CN103422146A - Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution - Google Patents
Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution Download PDFInfo
- Publication number
- CN103422146A CN103422146A CN2012101601088A CN201210160108A CN103422146A CN 103422146 A CN103422146 A CN 103422146A CN 2012101601088 A CN2012101601088 A CN 2012101601088A CN 201210160108 A CN201210160108 A CN 201210160108A CN 103422146 A CN103422146 A CN 103422146A
- Authority
- CN
- China
- Prior art keywords
- copper
- ion concentration
- adjusting
- electroplating solution
- electroplate liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 title claims abstract description 8
- 229910001431 copper ion Inorganic materials 0.000 title claims abstract description 8
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 title claims abstract description 8
- 238000009713 electroplating Methods 0.000 title abstract description 11
- 238000000034 method Methods 0.000 title abstract description 7
- 239000007788 liquid Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 210000005056 cell body Anatomy 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 abstract description 14
- 239000010959 steel Substances 0.000 abstract description 14
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010949 copper Substances 0.000 description 28
- 239000000243 solution Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 3
- 239000012267 brine Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000003487 electrochemical reaction Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution. According to the device, an adjusting tank is disposed in an electroplating tank, and an inert anode plate is used as an anode in an electroplating tank body. According to the method, the copper ion concentration can be adjusted, thus improving the quality of coppered steel wires, reducing the production cost and controlling heavy-metal pollution.
Description
Technical field
The present invention relates to a kind of device of regulating concentration of heavy metal ion, thereby especially in the cupric pyrophosphate electroplating solution, by regulating copper ion concentration, reach the device that improves the Coppered Steel Wire quality, reduces production costs, controls heavy metal contamination.
Background technology
At present, thus in known adjusting cupric pyrophosphate electroplating solution, the ordinary method of concentration of heavy metal ion is that the discharge electroplate liquid reduces concentration of heavy metal ion in electroplate liquid.The cupric pyrophosphate electro-coppering be using metal plated steel wire or by the plating matrix as negative electrode, copper as anode pad steel wire or by the plating matrix below, steel wire or by the plating matrix in electroplate liquid, move, by electrochemical reaction by copper be plating to steel wire or by the plating matrix on.In electroplating process, because the increase of current efficiency along with current density reduces, current efficiency is lower than 100%, and the speed that anode copper dissolves is far longer than the negative electrode steel wire or is plated matrix by copper-plated amount, Cu in solution
2+Content is relatively more and more higher, too high Cu
2+Content can cause steel wire or quilt plating matrix coating is coarse, crystal grain is excessive, thereby affect quality product.General treatment process is the discharge electroplate liquid, then reduces Cu in electroplate liquid
2+Concentration, this method, to environment, increases production cost.
Summary of the invention
In order to solve Cu in the cupric pyrophosphate electroplating solution
2+The problem of excessive concentration, the invention provides a kind of setting device of concentration of heavy metal ion, and this device can consume Cu unnecessary in electroplating solution
2+, keep Cu in electroplating solution
2+Stablizing of concentration, thus the good quality of Coppered Steel Wire guaranteed, avoid the discharge of heavy metal in electroplate liquid to cause the pollution to environment.
The technical solution adopted for the present invention to solve the technical problems is: regulating tank is set in plating tank, regulates in cell body and use the inert anode plate as anode.During plating, steel wire or quilt plating matrix continue deposition Cu as negative electrode
2+, the inert anode plate is dissolved copper not, and a brine electrolysis becomes O
2And H
2.
The electric current of regulating tank is according to electroplate liquid Cu
2+Concentration is regulated.Work as Cu
2+During excessive concentration, increase electric current in regulating tank and slow down shot copper ion dissolution rate, Cu
2+Concentration decreases.Otherwise, work as Cu
2+When concentration is on the low side, reduces electric current in regulating tank and promote shot copper ion dissolution rate, Cu in solution
2+After concentration is effectively controlled, just do not affect by plating matrix coating quality, simultaneously without passing through the discharge electroplate liquid to reduce Cu yet
2+Content.In addition, because the regulating tank brine electrolysis produces H
+, can reduce the pH value of electroplate liquid, avoid the higher enhancing solution acidic of pH value and then affect the Coppered Steel Wire quality.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is copper facing schematic diagram of the present invention.
Fig. 2 is the longitudinal section structural map of an embodiment of regulating tank.
1. cathode rollers in figure, 2. steel wire, 3. inert anode plate, 4. shot copper, 5. electroplate liquid, 6. power supply barretter, 7. stainless steel anode plate.
