CN103391703B - Clamping device - Google Patents
Clamping device Download PDFInfo
- Publication number
- CN103391703B CN103391703B CN201210402964.XA CN201210402964A CN103391703B CN 103391703 B CN103391703 B CN 103391703B CN 201210402964 A CN201210402964 A CN 201210402964A CN 103391703 B CN103391703 B CN 103391703B
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- CN
- China
- Prior art keywords
- electrically
- electronically
- body portion
- radiator
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005611 electricity Effects 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses clamping device 100, described device 100 be used for will electrically or electronically part 200,300 are clamped to radiator 500.The device includes body portion, the body portion, which has, is arranged adjacent to electrically or electronically part 200,300 clamping surface and clamp arrangements 107, the clamp arrangements 107, which are arranged to receive, to be used to promote the clamping surface in body portion to clamp the clamping force of electrically or electronically part between body portion and radiator 500 towards radiator.
Description
Technical field
The present invention relates to the field of radiating of Electrical and Electronic part.More specifically but non-exclusively, embodiments of the invention are related to
And help the heat for conducting electrically or electronically part to leave the device of electrically or electronically part so that heat can dissipate.
Background technology
It is well known that heat often dissipates as the accessory substance of the electric operation of Electrical and Electronic part.In addition, described
Electrical and Electronic part has certain operating temperature, it is preferred that some form of heat management is used in electronic installation,
To ensure that the heat distributed by electrically or electronically part will not cause overheat.
A kind of method for preventing that Electrical and Electronic part from overheating is to use radiator.Radiator is to be arranged to be connected to electricity
Gas or electronic unit are to help the heat-conduction component that part radiates.Radiator generally has by means of pectination or fin structure reality
Existing large surface area, to help to radiate.Although however, the heat-conduction component can successfully make heat be conducted off generation
The part of excessive heat, but the air themperature that the heat that dissipates of the part can still be by increasing inside device influenceed in device
The performance of internal vicinity electrically or electronically part.
In order to overcome described problem, generally help the air transmitted of heating leaving radiator using fan, and more
Importantly, it is transmitted to outside device.However, fan needs the space of the fair-sized in device, it uses relatively great amount of work(
Rate, adds the cost of device and adds the noise level produced by the device.
The content of the invention
Embodiments of the invention attempt to alleviate at least some problems in above mentioned problem.
There is provided the device that electronics or electric component are clamped to radiator according to an aspect of the present invention.The device bag
Include with the body portion for being arranged adjacent to the electrically or electronically clamping surface of part.The device also includes clamp arrangements, the clamping
Device, which is arranged to receive towards radiator, promotes the clamping surface in body portion electrically or electric to be clamped between body portion and radiator
The clamping force of subassembly.
Clamp arrangements may include clamping element support, and the clamping element support is arranged to receive the clamping from clamping element
Power.
At least a portion clamping element support can be formed in the part in body portion.
At least a portion clamping element support can be formed on the side relative with clamping surface in body portion.
Clamping element support may include the hole through body portion for being arranged to receive screw.The clamping element support may also include
Around hole, it is arranged to the shoulder for preventing screw terminal through hole.In use, as screw is tightened, clamping force can increase.
Clamp arrangements may additionally include the peripheral flange of hole and shoulder, to help screw to be positioned in hole.
The device, which may also include, to be arranged to the part that electrically or electronically part is connected to body portion connecting configuration.
Part connection configuration can be formed on the clamping surface in body portion.
It is that part connection configuration may include to be formed in body portion and be arranged to engagement features with electrically or electronically part
The engagement features of connection.
The engagement features of part connection configuration may be disposed to the complementation with the electrically or electronically engagement features of part.
The engagement features of part connection configuration can be projections and may be disposed to and the Kong Lian in electronics or electric component
Connect.
Part connection configuration may include multiple engagement features for being connected to multiple electrically or electronically parts.
Clamp arrangements may be disposed to provide the clamping force to multiple electrically or electronically parts.
Clamp arrangements may be disposed to be placed between multiple engagement features with to each in multiple electrically or electronically parts
It is individual that equal clamping force is provided.
Part connection configuration may include fixture, and the fixture is disposed against body portion and keeps electronics or electric component.
The device also includes supporting configuration, and the supporting deployment arrangements are connected to circuit board into by device, in the circuit
Electrically or electronically part will be connected on plate.
Supporting configuration may include to be arranged to be inserted at least one support column in the hole in circuit board.
The length of the support column can determine the electrically or electronically height of part placement on circuit boards.
