CN103471055A - Heat dissipation device and illumination device provided with same - Google Patents
Heat dissipation device and illumination device provided with same Download PDFInfo
- Publication number
- CN103471055A CN103471055A CN2012101876606A CN201210187660A CN103471055A CN 103471055 A CN103471055 A CN 103471055A CN 2012101876606 A CN2012101876606 A CN 2012101876606A CN 201210187660 A CN201210187660 A CN 201210187660A CN 103471055 A CN103471055 A CN 103471055A
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- Prior art keywords
- heat abstractor
- matrix
- reflector
- lighting device
- cavity
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- 238000005286 illumination Methods 0.000 title abstract description 4
- 230000017525 heat dissipation Effects 0.000 title abstract 4
- 239000011159 matrix material Substances 0.000 claims description 50
- 238000004020 luminiscence type Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 208000002925 dental caries Diseases 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000004512 die casting Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 239000006223 plastic coating Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a heat dissipation device (100) for an illumination device. The heat dissipation device (100) comprises a base body (1) and a reflector (2) integrally formed with the base body (1). Furthermore, the invention also relates to the illumination device provided with the heat dissipation device (100).
Description
Technical field
The present invention relates to a kind of heat abstractor for lighting device.In addition, the invention still further relates to a kind of lighting device with heat abstractor of the above-mentioned type.
Background technology
At some in traditional lighting device and LED lighting device, in order to meet different lighting requirements, usually need to be for lighting device is equipped with optical module, reflector for example.But, optical module usually and the miscellaneous part of lighting device divide and be arranged.When the assembling lighting device, usually optical module need to be assembled on the relevant position of lighting device individually.In the prior art, usually adopt plastics to make optical module by accurate injection Shooting Technique, reflector for example, and apply reflectance coating on reflector, but the material of this reflector has determined that it only can provide limited heat dispersion.In addition, also can manufacture the reflector of metal material by casting technique in the prior art, then by anode oxidation process, process this reflector, to obtaining good reflecting properties.But its machining accuracy is poor, cause reflecting properties poor, its reflectance factor is usually between 70% to 85%.
Yet the common shortcoming of the above-mentioned reflector of two types of the prior art of mentioning is, the manufacturing process complexity of these two kinds of reflectors is with high costs.Simultaneously, these two kinds of reflectors are all independent parts, and it need to be assembled on the relevant position of lighting device individually, so its assembling is also comparatively loaded down with trivial details.
Summary of the invention
For solving the problems of the technologies described above, the present invention proposes a kind of heat abstractor for lighting device.Can be used as reflector according to heat abstractor of the present invention itself and use, it is with low cost, and good reflecting properties can be provided, and it also has splendid heat dispersion simultaneously.In addition, the invention allows for a kind of lighting device with heat abstractor of the above-mentioned type.Simpler according to the assembling of lighting device of the present invention, with low cost.
The first purpose of the present invention realizes thus by a kind of heat abstractor for lighting device, and this heat abstractor comprises matrix, and wherein, heat abstractor also comprises the reflector integrally formed with matrix.In design according to the present invention, due to reflector and matrix integrally formed, so reflector itself is no longer independent parts, therefore without individually reflector being installed on heat abstractor in the later stage.This has simplified the installation of reflector.Simultaneously, reflector and matrix are integrally formed, therefore there do not is gap between reflector and matrix, thereby effectively reduced the thermal resistance the heat transfer path from reflector to matrix, improved significantly the heat dispersion according to heat abstractor of the present invention.
Preferably, matrix comprises at least one cavity, and the inwall that limits the matrix of this cavity forms reflector.Cancelled independently reflector in this structure, thereby made heat abstractor not only there is the function of heat radiation but also there is the function of reflection ray.
Advantageously, cavity comprises light-emitting window and the installing port relative with light-emitting window, and the luminescence component of lighting device is arranged on installing port.According to the type of luminescence component, luminescence component can be inserted into cavity from light-emitting window, and is arranged on installing port, also can insert cavity from installing port, and be arranged on installing port.
Preferably, matrix comprises a cavity, and this cavity is corresponding to whole light sources of luminescence component.In this scheme, the inwall of unique cavity has formed unique reflector, and the light of whole light sources of the luminescence component reflector unique by this reflected.
Optionally, matrix comprises a plurality of cavitys, and each cavity is corresponding to a light source of luminescence component.The inwall of each cavity has formed a reflector, therefore can design as required each reflector, thereby be complementary with each light source, to obtain different illuminating effects.
According to a preferred design of the present invention, matrix is made of metal.Metal has higher thermal conductivity, and the heat abstractor be made of metal can obtain good heat dispersion.
Be proved to be advantageously, matrix is made by die casting technique, and this has simplified manufacturing process significantly, has reduced the manufacturing cost according to heat abstractor of the present invention.
Preferably, reflector is processed and is formed inwall by glossing.Can strengthen significantly the reflecting properties of inwall by polishing.
Advantageously, be coated with plastic coating on inwall, and by vacuum aluminium plating process, inwall processed, to form reflector.Can significantly improve the accuracy of manufacture as the inwall of reflector after the application of plastics coatings on the inwall of metal, thereby lay a good foundation for by vacuum aluminium plating process, inwall being processed, to obtain the reflector of high accuracy and high reflectance.
According to another preferred design of the present invention, matrix is made by heat-conducting plastic.Heat-conducting plastic has relatively high thermal conductivity equally.In addition, the special material characteristics of heat-conducting plastic allows heat-conducting plastic to be configured to inexpensively different shapes, to obtain good cross-ventilation effect, thus the heat dispersion of raising heat abstractor.
Advantageously, matrix forms by spraying Shooting Technique.This has simplified manufacturing process significantly, has reduced the manufacturing cost according to heat abstractor of the present invention.
Preferably, the inwall of heat-conducting plastic being made by vacuum aluminium plating process is processed, to form reflector.Because the matrix itself of making by the injection Shooting Technique has had higher processing technology, therefore by vacuum aluminium plating process, can directly form the reflector with higher machining accuracy.
Preferably, be provided with at least one fin of radial distribution on the matrix peripheral surface.Fin has improved the contact area of heat abstractor and convection current air significantly, has improved the heat dispersion of heat abstractor.
Advantageously, reflector design becomes bowl-shape or cup-shaped.Certainly, in order to obtain other reflecting effects, reflector also can be designed to other shape.
Another object of the present invention realizes thus by a kind of lighting device, and this lighting device has the heat abstractor of the above-mentioned type and is arranged on the luminescence component in heat abstractor.Lighting device according to the present invention has good illumination performance, splendid radiating effect.It is with low cost simultaneously, and assembling is more easily simple.
Preferably, luminescence component comprise circuit board and be arranged on circuit board, as at least one LED chip of light source.LED chip has advantages of that light efficiency is high, the life-span long and energy-conserving and environment-protective.
It should be understood that if do not have other dated especially, the feature of different exemplary embodiment described herein can be bonded to each other.
The accompanying drawing explanation
Accompanying drawing forms the part of this specification, for helping further to understand the present invention.These accompanying drawings illustrate embodiments of the invention, and are used for illustrating principle of the present invention together with specification.Identical parts mean with identical label in the accompanying drawings.Shown in figure:
Fig. 1 is the schematic diagram according to the heat abstractor of the first embodiment of the present invention;
Fig. 2 is the schematic diagram of heat abstractor according to a second embodiment of the present invention;
Fig. 3 is the sectional view according to lighting device of the present invention.
The specific embodiment
In being discussed in more detail below, with reference to the accompanying drawing of a part that forms this specification, wherein, in the mode of illustration, showing and can implement specific embodiments of the invention.About figure, such as " end ", " on ", " interior " directional terms used with reference to the direction of described accompanying drawing.Because the assembly of the embodiment of the present invention can be placed on many different directions, thus the direction term only for the explanation, and without any the restriction the meaning.It should be understood that and can use other embodiment, and can carry out structure or logical changes under the prerequisite that does not deviate from scope of the present invention.So, below describes in detail and should not be understood to the restrictive meaning, and the present invention is defined by the appended claims.
Fig. 1 shows the schematic diagram according to the heat abstractor 100 of the first embodiment of the present invention.As seen from the figure, this heat abstractor 100 comprises matrix 1, this matrix 1 comprises a cavity 3, and the inwall that limits the matrix 1 of this cavity 3 forms unique reflector 2, and this unique reflector 2 is corresponding to whole light sources of the luminescence component 4 of the lighting device 200 shown in Fig. 3.According to design of the present invention, the inwall of matrix 1 itself has formed reflector 2, and this that is to say, reflector 2 is parts of matrix 1, it is no longer independent parts, and therefore without in the later stage, assembling individually other reflector, this has reduced the assembling complexity significantly.Therefore in addition, there is not gap in a part that itself is matrix 1 due to reflector 2 between reflector 2 and matrix 1, and the thermal resistance that this has reduced significantly on heat transfer path has improved the heat dispersion of heat abstractor 100.
From figure, further, cavity 3 comprises light-emitting window 31 and the installing port 32 relative with light-emitting window 31, and the luminescence component 4 of lighting device 200 shown in Figure 3 is arranged on installing port 32.In the present embodiment, reflector 2 is designed to bowl-shape, certainly, that it also can be designed as cup-shaped or other shapes.
In addition, also be provided with a plurality of fin 11 of radial distribution on the peripheral surface of matrix 1.These fin 11 have improved the contact area of heat abstractor 100 with the convection current air significantly, have improved the heat dispersion of heat abstractor 100.In addition, in the first embodiment shown in Fig. 1, cavity 3 is formed on the central authorities of matrix 1 basically, and has circular light-emitting window 31, and fin 11 symmetrically is distributed on the peripheral surface of matrix 1 with respect to circular light-emitting window 31.
Fig. 2 shows the schematic diagram of heat abstractor 100 according to a second embodiment of the present invention.Heat abstractor according to a second embodiment of the present invention 100 is with the difference of the heat abstractor 100 shown in Fig. 1, and matrix 1 comprises a plurality of cavitys 3, and each cavity 3 is corresponding to a light source of luminescence component 4.The inwall that limits the matrix 1 of these cavitys 3 has also formed respectively a plurality of reflectors 2.The shape of these reflectors 2 can be identical, can be also different, to meet different reflection requirements, to obtaining different illuminating effects.
In two embodiment shown in Fig. 1 and Fig. 2, matrix 1 can be made of metal or be made by heat-conducting plastic.
At matrix 1, be made of metal in situation, this matrix 1 can be made by die casting technique, can certainly make by other metal working process.The inwall of matrix 1 is processed to form reflector 2 by glossing.In a preferred scheme, also can be on inwall the application of plastics coatings, then by vacuum aluminium plating process, inwall is processed to form reflector 2.Due to, on inwall, applied plastic coating, and processed by vacuum aluminium plating process, so reflection precision and the reflectivity of reflector 2 are higher.
In the situation that the matrix 1 of being made by heat-conducting plastic, this matrix 1 can form by spraying Shooting Technique, then by vacuum aluminium plating process, inwall is processed to form reflector 2.This can obtain equally has high reflection precision and the reflector 2 of reflectivity.
In addition, from the second embodiment shown in Fig. 2, be formed with a plurality of cavitys 3 on matrix 1, these cavitys 3 are evenly distributed on matrix 1.Fin 11 the first embodiment equally as shown in Figure 1 equally is evenly distributed on the peripheral surface of matrix 1.
It is emphasized that at this aim of the present invention is, reflector 2 and the carrier of this reflector 2 of carrying are made into integration, thereby reduce manufacturing cost and simplify assembling process.Carrier is not restricted to heat abstractor itself, and it can be also the miscellaneous part of lighting device, for example housing of lighting device etc.
Fig. 3 shows the schematic diagram according to lighting device 200 of the present invention.As seen from the figure, lighting device 200 according to the present invention comprises the heat abstractor 100 of the above-mentioned type and is arranged on the luminescence component 4 in this heat abstractor 100, wherein, luminescence component 4 comprise circuit board 41 and be arranged on circuit board 41, as at least one LED chip 42 of light source.
When lighting device according to the present invention 200 adopts the heat abstractor 100 according to the first embodiment of the present invention, a unique reflector 2 of all LED chips 42 common uses of luminescence component 4, that is to say, all LED chips 42 all are arranged in a unique cavity 3.In addition, when the heat abstractor 100 adopted according to the first embodiment of the present invention, luminescence component 4 can be inserted in cavity 3 from the light-emitting window 31 of cavity, and is fixed to installing port 32 places, also can insert in cavity 3 from installing port 32, and be fixed to installing port 32 places.Certainly, the installation method of any type can not produce restriction to the present invention.
Although, this illustrate and described specific embodiment, it will be appreciated by one skilled in the art that under the prerequisite that does not deviate from scope of the present invention, various optional and/or embodiments that be equal to can replace the specific embodiment describing and illustrate.The application is intended to cover any modification or the distortion of specific embodiment discussed herein.So the present invention is intended to only be limited by claim and equivalent thereof.
Reference number
1 matrix
2 reflectors
3 cavitys
31 light-emitting windows
32 installing ports
4 luminescence components
41 circuit boards
42 LED chips
100 heat abstractors
200 lighting devices.
Claims (16)
1. the heat abstractor for lighting device (100), described heat abstractor (100) comprises matrix (1), it is characterized in that, described heat abstractor (100) also comprises the reflector (2) integrally formed with described matrix (1).
2. heat abstractor according to claim 1 (100), is characterized in that, described matrix (1) comprises at least one cavity (3), and the inwall that limits the described matrix (1) of described cavity (3) forms described reflector (2).
3. heat abstractor according to claim 2 (100), it is characterized in that, described cavity (3) comprises light-emitting window (31) and the installing port (32) relative with described light-emitting window (31), and the luminescence component of described lighting device (4) is arranged on described installing port (32).
4. heat abstractor according to claim 2 (100), is characterized in that, described matrix (1) comprises a described cavity (3), and described cavity (3) is corresponding to whole light sources of the luminescence component (4) of described lighting device.
5. heat abstractor according to claim 2 (100), is characterized in that, described matrix (1) comprises a plurality of described cavitys (3), and each described cavity (3) is corresponding to a light source of the luminescence component (4) of described lighting device.
6. heat abstractor according to claim 2 (100), is characterized in that, described matrix (1) is made of metal.
7. heat abstractor according to claim 6 (100), is characterized in that, described matrix (1) is made by die casting technique.
8. heat abstractor according to claim 7 (100), is characterized in that, described reflector (2) is processed and formed described inwall by glossing.
9. heat abstractor according to claim 8 (100), is characterized in that, on described inwall, is coated with plastic coating.
10. heat abstractor according to claim 2 (100), is characterized in that, described matrix (1) is made by heat-conducting plastic.
11. according to the described heat abstractor of claim 110 (100), it is characterized in that, described matrix (1) forms by spraying Shooting Technique.
12. according to the described heat abstractor of claim 9 or 11 (100), it is characterized in that, described reflector (2) is processed and is formed described inwall by vacuum aluminium plating process.
13. according to the described heat abstractor of any one in claim 1 to 12 (100), it is characterized in that, be provided with at least one fin (11) of radial distribution on described matrix (1) peripheral surface.
14. according to the described heat abstractor of any one in claim 1 to 12 (100), it is characterized in that, described reflector (2) is designed to bowl-shape or cup-shaped.
15. a lighting device (200), is characterized in that, described lighting device (200) comprises according to the described heat abstractor of any one in claim 1 to 14 (100) and is arranged on the luminescence component (4) in described heat abstractor (100).
16. lighting device according to claim 15 (200), is characterized in that, described luminescence component (4) comprise circuit board (41) and be arranged on described circuit board (41), as at least one LED chip (42) of described light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101876606A CN103471055A (en) | 2012-06-07 | 2012-06-07 | Heat dissipation device and illumination device provided with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101876606A CN103471055A (en) | 2012-06-07 | 2012-06-07 | Heat dissipation device and illumination device provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103471055A true CN103471055A (en) | 2013-12-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101876606A Pending CN103471055A (en) | 2012-06-07 | 2012-06-07 | Heat dissipation device and illumination device provided with same |
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| Country | Link |
|---|---|
| CN (1) | CN103471055A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106555955A (en) * | 2015-09-18 | 2017-04-05 | 西蒙独资有限公司 | Light fixture |
-
2012
- 2012-06-07 CN CN2012101876606A patent/CN103471055A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106555955A (en) * | 2015-09-18 | 2017-04-05 | 西蒙独资有限公司 | Light fixture |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131225 |