CN103383480B - Optical-fiber coupling connector and manufacture method thereof - Google Patents
Optical-fiber coupling connector and manufacture method thereof Download PDFInfo
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- CN103383480B CN103383480B CN201210135667.3A CN201210135667A CN103383480B CN 103383480 B CN103383480 B CN 103383480B CN 201210135667 A CN201210135667 A CN 201210135667A CN 103383480 B CN103383480 B CN 103383480B
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Abstract
一种光纤耦合连接器,包括具有发光面和受光面的光电单元、平面光波导、陶瓷基板基板和电路板,陶瓷基板具有相对的第一表面和第二表面,电路板具有相对的第三表面和第四表面,光电单元藉由COB制程电性设置于陶瓷基板的第二表面上且发光面和受光面朝向电路板的第三表面,平面光波导位于电路板的第三表面上,陶瓷基板与电路板之间设置有反射单元,光电单元的发光面发出的光线经反射单元反射后耦合进入平面光波导,平面光波导出射的光线经反射单元反射后被光电单元的受光面接收。本发明还提供上述光纤耦合连接器的制造方法。
An optical fiber coupling connector, comprising a photoelectric unit having a light-emitting surface and a light-receiving surface, a planar optical waveguide, a ceramic substrate substrate, and a circuit board, the ceramic substrate has opposite first and second surfaces, and the circuit board has an opposite third surface and the fourth surface, the photoelectric unit is electrically arranged on the second surface of the ceramic substrate by the COB process, and the light-emitting surface and the light-receiving surface face the third surface of the circuit board, the planar optical waveguide is located on the third surface of the circuit board, and the ceramic substrate A reflection unit is arranged between the circuit board and the light emitted by the light-emitting surface of the photoelectric unit is reflected by the reflection unit and then coupled into the planar light waveguide. The light emitted by the planar light waveguide is reflected by the reflection unit and received by the light-receiving surface of the photoelectric unit. The present invention also provides a manufacturing method of the above optical fiber coupling connector.
Description
技术领域technical field
本发明涉及一种光纤耦合连接器及其制造方法。The invention relates to an optical fiber coupling connector and a manufacturing method thereof.
背景技术Background technique
随着云端技术的发展,未来会需要越来越高频宽的高速传输系统。目前IBM致力于发展利用平面光波导的方式取代传统的铜线架构,利用光传递高速讯,取代过往由电传递高速信号。With the development of cloud technology, high-speed transmission systems with higher and higher bandwidths will be required in the future. At present, IBM is committed to developing the use of planar optical waveguides to replace the traditional copper wire structure, and to use light to transmit high-speed signals instead of transmitting high-speed signals by electricity in the past.
目前提出的平面光波导架构是将激光二极管或发光二极管、光电检测器及相应驱动电路整合在一个LTCC(low temperature co-fired ceramic,低温共烧陶瓷基板)上,需要在LTCC上设置通孔以使激光二极管或发光二极管和光电检测器的光窗对准LTCC,光线穿过LTCC后被一反射单元将垂直方向的光转成水平方向的光,再耦合进入平面光波导以进行长距离传输。The currently proposed planar optical waveguide architecture is to integrate laser diodes or light-emitting diodes, photodetectors and corresponding driving circuits on an LTCC (low temperature co-fired ceramic, low temperature co-fired ceramic substrate), and it is necessary to set through holes on the LTCC to Align the light window of the laser diode or light-emitting diode and the photodetector with the LTCC. After the light passes through the LTCC, the light in the vertical direction is converted into light in the horizontal direction by a reflection unit, and then coupled into the planar optical waveguide for long-distance transmission.
由于激光二极管或发光二极管、光电检测器及相应驱动电路体积比较小,故,通孔的精密度要求非常高,除了孔径要很小之外,同时还需要很高的精准度,从而使光纤耦合连接器的成本较高。Due to the relatively small size of laser diodes or light-emitting diodes, photodetectors, and corresponding drive circuits, the precision of the through holes is very high. In addition to the small aperture, high precision is also required, so that the optical fiber coupling The cost of the connector is higher.
发明内容Contents of the invention
有鉴于此,有必要提供一种成本较低、良率较高的光纤耦合连接器及其制造方法。In view of this, it is necessary to provide a low-cost, high-yield optical fiber coupling connector and a manufacturing method thereof.
一种光纤耦合连接器,包括光电单元、平面光波导、陶瓷基板基板和电路板,所述光电单元具有发光面和受光面,所述陶瓷基板具有相对的第一表面和第二表面,所述电路板具有相对的第三表面和第四表面,所述光电单元藉由COB制程电性设置于所述陶瓷基板的第二表面上且所述发光面和受光面朝向所述电路板的第三表面,所述平面光波导位于所述电路板的第三表面上,所述陶瓷基板与所述电路板之间设置有反射单元及透镜,所述透镜设置在所述反射单元上,所述光电单元的发光面发出的光线经所述反射单元反射后耦合进入所述平面光波导,所述平面光波导出射的光线经所述反射单元反射后被所述光电单元的受光面接收。An optical fiber coupling connector, comprising a photoelectric unit, a planar optical waveguide, a ceramic substrate substrate and a circuit board, the photoelectric unit has a light-emitting surface and a light-receiving surface, the ceramic substrate has opposite first surfaces and second surfaces, the The circuit board has opposite third surfaces and fourth surfaces, the photoelectric unit is electrically arranged on the second surface of the ceramic substrate by COB process, and the light-emitting surface and the light-receiving surface face the third surface of the circuit board. surface, the planar optical waveguide is located on the third surface of the circuit board, a reflection unit and a lens are arranged between the ceramic substrate and the circuit board, the lens is arranged on the reflection unit, and the optoelectronic The light emitted by the light-emitting surface of the unit is reflected by the reflective unit and then coupled into the planar light waveguide, and the light emitted by the planar light waveguide is reflected by the reflective unit and then received by the light-receiving surface of the photoelectric unit.
一种光纤耦合连接器的制造方法,所述光纤耦合连接器包括光电单元、陶瓷基板和电路板,所述电路板上具有平面光波导,所述陶瓷基板与所述电路板之间设置有反射单元及透镜,所述透镜设置在所述反射单元上,所述光纤耦合连接器的制造方法包括如下步骤:将所述光电单元采用COB制程设置在所述陶瓷基板的表面上;在所述陶瓷基板上设置球栅阵列;翻转所述陶瓷基板以使所述光电单元朝向所述电路板上的平面光波导;藉由球栅阵列连接所述陶瓷基板和电路板。A method for manufacturing an optical fiber coupling connector, the optical fiber coupling connector includes a photoelectric unit, a ceramic substrate and a circuit board, the circuit board has a planar optical waveguide, and a reflector is provided between the ceramic substrate and the circuit board A unit and a lens, the lens is arranged on the reflection unit, and the manufacturing method of the optical fiber coupling connector includes the following steps: the photoelectric unit is arranged on the surface of the ceramic substrate by COB process; A ball grid array is arranged on the substrate; the ceramic substrate is turned over so that the photoelectric unit faces the planar light waveguide on the circuit board; the ceramic substrate and the circuit board are connected by the ball grid array.
相较于现有技术,本实施例的光纤耦合连接器的光电单元采用COB制程设置在基板且发光面和受光面均朝向电路板,从而使基板上不需要设置精密度较高的通孔,即可实现光电单元与平面光波导之间的光耦合,故,光纤耦合连接器的成本较低,又由于光电单元采用COB制程设置在基板上,从而使光纤耦合连接器的良率较高。Compared with the prior art, the optoelectronic unit of the optical fiber coupling connector of this embodiment is arranged on the substrate by COB process, and the light-emitting surface and the light-receiving surface both face the circuit board, so that there is no need to set a through hole with high precision on the substrate. The optical coupling between the photoelectric unit and the planar optical waveguide can be realized. Therefore, the cost of the fiber coupling connector is relatively low, and since the photoelectric unit is arranged on the substrate using a COB process, the yield of the fiber coupling connector is high.
附图说明Description of drawings
图1是本发明实施例光纤耦合连接器的示意图。FIG. 1 is a schematic diagram of an optical fiber coupling connector according to an embodiment of the present invention.
主要元件符号说明Description of main component symbols
光纤耦合连接器 100Fiber Coupler 100
陶瓷基板 10Ceramic Substrate 10
第一表面 11first surface 11
第二表面 12second surface 12
光电单元 13Photoelectric unit 13
发光二极管 130LED 130
芯片 131chip 131
电路板 20circuit board 20
第三表面 21third surface 21
第四表面 22Fourth Surface 22
平面光波导 30Planar light guide 30
反射单元 40Reflex unit 40
透镜 50lens 50
球栅阵列 60Ball Grid Array 60
如下具体实施方式将结合上述附图进一步说明本发明。The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.
具体实施方式detailed description
请参阅图1,本发明实施例提供的光纤耦合连接器100包括陶瓷基板10、电路板20、平面光波导30、反射单元40和透镜50。Referring to FIG. 1 , an optical fiber coupling connector 100 provided by an embodiment of the present invention includes a ceramic substrate 10 , a circuit board 20 , a planar optical waveguide 30 , a reflection unit 40 and a lens 50 .
陶瓷基板10可以为低温共烧陶瓷基板(low temperature co-fired ceramic),其具有相对的第一表面11和第二表面12,第二表面12上电性设置有光电单元13。光电单元13包括发光二极管130、芯片131和光电二极管(图未示),发光二极管130、芯片131和光电二极管均采用COB制程设置在陶瓷基板10上并且发光二极管130的发光面和光电二极管的受光面均朝向电路板20。The ceramic substrate 10 may be a low temperature co-fired ceramic substrate (low temperature co-fired ceramic), which has a first surface 11 and a second surface 12 opposite to each other, and a photoelectric unit 13 is electrically disposed on the second surface 12 . The photoelectric unit 13 includes a light-emitting diode 130, a chip 131 and a photodiode (not shown in the figure). The faces are all facing the circuit board 20 .
芯片131用来驱动发光二极管130发光以及处理光电二极管输出的电信号。当然,在其它实施方式中,也可以将芯片131分成独立的两个,分别驱动发光二极管130发光以及处理光电二极管输出的电信号。The chip 131 is used to drive the light emitting diode 130 to emit light and process the electrical signal output by the photodiode. Of course, in other implementation manners, the chip 131 can also be divided into two independent ones, which respectively drive the light emitting diode 130 to emit light and process the electrical signal output by the photodiode.
电路板20藉由球栅阵列(Ball Grid Array,BGA)60与陶瓷基板10电性相连,电路板20可以为印刷电路板或软性电路板。电路板20具有相对的第三表面21和第四表面22,第三表面21朝向陶瓷基板10的第二表面12,换言之,第三表面21朝向发光二极管130的发光面和光电二极管的受光面。The circuit board 20 is electrically connected to the ceramic substrate 10 through a ball grid array (BGA) 60 , and the circuit board 20 can be a printed circuit board or a flexible circuit board. The circuit board 20 has opposite third surface 21 and fourth surface 22 , the third surface 21 faces the second surface 12 of the ceramic substrate 10 , in other words, the third surface 21 faces the light-emitting surface of the LED 130 and the light-receiving surface of the photodiode.
平面光波导30设置在电路板20的第三表面21上用来与光电单元13相耦合以实现光线的传输。The planar optical waveguide 30 is disposed on the third surface 21 of the circuit board 20 for coupling with the photoelectric unit 13 to realize light transmission.
透镜50和反射单元40设置在陶瓷基板10和电路板20之间,并且反射单元40位于电路板20的第三表面21上,透镜50设置在反射单元40上。The lens 50 and the reflective unit 40 are disposed between the ceramic substrate 10 and the circuit board 20 , and the reflective unit 40 is located on the third surface 21 of the circuit board 20 , and the lens 50 is disposed on the reflective unit 40 .
在光纤耦合连接器100传输光信号过程中,芯片131驱动光电单元13的发光二极管130发出基本垂直陶瓷基板10的光线,光线入射到透镜50上,从透镜50出射的光经反射单元40反射后变成基本平行电路板20的光线,基本平行电路板20的光线进入平面光波导30传输。同理,从平面光波导30出射的光信号经反射单元40反射后入射到透镜50上,从透镜出射的光被光电二极管所接收并转换为电信号,芯片131处理电信号以得到光纤耦合连接器100所传输的信号。During the optical signal transmission process of the optical fiber coupling connector 100, the chip 131 drives the light-emitting diode 130 of the photoelectric unit 13 to emit light that is substantially perpendicular to the ceramic substrate 10, and the light is incident on the lens 50, and the light emitted from the lens 50 is reflected by the reflection unit 40 The light becomes substantially parallel to the circuit board 20 , and the light substantially parallel to the circuit board 20 enters the planar optical waveguide 30 for transmission. Similarly, the optical signal emitted from the planar optical waveguide 30 is reflected by the reflection unit 40 and then incident on the lens 50, the light emitted from the lens is received by the photodiode and converted into an electrical signal, and the chip 131 processes the electrical signal to obtain a fiber-optic coupling connection The signal transmitted by the device 100.
在制造过程中,将光电单元13采用COB制程设置在陶瓷基板10的第二表面12上,然后在陶瓷基板10上设置球栅阵列60,翻转陶瓷基板10以使光电单元13朝向电路板20上的平面光波导30,藉由球栅阵列60连接陶瓷基板10和电路板20。In the manufacturing process, the photoelectric unit 13 is arranged on the second surface 12 of the ceramic substrate 10 by COB process, and then the ball grid array 60 is arranged on the ceramic substrate 10, and the ceramic substrate 10 is turned over so that the photoelectric unit 13 faces the circuit board 20 The planar optical waveguide 30 is connected to the ceramic substrate 10 and the circuit board 20 through the ball grid array 60 .
光纤耦合连接器100的光电单元13的发光面和受光面均朝向电路板20,不需要在陶瓷基板10上设置精密度较高的通孔,即可使光电单元13与平面光波导30实现光耦合,从而使光纤耦合连接器100的成本较低;又由于光电单元13采用COB制程设置在陶瓷基板10上,从而使光纤耦合连接器100的良率较高。The light-emitting surface and the light-receiving surface of the photoelectric unit 13 of the fiber-optic coupling connector 100 are both facing the circuit board 20, and there is no need to set a through hole with high precision on the ceramic substrate 10, so that the photoelectric unit 13 and the planar optical waveguide 30 can realize optical communication. Coupling, so that the cost of the optical fiber coupling connector 100 is lower; and because the photoelectric unit 13 is disposed on the ceramic substrate 10 using a COB process, the yield rate of the optical fiber coupling connector 100 is higher.
可以理解的是,本领域技术人员还可在本发明精神内做其它变化等用在本发明的设计,只要其不偏离本发明的技术效果均可。这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。It can be understood that those skilled in the art can also make other changes within the spirit of the present invention to be used in the design of the present invention, as long as they do not deviate from the technical effects of the present invention. These changes made according to the spirit of the present invention should be included in the scope of protection of the present invention.
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