CN103401958A - Mobile phone chip shielding structure and mobile phone - Google Patents

Abstract

The invention discloses a mobile phone chip shielding structure and a mobile phone. The mobile phone chip shielding structure includes a shielding cover and a shielding clip for clamping and fixing the shielding cover. The shielding clip is arranged on a PCB, and the shielding cover passes through the shielding clip. Clamp and fix and abut against the thermal pad on the chip of the mobile phone. In the mobile phone chip shielding structure and mobile phone provided by the present invention, the connection mode of the shielding cover is changed from a fixed connection to an adjustable plug-in connection by using a shielding clip, so that the shielding cover and the thermal pad on the chip can be effectively contacted, ensuring heat The effective transmission of the chip also ensures that the chip will not have problems affecting the performance of the mobile phone due to the pressure of the shielding cover.

Description

Mobile phone chip shielding structure and mobile phone

technical field

The invention relates to the field of mobile terminal equipment, in particular to a mobile phone chip shielding structure and a mobile phone.

Background technique

With the continuous popularization of smart phones, the competition among different manufacturers is becoming more and more fierce. Due to the serious homogeneity, the "arms" competition between different brands in terms of hardware is also intensifying. The processor has changed from single-core, dual-core, to the current quad-core; the resolution of the display screen has also been rising all the way. The problem of natural heat dissipation is also becoming more and more serious. While the mobile phone chip needs to be equipped with a shielding structure, it also needs to be equipped with an auxiliary heat dissipation structure. The currently commonly used mobile phone shielding structure is shown in FIG. Around the chip 120, the fixed connection of the two is realized through the cooperation of the convex hull on the shielding cover and the hole on the shielding frame. A thermal pad 150 is installed between the shielding cover 140 and the chip 120, and then mounted on the shielding cover 140. The heat sink 160, the assembly structure requires that the thermal pad 150 must be in good contact with the chip 120 and the shielding cover 140 to realize the timely transfer of heat, but because the height of the shielding cover 140 is fixed, and the thermal pad is not elastic , in actual assembly, it often leads to the fact that the thermal pad 150 cannot form effective contact with the chip 120 and the shielding cover 140, causing the heat generated by the chip to not be effectively transferred, and in another case, the gap between the chip 120 and the shielding cover 140 is smaller than the thermal conductivity The gasket 150 has a lot of thickness, which will keep the chip 120 in an overvoltage state and affect the reliability of the mobile phone.

Therefore, the prior art still needs to be improved and developed.

Contents of the invention

In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a mobile phone chip shielding structure and a mobile phone, aiming to solve the problem of unstable heat dissipation or excessive pressure on the chip caused by the assembly of the current mobile phone shielding structure.

Technical scheme of the present invention is as follows:

A mobile phone chip shielding structure, its cover is arranged on the top of the mobile phone chip, the mobile phone chip is arranged on the PCB board, the upper surface of the mobile phone chip is mounted with a thermal pad, wherein the mobile phone chip shielding structure includes a shielding cover and a shielding clip for clamping and fixing the shielding cover, the shielding clip is arranged on the PCB, a heat sink is mounted on the upper surface of the outer side of the shielding cover, and the shielding cover is clamped and fixed by the shielding clip and connected to the chip of the mobile phone The thermal pads are in contact with each other.

In the mobile phone chip shielding structure, the shielding clip is an integrally formed elastic member, including a clamping portion for clamping the shielding cover and a bottom edge for connecting with the PCB board.

In the mobile phone chip shielding structure, wherein, the clamping part is composed of two sidewalls whose middle parts are sunken inwards, and the upper parts of the sidewalls expand outwards respectively to form openings of the shielding clip.

In the mobile phone chip shielding structure, the shielding clamp clamps the side wall of the shielding cover, and the side wall of the shielding cover is frosted. the

A mobile phone, wherein the mobile phone includes the above-mentioned mobile phone chip shielding structure.

Beneficial effects: the invention provides a mobile phone chip shielding structure and a mobile phone. By using the shielding clip, the connection mode of the shielding cover is changed from a fixed connection to an adjustable insertion, so that the shielding cover and the thermal pad on the chip can be effectively contacted. , to ensure the effective transfer of heat, and also to ensure that the chip will not have problems affecting the performance of the mobile phone due to the pressure of the shielding cover.

Description of drawings

FIG. 1 is a schematic connection diagram of a mobile phone shielding structure used in the prior art.

Fig. 2 is a connection schematic diagram of the mobile phone shielding structure of the present invention.

Detailed ways

The present invention provides a mobile phone chip shielding structure and a mobile phone. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

The mobile phone chip shielding structure as shown in Figure 2, its cover is arranged on the top of mobile phone chip 220, and described mobile phone chip 220 is arranged on the PCB board 210, and described mobile phone chip 220 upper surface is mounted with thermal pad 250, described A heat sink 260 is attached to the outside of the shielding structure, wherein the mobile phone chip shielding structure includes a shielding cover 240 and a shielding clip 230 for clamping and fixing the shielding cover, the shielding clip 230 is arranged on the PCB board 210, and the shielding A heat sink 260 is mounted on the upper surface of the outer side of the cover 240 , and the shielding cover 240 is clamped and fixed by the shielding clip 230 and abuts against the thermal pad 250 on the chip of the mobile phone.