Embodiment
In Fig. 1, the inert anode plate 3 that replaces copper anode is padded on below steel wire 2, and steel wire 2 is moved by right side in electroplate liquid 5 to the left as negative electrode, and the shot copper 4 that electrochemical reaction will be placed in stainless steel anode plate 7 and be immersed in electroplate liquid 5 is decomposed into Cu
2+Be plating to the top layer of steel wire 2.
In embodiment illustrated in fig. 2, Cu in electroplating solution 5
2+Because dissolution rate higher than steel wire 2 by plating speed, Cu in electroplate liquid 5
2+When content is progressively too high, controls power supply barretter 6 and increase electric currents, Cu
2+Content correspondingly reduces.Otherwise, Cu in electroplate liquid 5
2+When content is on the low side, controls power supply barretter 6 and reduce electric current with active balance Cu
2+Content.Cu
2+Content is effectively controlled, and steel wire 2 copper plate quality just can be guaranteed, and simultaneously, has also avoided the discharge of heavy metal in the electroplate liquid to cause the pollution to environment.
Claims (1)
1. a cupric pyrophosphate electroplate liquid copper ion concentration setting device, is characterized in that: regulating tank is set in plating tank, regulates in cell body and use the inert anode plate as anode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101601088A CN103422146A (en) | 2012-05-22 | 2012-05-22 | Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101601088A CN103422146A (en) | 2012-05-22 | 2012-05-22 | Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103422146A true CN103422146A (en) | 2013-12-04 |
Family
ID=49647519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101601088A Pending CN103422146A (en) | 2012-05-22 | 2012-05-22 | Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103422146A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104060319A (en) * | 2014-07-01 | 2014-09-24 | 金华市恒飞电工材料有限公司 | Automatic balance control device and method for copper ion concentration |
-
2012
- 2012-05-22 CN CN2012101601088A patent/CN103422146A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104060319A (en) * | 2014-07-01 | 2014-09-24 | 金华市恒飞电工材料有限公司 | Automatic balance control device and method for copper ion concentration |
| CN104060319B (en) * | 2014-07-01 | 2016-08-31 | 金华市恒飞电工材料有限公司 | A kind of copper ion concentration automatic-balancing controller and control method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107326424B (en) | A kind of copper plating device and its copper-plating technique using external slot dissolution cathode copper | |
| CN101397691B (en) | Apparatus and technology for controlling and improving plating solution PH value on fingerprint resistant production chain | |
| CN106544703A (en) | Perforation Copper Foil foil machine and its production technology | |
| CN101550569A (en) | Non-cyanide alkaline copper plating bath, preparation and use method thereof | |
| WO2018103621A1 (en) | Acid copper electroplating process using insoluble anode and equipment therefor | |
| CN108823610B (en) | Additive for electrolytic copper foil and production process of electrolytic copper foil for 5-micron double-light lithium battery | |
| JP2010265519A (en) | Tin ion feeder | |
| CN100464878C (en) | Electrokinetic Remediation of Contaminated Soil and Groundwater | |
| CN103422149A (en) | Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution | |
| CN202705551U (en) | Regulation tank for copper ion concentration of copper pyrophosphate electroplate liquid and electroplating device | |
| CN201793799U (en) | Device for relieving generation of tin sludge in tin-plating solution | |
| CN1153855C (en) | Method and device for regulating concentration of substaces in electrolytes | |
| CN103422150A (en) | Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating | |
| CN103422146A (en) | Method of adjusting the copper ion concentration in copper pyrophosphate electroplating solution | |
| CN206052186U (en) | Perforation Copper Foil foil machine | |
| CN103422147A (en) | Method of adjusting the concentration of heavy metal ions in electroplating solution | |
| CN204779889U (en) | Flexible electrolytic device | |
| CN102268714B (en) | A kind of electrochemical pre-treatment method of electrolytic extraction of gallium negative electrode | |
| CN202705553U (en) | Heavy metal ion concentration adjusting tank | |
| CN103422145A (en) | Method of adjusting the concentration of heavy metal ions in electroplating solution | |
| CN202705550U (en) | Copper ion concentration adjusting device for copper pyrophosphate electroplating liquid | |
| CN202705552U (en) | Device for regulating concentration of heavy metal ions in electroplate liquid | |
| CN103422148A (en) | Heavy-metal-ion concentration adjusting tank | |
| CN116791155A (en) | Preparation method of electrolytic copper foil based on pulse electroplating | |
| CN204959050U (en) | Device of acid copper chloride of electrolysis |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |