CN103458615A - PCB for novel integrated manufacturing of electronic component structure - Google Patents

Abstract

The invention discloses a method for integratedly manufacturing electronic component materials in a printed circuit board, which includes a board body, wiring and via holes arranged on the board body and in the board body, and materials for making electronic components. The board body has a relative upper surface, a lower surface and an intermediate layer, and the wiring includes an upper row of wiring arranged on the upper surface, a lower row of wiring arranged on the lower surface, and a wiring in the board connecting the upper and lower rows of wiring, so The above-mentioned via holes are via holes connecting the upper and lower rows and the wiring in the middle layer of the board body. The printed circuit board arranges the materials of integrated electronic components in the board body, which can save the layout space of the printed circuit board, shorten the design cycle, and make the printed circuit board develop in the direction of miniaturization and functionalization.

Description

A new type of printed circuit board with integrated electronic component structure

technical field

The invention relates to the field of electronic components, in particular to a printed circuit board with an improved structure.

Background technique

In the design of electronic circuit products, electronic components are generally soldered on the upper or lower surface of the printed circuit board, and some SMD electronic components (resistors, capacitors, inductors, diodes, etc.) occupy a large space on the printed circuit board. For a printed circuit board of a specified size, it is very difficult to place more electronic components, which hinders the development of miniaturization and functionalization of electronic products. If the printed circuit board space occupied by SMD electronic components (resistors, capacitors, inductors, diodes, etc.) can be removed, a lot of layout space will be saved. Therefore need a kind of new technical problem to solve the above-mentioned problem.

Contents of the invention

The object of the present invention is to address the deficiencies in the prior art and provide a printed circuit board that can save layout space and integrate materials for making electronic components (resistors, capacitors, inductors, diodes, etc.) inside. In order to realize the above-mentioned purpose of the invention, the material method of integrated manufacturing electronic components (resistance, capacitance, inductance, diode etc.) in the printed circuit board of the present invention can adopt following technical scheme:

A material for the integrated production of electronic components (resistors, capacitors, inductors, diodes, etc.) , inductors, diodes, etc.) materials. The board body has a relative upper surface, a lower surface and an intermediate layer, and the wiring includes an upper row of wiring arranged on the upper surface, a lower row of wiring arranged on the lower surface, and a wiring in the board connecting the upper and lower rows of wiring, so The vias are vias connecting the upper and lower rows and the wiring in the middle layer of the board body. In the printed circuit board, materials for integrated electronic components are arranged in the board body.

Compared with the background technology, the beneficial effect of the present invention is that the materials for making electronic components (resistors, capacitors, inductors, diodes, etc.) are integrated inside the printed circuit board, which can save the layout space of the printed circuit board and make the Miniaturization and functional development can reduce the number of patch soldering, reduce the production process of products, and solve problems such as electromagnetic interference and crosstalk to a large extent.

Description of drawings

FIG. 1 is a schematic structural view of an embodiment of the present invention in which materials for making electronic components (resistors, capacitors, inductors, diodes, etc.) are integrated into a printed circuit board.

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment, please refer to shown in Fig. 1, (printed circuit board is taken as an example with four-layer board), for integrating and making electronic components (resistance, electric capacity, inductance, diode etc.) in the printed circuit board of the present invention An embodiment of the material. The materials integrated in the printed circuit board to manufacture electronic components (resistors, capacitors, inductors, diodes, etc.) include boards 1-6 (hereinafter referred to as boards) and wiring arranged on the boards. The board body has an upper surface 1 and a lower surface 6 opposite to each other. The wiring includes an upper row of wiring 11 arranged on the upper surface 1 , a lower row of wiring 12 arranged on the lower surface 6 , and a wiring 10 arranged between the upper surface 1 and the lower surface 6 . Materials 9 for making electronic components (resistors, capacitors, inductors, diodes, etc.) are provided in the board. In this embodiment, the board is provided with a via hole 7 penetrating through the upper surface and a lower surface of the board body, and a via hole 8 penetrating through the inside of the board body. The material 9 for making electronic components (resistors, capacitors, inductors, diodes, etc.) is connected to the internal vias 8 of the board through the internal wiring 10 of the board, and the internal vias 8 are connected to the vias 7 passing through the board through the internal wiring of the board. , the via hole 7 is connected to the wiring 11 and 12 on the upper surface and the lower surface of the board. In this way, the material 9 for making electronic components (resistors, capacitors, inductors, diodes, etc.) is connected to the inside of the board and the upper and lower surfaces of the board through wiring and via holes.

The above embodiments can realize the connection of upper surface wiring, internal wiring and lower surface wiring by integrating the materials of electronic components (resistors, capacitors, inductors, diodes, etc.) in the printed circuit board, which can save the layout space of the printed circuit board, The miniaturization of the printed circuit board is developed, and it is convenient for the circuit designer to design the circuit, saving design time.

To sum up, the above is only an example of the present invention, and the corresponding size can be designed for different printed circuit boards. All equivalent modifications made according to the claims of the present invention and the content of the description of the invention are covered by the patent of the present invention. In the range.

Claims (2)

1. A material for integrated production of electronic components in a printed circuit board, including a board body and wiring, vias and materials for making electronic components arranged on the board body and in the board body. The board body has a relative upper surface, a lower surface and an intermediate layer, and the wiring includes an upper row of wiring arranged on the upper surface, a lower row of wiring arranged on the lower surface, and a wiring in the board connecting the upper and lower rows of wiring, so The vias are vias connecting the upper and lower rows and the wiring in the middle layer of the board body. It is characterized in that: materials for the integrated production of electronic components are arranged in the board body. 2. The material for the integrated production of electronic components in a printed circuit board according to claim 1, characterized in that: the board is provided with openings and wiring through the board and the inside of the board, and the electronic components for making are The material is integrated in the printed circuit board and connected to the upper wiring and the lower wiring, the wiring and the via hole in the printed circuit board.

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