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CN103424057B - Micro electromechanical structure deflection angle measures vernier scale - Google Patents

Micro electromechanical structure deflection angle measures vernier scale Download PDF

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CN103424057B
CN103424057B CN201310399725.8A CN201310399725A CN103424057B CN 103424057 B CN103424057 B CN 103424057B CN 201310399725 A CN201310399725 A CN 201310399725A CN 103424057 B CN103424057 B CN 103424057B
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baseline
convex
vertical
deflection angle
vernier
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CN103424057A (en
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李伟华
王雷
张晓强
张璐
周再发
孙超
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Southeast University
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Abstract

本发明公开了一种用于测量微机电结构偏转角度的游标尺结构,该结构既可以测量顺时针偏转角,也可以测量逆时针偏转角。微机电结构偏转角测量游标尺由一维移动测量游标尺;偏转指针板;相对型电热执行器;连接一维移动测量游标尺和相对型电热执行器的水平直梁,以及连接偏转指针板和相对型电热执行器的水平直梁组成。通过电热执行器推动角度测量指针偏转并同时带动游标尺结构水平直线移动。根据游标尺的水平移动量和设计参数并由简单地数学计算得到指针所发生的角度偏转量。通过该游标尺可以测量微机电器件受驱动所产生的偏转角,也可以测量结构释放时因残余应力而产生的偏转角。

The invention discloses a vernier structure for measuring the deflection angle of a micro-electromechanical structure. The structure can measure both the clockwise deflection angle and the counterclockwise deflection angle. The micro-electromechanical structure deflection angle measuring vernier consists of a one-dimensional moving measuring vernier; a deflection pointer plate; a relative electrothermal actuator; a horizontal straight beam connecting the one-dimensional moving measuring vernier and the relative electrothermal actuator, and connecting the deflection pointer plate and The horizontal straight beam of the relative type electrothermal actuator is composed. The electrothermal actuator pushes the angle measurement pointer to deflect and simultaneously drives the vernier structure to move horizontally and linearly. According to the horizontal movement of the vernier and the design parameters, the angular deflection of the pointer can be obtained through simple mathematical calculation. The vernier scale can measure the deflection angle generated by the driving of the micro-electromechanical device, and can also measure the deflection angle generated by the residual stress when the structure is released.

Description

微机电结构偏转角测量游标尺MEMS deflection angle measurement vernier

技术领域technical field

本发明提供了一种用于微机电结构偏转角测量的游标尺结构。属于微机电系统(MEMS)测试技术领域。The invention provides a vernier structure for measuring the deflection angle of the micro-electromechanical structure. The invention belongs to the technical field of microelectromechanical system (MEMS) testing.

背景技术Background technique

微机电器件中做偏转运动部件工作时的偏转角,以及微机电材料参数测试中的偏转角是反映器件与材料性能的重要参量,另一方面,这些偏转角除和设计值有关外,还将受到加工过程的影响,这些由加工工艺所导致的不确定因素,将使得器件设计与性能预测出现不确定和不稳定的情况。实际偏转角的测试目的之一就在于能够实时地测量由具体工艺制造的微机电器件参数,并可对工艺的稳定性进行监控,根本目的是将参数反馈给设计者,以便获得准确的设计。The deflection angle of the deflection moving part in the MEMS device and the deflection angle in the parameter test of the MEMS material are important parameters reflecting the performance of the device and the material. On the other hand, these deflection angles are not only related to the design value, but also Affected by the processing process, these uncertain factors caused by the processing technology will make device design and performance prediction uncertain and unstable. One of the purposes of testing the actual deflection angle is to be able to measure the parameters of MEMS devices manufactured by a specific process in real time, and to monitor the stability of the process. The fundamental purpose is to feed back the parameters to the designer in order to obtain an accurate design.

上述偏转角的产生原因通常有两个:驱动产生位移和结构释放产生形变位移。驱动产生的偏转角是微机电执行机构受到信号的作用而产生的角度偏转,典型的例子是长短梁电热执行所产生的结构偏转。结构释放产生的形变位移是由于结构释放后因残余应力释放所产生的偏转,典型的情况是两层材料的残余张应力释放所产生的结构弯曲。发生偏转的结构所具有的共同特征是这些结构具有自由端,即结构至少有一端悬浮在衬底材料之上。There are usually two reasons for the above-mentioned deflection angles: displacement due to driving and deformation displacement due to release of the structure. The deflection angle generated by the drive is the angular deflection of the micro-electromechanical actuators under the action of the signal. A typical example is the structural deflection generated by the electrothermal execution of long and short beams. The deformation displacement caused by the release of the structure is due to the deflection caused by the release of the residual stress after the release of the structure. The typical case is the bending of the structure caused by the release of the residual tensile stress of the two-layer material. A common feature shared by the deflecting structures is that they have free ends, ie at least one end of the structure is suspended above the substrate material.