The device can be formed as single-piece.The device can be formed by insulating materials.
There is provided a kind of system according to another aspect of the present invention.The system includes apparatus discussed above.The system is also
Radiator including being arranged to the heat that dissipation is conducted from electronics or electric component.
The radiator may include clutch features, and the clamp arrangements of described device are arranged attached to the clutch features, with
Electrically or electronically part is clamped between device and radiator.The clutch features can be screw thread.
The system may also include the screw for being arranged to that the clamp arrangements of the device are connected to radiator.
Radiator can be arranged to accommodate the framework of electronics or electric component.
The system may also include electrically or electronically part, and the electrically or electronically part is arranged in the body portion of device and dissipated
It is clamped between hot device.
Embodiments of the invention provide radiator folder, and radiator folder is promoted including being arranged to clamped part towards radiator
Clamping body portion, wherein, be arranged in the electrically or electronically part between clamping body portion and radiator by the thrust of clamping element
It is clamped to radiator.
The embodiment provides heat sink arrangements, the heat sink arrangements include radiator and be arranged to by electrically or
Electronic unit is clamped to the clamping device of radiator, wherein, the radiator, which is arranged to, makes heat dissipation leave electronics or electric
Part.The radiator can be arranged to the heat of electrically or electronically part being dissipated to the external conductive member of outside.
Brief description of the drawings
Below with reference to the accompanying drawings the exemplary embodiment of the present invention is illustrated, wherein：
Fig. 1 shows the heat transfer clamping device for being connected with two electronic units；
Fig. 2 shows the heat transfer clamping device in the Fig. 1 not being connected with any electronic unit；
Fig. 3 shows the rearview of the heat transfer clamping device in the Fig. 1 not being connected with any electronic unit；
Fig. 4 shows the heat transfer clamping device in the Fig. 1 installed on a printed circuit.
Fig. 5 shows that the heat transfer in the Fig. 1 installed on the printed circuit board (PCB) being ready for insertion into Fig. 4 of framework clamps dress
Put；And
Fig. 6 shows the interior views of framework, and heat transfer clamping device is inserted into the framework.
In entire disclosure and accompanying drawing, identical reference represents identical part.
Embodiment
The electric component heat transfer clamping device according to the first embodiment of the present invention is illustrated with reference now to Fig. 1 to 6.
Heat transfer clamping device 100 is arranged in electronic system.Clamping device 100 is the makrolon of injection molding
Structure, is arranged to and is connected to FET by connecting element 101,102,103,104,105（Field-effect transistor）200 and two pole
Pipe 300, and FET200 and diode 300 be clamped to by aerial lug 107 the die casting aluminium chassis 500 of electronic system,
The die casting aluminium chassis 500 are used as outside radiator.Therefore, the heat produced by electronic unit 200,300 is transmitted to framework
500, and then dissipated by framework 500.Because framework 500 is in the outside of the electronic circuit of the system, therefore, by electronic unit
Heat produced by 200,300, which dissipates, leaves the electronic circuit of the system.
The configuration of clamping device 100 is explained in more detail now.
As shown in figure 1, FET 200 and diode 300, which are arranged to, is connected to clamping device 100.The clamping device 100 is wrapped
The body portion of general planar is included, the body portion is formed with the first group parts connecting element 101,102,103 on side.Two parts connect
It is semicircle to connect the cross section of element 101,103, and another part connecting element is rounded projections, or cylindrical projections.If
The first group parts connecting element 101,102,103 and formed in FET 200 and diode 300, cloth are shaped such that described in putting
The shape for being set to the respective aperture being connected with the first group parts connecting element 101,102,103 or groove is complementary.For example, in Fig. 1
The outer shape of the upper left part connecting element 101 shown is configured to the interior shape substantially phase with FET 200 hole
Together so that connecting element 101 and the frictional fits of FET 200, thus FET 200 surface is made to be held against the body of device 100
The FET is caused to keep on the device 100 in the case of portion.Along each in the first group parts connecting element 101,102,103
Length other flank is set, with help by connecting element 101,102,103 provided promptly.
Connect respectively with FET 200 and diode 300 however, the first and second part connecting elements 101 and 102 are arranged to
Connect, third member connecting element 103 is configured to be connected to another electronic unit, the electronic unit have with FET 200 not
Connection features at same position.Therefore, device 100 is designed to and the electronic unit one with different physical package sizes
Rise and use.Therefore, third member connecting element 103 makes clamping device 100 be suitable in different circuit structures.Part is connected
The non-circular cross section with semicircular cross section of element 101 and 102 so that when electrically or electronically part is connected to portion
During part connecting element 101, part connecting element 102 will not hinder the connection, and vice versa.
