[go: up one dir, main page]

CN103388121B - A kind of mixing manufacture craft of high-precision metal mask plate - Google Patents

A kind of mixing manufacture craft of high-precision metal mask plate Download PDF

Info

Publication number
CN103388121B
CN103388121B CN201210139817.8A CN201210139817A CN103388121B CN 103388121 B CN103388121 B CN 103388121B CN 201210139817 A CN201210139817 A CN 201210139817A CN 103388121 B CN103388121 B CN 103388121B
Authority
CN
China
Prior art keywords
electroforming
mask plate
manufacture craft
metal mask
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210139817.8A
Other languages
Chinese (zh)
Other versions
CN103388121A (en
Inventor
魏志凌
高小平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Power Stencil Co Ltd
Original Assignee
Kunshan Power Stencil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Power Stencil Co Ltd filed Critical Kunshan Power Stencil Co Ltd
Priority to CN201210139817.8A priority Critical patent/CN103388121B/en
Priority to KR1020147031429A priority patent/KR101911416B1/en
Priority to JP2015510623A priority patent/JP5969114B2/en
Priority to PCT/CN2013/075226 priority patent/WO2013166951A1/en
Priority to TW102116297A priority patent/TWI513080B/en
Publication of CN103388121A publication Critical patent/CN103388121A/en
Application granted granted Critical
Publication of CN103388121B publication Critical patent/CN103388121B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/14Forme preparation for stencil-printing or silk-screen printing
    • B41C1/142Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/14Forme preparation for stencil-printing or silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/14Forme preparation for stencil-printing or silk-screen printing
    • B41C1/147Forme preparation for stencil-printing or silk-screen printing by imagewise deposition of a liquid, e.g. from an ink jet; Chemical perforation by the hardening or solubilizing of the ink impervious coating or sheet
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • C23F1/04Chemical milling
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/28Acidic compositions for etching iron group metals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Electroluminescent Light Sources (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention discloses a kind of preparation technology of high-precision metal mask plate, processing step includes:By electric cast nickel alloy, certain thickness substrate is made, opening (through hole) is carried on substrate;By etch process in a facet etch certain depth groove of mask substrate, make the opening size of etching one side more than non-etching face opening size, and hole wall is rounded, forms taper.Using the metal mask plate that the hybrid technique of electroforming plus etching is prepared, the advantages of according to having low cost, perforate Functionality, quality and appealing design, perforate high precision, and the thickness of effective template is reduced, improve the evaporation film-forming rate during mask plate evaporation.

Description

A kind of mixing manufacture craft of high-precision metal mask plate
Technical field
The present invention relates to a kind of manufacture craft of evaporation mask plate, belong to material and prepare and manufacture field, specifically relate to And a kind of preparation technology of OLED evaporations high-precision mask plate.
Background technology
Now, with the development and the arriving of information-intensive society of multimedia technology, the requirement to flat-panel monitor performance is more next It is higher.Three kinds of Display Techniques are newly occurred in that in recent years:Plasma display, Field Emission Display and display of organic electroluminescence (Abbreviation OLED), the deficiency of cathode-ray tube and liquid crystal display is compensate for a certain extent.Wherein, organic electroluminescent Display has from a series of advantages such as main light emission, low-voltage direct-current driving, all solidstate, the wide, various colors in visual angle, with liquid crystal Display is compared, and display of organic electroluminescence does not need backlight, and visual angle is big, and power is low, and its response speed can reach liquid crystal 1000 times of display, its manufacturing cost is but less than the liquid crystal display of equal resolution ratio.Therefore, display of organic electroluminescence Have broad application prospects, be counted as pole and assign one of following flat panel display of competitiveness.
Top light emitting organic display(OLED)Because its have it is all solid state, actively luminous, high-contrast, ultra-thin, low-power consumption, Without visual angle limitation, fast response time, antidetonation, working range is wide, be easily achieved Flexible Displays and many advantages, such as 3D shows, gradually As following 20 years most fast new Display Techniques of growing up.
Conventional top emitting OLED structure as other OLED structures, by anode(First electrode), negative electrode(Second electricity Pole)And the organic luminous layer between anode and negative electrode is constituted.The luminescence mechanism and process of OLED are from yin, yang the two poles of the earth point Not Zhu Ru electronics and hole, the electronics being injected into and hole transmit in organic layer, and is combined in luminescent layer, so as to excite hair Photosphere molecule produces singlet exciton, singlet exciton attenuation and lights.At present, the anode of existing bottom-emission OLED Mostly with indium oxide-tin(ITO)Used as raw material, with radio frequency sputtering method plated film to form electrode, film is single-layer membrane structure.Top Portion's emitting OLED-device then plates one layer of reflecting layer again on transparent anode ITO.But in general, manufactured using radio frequency sputtering method Ito anode, is easily caused its surface irregularity by bad influence of technology controlling and process factor, and then causes its surface to produce sophisticated thing Matter or thrust.In addition, the process of high-temperature calcination and recrystallization can also provide the chance that hole is emitted directly toward negative electrode, so that leakage Electric current increases, and influences the luminous efficiency of OLED.In addition, it is larger with the electrode resistance that ITO makes, easily increase heat production and power consumption.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, one object of the present invention It is to propose a kind of manufacture craft of evaporation mask plate, the method system that can effectively solve the chemical etching of traditional handicraft use The standby mask plate for obtaining there are problems that the difficult demoulding,.
The present invention relates to a kind of manufacture craft of evaporation mask plate, this kind of technique includes electroforming(Electro-deposition)Technique and erosion Carving technology.
Specifically, the manufacture craft includes electroforming at least one times(Electro-deposition)One side etching at least one times.
Specifically, the manufacture craft is first to carry out electroforming(Electro-deposition)Technique, then it is etched technique.
Specifically, electroforming(Electro-deposition)What technique included comprises the following steps that:
A, core pre-treatment:By core oil removing, pickling, sandblasting, to remove the oil stain impurity on surface, and surface is polished light It is sliding;
B, pad pasting:Mandrel surface is carried out into pad pasting;
C, exposure:Figure open area is exposed, so that unexposed area dry film is removed by developing, exposure is left Part is making the diaphragm of follow-up electroforming step;
D, surface development:Unexposed portion in step of exposure c is developed, leaves the part of exposure to make follow-up electroforming step Diaphragm;
E, electroforming(Electro-deposition):Core is immersed and deposits to without dry film region electroforming material in electrotyping bath;
F, take off film:Immersion of the exposure dry film that will do not removed in developing procedure by taking off film liquid is scrubbed and taken off except clean;
G, substrate post processing:By substrate together with core oil removing, pickling, air-dry.
Specifically, what etch process included comprises the following steps that:
A, two-sided pad pasting:Mandrel surface and substrate surface are carried out into pad pasting;
B, double-sided exposure:Make regional exposure beyond recess region, so that unexposed area dry film is removed by developing, stay The part of lower exposure is making the diaphragm of subsequent;
C, surface development:Unexposed portion in the step of exposure is developed, leaves the part of exposure to make subsequent etch The diaphragm of step;
D, one side etching:Method using etching is corroded by etching solution to the exposed surface of electroforming substrate;
E, take off film:Immersion of the exposure dry film that will do not removed in developing procedure by taking off film liquid is scrubbed and taken off except clean;
F, post processing:By the mask plate after etching together with core oil removing, pickling, air-dry;
G, stripping:Mask plate is stripped down from core;
H, detection:Mask plate under peeling off is carried out into quality testing;
I, assembling:The mask plate for detecting qualified is fixed on by any one mode in welding, glue, nut piece and is covered On template framework, mask assembly is formed;
J, finished product detection:The mask assembly that will be assembled carries out quality testing;
K, packaging:Qualified mask plate component Package casing, finished product shipment will be detected.
More specifically, the specific process parameter of electroforming process is as follows:
(1)Pre-treatment parameter:The oil removing time:1~2min
Pickling time:1~2min
Blast time:1~2min
Blasting pressure:2.0kg/cm2
(2)Pad pasting parameter:Temperature:110℃
Speed:1.4m/min
Pressure:0.6MPa
(3)Exposure parameter:Energy:100mj~600mj
Power:8w
(4)Photographic parameter:0.7%~0.9%Na2CO3Solution
(5)Activation parameter:Soak time:8min~10min,
Activation temperature:25~35 DEG C,
Activation solution concentration:1~2mol/L
(6)Electroforming process parameter:PH 3.0~3.8
35~40 DEG C of temperature
1~1.7A/dm of current density2
(7)Electroforming solution is constituted:225~255g/L of nickel sulfate
35~45g/L of nickel chloride
36~43g/L of ferrous sulfate
(8)The additive of electroforming solution:0.5~5ml/L of stabilizer
0.5~5ml/L of wetting agent
Walk 0.5~5ml/L of agent
Specifically, electroforming(Electro-deposition)The middle cathode base for using is stainless steel 201,202,301,304,420J1, Any one in 420J2;Anode is using any one in anode nickel block, anode nickel plates.
Specifically, the substrate thickness that electroforming is obtained is 10~50 μm, and electroforming material is Magnetic nickel or nickel alloy material.Nickel Alloy material is the one kind in dilval, nickel cobalt (alloy), Perminvar.
Specifically, the sectional elevation of electroforming formation opening is tapered.
Specifically, it is 0.01~0.1mm that electroforming forms opening size, it is preferable that electroforming forms opening optimum size and is 0.01~0.05mm.
Specifically, the parameter of etch process is:
(1)The specific composition of etching solution:160~230g/L of ferric trichloride
1~4g/L of hydrochloric acid
The g/L of sodium hypochlorite 0.1~1
(2)Specific process parameter:Proportion 1.4~1.5
PH 1.4~2.0
45~55 DEG C of temperature
45~50kg/cm of pressure2
Specifically, etch depth is 50%~100% electroforming substrate thickness, it is preferable that etch depth most preferably 100% Electroforming substrate thickness.
Specifically, etched recesses edge overlaps with evaporation face edge of opening, and etched recesses sectional elevation is in bowl-type, etching The profile angle of groove is 30o~50o
The opening needed for going out evaporation is directly corroded on invar alloy sheet material using the method for chemical etching compared with traditional handicraft, The obtained opening of hybrid technique that first electroforming is etched again, hole wall is smooth, and dimensional accuracy is high, evaporation face opening size obtained in electroforming Precision reaches ± 1 μm, and positional precision reaches ± 5 μm, and the obtained groove of etching forms bowl-shape hole wall, with the knot that is open obtained in electroforming Close, be obtained and meet the opening that evaporation is required, the steep-taper that bowl-shape hole wall has, it is to avoid evaporation process middle hole wall is to deposition material Block, improve evaporation film-forming rate, and smooth electroforming hole wall relatively etches hole wall and changes one's clothes the demoulding, will not to being deposited with material Material is impacted.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to embodiment is combined Substantially and be readily appreciated that.
Fig. 1 is the open profile figure made using double-sided etching process:
Wherein, corroded from invar sheets two sides respectively using two-sided etching, the section of formation is calabash shaped opening, but due to It is etched to and subtracts into technique, and there is side corrosiveness so that the opening size l1 of sheet surface is more than preliminary dimension l2, size essence Bad control is spent, size has deviation, and the perforated wall that etching is formed is coarse rough.T1 is ito surface etch depth, and t2 is steaming Surfacing etch depth.
Fig. 2 is the open profile figure that electroforming process of the present invention makes:
Wherein, electroforming thickness is t'z, and l'1 is ito surface opening size, and 1 is evaporation face, and 2 is ito surface(During electroforming and core It is close to).Because electroforming is additive process, and it is electro-deposition, is open as metal ion is attached to light-sensitive surface or photoresists clone's shape Into, therefore opening wall surface is smooth, and opening size high precision, l'1 is controlled well, t'z also dependent on any plus-minus is needed, with etching Technique is limited difference by invar sheets model.
Fig. 3 is that the present invention continues to etch the open profile figure for making on the basis of electroforming:
Wherein, 1 is evaporation face, and 2 is ito surface, and 3 is etched recesses, and l'1 is ito surface opening size, and as effectively evaporation is opened Mouth thickness, t'2 is the depth of etched recesses, and t'1+t'2=t'z, α are the profile angle of etched recesses.t'2=(50%~100%) t'z
Fig. 4 is the stereogram of high-precision metal mask plate:
Wherein, 1 is evaporation face, and 3 is etched recesses, and 4 is closely metal mask plate high.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached It is exemplary to scheme the embodiment of description, is only used for explaining the present invention, and is not considered as limiting the invention.
The present invention produces the tapered mask plate of opening band using the hybrid technique that first electroforming is etched again.
1st, the step of electroforming process is as follows:
Core pre-treatment → one side pad pasting → one side exposure → surface development → electroforming(Electro-deposition)→ take off film → substrate after Treatment.
Comprise the following steps that:
Stainless steel core die 304 is carried out the early stage treatment of oil removing, pickling and sandblasting, the dirt and impurity on its surface is removed, Increase its surface roughness.One side patch light-sensitive surface or coating photoresists, will be wanted by scan exposure on stainless steel 304 core Light-sensitive surface or the photoresists exposure in opening figure region are formed, used as electroforming diaphragm, unexposed light-sensitive surface or photoresists exist Washed away by alkali lye in follow-up developing procedure, core is exposed and forms follow-up electroforming and wants deposited metal material area.Will be aobvious The core of movie queen is put into electrotyping bath, adjusts electroforming parameter, and electroforming metal material is deposited to without dry film region.
Specific process parameter is as follows:
(1)Pre-treatment parameter:The oil removing time:1min
Pickling time:1min
Blast time:1min
Blasting pressure:2.0kg/cm2
(2)Pad pasting parameter:Temperature:110℃
Speed:1.4m/min
Pressure:0.6MPa
(3)Exposure parameter:Energy:300mj
Power:8w
(4)Photographic parameter:0.7%Na2CO3 solution
(5)Activation parameter:Soak time:8min
Activation temperature:25℃
Activation solution concentration is:1mol/L
(6)Electroforming process parameter:
pH 3.4
35 DEG C of temperature
Current density 1.4A/dm2
(7)Electroforming solution is constituted:Nickel sulfate 240g/L
Nickel chloride 35g/L
Ferrous sulfate 40g/L
(8)The additive of electroforming solution:
Stabilizer 2ml/L
Wetting agent 3ml/L
Walk agent 3ml/L
Above-mentioned electroforming parameter is obtained the electroforming substrate that thickness is 50 μm, and with patterns of openings, opening hole wall is smooth, size High precision, evaporation face opening size precision obtained in electroforming reaches ± 1 μm, and positional precision reaches ± 5 μm.Smooth electroforming hole wall Relatively etching hole wall be more easy to the demoulding, will not to being deposited with material impact
2nd, the step of etch process is as follows:
Two-sided pad pasting → double-sided exposure → surface development → one side etches → washes → take off film → post processing → stripping → inspection Survey → assembling → finished product detection → packaging
Comprise the following steps that:
By above-mentioned electroforming gained substrate together with core, Double-face adhesive light-sensitive surface or coating photoresists, by core one side Light-sensitive surface or photoresists expose completely;The region that substrate side will be etched retains, other regional exposures, the light-sensitive surface of exposure Or photoresists are not corroded as diaphragm, protective substrate and core in follow-up etch process by etching solution;To not expose The light-sensitive surface or photoresists of light are removed by alkali lye, the substrate surface that will be etched is spilt cruelly, are entered by corrosive liquids Row corrosion, by controlling etching transfer rate or etchant concentration to realize the depth to be etched.
On the basis of the opening that original electroforming is formed, the groove of certain depth is etched, groove walls are in bowl-shape.
Specific process parameter is as follows:
(1)The specific composition of etching solution is as follows:
Ferric trichloride 200g/L
Hydrochloric acid 2g/L
The g/L of sodium hypochlorite 0.2
(2)Etch process parameters
Proportion 1.45
pH 1.4
55 DEG C of temperature
Pressure 45kg/cm2
It is 40 μm that above-mentioned etching parameter is obtained depth of groove, i.e., effectively evaporation opening thickness is 10 μm.Etching is obtained recessed Groove forms bowl-shape hole wall, is combined with being open obtained in electroforming, is obtained and meets the opening that evaporation is required, the auger that bowl-shape hole wall has Degree, it is to avoid evaporation process middle hole wall is blocked to deposition material, improves evaporation film-forming rate.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that:Not Can these embodiments be carried out with various changes, modification, replacement and modification in the case of departing from principle of the invention and objective, this The scope of invention is limited by claim and its equivalent.

Claims (15)

1. a kind of mixing manufacture craft of high-precision metal mask plate, this kind of technique includes electroforming process and etch process;It is special Levy and be, first carry out electroforming process, then be etched technique;
Described electroforming process, its step is:Core pre-treatment → one side pad pasting → one side exposure → surface development → electroforming → Take off film → substrate post processing;
Described etch process, its step is:Two-sided pad pasting → double-sided exposure → surface development → one side is etched → washed → takes off Film → post processing → stripping → detection → assembling → finished product detection → packaging.
2. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that including at least one times Electroforming and at least one times one side etching.
3. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that the electroforming work The concrete technology step of skill is:
A, core pre-treatment:By core oil removing, pickling, sandblasting, to remove the oil stain impurity on surface, and surface is polished smooth;
B, one side pad pasting:Mandrel surface is carried out into pad pasting;
C, one side exposure:Figure open area is exposed, so that unexposed area dry film is removed by developing, exposure is left Part is making the diaphragm of follow-up electroforming step;
D, surface development:Unexposed portion in step of exposure c is developed, leaves the part of exposure to make the guarantor of follow-up electroforming step Cuticula;
E, electroforming:Core is immersed in electrotyping bath, electroforming material is deposited to without dry film region;
F, take off film:Immersion of the exposure dry film that will do not removed in developing procedure by taking off film liquid is scrubbed and taken off except clean;
G, substrate post processing:By substrate together with core oil removing, pickling, air-dry.
4. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that the etching work The concrete technology step of skill is:
A, two-sided pad pasting:Mandrel surface and substrate surface are carried out into pad pasting;
B, double-sided exposure:Make regional exposure beyond recess region, so that unexposed area dry film is removed by developing, leave exposure The part of light is making the diaphragm of subsequent;
C, surface development:Unexposed portion in the step of exposure is developed, leaves the part of exposure to make subsequent Diaphragm;
D, one side etching:Method using etching is corroded by etching solution to the exposed surface of electroforming substrate;
E, washing;
F, take off film:Immersion of the exposure dry film that will do not removed in developing procedure by taking off film liquid is scrubbed and taken off except clean;
G, post processing:By the mask plate after etching together with core oil removing, pickling, air-dry;
H, stripping:Mask plate is stripped down from core;
I, detection:Mask plate under peeling off is carried out into quality testing;
J, assembling:The mask plate for detecting qualified is fixed on mask plate by any one mode in welding, glue, nut piece On framework, mask assembly is formed;
K, finished product detection:The mask assembly that will be assembled carries out quality testing;
L, packaging:Qualified mask plate component Package casing, finished product shipment will be detected.
5. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that used in electroforming Cathode base be stainless steel 201,202,301,304,420J1, any one in 420J2;Anode uses anode nickel block, sun Any one in the nickel plate of pole.
6. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that electroforming substrate is thick It is 10~50 μm to spend, and electroforming material is Magnetic nickel or nickel alloy material.
7. the mixing manufacture craft of high-precision metal mask plate according to claim 6, it is characterised in that nickel alloy material It is the one kind in dilval, nickel cobalt (alloy), Perminvar.
8. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that electroforming is formed and opened The sectional elevation of mouth is tapered.
9. the mixing manufacture craft of high-precision metal mask plate according to claim 1, it is characterised in that electroforming is formed and opened Mouth size is 0.01~0.1mm.
10. the mixing manufacture craft of high-precision metal mask plate according to claim 9, it is characterised in that electroforming is formed Opening optimum size is 0.01~0.05mm.
The mixing manufacture craft of 11. high-precision metal mask plates according to claim 1, it is characterised in that etch depth It is 50%~100% electroforming substrate thickness.
The mixing manufacture craft of 12. high-precision metal mask plates according to claim 11, it is characterised in that etch depth Most preferably 100% electroforming substrate thickness.
The mixing manufacture craft of 13. high-precision metal mask plates according to claim 1, it is characterised in that etched recesses Edge overlaps with evaporation face edge of opening.
The mixing manufacture craft of 14. high-precision metal mask plates according to claim 1, it is characterised in that etched recesses Sectional elevation is in bowl-type.
The mixing manufacture craft of 15. high-precision metal mask plates according to claim 1, it is characterised in that etched recesses Profile angle be 30o~50o
CN201210139817.8A 2012-05-08 2012-05-08 A kind of mixing manufacture craft of high-precision metal mask plate Expired - Fee Related CN103388121B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201210139817.8A CN103388121B (en) 2012-05-08 2012-05-08 A kind of mixing manufacture craft of high-precision metal mask plate
KR1020147031429A KR101911416B1 (en) 2012-05-08 2013-05-07 Mixed fabricating technique for high precision metal mask plate
JP2015510623A JP5969114B2 (en) 2012-05-08 2013-05-07 Mixed metal mask manufacturing process
PCT/CN2013/075226 WO2013166951A1 (en) 2012-05-08 2013-05-07 Mixed fabricating technique for high precision metal mask plate
TW102116297A TWI513080B (en) 2012-05-08 2013-05-08 A mixed manufacturing method of a metal mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210139817.8A CN103388121B (en) 2012-05-08 2012-05-08 A kind of mixing manufacture craft of high-precision metal mask plate

Publications (2)

Publication Number Publication Date
CN103388121A CN103388121A (en) 2013-11-13
CN103388121B true CN103388121B (en) 2017-07-11

Family

ID=49532539

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210139817.8A Expired - Fee Related CN103388121B (en) 2012-05-08 2012-05-08 A kind of mixing manufacture craft of high-precision metal mask plate

Country Status (5)

Country Link
JP (1) JP5969114B2 (en)
KR (1) KR101911416B1 (en)
CN (1) CN103388121B (en)
TW (1) TWI513080B (en)
WO (1) WO2013166951A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102134363B1 (en) * 2013-09-10 2020-07-16 삼성디스플레이 주식회사 Method for manufacturing metal mask and metal mask using the same
CN103882375B (en) * 2014-03-12 2016-03-09 京东方科技集团股份有限公司 A kind of mask plate and preparation method thereof
CN104593722B (en) * 2014-12-23 2017-06-06 深圳市华星光电技术有限公司 The preparation method of mask plate
CN106033802B (en) * 2015-03-17 2018-06-29 上海和辉光电有限公司 A kind of evaporation mask plate and preparation method thereof
EP3993075A1 (en) * 2015-04-24 2022-05-04 Lg Innotek Co. Ltd Deposition mask
CN108026628B (en) * 2015-09-15 2020-09-25 应用材料公司 Shadow mask for organic light emitting diode fabrication
WO2017142231A1 (en) * 2016-02-16 2017-08-24 엘지이노텍 주식회사 Metal plate, mask for deposition and manufacturing method therefor
CN105714248A (en) * 2016-04-01 2016-06-29 昆山允升吉光电科技有限公司 Manufacturing method for high-precision composite mask plate assembly for evaporation
JP6264523B1 (en) * 2016-05-23 2018-01-24 凸版印刷株式会社 Metal mask for vapor deposition, method for producing metal mask for vapor deposition, and metal mask forming substrate for vapor deposition
JP2019516867A (en) * 2016-05-24 2019-06-20 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Shadow mask with plasma resistant coating
CN106119773B (en) 2016-08-03 2018-10-26 京东方科技集团股份有限公司 Mask plate and its manufacturing method, vapor deposition mask plate component and its manufacturing method
CN106350769B (en) * 2016-09-22 2019-03-01 常州友机光显电子科技有限公司 A kind of metal shadow mask and preparation method thereof
CN108728790A (en) * 2017-04-21 2018-11-02 苏州苏大维格光电科技股份有限公司 The manufacturing method of AMOLED metal mask plates
CN107164788B (en) * 2017-05-23 2019-08-02 上海天马有机发光显示技术有限公司 Mask plate and preparation method thereof
CN107699854B (en) * 2017-11-10 2019-09-17 京东方科技集团股份有限公司 Mask assembly and its manufacturing method
CN108251868B (en) * 2018-02-10 2018-12-04 胡泮 A kind of separation method of instrument board slush mold nickel shell and resin core model
CN108630832A (en) * 2018-03-13 2018-10-09 阿德文泰克全球有限公司 Metal shadow mask and preparation method thereof
CN108300963B (en) * 2018-03-30 2019-08-27 昆山国显光电有限公司 A kind of mask plate
CN111508349B (en) * 2019-01-31 2022-03-08 武汉华星光电半导体显示技术有限公司 Display panel, manufacturing method of display panel and electronic equipment
CN109898104A (en) * 2019-02-20 2019-06-18 合肥永淇智材科技有限公司 A kind of FMM electroforming motherboard production method of conical mouths
CN110484864B (en) * 2019-09-29 2021-09-10 京东方科技集团股份有限公司 Sub-mask and mask
CN112606544B (en) * 2020-11-19 2023-05-12 浙江硕克科技有限公司 Metal plate and processing technology thereof
JP2022108144A (en) * 2021-01-12 2022-07-25 株式会社ジャパンディスプレイ Immersion treatment equipment
TWI810563B (en) * 2021-05-14 2023-08-01 達運精密工業股份有限公司 Mask manufacturing method and mask manufacturing device
CN113276536B (en) * 2021-05-14 2022-05-27 常州天禄显示科技有限公司 Microstructure hole metal printing template and manufacturing method thereof
TWI822510B (en) * 2022-12-09 2023-11-11 達運精密工業股份有限公司 Metal mask and the method to produce metal mask
CN116511842B (en) * 2023-04-27 2023-10-03 寰采星科技(宁波)有限公司 Manufacturing method of precise metal mask plate and precise metal mask plate
CN116825752B (en) * 2023-08-29 2024-02-09 江西兆驰半导体有限公司 Wafer and printing method thereof
CN117286449A (en) * 2023-09-26 2023-12-26 京东方科技集团股份有限公司 Mask plate, mask plate preparation method and evaporation device
CN119332244A (en) * 2024-12-24 2025-01-21 浙江众凌科技有限公司 Substrate thinning method for producing OLED metal mask

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203975A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production method for mark points on an electroformed mask plate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615781A (en) * 1985-10-23 1986-10-07 Gte Products Corporation Mask assembly having mask stress relieving feature
KR100490534B1 (en) * 2001-12-05 2005-05-17 삼성에스디아이 주식회사 Mask frame assembly for thin layer vacuum evaporation of Organic electro luminescence device
JP2005314787A (en) * 2004-03-31 2005-11-10 Kenseidou Kagaku Kogyo Kk Method for producing metal mask
JP2005322354A (en) * 2004-05-11 2005-11-17 Canon Inc Method for manufacturing optical master disk and method for manufacturing stamper
JP2006152396A (en) * 2004-11-30 2006-06-15 Sony Corp Method for manufacturing metal mask, mask of artwork master for electroforming and artwork master
CN100590232C (en) * 2005-11-14 2010-02-17 昆山允升吉光电科技有限公司 A kind of electroforming manufacturing method of organic light-emitting display evaporation mask
JP2007276046A (en) * 2006-04-06 2007-10-25 Seiko Epson Corp Manufacturing method of structure
JP4677363B2 (en) * 2006-04-07 2011-04-27 九州日立マクセル株式会社 Vapor deposition mask and manufacturing method thereof
KR100971753B1 (en) * 2007-11-23 2010-07-21 삼성모바일디스플레이주식회사 Mask assembly for thin film deposition of flat panel display
KR20100026655A (en) * 2008-09-01 2010-03-10 삼성모바일디스플레이주식회사 Mask for thin film deposition and manufacturing method of oled using the same
CN101413138B (en) * 2008-09-20 2010-09-08 大连理工大学 A Method of Improving Dimensional Accuracy of Micro-Electroforming Layer
JP2011088107A (en) * 2009-10-26 2011-05-06 Seiko Epson Corp Method for manufacturing of filter, and filter
KR101182440B1 (en) * 2010-01-11 2012-09-12 삼성디스플레이 주식회사 Mask frame assembly for thin film deposition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203975A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production method for mark points on an electroformed mask plate

Also Published As

Publication number Publication date
CN103388121A (en) 2013-11-13
JP2015518524A (en) 2015-07-02
JP5969114B2 (en) 2016-08-10
TW201347267A (en) 2013-11-16
WO2013166951A1 (en) 2013-11-14
KR20150021914A (en) 2015-03-03
KR101911416B1 (en) 2018-10-24
TWI513080B (en) 2015-12-11

Similar Documents

Publication Publication Date Title
CN103388121B (en) A kind of mixing manufacture craft of high-precision metal mask plate
CN100590232C (en) A kind of electroforming manufacturing method of organic light-emitting display evaporation mask
CN104593722B (en) The preparation method of mask plate
KR20220025944A (en) Deposition mask, method of manufacturing deposition mask and metal plate
JP2011023717A (en) Method for etching see-through thin film solar module
CN103589995B (en) A kind of production method of mask plate
CN110165084A (en) A kind of array substrate and preparation method thereof, display panel and display device
CN103556111A (en) Mask plate and production method thereof
CN104164647B (en) A kind of manufacture craft of mask plate
JP5441663B2 (en) Multilayer metal mask
CN103589997A (en) Evaporation mask plate
KR102269904B1 (en) Method for manufacturing open metal mask of large area for oled deposition
CN103205672B (en) A kind of preparation technology of the evaporation mask plate for being easy to welding
JP6372755B2 (en) Method for manufacturing vapor deposition mask, metal plate used for producing vapor deposition mask, and vapor deposition mask
CN203569175U (en) Mask plate and mask assembly
CN103205697B (en) Vapor deposition mask plate and manufacture method thereof
CN103205782A (en) A preparation method for a vapor plating mask plate made from a nickel-iron alloy
CN103589996A (en) Mask plate
CN103589993A (en) Manufacturing method of evaporation mask plate
CN203569176U (en) Mask plate and mask component for evaporation plating
KR102405552B1 (en) Method for manufacturing open metal mask of large area for oled deposition
CN103589994A (en) Preparation method of evaporation mask plate
CN108251794A (en) The post-processing approach and mask plate of mask plate
CN102709156A (en) Wet etching method for ZnO-based transparent conductive film
CN106350769B (en) A kind of metal shadow mask and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
PP01 Preservation of patent right
PP01 Preservation of patent right

Effective date of registration: 20190808

Granted publication date: 20170711

PD01 Discharge of preservation of patent
PD01 Discharge of preservation of patent

Date of cancellation: 20220808

Granted publication date: 20170711

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170711

Termination date: 20190508