测量偏转角的方法多种多样,大多数需要借助特殊的仪器。由于器件与材料参数测试结构的实际偏转角度与工艺密切相关,因此比较理想的方法是进行在线测量,即不离开加工环境并采用通用设备进行测试。There are various methods of measuring deflection angle, most of which require special instruments. Since the actual deflection angle of the device and material parameter test structure is closely related to the process, the ideal method is to conduct online measurement, that is, to use general-purpose equipment for testing without leaving the processing environment.

本发明提供了一种用于测量微机电结构偏转角的游标尺结构,该结构既可以测量顺时针偏转角,也可以测量逆时针偏转角。微机电偏转角测量游标尺由四个部分组成:一维移动测量游标尺;偏转指针板;相对型电热执行器;连接一维移动测量游标尺和相对型电热执行器的水平直梁,以及连接偏转指针板与相对型电热执行器的水平直梁。通过电热执行器推动角度测量指针偏转并同时带动游标尺结构水平直线移动。根据游标尺的水平移动量和设计参数并由简单地数学计算得到指针所发生的角度偏转量。通过该游标尺可以测量微机电器件受驱动所产生的偏转角,也可以测量结构释放时因残余应力而产生的偏转角。The invention provides a vernier structure for measuring the deflection angle of a micro-electromechanical structure, and the structure can measure both clockwise deflection angle and counterclockwise deflection angle. The micro-electromechanical deflection angle measuring vernier consists of four parts: one-dimensional moving measuring vernier; deflection pointer plate; opposite type electrothermal actuator; horizontal straight beam connecting one-dimensional moving measuring vernier and opposite type Horizontal straight beam for deflection pointer plate and opposite type electrothermal actuator. The electrothermal actuator pushes the angle measurement pointer to deflect and simultaneously drives the vernier structure to move horizontally and linearly. According to the horizontal movement of the vernier and the design parameters, the angular deflection of the pointer can be obtained through simple mathematical calculation. The vernier scale can measure the deflection angle generated by the driving of the micro-electromechanical device, and can also measure the deflection angle generated by the residual stress when the structure is released.

发明内容Contents of the invention

本发明提供了一种用于测量微机电结构偏转角的游标尺结构,该结构既可以测量顺时针偏转角,也可以测量逆时针偏转角。通过该游标尺可以测量微机电器件受驱动所产生的偏转角,也可以测量结构释放时因残余应力而产生的偏转角。The invention provides a vernier structure for measuring the deflection angle of a micro-electromechanical structure, and the structure can measure both clockwise deflection angle and counterclockwise deflection angle. The vernier scale can measure the deflection angle generated by the driving of the micro-electromechanical device, and can also measure the deflection angle generated by the residual stress when the structure is released.

为实现上述目的,本发明采用的技术方案是:In order to achieve the above object, the technical scheme adopted in the present invention is:

一种微机电结构偏转角测量游标尺,该游标尺结构由一维移动测量游标尺、偏转指针板、相对型电热执行器、连接一维移动测量游标尺和相对型电热执行器的第一水平直梁,以及连接偏转指针板和相对型电热执行器的第二水平直梁,其特征在于:A micro-electromechanical structure deflection angle measuring vernier, the vernier structure consists of a one-dimensional moving measuring vernier, a deflection pointer plate, a relative electrothermal actuator, and a first level connecting the one-dimensional moving measuring vernier and the relative electrothermal actuator a straight beam, and a second horizontal straight beam connecting the deflection pointer plate and the opposing type electrothermal actuator, characterized by:

所述一维移动测量游标尺由左右两部分组成,其左半部分包括多个相同并顺时针旋转90度的“T”型结构,旋转后的“T”型结构由水平矩形和与其垂直的竖直矩形构成;The one-dimensional mobile measuring vernier consists of left and right parts, the left half of which includes a plurality of identical "T"-shaped structures rotated 90 degrees clockwise, and the rotated "T"-shaped structure consists of a horizontal rectangle and a vertical vertical rectangles;