Clamping device 100 also includes two accessory connecting elements 104,105.First auxiliary connecting element 104 be from
The clip that the back plate of device 100 is protruded, and it is included in the transverse projections of the near-end of the clip.The transverse projections are configured to
FET 200 at least a portion is clamped from top, so as to promote FET 200 towards the body portion of heat conducting device with by FET 200
It is held in place by.Hole 104a in the body portion of device 100 is required in casting device 100, is especially being formed
It is required during transverse projections.If it is understood that carrying out forming apparatus 100 using other methods, then hole 104a can
It can be not required.
Second auxiliary connecting element 105 is also clip configuration.The element be included in in plate-like body identical plane to
The main part of the direction extension in the lower body portion along separating device 100, and with multiple arms, the arm is parallel to each other and vertical
Ground extends along the direction for leaving the main body.Arm edge and each element identical side in part connecting element 101,102,103
To extension, and be arranged in below diode 300 extend and be connected to diode between diode leg.Arm includes
Transverse projections, the transverse projections stretch out from each arm, to be clipped on the leg of diode 300.The auxiliary connecting element
It is arranged to and is held in place by diode 300.
From figure 2 it can be seen that clamping device also includes lateral flank 106a, 106b, 106c, 106d, the cross rib
Portion in the body portion of device 100 with the identical side of connecting element 101,102,103,104, forming.The flank 106a,
106b, 106c, 106d are the elongated protrusions in the body portion for being horizontally through device 100.Transverse ribs 106a, 106b, 106c, 106d increasing
The contact between clamping device 100 and electronic unit 200,200 is added, has been arrived so as to improve from electronic unit 200,300
The heat conduction of framework 500.In addition to improving heat conduction, the flank also helps stiffening device 100.
As shown in figure 3, other supporting flank 108a is provided with the second or rear surface in the body portion of device 100,
108b,108c,108d,108e.It is such as discussed in detail on clamping, these flank stiffening devices 100 and also help improve
Device 100 arrives the clamping of framework 500.
Clamping device 100 also includes support column 109,110, and the support column is arranged to connect clamping device 100
To the first printed circuit board (PCB) for being provided with part 200,300（Printed circuitboard, PCB）402.Therefore, pillar
109,110 help to provide stability for device 100.However, pillar is also set for the leg of electronic unit 200,300 to be welded
It is connected to the first PCB 402 height.Therefore the height of electronic unit is set to determine pillar according in the tops of the first PCB 402
109,110 length.Pillar be arranged to the hole being pushed through in the first PCB and be snap-fitted in the first PCB hole with
Just pillar is fixed to by the first PCB with fixed height.
Clamping device 100 also includes aerial lug 107.The aerial lug 107, which is arranged to, connects clamping device 100
Be connected to external device (ED) or part, such as using electronic unit electronic installation framework 500.In this way, aerial lug 107 makes folder
Tight device 100 can clamp electronic unit 200,300 between clamping device 100 and framework 500.Aerial lug 107 includes
Hole 107a, the screw thread that screw 600 is disposed through hole 107a and is connected in framework 500.Shoulder is provided with around hole
Portion, the shoulder prevents the head of screw 600 from passing through hole 107a.Therefore, as screw 600 is tightened, screw head fills clamping
The body portion put pulls to framework 500.Two cylindrical flanges for being respectively placed in the both sides of device 100 are provided with around hole.First
Flange 107b is arranged on on electronic unit 200,300 identical sides, and being arranged to adjacent framework 500, in use, special
Not, flange 107b is arranged to engage with the projection in framework, to help clamping device 100 being maintained at just on framework 500
True position.The second flange 107c, the second flange 107c is set to be arranged to insertion spiral shell on the opposite side of electronic unit 200,300
The guiding piece of silk 600.
First flange 107b is also configured to prevent electronic unit 200,300 along stopping end（stop-end）111,112
Transverse movement, every side extension of the stopping end 111,112 along clamping device 100.Stop end 111,112 from clamping device 100
Every one end, along and the identical direction of part connecting element 101,102,103 protrude.When electronic unit 200,300 is connected to
During connecting element 101,102,102, stop end blocking member 200,300 and laterally outwardly move, and the first flange 107b is prevented
Part 200,300 is laterally inward motion.Therefore, FET 200, which is laterally retained, stops the one of the flange 107B of end 111 and first first
Between side, and diode 300 is laterally retained and stopped second between end and the first flange 107b opposite side.Therefore this configuration
Help electronic unit 200,300 being held in place by.
