CN103423630A - Light emitting device - Google Patents
Light emitting device Download PDFInfo
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- CN103423630A CN103423630A CN2012101646178A CN201210164617A CN103423630A CN 103423630 A CN103423630 A CN 103423630A CN 2012101646178 A CN2012101646178 A CN 2012101646178A CN 201210164617 A CN201210164617 A CN 201210164617A CN 103423630 A CN103423630 A CN 103423630A
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Abstract
本发明公开了一种发光装置，其包括至少一光源、至少一基板、至少一底座、至少一热管及一冷却液。该基板具有至少一孔洞。该光源位于该基板上，且相对于该孔洞。该底座具有一贯穿孔。该基板邻接于该底座，且该孔洞连通该贯穿孔。该热管邻接于该底座，且具有一热管开口连通该贯穿孔。该冷却液位于该孔洞内，从而吸收该光源的热量以形成蒸发气体而在该热管内流动。由此，可有效地降低该光源的工作温度。
The invention discloses a light-emitting device, which includes at least one light source, at least one substrate, at least one base, at least one heat pipe and a cooling liquid. The substrate has at least one hole. The light source is located on the substrate and relative to the hole. The base has a through hole. The substrate is adjacent to the base, and the hole is connected to the through hole. The heat pipe is adjacent to the base and has a heat pipe opening connected to the through hole. The cooling liquid is located in the hole, thereby absorbing heat from the light source to form evaporated gas that flows in the heat pipe. As a result, the operating temperature of the light source can be effectively reduced.
Description
Technical field
The present invention relates to a kind of light-emitting device, in detail, relate to a kind of light-emitting device that reduces the operating temperature of light source.
Background technology
Along with environmental protection and energy-conservation subject under discussion day by day come into one's own, the light-emitting device with light emitting diode (LED) replaces traditional bulb gradually.Yet light emitting diode is usually arranged together with many, therefore how effectively heat radiation is a large problem.
With reference to figure 1, shown the cross-sectional schematic of existing light-emitting device.This light-emitting device 1 comprises a light emitting diode (LED) element 10, a substrate 12, a container 16 and a cooling water 14.This substrate 12 is a base plate for packaging, and has a first surface 121, a second surface 122.This light-emitting diode 10 is positioned at the first surface 121 of this substrate 12.The second surface 122 of this substrate 12 is positioned on this container 16.This cooling water 14 is interior mobile at this container 16, to take away the luminous heat produced of this light-emitting diode 10.
The shortcoming that should have light-emitting device 1 now is as follows.The heat of this light-emitting diode 10 is first after the sidewall by this substrate 12 and this container 16, just can enter this cooling water 14, and is taken away by this cooling water 14.Because this substrate 12 and this container 16 is not hot good conductor usually, therefore, the heat of this light-emitting diode 10 can't be transmitted to this cooling water 14 rapidly, causes the radiating efficiency of this existing light-emitting device 1 not high.In other words, the thermal resistance of prior art is excessive.
Summary of the invention
Technical problem to be solved by this invention is: the light-emitting device of prior art, and the heat of its light-emitting diode can't be transmitted to cooling water rapidly, causes radiating efficiency not high, and thermal resistance is excessive.
The invention provides a kind of light-emitting device, it comprises at least one light source, at least one substrate, at least one base, at least one heat pipe and a cooling fluid.This substrate has at least one hole.This light source is positioned on this substrate, and this hole is opened on a surface of this at least one substrate, and with respect to this light source.This base has a through hole, and this through hole runs through this base, and this substrate is adjacent to this base, and this hole is communicated with this through hole.This heat pipe is adjacent to this base, and has a heat pipe opening, this this through hole of heat pipe open communication.This ECL, in this hole, flows to form a boil-off gas thereby absorb the heat that this light source luminescent produces in this heat pipe.
Particularly, the invention provides a kind of light-emitting device, comprising:
At least one light source;
At least one substrate, have at least one hole, and this at least one light source is positioned on this at least one substrate, and this at least one hole is opened on a surface of this at least one substrate, and with respect to this at least one light source;
At least one base, have a through hole, and this through hole runs through this at least one base, and this at least one substrate is adjacent to this at least one base, and this at least one hole is communicated with this through hole;
At least one heat pipe, be adjacent to this at least one base, and have a heat pipe opening, this this through hole of heat pipe open communication; And
One cooling fluid, be positioned at this at least one hole, thereby the heat that absorbs this at least one light source flows in this at least one heat pipe to form boil-off gas.