各个“T”型结构的水平矩形与竖直梁垂直连接,“T”型结构的竖直矩形的两条长边是对准用的基线,其中,右侧长边为A基线,左边长边为B基线,所有“T”型结构的尺寸完全相同,所有A基线在一条直线上,B基线在另一条直线上;The horizontal rectangles of each "T"-shaped structure are vertically connected to the vertical beams, and the two long sides of the vertical rectangles of the "T"-shaped structure are the baselines for alignment. Among them, the right long side is the A baseline, and the left long side For the B baseline, all "T"-shaped structures have exactly the same size, all A baselines are on one straight line, and B baselines are on another straight line;

所述一维移动测量游标尺的右半部分由梳齿结构和位于齿上的“凸”型结构构成,梳齿结构由锚区和垂直连接到锚区的若干齿构成。在齿上与“T”型结构相邻的一边设计有“凸”型结构,“凸”型结构的个数等于齿的个数减1后乘以2,“凸”型结构上与齿垂直的4条直线是另一组对准基线,其中最左边的为C1对准基线,向右依次为C2、C3、C4对准基线,C1、C2基线间距以及C3、C4基线间距均等于(“凸”型结构个数×2-1)×△,其中△为游标的最小分辨单位;The right half of the one-dimensional mobile measuring vernier consists of a comb-tooth structure and a "convex" structure on the teeth. The comb-tooth structure is composed of an anchor area and several teeth vertically connected to the anchor area. A "convex" structure is designed on the side adjacent to the "T" structure on the tooth. The number of "convex" structures is equal to the number of teeth minus 1 and multiplied by 2. The "convex" structure is perpendicular to the teeth. The 4 straight lines are another set of alignment baselines, among which the leftmost one is C1 alignment baseline, and the right ones are C2, C3, and C4 alignment baselines. The distance between C1 and C2 baselines and the distance between C3 and C4 baselines are all equal to (" The number of "convex" structures × 2-1) × △, where △ is the minimum resolution unit of the cursor;

所述偏转指针板由固定在衬底上的锚区;具有两个指针的矩形指针板;连接锚区和矩形指针板的细梁三部分组成,其中,所述矩形指针板的上端有两条指针Z1和Z2,两条指针的旋转圆点位于锚区与细梁的结合点O,其中Z1与矩形指针板的长边平行,Z2相对于Z1顺时针旋转α度,在矩形指针板上沿着指针方向开了若干孔;The deflection pointer plate is composed of an anchor area fixed on the substrate; a rectangular pointer plate with two pointers; a thin beam connecting the anchor area and the rectangular pointer plate, wherein the upper end of the rectangular pointer plate has two Pointers Z1 and Z2, the rotation points of the two pointers are located at the joint point O of the anchor area and the thin beam, where Z1 is parallel to the long side of the rectangular pointer plate, Z2 is rotated clockwise by α degrees relative to Z1, and on the edge of the rectangular pointer plate A number of holes are opened in the direction of the pointer;

所述相对型电热执行器由上下两个普通的横向运动电热执行器相对连接而成,横向运动电热执行器由锚区、细梁、宽梁、细梁、连接梁组成,上下两个横向运动电热执行器通过水平细梁、竖直宽梁和水平细梁连接;The relative type electrothermal actuator is composed of two common horizontal motion electrothermal actuators connected up and down. The lateral motion electrothermal actuator is composed of anchor area, thin beam, wide beam, thin beam and connecting beam. The electrothermal actuator is connected by horizontal thin beams, vertical wide beams and horizontal thin beams;

所述微机电偏转角测量游标尺各组成部分的连接关系如下:相对型电热执行器中宽梁的垂直对称中心位置上左右各有一根连接梁,其中第二连接梁的另一端与矩形指针板垂直连接,第一连接梁的另一端和一维移动测量游标尺左半部分中直梁垂直连接,第二连接梁的垂直中分线到O点的垂直距离为L;整个结构除固定在衬底上的锚区外全部悬浮于衬底之上。The connection relationship of the various components of the micro-electromechanical deflection angle measuring vernier is as follows: there is a connecting beam on the left and right of the vertical symmetrical center of the wide beam in the relative electrothermal actuator, and the other end of the second connecting beam is connected to the rectangular pointer plate. Vertically connected, the other end of the first connecting beam is vertically connected with the straight beam in the left half of the one-dimensional mobile measuring vernier, and the vertical distance from the vertical middle line of the second connecting beam to point O is L; the whole structure is fixed on the lining All but the anchor region on the bottom are suspended above the substrate.

