CN103413887A - LED packaging structure - Google Patents

Abstract

The present invention relates to the technical field of LED lamp chip packaging, and specifically to an LED packaging structure, including a bracket monomer and an LED chip arranged on the bracket monomer, and also including an optical lens covered on the LED chip, the bracket monomer includes a colloid bracket and a metal bracket, the metal bracket includes a heat dissipation function body formed by folding a metal sheet and an electrode support leg extending from the metal sheet, a mirrored LED chip mounting seat is provided on one side of the heat dissipation function body, and a heat sink formed by folding a metal sheet is provided on the other side of the heat dissipation function body; the colloid bracket surrounds the LED chip mounting seat and the heat sink, and the electrode support leg penetrates the colloid bracket and extends outward. The LED packaging structure of the present invention not only has a good light output effect, but also has a simple structure and good heat dissipation function.

Description

A kind of LED packaging structure

technical field

The invention relates to the technical field of LED lamp chip packaging, in particular to an LED packaging structure.

Background technique

Light Emitting Diode (LED) is a solid-state semiconductor device that can convert electrical energy into visible light. It is widely used in display screens, traffic signals, display light sources, automotive lights, LED backlights, lighting sources, etc. , LED semiconductor lighting has the remarkable characteristics of long life, energy saving, green environmental protection, rich colors, miniaturization and so on.

The LED packaging structure is generally a packaging structure in which the LED chip is mounted on a single bracket. The heat dissipation of such an LED packaging structure is usually provided with a heat dissipation copper column on the single bracket. The effect is poor; in addition, in order to realize the uniform reflection of light effect in the existing LED packaging structure, reflector cups are usually arranged on the stand alone, so that the light effect of the LED chip can be evenly distributed. Such a structure is more complicated and installation is also difficult It is relatively inconvenient, a large amount of manpower and material resources will be wasted in the production process, the production efficiency is low, and the cost is high.

Contents of the invention

The object of the present invention is to provide an LED packaging structure with simple structure and convenient manufacture in view of the deficiencies of the prior art. The LED packaging structure has better heat dissipation effect and relatively uniform light effect distribution.

An LED packaging structure, comprising a single bracket and an LED chip arranged on the single bracket, and an optical lens covered on the LED chip, the single bracket includes a colloid bracket and a metal bracket, and the metal bracket includes The heat dissipation function body formed by folding a metal sheet and the electrode legs extended from the metal sheet, one side of the heat dissipation function body is equipped with a mirror surface LED chip mounting seat, and the other side of the heat dissipation function body is a heat sink formed by folding a metal sheet ; The colloidal support surrounds the LED chip mounting seat and the heat sink, and the electrode legs protrude outward through the colloidal support.

Wherein, the optical lens is a silicone lens.

Wherein, the optical lens is hemispherical or cylindrical.

Wherein, the surface of the LED chip mounting seat is plated with a mirror electroplated silver layer.

Wherein, the metal support is provided with a welding area, and the welding area is surrounded by the colloidal support.

Wherein, the welding area is provided with a conductive layer that has been processed by an immersion gold process.

Wherein, the welding area includes a positive electrode welding area, a negative electrode welding area and a welding secondary protection tube area.

Wherein, the heat dissipation fins of the heat dissipation function body have a two-layer structure.

Wherein, the heat dissipation fins of the heat dissipation function body have a three-layer structure.

Wherein, the heat dissipation fin is provided with a plurality of heat dissipation holes.

Beneficial effects of the present invention: the LED chip of the present invention is covered with an optical lens, which can adjust the light-emitting angle of the LED package structure, expand its light-emitting surface, thereby improving the display quality and enhancing the viewing effect; LED chip installation The seat is set as a mirror surface, which has the function of a reflector. The mirror mounting seat makes the light distribution more uniform, and the LED chip light output effect is better; The process of installing the heat dissipation copper pillar improves the production efficiency and reduces the production cost.

Description of drawings

Fig. 1 is a schematic diagram of the LED packaging structure of the present invention.

Fig. 2 is a schematic cross-sectional structure diagram along the line A-A of Fig. 1 .

FIG. 3 is a schematic diagram of the reverse structure of FIG. 1 .

Fig. 4 is a schematic structural view of the metal sheet for making the metal stent of the present invention.

1—stent monomer; 2—LED chip;

3—optical lens; 11—electrode legs;

12—LED chip mount; 13—heat sink;

14—colloid support; 15—positive electrode welding area;

16—Negative electrode welding area; 17—Welding secondary protection tube area;

18—cooling holes.

Detailed ways

The present invention will be further described below in conjunction with embodiment.