Preferably, the shielding clip 230 is an integrally formed elastic member, including two corresponding side walls and a bottom surface connecting the two corresponding side walls, and the middle parts of the two corresponding side walls are inwardly recessed to form a clamp for clamping the shielding cover. part, and the upper parts of the two corresponding side walls are respectively expanded outwards. After the clamping part of the shielding clip is stamped and formed during preparation, the distance between the narrowest part of the two side walls should be smaller than the thickness of the side wall of the shielding cover, so that the side wall of the shielding cover and the shielding clip can perform an interference fit, and the shielding clip is formed by deformation of the side wall For the clamping force of the shielding cover, the clamping force can be adjusted by adjusting the degree of depression of the side wall of the shielding clamp when the shielding clamp is prepared as required. The deformation of the shielding clip after clamping the shielding cover is within its elastic deformation range. Therefore, the shielding clip will not lose its clamping force due to long-term clamping and the shielding cover will not become loose.

The shielding clip 230 is fixed by connecting the bottom surface to the PCB board 210, which is arranged on the PCB board through a patch process, and shielding clips are provided on each side wall of the shielding cover according to the required fixed position of the shielding cover. Preferably, a shielding clip is provided in the middle of each side wall of the shielding cover, and the two side walls of the upper part of the shielding clip are spread out to make the opening gradually open, which makes it easier for the shielding cover to be assembled. Alignment with the shielding clip makes it easier to insert into the clamping part of the shielding clip, which reduces the assembly accuracy requirements, and on the contrary simplifies the assembly alignment process and improves assembly efficiency. Moreover, compared with the existing shielding structure that engages through concave and convex parts, the shielding cover and the shielding clip of the present invention are plug-in structures, and the side wall of the shielding cover does not need any treatment (while in the prior art, convex holes must be processed on the side wall ), which also simplifies the processing of the shielding cover, simplifies the processing procedure, and improves the processing efficiency of the shielding cover. the

After the shielding cover 240 is inserted into the shielding clip 230, if the insertion depth is too deep, that is, the shielding cover goes down too much, the shielding cover will be subjected to the back pressure of the thermal pad 250, and finally move up and when the clamping force of the shielding clip When the applied force of the thermal pad is equal to that of the thermal pad, the shielding cover can not only effectively contact the thermal pad, but also ensure that the chip is not under too much pressure.

When the shielding cover and the shielding clamp are designed to match, it is necessary to ensure that after the shielding cover is connected in place, there is still a gap between the end of the shielding cover and the bottom edge of the shielding clamp. In addition, when assembling the shielding cover to the shielding clip, a predetermined amount of force should be applied to the top of the shielding cover to ensure that the mobile phone chip, thermal pad, and shielding cover form a close and effective contact.

In another embodiment, the inner and outer surfaces of the side wall of the shielding cover can be frosted, so that after the shielding clip is connected, the fixing of the shielding clip and the shielding cover increases the friction between the two based on the clamping force of the original shielding clip. , to further ensure the connection strength.

In another embodiment, the side wall of the shielding cover can be pre-set with a score line or a scribing line to indicate the depth of the shielding cover inserted into the shielding clip. Standard setting, during product quality inspection, you can directly observe the relative position of the engraved line and the shielding clip, if the engraved line is flat or slightly lower than the top of the shielding clip, it is qualified, then the inspector can find the shielding cover that is not installed in place through direct observation . Alternatively, a scanning head is set on the production line, and the scanning head scans the engraved or scribed line of the shielding cover on the product at a certain height. If it is not scanned, it means that the installation is not in place, and the unqualified products will be handled according to the predetermined rules. Realize the automatic inspection of the installation quality of shielding cover and shielding clip.

In addition, a cooling fin is mounted on the outer upper surface of the shielding cover. Preferably, the surface area of the cooling fin should be larger than the upper surface area of the shielding cover, which is more conducive to the timely dissipation of heat. In the same principle, the heat conduction pad abutted by the shielding cover should also be larger than the upper surface area of the mobile phone chip, preferably slightly smaller than the lower surface area of the shielding cover, so as to achieve the most efficient heat transfer of the chip.

A mobile phone, comprising the above-mentioned mobile phone chip shielding structure.

The invention provides a mobile phone chip shielding structure and a mobile phone. By using a shielding clip, the connection mode of the shielding cover is changed from a fixed connection to an adjustable plug connection, so that the shielding cover and the thermal pad on the chip can be effectively contacted, ensuring The effective transfer of heat also ensures that the chip will not have problems affecting the performance of the mobile phone due to the pressure of the shielding cover.

It should be understood that the application of the present invention is not limited to the above examples, and those skilled in the art can make improvements or transformations according to the above descriptions, and all these improvements and transformations should belong to the protection scope of the appended claims of the present invention.

Claims (5)

1. chip for cell phone shielding construction, it covers at the top of chip for cell phone, described chip for cell phone is arranged on pcb board, described chip for cell phone upper surface is pasted with heat-conducting pad, it is characterized in that, described chip for cell phone shielding construction comprises screening cover and for the shield clip that grips screening cover, described shield clip is arranged on pcb board, described screening cover outer upper surface is pasted with fin, and described screening cover grips by shield clip and with the heat-conducting pad on chip for cell phone, connects.

2. chip for cell phone shielding construction according to claim 1, is characterized in that, the elastic component that described shield clip is formed in one, comprise for the clamping part of clamping screening cover be connected the base that is connected with pcb board.

3. chip for cell phone shielding construction according to claim 2, is characterized in that, described clamping part forms for the sidewall that is all caved inward by two middle parts, and the opening of shield clip is outwards launched to form respectively in the top of described sidewall.

4. chip for cell phone shielding construction according to claim 1, is characterized in that, the sidewall of described shield clip clamping screening cover, the sidewall of described screening cover are done frosted and processed.

5. a mobile phone, is characterized in that, described mobile phone comprises chip for cell phone shielding construction as claimed in claim 1.

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