根据本发明的一个方面,所述一维移动测量游标尺的齿和“T”型结构间隔排列,其中右半部分的锚区与左半部分的直梁平行,右半部分的齿与左半部分“T”型结构的底部所对应的矩形结构平行。According to one aspect of the present invention, the teeth of the one-dimensional mobile measuring vernier are arranged at intervals with the "T"-shaped structure, wherein the anchor area of the right half is parallel to the straight beam of the left half, and the teeth of the right half are aligned with the left half. The rectangular structures corresponding to the bottom of some "T"-shaped structures are parallel.

根据本发明的一个方面,B基线与最上边的“凸”型结构的C2对准基线对齐,A基线与B基线的间距比C2、C4或C1、C3间距大1△。According to one aspect of the present invention, the B base line is aligned with the C2 alignment base line of the uppermost "convex" structure, and the distance between the A base line and the B base line is 1△ larger than the distance between C2, C4 or C1, C3.

根据本发明的一个方面,任何两个上下相邻的“凸”型结构,设置在下面的“凸”型结构比上面的“凸”型结构向左平移2△。According to one aspect of the present invention, for any two adjacent "convex" structures up and down, the lower "convex" structure is shifted to the left by 2Δ than the upper "convex" structure.

与现有技术相比,本发明具有以下有益效果:Compared with the prior art, the present invention has the following beneficial effects:

本发明所提供的微机电结构偏转角测量游标尺,其特点在于结构简单并且能够测量待测结构顺、逆时针偏转。在实际测试中,最常用的在线测试设备是显微镜,本发明所提供的一维移动游标尺是直线对准方式,在普调的显微镜下可以直观地检查对准的位置,并可根据对准位置直接读出偏移量。本发明所提供的结构可以采用多晶硅制作,微机电工艺中的多晶硅通常有2层以上,属于普通材料。另一方面,本发明所提供的一维移动游标尺不受工艺偏差的影响,工艺加工中出现的最常见情况是加工线条的宽度发生变化,例如过刻蚀导致线条变细以及欠刻蚀导致的线条变宽,由于本发明的结构是同一材料,相同的加工过程,因此出现线宽误差时,“T”型结构和“凸”型结构中的对准基线的偏离程度是相同的,并且是同方向的,其相对位置并没有发生变化。The micro-electromechanical structure deflection angle measuring vernier provided by the invention is characterized in that it has a simple structure and can measure the clockwise and anticlockwise deflection of the structure to be measured. In actual testing, the most commonly used on-line testing equipment is a microscope. The one-dimensional moving vernier provided by the present invention is a linear alignment method, which can visually check the alignment position under a general-tuning microscope, and can The position is directly read off the offset. The structure provided by the present invention can be made of polysilicon, and the polysilicon in the MEMS process usually has more than two layers, which is a common material. On the other hand, the one-dimensional moving vernier provided by the present invention is not affected by process deviation. The most common situation in process processing is that the width of the processing line changes, such as over-etching leads to line thinning and under-etching causes The line becomes wider, because the structure of the present invention is the same material and the same processing process, when there is a line width error, the degree of deviation of the alignment base line in the "T" structure and the "convex" structure is the same, and are in the same direction, and their relative positions have not changed.

附图说明Description of drawings

现在将描述如本发明的优选但非限制性的实施例,本发明的这些和其他特征、方面和优点在参考附图阅读如下详细描述时将变得显而易见,其中:These and other features, aspects and advantages of the invention will now be described as preferred but non-limiting embodiments of the invention will become apparent when the following detailed description is read with reference to the accompanying drawings in which:

图1是本发明的俯视图;Fig. 1 is a top view of the present invention;

图2是本发明的局部结构图;Fig. 2 is a partial structural diagram of the present invention;

图3是本发明的一维移动游标对准关系图;Fig. 3 is a one-dimensional moving cursor alignment diagram of the present invention;

附图标记:100—相对型电热执行器,101—横向运动电热执行器、101-7(101-9)—第一(第二)水平细梁,101-8—竖直宽梁,101-1,101-2—锚区,101-3—第一细梁,101-4—宽梁,101-5—连接梁,101-6—第二细梁;Reference signs: 100—relative type electric heating actuator, 101—transverse motion electric heating actuator, 101-7 (101-9)—first (second) horizontal thin beam, 101-8—vertical wide beam, 101- 1, 101-2—anchor area, 101-3—first thin beam, 101-4—wide beam, 101-5—connecting beam, 101-6—second thin beam;

102—一维移动测量游标尺,102-1—水平矩形,102-2—竖直矩形,102-3—竖直梁,102-4—锚区,102-11—齿,102-5~102-10—“凸”型结构;102—one-dimensional mobile measuring vernier, 102-1—horizontal rectangle, 102-2—vertical rectangle, 102-3—vertical beam, 102-4—anchor area, 102-11—tooth, 102-5~102 -10—"convex" structure;

103—偏转指针板,103-1—锚区,103-2—连接梁,103-4—矩形板,103-3—孔,Z1、Z2—指针;103—deflection pointer plate, 103-1—anchor area, 103-2—connecting beam, 103-4—rectangular plate, 103-3—hole, Z1, Z2—pointer;

104—连接一维移动测量游标尺102和相对型电热执行器中101-8的第一水平直梁,105—连接偏转指针板103与相对型电热执行器中101-8的第二水平直梁。104—connect the one-dimensional mobile measuring vernier scale 102 and the first horizontal straight beam of 101-8 in the relative electrothermal actuator, 105—connect the deflection pointer plate 103 and the second horizontal straight beam of 101-8 in the relative electrothermal actuator .

具体实施方式detailed description

以下的说明本质上仅仅是示例性的而并不是为了限制本公开、应用或用途。应当理解的是,在全部附图中,对应的附图标记表示相同或对应的部件和特征。下面结合附图1~3对本发明做更进一步的说明。The following description is merely exemplary in nature and not intended to limit the disclosure, application or use. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features. The present invention will be further described below in conjunction with accompanying drawings 1-3.

由附图1可以看到,本发明的结构由一维移动测量游标尺102、偏转指针板103、相对型电热执行器100、连接一维移动测量游标尺102和相对型电热执行器100的水平直梁104以及连接相对型电热执行器100和偏转指针板103的水平直梁105所组成。As can be seen from accompanying drawing 1, the structure of the present invention consists of a one-dimensional mobile measuring vernier 102, a deflection pointer plate 103, a relative electrothermal actuator 100, and a level connecting the one-dimensional mobile measuring vernier 102 and the relative electrothermal actuator 100. It consists of a straight beam 104 and a horizontal straight beam 105 connecting the relative electrothermal actuator 100 and the deflection pointer plate 103 .

所述一维移动测量游标尺102由左右两部分组成,其中:The one-dimensional mobile measuring vernier 102 is composed of left and right parts, wherein:

一维移动测量游标尺102的左半部分包括多个尺寸完全相同并顺时针旋转90度的“T”型结构,“T”型结构的“|”部分(底部)为水平矩形接轨102-1,“T”型结构的“一”部分(顶部)为竖直矩形结构102-2,各个“T”型结构的水平矩形102-1与一个竖直梁102-3连接,呈垂直关系。“T”型结构的“一”部分(顶部)所对应的竖直矩形102-2,其两条长边是对准用的基线,其中,右侧长边为A基线,左边长边为B基线(图2所示)。因为所有“T”型结构的尺寸完全相同,所以,所有“T”型结构的A基线在一条直线上,B基线在另一条直线上。The left half of the one-dimensional mobile measuring vernier 102 includes a plurality of "T"-shaped structures with the same size and rotated 90 degrees clockwise. The "|" part (bottom) of the "T"-shaped structure is a horizontal rectangular rail 102-1 , the "one" part (top) of the "T"-shaped structure is a vertical rectangular structure 102-2, and the horizontal rectangle 102-1 of each "T"-shaped structure is connected with a vertical beam 102-3 in a vertical relationship. The vertical rectangle 102-2 corresponding to the "one" part (top) of the "T" structure has two long sides as baselines for alignment, wherein the long side on the right side is the baseline A, and the long side on the left side is B Baseline (shown in Figure 2). Because the dimensions of all "T"-shaped structures are exactly the same, the A baselines of all "T"-shaped structures are on one straight line, and the B baselines are on another straight line.

所述一维移动测量游标尺102的右半部分包括两个主要单元:梳齿结构和位于齿上的“凸”型结构。梳齿结构由锚区102-4和垂直连接到锚区的若干齿102-11构成。在齿上与“T”型结构相邻的一边设计有“凸”型结构(102-5~102-10)。“凸”型结构的个数等于齿的个数减1后乘以2,本实施例齿的个数为4,所以“凸”型结构的个数为6。“凸”型结构上与齿垂直的4条直线是另一组对准基线,其中,最左边的为C1对准基线,向右依次为C2、C3、C4对准基线。C1、C2基线间距以及C3、C4基线间距等于(“凸”型个数×2-1)×△,△为游标的最小分辨单位,本实施例的上述基线间距为11△。The right half of the one-dimensional movement measuring vernier 102 includes two main elements: a comb structure and a "convex" structure on the teeth. The comb structure consists of an anchor area 102-4 and several teeth 102-11 connected vertically to the anchor area. A "convex" structure (102-5-102-10) is designed on the side adjacent to the "T" structure on the teeth. The number of "convex" structures is equal to the number of teeth minus 1 and multiplied by 2. In this embodiment, the number of teeth is 4, so the number of "convex" structures is 6. The four straight lines perpendicular to the teeth on the "convex" structure are another set of alignment baselines, among which the leftmost alignment baseline is C1, and the rightmost alignment alignment baselines are C2, C3, and C4. The distance between the baselines of C1 and C2 and the distance between the baselines of C3 and C4 is equal to (the number of “convex” shapes×2-1)×△, and △ is the minimum resolution unit of the cursor. The above-mentioned baseline distance in this embodiment is 11△.

所述一维移动测量游标尺的齿和“T”型结构间隔排列,其中右半部分的锚区102-4与左半部分的竖直梁102-3平行,右半部分的齿102-11与左半部分“T”型结构的“|”部分(底部)所对应的水平矩形102-1平行。The teeth of the one-dimensional mobile measuring vernier are arranged at intervals with the "T" structure, wherein the anchor area 102-4 of the right half is parallel to the vertical beam 102-3 of the left half, and the teeth 102-11 of the right half are It is parallel to the horizontal rectangle 102-1 corresponding to the "|" part (bottom) of the "T"-shaped structure in the left half.

由附图2可以看到,B基线与最上边的“凸”型结构102-5的C2对准基线对齐。A基线与B基线的间距比C2、C4(C1、C3)间距大1△。It can be seen from FIG. 2 that the B baseline is aligned with the C2 alignment baseline of the uppermost "convex" structure 102-5. The distance between A baseline and B baseline is 1△ larger than the distance between C2 and C4 (C1 and C3).

由附图3可以看到,任何两个上下相邻的“凸”型结构,下面的“凸”型结构比上面的“凸”型结构向左平移2△,所以,B基线比第2个“凸”型结构102-6的C2对准基线偏右2△,比第3个“凸”型结构102-7的C2对准基线偏右4△,比第4个“凸”型结构102-8的C2对准基线偏右6△,比第5个“凸”型结构102-9的C2对准基线偏右8△,比第6个“凸”型结构102-10的C2对准基线偏右10△;A基线比最上边“凸”型结构102-5的C4对准基线偏右1△,比第2个“凸”型结构102-6的C4对准基线偏右3△,比第3个“凸”型结构102-7的C4对准基线偏右5△,比第4个“凸”型结构102-8的C4对准基线偏右7△,比第5个“凸”型结构102-9的C4对准基线偏右9△,比第6个“凸”型结构102-10的C4对准基线偏右11△。It can be seen from Figure 3 that for any two "convex" structures that are adjacent up and down, the lower "convex" structure is 2△ to the left than the upper "convex" structure, so the B baseline is larger than the second The C2 alignment baseline of the "convex" structure 102-6 is 2△ to the right, 4△ to the right of the C2 alignment baseline of the third "convex" structure 102-7, and 4△ to the right of the C2 alignment baseline of the fourth "convex" structure 102 -8's C2 alignment baseline is 6△ to the right, 8△ to the right of the C2 alignment baseline of the fifth "convex" structure 102-9, and 8△ to the right of the C2 alignment baseline of the sixth "convex" structure 102-10 The baseline is 10△ to the right; the baseline of A is 1△ to the right of the C4 alignment baseline of the uppermost "convex" structure 102-5, and 3△ to the right of the C4 alignment baseline of the second "convex" structure 102-6 , 5△ to the right of the C4 alignment baseline of the third "convex" structure 102-7, 7△ to the right of the C4 alignment baseline of the fourth "convex" structure 102-8, and 7△ to the right of the C4 alignment baseline of the fourth "convex" The C4 alignment baseline of the convex structure 102-9 is 9△ to the right, which is 11△ to the right of the C4 alignment baseline of the sixth "convex" structure 102-10.