In above-mentioned light-emitting device, preferably, this at least one substrate also has a first surface and a second surface, and this at least one light source is positioned at this first surface of this at least one substrate, and this at least one hole is opened on this second surface of this at least one substrate; This at least one base also has a first end and one second end, and this through hole is for being opened on respectively this first end and this second end, and this at least one substrate is adjacent to this first end of this at least one base; This at least one heat pipe is adjacent to this second end of this at least one base.
In above-mentioned light-emitting device, preferably, this at least one light source is LED.
In above-mentioned light-emitting device, preferably, this at least one hole is blind hole.
In above-mentioned light-emitting device, preferably, this at least one hole also is opened on this first surface of this at least one substrate, makes this cooling fluid contact this at least one light source.
In above-mentioned light-emitting device, preferably, this cooling fluid is water, methyl alcohol, ethanol, ammonia or acetone.
In above-mentioned light-emitting device, preferably, this through hole has respectively one first opening and one second opening in first end and second end of this at least one base, and this first opening is less than this second opening.
In above-mentioned light-emitting device, preferably, also there is a joint element, between this at least one substrate and this at least one base, in order to engage this at least one substrate and this at least one base, and this joint element is cold welding agent, the ceramic cold welding agent of filling out pore or the packaging plastic of mixing phosphor powder.
In above-mentioned light-emitting device, preferably, this at least one heat pipe comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define a hollow accommodation space and this heat pipe opening, make this boil-off gas flow in this hollow accommodation space through this heat pipe opening, and then form heat exchange across this shell body and external environment, finally be condensed into liquid coolant.
In above-mentioned light-emitting device, preferably, the material of this shell body is metal, and this capillary structure is that copper mesh, copper powder burn solution or groove.
In above-mentioned light-emitting device, preferably, also comprise at least one heat dissipation element, it has a central tube and a plurality of radiating fin, this central tube is sheathed on this at least one heat pipe, and these radiating fins are to be stretched out by this central tube, and this central tube and these radiating fins are formed in one.
In above-mentioned light-emitting device, preferably, also comprise at least one holder and a loading plate, this at least one holder has a central bore, and in order to accommodating this base, and this at least one holder is fixedly arranged on this loading plate, this loading plate has at least one opening, in order to appear this at least one light source.
By technique scheme, light-emitting device of the present invention can realize effectively reducing the useful technique effect of the operating temperature of light source.
The accompanying drawing explanation
Fig. 1 has shown the cross-sectional schematic of existing light-emitting device;
Fig. 2 shows the schematic perspective view of an embodiment of light-emitting device of the present invention;
Fig. 3 shows the partial schematic sectional view of Fig. 2;
Fig. 4 shows the schematic perspective view of another embodiment of light-emitting device of the present invention;
Fig. 5 has shown in different interface temperature situations, the output of light relatively and the graph of a relation between service life of light emitting diode (LED) element;
Fig. 6 has shown the schematic perspective view of another embodiment of light-emitting device of the present invention;
Fig. 7 has shown that the light-emitting device of Fig. 2 is assemblied in the schematic diagram of a loading plate;
Fig. 8 has shown that the light-emitting device of Fig. 4 is assemblied in the schematic diagram of a loading plate; And
Fig. 9 has shown that the light-emitting device of Fig. 6 is assemblied in the schematic diagram of a loading plate.
[main element symbol description]
1 existing light-emitting device
One embodiment of 2 light-emitting devices of the present invention
Another embodiment of 3 light-emitting devices of the present invention
Another embodiment of 3a light-emitting device of the present invention
10 light emitting diodes (LED) element
12 substrates
14 cooling waters
16 containers
20 light sources
22 substrates
24 bases
26 heat pipes
28 cooling fluids
30 joint elements
32 holders
33 heat dissipation elements
The 33a heat dissipation element
34 central tubes
36 radiating fins
The 36a radiating fin
38 loading plates
The first surface of 121 substrates
The second surface of 122 substrates
201 crystal grain
202 adhesive materials
203 wires
The first surface of 221 substrates
The second surface of 222 substrates
223 holes
Fluting on 224
The first end of 241 bases
The second end of 242 bases
243 through holes
261 heat pipe openings
262 shell bodies
263 capillary structures
264 hollow accommodation spaces
321 central bore
The first surface of 381 loading plates
The second surface of 382 loading plates
2431 first openings
2432 second openings.