Will be explained below electronic unit 200,300 being clamped to using clamping device 100 process of framework 500.
First, part 200,300 are fixed on clamping device 100.Then clamping device 100 and the quilt of part 200,300
It is connected to PCB 402.The pillar 109,110 of heat conducting device 100 is snap-fitted in PCB 402 complimentary aperture, and part
200,300 leg is slidably fitted in PCB 402 each hole.Then part 200,300 is soldered to appropriate on PCB 402
In position, PCB 402 is fixed and be electrically connected to part.2nd PCB 401 is vertical with the first PCB 402, is connected to
One PCB 402.Vertical PCB 401 has opening（It is not shown）, the opening be positioned to allow screw 600 by the opening and
It is inserted into the hole 107a of clamping device 100.Second flange 107b contributes to screw 600 from vertical PCB 401
Opening is directed to hole 107a.As indicated by the arrows in fig. 5, including be provided with clamping device PCB 401,402 structure, be inserted into
To framework 500.Then, screw 600 is inserted into hole 107a, and with by heat transfer in the screw thread 501 being threaded into framework 500
Device 100 is connected to framework 500.As screw 600 is tightened, heat conducting device 100 is clamped to framework 500 by screw 600.Rib
Portion 108a, 108b, 108c, 108d, 108e contribute to the pressure distribution for applying screw on whole clamping device 100, so that
Apply average power behind part 200,300 to shift part on framework 500 onto.In this way, making electronic unit 200,300
Preceding surface, i.e. those surfaces not in contact with heat conducting device, in face of the inner surface of framework 500 so that heat can be by directly from electricity
Subassembly 200,300 is transmitted to framework 500.FET 200 is clamped against the heat conduction portion 502 of framework 500, and diode
300 clamp against the second heat conduction portion 503 of framework 500.Heat conduction portion 502,503 has FET 200 and diode
Therefore the complementary shape on 300 surface, to maximize contact surface area, and be conducted off electronic unit 200,300 by heat.
It will be appreciated that in alternative embodiments of the present invention, the device can be arranged to be connected to it is other electrically and/
Or electronic unit.In addition, in other embodiments of the invention, the device, which can be arranged to, is connected to single electrically or electronically portion
Part, or be connected to more than two electrically and/or electronic unit.
In other embodiments of the invention, clamping device is connected to another outside heat-conduction component, rather than electricity
On the framework of sub-device.For example, in certain embodiments, specific radiator is set with the heat that dissipates.In the embodiment
In, clamping device is arranged to member grip to radiator.
It will be appreciated that in other embodiments of the invention, clamping device need not be made up of poly- ammonium carbonate material.Example
Such as, clamping device can be made up of heat conducting material, so as to help heat being conducted off part.
There is provided the difference configuration of part connecting element in other embodiments of the invention.
It also will be understood that in alternative embodiments of the present invention, screw 600 can be integrated into clamping device 100.
It will be appreciated that the above embodiment of the present invention and example, which are provided to help, understands the present invention, have no effect on by
Protection domain defined in appended claims.
Claims (23)
1. a kind of device by electrically or electronically member grip to radiator, described device includes：
Body portion, the body portion has the clamping surface for being arranged adjacent to electrically or electronically part；
Clamp arrangements, the clamp arrangements are arranged to by clamping force, and the clamping force promotes the body portion towards radiator
Clamping surface between the body portion and the radiator to clamp electrically or electronically part；And
Supporting configuration, the supporting deployment arrangements into attaching the device to circuit board, the electrically or electronically part treat by
It is connected on the circuit board, wherein the supporting configuration includes at least one support column, at least one described support column
It is arranged in the hole that is snap-fitted in the circuit board, and the length of at least one wherein described support column determines the electricity
Son or electric component are placed on the height on the circuit board.
2. device as claimed in claim 1, wherein, the clamp arrangements include clamping element support, the clamping element supporting
Portion is arranged to receive the clamping force from clamping element.
3. device as claimed in claim 2, wherein, the supporting of at least a portion clamping element is formed in the part in the body portion
Portion.
4. device as claimed in claim 2, wherein, form at least one on the side relative with clamping surface in the body portion
Grips part support.
5. the device as described in any one in claim 2 to 4, wherein, the clamping element support includes：
Hole, the hole is through body portion and is arranged to accommodate screw；And
Shoulder, the shoulder is arranged to prevent the head of screw to pass through hole around hole,
Wherein, in use, as screw is tightened, clamping force increase.