由附图1可以看到,所述偏转指针板103由三部分组成:固定在衬底上的锚区103-1;具有两个指针的矩形指针板103-4;连接锚区103-1和矩形指针板103-4的细梁103-2。其中:As can be seen from accompanying drawing 1, the deflection pointer plate 103 is made up of three parts: the anchor region 103-1 fixed on the substrate; the rectangular pointer plate 103-4 with two pointers; the anchor region 103-1 and the Thin beam 103-2 of rectangular pointer plate 103-4. in:

矩形指针板103-4的上端有两条指针Z1和Z2,两条指针的旋转圆点位于锚区与细梁的结合点O。其中,Z1与矩形指针板103-4的长边平行,Z2相对于Z1顺时针旋转α度。在矩形指针板103-4上沿着指针方向开了若干孔103-3。There are two pointers Z1 and Z2 on the upper end of the rectangular pointer plate 103-4, and the rotating dots of the two pointers are located at the joint point O of the anchor area and the thin beam. Wherein, Z1 is parallel to the long side of the rectangular pointer plate 103-4, and Z2 is rotated by α degrees clockwise relative to Z1. A plurality of holes 103-3 are opened along the pointer direction on the rectangular pointer plate 103-4.

所述相对型电热执行器100由上下两个普通的横向运动电热执行器101相对连接而成,横向运动电热执行器101由锚区101-1和101-2、第一细梁101-3、宽梁101-4、第二细梁101-6、连接101-4和101-6的连接梁101-5组成。上下两个横向运动电热执行器101通过第一水平细梁101-7、竖直宽梁101-8和第二水平细梁101-9连接。The relative electrothermal actuator 100 is composed of two upper and lower common transverse motion electrothermal actuators 101 which are relatively connected. It consists of a wide beam 101-4, a second thin beam 101-6, and a connecting beam 101-5 connecting 101-4 and 101-6. The two horizontally moving electrothermal actuators 101 up and down are connected by a first horizontal thin beam 101-7, a vertical wide beam 101-8 and a second horizontal thin beam 101-9.

所述微机电偏转角测量游标尺各组成部分的连接关系如下:相对型电热执行器100中竖直宽梁101-8的垂直对称中心位置上左右各有一根连接梁105和104(第一、二水平直梁),左边连接梁105(第二水平直梁)的另一端与矩形指针板103垂直连接,右边连接梁104(第一水平直梁)的另一端和一维移动测量游标尺102左半部分中竖直梁102-3垂直连接。左边连接梁105(第二水平直梁)的垂直中分线到O点的垂直距离为L。The connection relationship of the various components of the micro-electromechanical deflection angle measuring vernier scale is as follows: there is a connecting beam 105 and 104 on the left and right of the vertical symmetrical center position of the vertical wide beam 101-8 in the relative electrothermal actuator 100 (first, Two horizontal straight beams), the other end of the left connecting beam 105 (the second horizontal straight beam) is vertically connected with the rectangular pointer plate 103, the other end of the right connecting beam 104 (the first horizontal straight beam) and the one-dimensional mobile measuring vernier scale 102 Vertical beams 102-3 are connected vertically in the left half. The vertical distance from the vertical midline of the left connecting beam 105 (the second horizontal straight beam) to point O is L.

整个结构除固定在衬底上的锚区外全部悬浮于衬底之上,共有6个锚区,分别是:位于一维移动测量游标尺102右半部分的锚区102-4;位于偏转指针板左下部的锚区103-1;相对型电热执行器中的锚区101-1和101-2,每个横向运动电热执行器两个。The entire structure is suspended above the substrate except for the anchor area fixed on the substrate. There are 6 anchor areas in total, namely: the anchor area 102-4 located in the right half of the one-dimensional mobile measuring vernier 102; the anchor area located in the deflection pointer Anchor area 103-1 at the bottom left of the plate; anchor areas 101-1 and 101-2 in opposing type electrothermal actuators, two for each lateral movement electrothermal actuator.

以上所述仅是本发明的优选实施方式,应当指出:对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above is only a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also possible. It should be regarded as the protection scope of the present invention.

