) * | 2000-07-05 | 2003-09-03 | 卡伯特微电子公司 | Silane containing polishing composition for CMP |
| CN101058713A (en) * | 2001-10-31 | 2007-10-24 | 日立化成工业株式会社 | Polishing slurry and polishing method |
| CN1809620A (en) * | 2003-04-21 | 2006-07-26 | 卡伯特微电子公司 | Coated metal oxide particles for CMP |
| CN101928521A (en) * | 2009-06-26 | 2010-12-29 | 盟智科技股份有限公司 | Slurry composition and damascene structure manufacturing method using the slurry composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103498160A (en) | 2014-01-08 |
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Effective date of registration: 20170523 Address after: 526100 Heping Road (zone B) processing building, Gaoyao District, Zhaoqing, Guangdong Patentee after: ZHAOQING CHENYE ELECTRONICS CO.,LTD. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170523 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 214000 Jiangsu city in Wuxi Province Economic Development Zone Huishan Spring Road No. 588 Patentee before: WUXI YANGGONG MACHINERY MANUFACTURING Co.,Ltd. |
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Granted publication date: 20160120 |
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