The specific embodiment
Please refer to Fig. 2, shown the schematic perspective view of an embodiment of light-emitting device of the present invention.Please refer to Fig. 3, shown the partial schematic sectional view of Fig. 2.This light-emitting device 2 comprises at least one light source 20, at least one substrate 22, at least one base 24, at least one heat pipe 26, a cooling fluid 28, a joint element 30 and at least one holder 32.
In the present embodiment, this light source 20 is light emitting diode (LED) element, and it comprises a plurality of crystal grain 201 and an adhesive material 202, and is positioned on this substrate 22.
In the present embodiment, this substrate 22 is metal base printed circuit board (Metal Core PCB, MCPCB), and it has a first surface 221, a second surface 222 and at least one hole 223.This light source 20 is positioned at this first surface 221 of this substrate 22, that is these crystal grain 201 are attached to this first surface 221, and utilizes many wires 203 to be electrically connected to this first surface 221, and this adhesive material 202 coats these crystal grain 201 and these wires 203.
The position of this hole 223 is relative with this light source 20.In the present embodiment, this hole 223 is opened on this second surface 222 and this first surface 221 of this substrate 22, that is this hole 223 runs through this substrate 22, make this cooling fluid 28 after entering this hole 223, can contact these crystal grain 201 of this light source 20, directly to take away the luminous heat produced of these crystal grain 201 of this light source 20.Yet in other embodiments, this hole 223 only is opened on this second surface 222 of this substrate 22, that is this hole 223 is blind hole.Preferably, the upper end of this hole 223 has on one slots 224, and it is opened on this second surface 222 of this substrate 22, and it is the taper external form.In the present embodiment, this substrate 22 has 9 holes 223, and it is arranged in the matrix of 3*3; Yet in other embodiments, this substrate 22 also can only have a hole 223.Also at large say, each of these crystal grain 201 is coordinating each of these holes 223, has how many described crystal grain 201 just to have how many described holes 223.
This base 24 has a first end 241, one second end 242 and a through hole 243.This through hole 243 runs through this base 24, and is opened on respectively this first end 241 and this second end 242.In the present embodiment, this through hole 243 has respectively one first opening 2431 and one second opening 2432 in this first end 241 and this second end 242, and the sectional area of this first opening 2431 is less than the sectional area of this second opening 2432, make this through hole 243 form taper.
This substrate 22 is adjacent to the first end 241 of this base 24, and the sectional area of this first opening 2431 contains these holes 223, makes these holes 223 be communicated with these through holes 243.In the present embodiment, this joint element 30 is between this substrate 22 and this base 24, and in order to engage this substrate 22 and this base 24, and this joint element 30 is the packaging plastic of filling out cold welding agent, the ceramic cold welding agent of pore or mixing phosphor powder.This joint element 30 is except the function engaged, and it has the function of sealing concurrently, to prevent this cooling fluid 28, oozes out.
This heat pipe 26 is adjacent to the second end 242 of this base 24, and has a heat pipe opening 261, and this heat pipe opening 261 is communicated with this through hole 243.In the present embodiment, this heat pipe 26 utilizes the argon welding mode to be fixedly arranged on the second end 242 of this base 24.This cooling fluid 28 is positioned at this hole 223, thereby it is interior mobile at this heat pipe 26 to form a boil-off gas to absorb luminous the produced heat of this light source 20.In the present embodiment, this cooling fluid 28 is water, methyl alcohol, ethanol, ammonia, acetone or its any combination.This heat pipe 26 comprises a shell body 262 and a capillary structure 263.This capillary structure 263 is positioned at the madial wall of this shell body 262 to define a hollow accommodation space 264.Preferably, the material of this shell body 262 is metal (for example: brass, nickel, stainless steel, tungsten or other alloys), and this capillary structure 263 is that copper mesh, copper powder burn solution or groove.
This heat pipe opening 261 is communicated to this hollow accommodation space 264, make the formed boil-off gas of this cooling fluid 28 can be through this heat pipe opening 261 and flow this hollow accommodation space 264 is interior, and then form heat exchange across this shell body 262 and external environment, finally be condensed into liquid coolant 28.The liquid coolant 28 that this condensation forms is got back in these holes 223 through the through hole 243 of this base 24 via these capillary structure 263 backflows, and then can successionally take away luminous the produced heat of this light source 20, thereby forms a heat radiation circulation.