Claims (4)

1. a micro electromechanical structure deflection angle measures vernier scale, this vernier scale structure measures vernier scale (102) by one-dimensional movement, deflection dial plate (103), relative type electrical actuator (100), connect one-dimensional movement and measure vernier scale (102) and the first horizontal straight beam (104) of relative type electrical actuator (100), and connect deflection dial plate (103) and the second horizontal straight beam (105) of relative type electrical actuator (100), it is characterized in that: described one-dimensional movement is measured vernier scale (102) and is made up of left and right two parts, its left-half comprises the T-shape structure that multiple identical and dextrorotation turn 90 degrees, postrotational T-shape structure is made up of horizontal rectangular (102-1) and perpendicular vertical rectangle (102-2),
The horizontal rectangular (102-1) of each T-shape structure is connected with vertical beam (102-3) is vertical, two long limits of the vertical rectangle (102-2) of T-shape structure are to mutatis mutandis baseline, wherein, long limit, right side is A baseline, long limit, the left side is B baseline, the size of all T-shape structures is identical, and point-blank, B baseline is on another straight line for all A baselines;
Described one-dimensional movement measures the right half part of vernier scale (102) by comb structure and " convex " type Structure composing be positioned on tooth, comb structure is made up of with the vertical some teeth (102-11) being connected to anchor district (102-4) anchor district (102-4), upper adjacent with T-shape structure while be designed with " convex " type structure (102-5 ~ 102-10) at tooth (102-11), 2 are multiplied by after the number that the number of " convex " type structure equals tooth (102-11) subtracts 1, 4 straight lines vertical with tooth in " convex " type structure are that another is organized and aims at baseline, wherein leftmost is C1 aligning baseline, be followed successively by C2 to the right, C3, C4 aims at baseline, C1, C2 baseline spacing and C3, C4 baseline spacing is equal to (" convex " type structure number × 2-1) × △, wherein △ is the minimum resolution unit of vernier,
Described deflection dial plate (103) is by being fixed on substrate Shang Mao district (103-1); There is the rectangle dial plate (103-4) of two pointers; Connect thin beam (103-2) the three part composition of anchor district (103-1) and rectangle dial plate (103-4), wherein, there are two pointer Z1 and Z2 the upper end of described rectangle dial plate (103-4), article two, the rotation round dot of pointer is positioned at the binding site O of anchor district (103-1) and thin beam (103-2), wherein Z1 is parallel with the long limit of rectangle dial plate (103-4), Z2 to turn clockwise α degree relative to Z1, and rectangle dial plate (103-4) has opened some holes (103-3) along pointer direction;
Described relative type electrical actuator (100) is formed by connecting relatively by upper and lower two common transverse movement electrical actuators (101), transverse movement electrical actuator (101) is by anchor district (101-1,101-2), the first thin beam (101-3), wide beam (101-4), the second thin beam (101-6), tie-beam (101-5) composition, upper and lower two transverse movement electrical actuators (101) are connected with the second horizontal thin beam (101-9) by the first horizontal thin beam (101-7), vertically wide beam (101-8), the annexation that described micro electronmechanical deflection angle measures each ingredient of vernier scale is as follows: in type electrical actuator (100), vertically upper left the parting on the right side in vertical symmetry center of wide beam (101-8) does not have the second horizontal straight beam (105) relatively, first horizontal straight beam (104), wherein the other end of the second horizontal straight beam (105) is connected with rectangle dial plate (103-4) is vertical, the other end and the one-dimensional movement of the first horizontal straight beam (104) are measured vertical beam (102-3) in vernier scale (102) left-half and are vertically connected, the vertical centering control separated time of the second horizontal straight beam (105) is L to the vertical range of O point, total is all suspended in substrate except being fixed on substrate Shang Mao district.
2. micro electromechanical structure deflection angle according to claim 1 measures vernier scale, it is characterized in that described one-dimensional movement measures tooth and the arrangement of T-shape spacing structure of vernier scale, wherein the anchor district (102-4) of right half part and the vertical beam (102-3) of left-half parallel, the tooth (102-11) of right half part is parallel with the rectangular configuration (102-1) corresponding to the bottom of left-half T-shape structure.
3. micro electromechanical structure deflection angle according to claim 1 measures vernier scale, it is characterized in that: B baseline aims at Base alignment: See Alignment, gap ratio C2, C4 or C1 of A baseline and B baseline, large 1 △ of C3 spacing with the C2 of " convex " type structure (102-5) topmost.
4. micro electromechanical structure deflection angle according to claim 1 measures vernier scale, it is characterized in that any two neighbouring " convex " type structures, is arranged on " convex " type structure above " convex " type structural rate below to left 2 △.
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