Referring to Fig. 1 to Fig. 4, an LED packaging structure includes a stand unit 1 and an LED chip 2 arranged on the stand unit 1, and also includes an optical lens 3 covered on the LED chip 2, and the stand unit 1 includes a colloid support 14 and a metal support. The metal support includes a heat dissipation function body formed by folding a metal sheet and electrode legs 11 extending from the metal sheet. One side of the heat dissipation function body is provided with a mirror LED chip mounting seat 12. The other side of the heat dissipation function body is a heat sink 13 formed by folding metal sheets; the colloid support 14 surrounds the LED chip mount 12 and the heat dissipation fin 13 , and the electrode legs 11 protrude outward through the colloid support 14 .

The LED chip 2 of the LED packaging structure is covered with an optical lens 3, which can adjust the light emitting angle of the LED packaging structure, expand its light-emitting surface, thereby improving the display quality and enhancing the viewing effect; the LED chip mounting seat 12 It is set as a mirror surface, which has the function of a reflector. The mirror mounting seat makes the light effect distribution more uniform, and the LED chip 2 has a better light output effect; in addition, the heat sink 13 and the bracket unit 1 are integrally structured. On the basis of ensuring the heat dissipation effect, The process of installing the heat dissipation copper pillar is reduced, the production efficiency is improved, and the production cost is reduced.

Wherein, the optical lens 3 is a silicone lens. Of course, lenses of other transparent materials can also be used as the optical lens 3 .

Wherein, the optical lens 3 is hemispherical or cylindrical.

Wherein, the surface of the LED chip mounting seat 12 is plated with a mirror electroplated silver layer. On the one hand, the electroplated silver layer can reflect light, on the other hand, it can also prevent oxidation and ensure the safety of the circuit.

Wherein, the metal support is provided with a welding area, and the welding area is surrounded by the colloidal support 14 .

Wherein, the welding area is provided with a conductive layer that has been processed by an immersion gold process. The conductive layer treated by the immersion gold process can effectively prevent corrosion, has good conductivity and strong stability.

Wherein, the welding area includes a positive electrode welding area 15 , a negative electrode welding area 16 and a welding secondary protection tube area 17 . According to the packaging process of different LED chips 2 or different chip functions, the positive connection end or negative connection end of the electrode leg 11 can be connected with the welding secondary protection tube area 17 to realize the protection of the LED chip 2 .

Wherein, the heat sink 13 of the heat dissipation function body has a two-layer structure or a three-layer structure. The heat sink 13 of the two-layer structure is easy to fold, but the heat dissipation is poorer than that of the three-layer structure; while the heat sink 13 of the three-layer structure has a better heat dissipation effect, and the service life of the LED chip 2 is longer.

Wherein, the heat dissipation fin 13 is provided with a plurality of heat dissipation holes 18 . The heat dissipation holes 18 can accelerate the heat dissipation of the LED chip 2, and the heat dissipation effect is better.

The LED packaging structure of the present invention not only has better light emitting effect, but also has simple structure and better heat dissipation function.

The above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the present invention, although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technology of the present invention can be The scheme shall be modified or equivalently replaced without departing from the spirit and scope of the technical scheme of the present invention.

Claims (10)

1. A kind of LED package structure, comprise bracket monomer and be arranged on the LED chip on bracket monomer, it is characterized in that: also comprise the optical lens that cover is arranged on LED chip, described bracket monomer comprises colloid bracket and metal bracket , the metal bracket includes a heat dissipation function body formed by folding a metal sheet and electrode legs extending from the metal sheet, one side of the heat dissipation function body is provided with a mirror LED chip mounting seat, and the other side of the heat dissipation function body is a metal sheet A heat sink formed by folding; the colloid support surrounds the LED chip mounting seat and the heat sink, and the electrode legs protrude outward through the colloid support. 2. The LED packaging structure according to claim 1, wherein the optical lens is a silicone lens. 3. The LED packaging structure according to claim 1, wherein the optical lens is hemispherical or cylindrical. 4 . The LED packaging structure according to claim 1 , characterized in that: the surface of the LED chip mounting base is plated with a mirror electroplated silver layer. 5 . The LED packaging structure according to claim 1 , wherein a welding area is provided on the metal support, and the welding area is surrounded by a colloidal support. 6 . 6 . The LED package structure according to claim 5 , wherein the soldering area is provided with a conductive layer processed by an immersion gold process. 7 . 7 . The LED packaging structure according to claim 6 , wherein the soldering area includes a positive electrode soldering area, a negative electrode soldering area and a welding secondary protection tube area. 8 . 8. The LED package structure according to claim 1, wherein the heat sink of the heat dissipation function body has a two-layer structure. 9. The LED packaging structure according to claim 1, wherein the heat sink of the heat dissipation function body has a three-layer structure. 10. The LED package structure according to any one of claims 1 to 9, wherein a plurality of heat dissipation holes are provided on the heat dissipation sheet.

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