This holder 32 has a central bore 321, in order to accommodating this base 24.In the present embodiment, the material of this holder 32 and this base 24 is metal (for example: brass, nickel, stainless steel, tungsten or other alloys), and this holder 32 is fixed in this base 24.Yet in other embodiments, this holder 32 and this base 24 are formed in one.
The type of drive of this light-emitting device 2 is as follows.When the luminous generation of this light source 20 is hot, the cooling fluid 28 that is positioned at this hole 223 absorbs the heat of this light source 20 and forms a boil-off gas.This boil-off gas know from experience through the through hole 243 of this base 24, in this hollow accommodation space 264, flow to this heat pipe 26 above.Because the top of this heat pipe 26 is to touch the lower temperature place, so during to this end, just start to produce condensation when this boil-off gas, now heat is exactly to be passed to heat pipe 26 outsides of lower temperature by this shell body 262 by this boil-off gas.Simultaneously, this boil-off gas cognition condenses into liquid, and these liquid coolant 28 that produce after because of condensation flow back to the through hole 243 of this base 24 via the effect of the capillarity (Capillary Pumping) of this capillary structure 263, enter afterwards in these holes 223 again.So thereby circulation can continue to carry out to improve radiating effect.Therefore, the present invention can remove the thermal resistance between this cooling fluid 28 and this light source 20 in this heat pipe 26, make the radiating effect of this cooling fluid 28 in this heat pipe 26 to maximize, and can effectively reduce the operating temperature of this light source 20, and then extend the service life of this light source 20.
Please refer to Fig. 4, shown the schematic perspective view of another embodiment of light-emitting device of the present invention.The light-emitting device 3 of the present embodiment is roughly the same with the light-emitting device 2 of Fig. 1 and 2, and wherein identical element is given identical Reference numeral.The light-emitting device 3 of the present embodiment and the light-emitting device 2 of Fig. 1 and 2 different be in, in the present embodiment, this light-emitting device 3 also comprises at least one heat dissipation element 33, it has a central tube 34 and a plurality of radiating fin 36.This central tube 34 is sheathed on this heat pipe 26, preferably, and these central tube 34 these heat pipes 26 of contact.These radiating fins 36 are to be stretched out in radial mode by this central tube 34, and this central tube 34 and these radiating fins 36 are formed in one.
Please refer to Fig. 5, shown in different interface temperature situations, the output of light relatively (Relative Light Output) and the graph of a relation between service life of light emitting diode (LED) element.This interface temperature refers to the temperature of these crystal grain 201 and these substrate 22 contact-making surfaces (i.e. this first surface 221).Light emitting diode (LED) element light output meeting decayed along with the time, and light is output as the ratio of light output and initial light output relatively.In the drawings, curve 51 represents 69 ℃ of interface temperatures, and curve 52 represents 79 ℃ of interface temperatures, and curve 53 represents 85 ℃ of interface temperatures, and curve 54 represents 96 ℃ of interface temperatures, and curve 55 represents 107 ℃ of interface temperatures, and curve 56 represents 115 ℃ of interface temperatures.As shown in the figure, in the same output of light relatively situation, the light-emitting diode that interface temperature is lower has longer service life.
Interface temperature through testing the light-emitting device 3 that can record Fig. 4 is 51.1 ℃, and (experiment condition is as follows: this cooling fluid 28 is water; The power of these crystal grain 201 is 10W; Operating pressure in this hollow accommodation space 264 is 64 holders (Torr); Room temperature is 21.6 ℃).In addition, if install fan additional, laterally brush these radiating fins 36, the interface temperature that can record this light-emitting device 3 is 32.8 ℃, and (experiment condition is as follows: this cooling fluid 28 is water again; The power of these crystal grain 201 is 9.6W; Operating pressure in this hollow accommodation space 264 is 25 holders (Torr); Room temperature is 22 ℃).In comparison, light emitting diode (LED) element 10 of the light-emitting device 1 of Fig. 1 is lined up interface temperature measured in the situation of 3*3 matrix and is about 70 ℃.Therefore, the interface temperature of known this light-emitting device 3 is lower than prior art, and can rationally calculate that its service life also can be longer.
Please refer to Fig. 6, shown the schematic perspective view of another embodiment of light-emitting device of the present invention.The light-emitting device 3a of the present embodiment and the light-emitting device 3 of Fig. 4 are roughly the same, and wherein identical element is given identical Reference numeral.The light-emitting device 3a of the present embodiment and the light-emitting device 3 of Fig. 4 different be in, the outward extending width of radiating fin 36 of the heat dissipation element 33 of the light-emitting device 3 of Fig. 4 is all equal, and forms circular appearance in periphery; Otherwise in the present embodiment, the outward extending width of radiating fin 36a of the heat dissipation element 33a of this light-emitting device 3a is not exclusively equal, and form rectangular appearance in periphery.
Please refer to Fig. 7, show that the light-emitting device of Fig. 2 is assemblied in the schematic diagram of a loading plate.This loading plate 38 has a first surface 381, a second surface 382 and a plurality of opening (not shown), and these openings run through this loading plate 38.A plurality of light-emitting device 2(Fig. 2) utilize its holder 32 and set firmly (for example utilizing screw closure) on the second surface 382 of this loading plate 38, these openings are corresponding with the light source 20 of these light-emitting devices 2, to appear these light sources 20.So, can increase sent brightness, and can use as for example street lamp.In the present embodiment, these light-emitting devices 2 are for lining up the 3*3 matrix, yet in other embodiments, these light-emitting devices 2 also can be looked actual needs and line up other patterns.
Please refer to Fig. 8, shown that the light-emitting device of Fig. 4 is assemblied in the schematic diagram of a loading plate.In the present embodiment, a plurality of light-emitting device 3(Fig. 4) utilize its holder 32 and set firmly (for example utilizing screw closure) on the second surface 382 of this loading plate 38, and these openings of this loading plate 38 are corresponding with the light source 20 of these light-emitting devices 3, to appear these light sources 20.In the present embodiment, these light-emitting devices 3 are for lining up the 3*3 matrix, yet in other embodiments, these light-emitting devices 3 also can be looked actual needs and line up other patterns.
Please refer to Fig. 9, shown that the light-emitting device of Fig. 6 is assemblied in the schematic diagram of a loading plate.In the present embodiment, a plurality of light-emitting device 3a(Fig. 6) utilize its holder 32 and set firmly (for example utilizing screw closure) on the second surface 382 of this loading plate 38, and these openings of this loading plate 38 are corresponding to the light source 20 of these light-emitting devices 3a, to appear these light sources 20.In the present embodiment, these light-emitting devices 3a lines up the 3*3 matrix, yet in other embodiments, these light-emitting devices 3a also can look actual needs and line up other patterns.
But above-described embodiment is only explanation principle of the present invention and effect thereof, but not in order to limit the present invention.Therefore, those of ordinary skill in the art modifies to above-described embodiment and changes and still do not break away from spirit of the present invention.Interest field of the present invention should be limited as claims.
Claims (12)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101117917A TWI461634B (en) | 2012-05-18 | 2012-05-18 | Light-emitting apparatus |
| TW101117917 | 2012-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103423630A true CN103423630A (en) | 2013-12-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101646178A Pending CN103423630A (en) | 2012-05-18 | 2012-05-24 | Light emitting device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103423630A (en) |
| TW (1) | TWI461634B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103712192A (en) * | 2014-01-08 | 2014-04-09 | 武汉阳光佰鸿新能源股份有限公司 | Integrated phase-changing heat-sink high-power LED lamp radiator |
| CN104896330A (en) * | 2015-06-03 | 2015-09-09 | 中国科学院半导体研究所 | Led light source module |
| CN109937326A (en) * | 2016-11-17 | 2019-06-25 | 三菱电机株式会社 | Light emitting device, electronic equipment, lighting device and headlight for automobile |
| TWI864019B (en) * | 2019-07-09 | 2024-12-01 | 日商索尼股份有限公司 | Wavelength conversion components |
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| TWI261938B (en) * | 2004-04-06 | 2006-09-11 | Yu-Chao Wu | LED device and LED heat dissipation system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103712192A (en) * | 2014-01-08 | 2014-04-09 | 武汉阳光佰鸿新能源股份有限公司 | Integrated phase-changing heat-sink high-power LED lamp radiator |
| CN104896330A (en) * | 2015-06-03 | 2015-09-09 | 中国科学院半导体研究所 | Led light source module |
| CN109937326A (en) * | 2016-11-17 | 2019-06-25 | 三菱电机株式会社 | Light emitting device, electronic equipment, lighting device and headlight for automobile |
| TWI864019B (en) * | 2019-07-09 | 2024-12-01 | 日商索尼股份有限公司 | Wavelength conversion components |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI461634B (en) | 2014-11-21 |
| TW201348645A (en) | 2013-12-01 |
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