CN103465154B - Soft grinding and polishing dish - Google Patents
Soft grinding and polishing dish Download PDFInfo
- Publication number
- CN103465154B CN103465154B CN201310402613.3A CN201310402613A CN103465154B CN 103465154 B CN103465154 B CN 103465154B CN 201310402613 A CN201310402613 A CN 201310402613A CN 103465154 B CN103465154 B CN 103465154B
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- Prior art keywords
- grinding
- layer
- soft
- polishing dish
- strengthening
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- 238000005498 polishing Methods 0.000 title claims abstract description 35
- 238000005728 strengthening Methods 0.000 claims abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910001074 Lay pewter Inorganic materials 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 230000002787 reinforcement Effects 0.000 claims description 11
- 229910001018 Cast iron Inorganic materials 0.000 claims description 10
- 238000003754 machining Methods 0.000 abstract description 3
- 229910052787 antimony Inorganic materials 0.000 description 9
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of soft grinding and polishing dish, is circular disk configuration, and middle part is provided with through hole, this soft grinding and polishing dish at least includes grinding layer, described grinding layer is made up of leypewter, and each composition quality degree of described leypewter is as follows: tin is 65-75%, and lead is 25-35%; Described grinding layer rear is provided with strengthening layer, and this strengthening layer is all made up higher than the material of grinding layer of intensity and fusing point. The present invention is simple in structure, the problem on deformation can overcome grinding time, and the sticky bits problem while simultaneously avoiding grinding, has improved machining accuracy and efficiency, has practicality.
Description
Technical field
The present invention relates to the accessory technology of grinding machinery, relate in particular to one and can effectively raise the efficiency, increase the service lifeSoft grinding and polishing dish.
Background technology
In the past, abrasive disk be form taking abrasive material as main manufacture be applied in the important grinding tool on grinding machine, abrasive diskWhether performance, directly affects the performance of whole grinding process and the precision of processed finished products, and therefore abrasive disk is performance performance of grinding machineA key factor. The kind of abrasive disk is a lot, and has various shape and size, by material, knot to manufacture abrasive diskThe different choice of mixture and technique, can realize different service behaviours. Each abrasive disk is according to the characteristic of itself, all toolThere is certain scope of application, therefore, when grinding, must select as the case may be suitable emery wheel, otherwise can be because grindingSelection improper and directly affect machining accuracy, surface roughness and production efficiency.
At present, in the time that the CD to silicon material etc. carries out surfacing, because its required precision is high, usually use softThe grinding and polishing dish of matter carries out grinding, but domestic this grinding and polishing dish does not solve sticky bits problem, and during due to grindingReaction force, causes the shape of dish to deform, and then the precision of grinding is reduced, at this moment can be by improving grinding and polishing dishHardness is avoided this distortion, but the increase of hardness can make again grinding and polishing dish too fast to the surfacing of this material, simultaneouslyAlso exist potential safety hazard. In sum, for the defect of prior art, need especially a kind of soft grinding and polishing dish, withSolve the deficiencies in the prior art.
For this reason, designer of the present invention, by concentrating on studies and designing, is comprehensively engaged in for a long time the experience of related industry for many yearsAnd achievement, research and design goes out a kind of soft grinding and polishing dish, to overcome above-mentioned defect.
Summary of the invention
The object of the present invention is to provide a kind of soft grinding and polishing dish, it is simple in structure, the distortion can overcome grinding timeProblem, the sticky bits problem while simultaneously avoiding grinding, has improved machining accuracy and efficiency, has practicality.
For achieving the above object, the invention discloses a kind of soft grinding and polishing dish, for constructing because of dish, middle part is provided with logicalHole, is characterized in that:
This soft grinding and polishing dish at least includes grinding layer, and described grinding layer is made up of leypewter, and described tin lead closesEach composition quality degree of gold is as follows: tin is 65-75%, and lead is 25-35%;
Described grinding layer rear is provided with strengthening layer, this strengthening layer by intensity and fusing point all higher than the material system of grinding layerBecome.
Wherein: each composition quality degree of leypewter is as follows: tin is 68-70%, lead is 30-32%.
Wherein: leypewter also comprises the antimony of 0.1-0.5%.
Wherein: this strengthening layer is made of cast iron.
Wherein: in strengthening layer, be provided with multiple reinforcements, described reinforcement is to embed the cylinder of described strengthening layer, itsBe spaced the periphery in described strengthening layer.
By said structure, soft grinding and polishing dish of the present invention has been realized following technique effect:
1, grinding polishing effect is good, is difficult for producing chip, has effectively improved the rate of pass;
2, distortion is few, and anti-wear performance is better, has extended service life, has reduced maintenance cost;
3, manufacture simply, good forming effect, manufacturing cost is lower.
The present invention will be further described in detail by the following specific embodiments, and further combined with to accompanying drawingIllustrate and will be more apparent and obvious to understand.
Brief description of the drawings
Fig. 1 has shown the front view of the soft grinding and polishing dish of the present invention.
Fig. 2 has shown the structural representation of a kind of embodiment of the soft grinding and polishing dish of the present invention.
Fig. 3 has shown the structural representation of the another kind of embodiment of the soft grinding and polishing dish of the present invention.
Fig. 4 has shown the rearview that the present invention is embodiment illustrated in fig. 3.
Reference numeral:
1: soft grinding and polishing dish;
11: grinding layer;
12: strengthening layer;
13: reinforcement.
Detailed description of the invention
Referring to Fig. 1, show soft grinding and polishing dish of the present invention.
This soft grinding and polishing dish 1 is circular disk configuration, and middle part is provided with through hole, can be fixed to grinding tool by fixtureUpper, require high workpiece to carry out process operation by soft grinding and polishing dish 1 to the surface accuracy such as such as silicone disc.
Referring to Fig. 2, show the structural representation of a kind of embodiment of the soft grinding and polishing dish of the present invention.
This soft grinding and polishing dish 1 at least includes grinding layer 11, and by comparative analysis, described grinding layer 11 is by being selected fromThe material of soft metal is made, and because soft metal is softer, in the time that workpiece is carried out to polishing, in last polishing process, can realizeThe high finishing polish of effects on surface.
And optionally, by selecting, find that tin, as the material in soft metal, is ductile, moulding condition is goodAdvantage, but fusing point is lower, and can effectively overcome its defect by certain lead that adulterates in tin, therefore by certain relatively dividingAnalyse, described grinding layer 11 is made by leypewter, and each composition quality degree of described leypewter is as follows: tin is65-75%, lead is 25-35%, and preferably, tin is 68-70%, and lead is 30-32%, the leypewter of this composition, it is not only protectedStay the intensity of soft metal, simultaneously also improved the fusing point of soft metal, avoided the separation of chip in grinding process and come off, ledCause machined surface is produced to cut.
Meanwhile, the present inventor by increasing the antimony of 0.1-0.5% in alloy, and especially 0.3% antimony, makesBy performance that can better balanced alloy in process, obviously improve the effect of grinding.
Because the selection of alloy material can not significantly improve intensity and the fusing point of grinding layer, and in the time of grinding, owing to addingThe raising of work process temperature, causes grinding layer to deform, especially on periphery, be out of shape more obvious, for avoiding occurring thisThe situation of kind, soft grinding and polishing dish 1 of the present invention is provided with strengthening layer 12 at grinding layer 11 rears, and this strengthening layer 12 is by strongDegree and fusing point are all made higher than the material of grinding layer 11, to avoid the grinding layer distortion in process, by this strengthening layerSetting, make to add man-hour, the distortion of grinding layer 11 be reinforced layer 12 absorb, can effectively keep the uniformity on grinding layer 11 surfaces.
Optionally, this strengthening layer 12 is made of cast iron.
Referring to Fig. 3 and Fig. 4, show the another kind of embodiment of the soft grinding and polishing dish of the present invention.
In this embodiment, be provided with multiple reinforcements 13 in strengthening layer 12, described reinforcement 13 is described strong for embeddingThe cylinder of changing layer 12, spaced arrangement is in the periphery of described strengthening layer 12.
Below by recently describing effect of the present invention:
Choose respectively five groups of experimental subjects, first group is the soft grinding head of commonly using, and is made up of tin, and thickness is 24mm; TheTwo groups is structure of the present invention, and leypewter layer is 12mm, and percentage is: tin is 65%, and lead is 35%; Strengthening layer thickness is12mm, material is cast iron, without reinforcement; The 3rd group is structure of the present invention, and leypewter layer is 12mm, and percentage is: tin is66%, lead is 33.8%, and antimony is 0.2%; Strengthening layer thickness is 12mm, and material is cast iron, has reinforcement; The 4th group is of the present inventionStructure, leypewter layer is 12mm, and percentage is: tin is 70%, and lead is 30%; Strengthening layer thickness is 12mm, and material is cast iron,Without reinforcement; The 5th group is structure of the present invention, and leypewter layer is 12mm, and percentage is: tin is 68%, and lead is 31.7%, antimonyBe 0.3%; Strengthening layer thickness is 12mm, and material is cast iron, has reinforcement, and five groups are carried out last polishing to 2000 CDs respectivelyOperation, evaluates five groups of experimental subjects by the minimizing thickness of the rate of pass, dish and the degree of deformation of dish respectively.
In another group contrast experiment, by four groups of removing materials, the grinding layer of first group is 10mm, and percentage is: tinBe 65%, lead is 35%, does not wherein add any antimony; Strengthening layer thickness is 10mm, and material is cast iron; Second group grinding layerFor 10mm, percentage is: tin is 65%, and lead is 34.9%, adds 0.1% antimony; Strengthening layer thickness is 10mm, and material is castingIron; Second group grinding layer be 10mm, percentage is: tin is 65%, lead is 34.6%, adds 0.4% antimony; Strengthening layer thicknessFor 10mm, material is cast iron; Second group grinding layer be 10mm, percentage is: tin is 65%, lead is 34.7%, add 0.3%Antimony; Strengthening layer thickness is 10mm, and material is cast iron; Four groups are carried out last polishing process to 2000 CDs respectively, logical respectivelyCross the minimizing thickness of the rate of pass, dish and the degree of deformation of dish is evaluated four groups of experimental subjects.
More known, add by the difference of antimony, also can effectively improve Grinding Quality.
Known by above-mentioned experiment, soft grinding and polishing dish tool of the present invention has the following advantages:
1, grinding polishing effect is good, is difficult for producing chip, has effectively improved the rate of pass;
2, distortion is few, and anti-wear performance is better, has extended service life, has reduced maintenance cost;
3, manufacture simply, good forming effect, manufacturing cost is lower.
It is evident that, above description and record be only for example instead of for limit of the present invention open inHold, apply or use. Although oneself was through describing in an embodiment and be described in the drawings embodiment, the present invention does not limitThe optimal mode of being thought at present by the conduct of accompanying drawing example and description is in an embodiment to implement the particular case of instruction of the present invention
Son, scope of the present invention will comprise any embodiment that falls into description above and appended claim.
Claims (3)
1. a soft grinding and polishing dish, is circular disk configuration, and middle part is provided with through hole, it is characterized in that: this soft grinding and polishing dishAt least include grinding layer, described grinding layer is made up of leypewter, each composition quality degree of described leypewterAs follows: tin is 65-75%, lead is 25-35%; Described grinding layer rear is provided with strengthening layer, and this strengthening layer is by intensity and fusing pointAll make higher than the material of grinding layer; In strengthening layer, be provided with multiple reinforcements, described reinforcement is for embedding described strengthening layerCylinder, spaced arrangement is in the periphery of described strengthening layer.
2. soft grinding and polishing dish as claimed in claim 1, is characterized in that: each composition quality percentage of leypewterContent is as follows: tin is 68-70%, and lead is 30-32%.
3. soft grinding and polishing dish as claimed in claim 1, is characterized in that: this strengthening layer is made of cast iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310402613.3A CN103465154B (en) | 2013-09-07 | 2013-09-07 | Soft grinding and polishing dish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310402613.3A CN103465154B (en) | 2013-09-07 | 2013-09-07 | Soft grinding and polishing dish |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103465154A CN103465154A (en) | 2013-12-25 |
| CN103465154B true CN103465154B (en) | 2016-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310402613.3A Active CN103465154B (en) | 2013-09-07 | 2013-09-07 | Soft grinding and polishing dish |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103465154B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412902A (en) * | 2007-10-16 | 2009-04-22 | 研磨剂与耐火品研究与开发中心C.A.R.R.D.有限公司 | Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2340384A (en) * | 1939-04-10 | 1944-02-01 | American Steel & Wire Co | Lapping tool |
| JP3954190B2 (en) * | 1998-02-26 | 2007-08-08 | 株式会社東芝 | Lapping surface plate and lapping apparatus using the same |
| JP2002507491A (en) * | 1998-03-27 | 2002-03-12 | サンーゴバン アブレイシブズ，インコーポレイティド | Polishing tool |
| US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
| JP2003225866A (en) * | 2002-01-31 | 2003-08-12 | Allied Material Corp | Metal bond diamond lapping surface plate for processing thin sheet |
| CN101875185B (en) * | 2009-04-29 | 2012-01-04 | 重庆川仪自动化股份有限公司 | Manufacturing method of polishing disk for gem plane and material for preparing polishing layer |
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2013
- 2013-09-07 CN CN201310402613.3A patent/CN103465154B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412902A (en) * | 2007-10-16 | 2009-04-22 | 研磨剂与耐火品研究与开发中心C.A.R.R.D.有限公司 | Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives |
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| Publication number | Publication date |
|---|---|
| CN103465154A (en) | 2013-12-25 |
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