6. device as claimed in claim 5, wherein, the clamp arrangements also include the periphery around the hole and the shoulder
Flange, the flange arrangement is into helping positioning of the screw in hole.
7. device as claimed in claim 1, in addition to part connection configuration, the part connects deployment arrangements into by the electricity
Gas or electronic unit are connected to the body portion.
8. device as claimed in claim 7, wherein, the part connection configuration is formed on the clamping surface in the body portion.
9. device as claimed in claim 7, wherein, it is special that the part connection configuration is included in the engagement formed in the body portion
Levy, the engagement features are arranged to be connected with the engagement features of the electrically or electronically part.
10. device as claimed in claim 9, wherein, the engagement features of the part connection configuration be arranged to it is described electrically
Or the engagement features of electronic unit are complementary.
11. device as claimed in claim 9, wherein, the engagement features of the part connection configuration are projections and are arranged to
It is connected with the hole in the electrically or electronically part.
12. device as claimed in claim 7, wherein, the part connection configuration includes being connected to multiple electrically or electronically portions
Multiple engagement features of part.
13. device as claimed in claim 12, wherein, the clamp arrangements are arranged to the multiple electrically or electronically part
Clamping force is provided.
14. device as claimed in claim 13, wherein, the clamp arrangements be arranged to be placed on the multiple engagement features it
Between, to provide each in the multiple electrically or electronically part equal clamping force.
15. device as claimed in claim 7, wherein, the part connection configuration includes fixture, and the fixture is arranged to
Make electrically or electronically part kept against the body portion.
16. device as claimed in claim 1, wherein, described device is formed as single-piece.
17. device as claimed in claim 1, wherein, described device is formed by insulating materials.
18. a kind of electronic system, the electronic system includes：
The device described in any one in preceding claims；And
Radiator, the radiator is arranged to the heat dissipated from electrically or electronically member conducts.
19. electronic system as claimed in claim 18, wherein, the radiator includes clutch features, the clamping of described device
Deployment arrangements are into the clutch features are connected to, so that electrically or electronically part described in being clamped between device and radiator.
20. electronic system as claimed in claim 19, wherein, the clutch features are screw threads.
21. electronic system as claimed in claim 18, in addition to screw, the screw are arranged to match somebody with somebody the clamping of described device
Put and be connected to the radiator.
22. electronic system as claimed in claim 18, wherein, the radiator is framework, and the frame arrangement is into accommodating institute
State electrically or electronically part.
23. electronic system as claimed in claim 19, in addition to electrically or electronically part, the electrically or electronically part arrangement
Clamped between the body portion of described device and radiator.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261645853P | 2012-05-11 | 2012-05-11 | |
| US61/645,853 | 2012-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103391703A CN103391703A (en) | 2013-11-13 |
| CN103391703B true CN103391703B (en) | 2017-08-18 |
Family
ID=49535831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210402964.XA Expired - Fee Related CN103391703B (en) | 2012-05-11 | 2012-10-22 | Clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103391703B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163214B (en) * | 2015-04-07 | 2020-07-10 | 罗伯特·博世有限公司 | Electric unit and heat radiation assembly thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT220643Z2 (en) * | 1990-10-22 | 1993-10-07 | Marelli Autronica | DEVICE FOR FIXING ELECTRONIC POWER COMPONENTS TO A THERMAL DISSIPATOR |
| KR19990064171A (en) * | 1995-10-13 | 1999-07-26 | 윌리암디.조단 | Junction Transistor Clips and Heat Absorbers |
| US5991154A (en) * | 1997-10-07 | 1999-11-23 | Thermalloy, Inc. | Attachment of electronic device packages to heat sinks |
| JP2003289190A (en) * | 2002-03-28 | 2003-10-10 | Keihin Corp | Mounting member and mounting method for heat-generating electronic components |
| JP3790225B2 (en) * | 2003-03-25 | 2006-06-28 | 東芝キヤリア株式会社 | Heat dissipation device |
-
2012
- 2012-10-22 CN CN201210402964.XA patent/CN103391703B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103391703A (en) | 2013-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: British Powys Applicant after: Nideke Control Technology Co. Ltd. Address before: British Powys Applicant before: Control Tech Ltd |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Troy Winsander Inventor after: Jonathan Holman Inventor after: Arthur Colombo Inventor before: Troy Winsander Inventor before: Jonathan Holman Inventor before: Aalter Colombo |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170818 Termination date: 20201022 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |